JPH0572111B2 - - Google Patents
Info
- Publication number
- JPH0572111B2 JPH0572111B2 JP57082927A JP8292782A JPH0572111B2 JP H0572111 B2 JPH0572111 B2 JP H0572111B2 JP 57082927 A JP57082927 A JP 57082927A JP 8292782 A JP8292782 A JP 8292782A JP H0572111 B2 JPH0572111 B2 JP H0572111B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- light receiving
- light
- thin film
- common electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 10
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- NCNKEKMPAIXPOV-UHFFFAOYSA-N oxotin;platinum Chemical compound [Pt].[Sn]=O NCNKEKMPAIXPOV-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
- H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
- H04N1/03—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/40—Picture signal circuits
- H04N1/403—Discrimination between the two tones in the picture signal of a two-tone original
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
- Light Receiving Elements (AREA)
Description
【発明の詳細な説明】
この発明は、受光素子にかかり、特にフアクシ
ミリ、デイジタル複写機その他の画像処理装置等
に使用される長尺形の薄膜受光素子に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a light receiving element, and particularly to a long thin film light receiving element used in facsimiles, digital copying machines, and other image processing apparatuses.
従来光信号を電気信号に変換する受光素子とし
ては、フオトダイオード、フオトトランジスタあ
るいはCCDセンサなどがある。これらの受光素
子は、読み取るべき画像に比べて小さく、縮小光
学系を用いる必要があるという不便さをもつてい
る。 Conventional light-receiving elements that convert optical signals into electrical signals include photodiodes, phototransistors, and CCD sensors. These light receiving elements are small compared to the image to be read, and have the inconvenience of requiring the use of a reduction optical system.
このような点に鑑みて、画像を何ら縮小するこ
となくそのままの大きさで読み取ることができる
長尺化された薄膜受光素子が提案されている。 In view of these points, an elongated thin-film light-receiving element that can read an image in its original size without any reduction has been proposed.
このような薄膜受光素子の一例を第1図A,B
に示す。この図のうちAは全体を示す斜視図であ
り、Bは分解図である。図示の如く薄膜受光素子
90は絶縁性基板91上に4個の分割電極92を
形成し、この電極の一部に重ねて光電変換膜93
を形成し、更にこの上に他の電極94を設けた構
造となつている。 An example of such a thin film photodetector is shown in Figures 1A and 1B.
Shown below. In this figure, A is a perspective view showing the whole, and B is an exploded view. As shown in the figure, the thin film light receiving element 90 has four divided electrodes 92 formed on an insulating substrate 91, and a photoelectric conversion film 93 overlaid on a part of the electrodes.
is formed, and furthermore, another electrode 94 is provided thereon.
絶縁性基板91としては、ガラス、セラミツ
ク、表面を絶縁化した金属板あるいはシリコンウ
エハ等が用いられる。次に分割電極92としては
アルミニウム、クロム、白金酸化すず(SnO2)
と酸化インジウム(In2O3)の複合膜(以下
「ITO膜」という)等が用いられる。また、光電
変換膜93としては、水素化アモルフアスシリコ
ン(水素のみのn型及びアクセプタをドープした
P型を含む)、Se−Te−As、CdS、CdSe、CdTe
などが用いられる。更に上部電極94としては、
ITO膜、SnO2、In2O3、Al、Cr、Auなどが用い
られる。 As the insulating substrate 91, glass, ceramic, a metal plate with an insulated surface, a silicon wafer, or the like is used. Next, the divided electrodes 92 are made of aluminum, chromium, platinum tin oxide (SnO 2 ).
A composite film of indium oxide (In 2 O 3 ) and indium oxide (In 2 O 3 ) (hereinafter referred to as "ITO film") is used. Further, as the photoelectric conversion film 93, hydrogenated amorphous silicon (including n-type containing only hydrogen and p-type doped with an acceptor), Se-Te-As, CdS, CdSe, CdTe
etc. are used. Furthermore, as the upper electrode 94,
ITO film, SnO 2 , In 2 O 3 , Al, Cr, Au, etc. are used.
なお、これらの材料の組合わせ等によつて光電
変換膜93と電極92,94との界面部分に種々
の特性を有する接合部を構成する。この特性を、
オーミツクとするかあるいは阻止型又はダイオー
ド型とするかは、信号の読出し回路との関係によ
つて定められるものである。 Note that, by combining these materials, a joint portion having various characteristics is formed at the interface between the photoelectric conversion film 93 and the electrodes 92 and 94. This characteristic
Whether it is an ohmic type, a blocking type, or a diode type is determined depending on the relationship with the signal readout circuit.
次に、第1図Aの矢印,から見た図が第2
図及び第3図である。この第2図、第3図におい
て、受光素子としての機能を有する受光部95
は、下側の分割電極92と、上側の電極94とが
交差する領域であつて、光電変換膜93が全部有
効にデバイスとして機能するわけではない。な
お、電極92,94のうち少なくとも一方は外部
から光が入射するよう透光性を有する材料で形成
される必要があり、また分割電極92側から光が
入射する場合は、絶縁性基板91も透光性を有す
る材料としなければならない。 Next, the view from the arrow in Figure 1A is the second one.
FIG. In FIGS. 2 and 3, a light receiving section 95 having a function as a light receiving element is shown.
is a region where the lower divided electrode 92 and the upper electrode 94 intersect, and not all of the photoelectric conversion film 93 effectively functions as a device. Note that at least one of the electrodes 92 and 94 needs to be formed of a transparent material so that light can enter from the outside, and in the case that light is input from the split electrode 92 side, the insulating substrate 91 must also be formed. The material must be translucent.
第4図は読出し回路の一例を示すものであつ
て、前記分割電極92は各々半導体スイツチ82
を介してアンプ83に入力され、電極94は電源
81を介してアンプ83に入力されている。受光
部95のうちいずれか1つが半導体スイツチ82
によつて選択され、その信号がアンプ83で増幅
されて出力されるようになつている。 FIG. 4 shows an example of a readout circuit, in which the divided electrodes 92 are connected to semiconductor switches 82 and 82, respectively.
The electrode 94 is input to the amplifier 83 via the power supply 81 . One of the light receiving sections 95 is the semiconductor switch 82.
The selected signal is amplified by an amplifier 83 and output.
以上のような構成を有する薄膜受光素子は、例
えばフアクシミリの送信装置において第5図のよ
うに配置される。この図において矢印F1の方向
に回転するローラ88によつて、図の上方から図
示しない原稿が送られ、光源89の光が照射され
るようになつている。この光は矢印F2の如く原
稿で反射されて薄膜受光素子87に入射する。原
稿面の走査のうち送り方向の副走査は、図示しな
いモータ等によつて機械的に行われ、これと垂直
な主走査は、第4図に示した半導体スイツチを使
用することによつて電気的に行われるようになつ
ている。 The thin film light receiving element having the above configuration is arranged as shown in FIG. 5 in, for example, a facsimile transmitter. In this figure, a document (not shown) is fed from above the figure by a roller 88 rotating in the direction of arrow F1, and is irradiated with light from a light source 89. This light is reflected by the original as indicated by arrow F2 and enters the thin film light receiving element 87. Of the scanning of the document surface, the sub-scanning in the feed direction is performed mechanically by a motor (not shown), and the main scanning perpendicular to this is performed electrically by using the semiconductor switch shown in Figure 4. This is becoming more and more common.
従つて、第1図乃至第3図に示すように、電極
94の端部に何らかの原因で位置の不揃いが生ず
ると、機能部分である受光部95が影響を受け、
特性上のばらつきが生ずることとなる。このた
め、受光部95間で解像度が変化すなわち主走査
方向で解像度が不均一となるという不都合があ
る。 Therefore, as shown in FIGS. 1 to 3, if the ends of the electrodes 94 are misaligned for some reason, the light receiving section 95, which is a functional part, will be affected.
This results in variations in characteristics. Therefore, there is a problem that the resolution changes between the light receiving sections 95, that is, the resolution becomes non-uniform in the main scanning direction.
この発明は上記実情に鑑みてなされたものであ
り、各素子の解像度の不均一に低減せしめ、十分
に実用に供し得る薄膜受光素子を提供することを
その目的とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a thin film light-receiving element which can be sufficiently put to practical use by reducing the resolution of each element non-uniformly.
すなわち、この発明は、1つの受光部からなる
各素子毎の電極のうち引き出し部分の幅を狭くす
ることにより他の共通電極と交差する面積の均一
化を図ることによつて前記目的を達成し、解像度
の変動を低減せしめようとするものである。 That is, the present invention achieves the above object by narrowing the width of the lead-out portion of the electrode for each element comprising one light-receiving section, thereby making the area intersecting with other common electrodes uniform. , which attempts to reduce fluctuations in resolution.
以下、この発明にかかる薄膜受光素子を添付図
面に示す実施例に従つて詳細に説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS The thin film light receiving element according to the present invention will be described in detail below with reference to embodiments shown in the accompanying drawings.
第6図乃至第9図は、この発明にかかる薄膜受
光素子を示す図で、このうち第6図Aは全体の斜
視図、第6図Bは分解図、第7図は第6図Aの矢
印から見た平面図、第8図は第6図Aの矢印
から見た正面図である。更に第9図は電極の重な
りを示す説明図である。 6 to 9 are diagrams showing a thin film light receiving element according to the present invention, of which FIG. 6A is an overall perspective view, FIG. 6B is an exploded view, and FIG. 7 is a view of FIG. 6A. FIG. 8 is a plan view as seen from the arrow, and FIG. 8 is a front view as seen from the arrow in FIG. 6A. Furthermore, FIG. 9 is an explanatory diagram showing the overlapping of electrodes.
以上の第6図乃至第9図において、まず絶縁状
の材料から成る基板11上には、機能部分である
受光部15を構成するための幅LAを有する四角
形状の電極部22と、他の電極(以下「共通電
極」という)14の端部が変化する方向と垂直な
方向の幅がLBである、引き出し用の電極部21
とから成る複数の分割電極20と、他の電極の引
き出し用の略コ字状の電極12とが図示の如く形
成されている。このうち、分割電極20上には、
少なくとも電極部20を十分カバーするように光
電変換膜13が形成され、更に、この光電変換膜
13をカバーし、その端部が電極12に重なるよ
うに共通電極14が設けられている。この共通電
極14と、分割電極20との重なりの程度は第9
図の如くであつて、少なくとも電極部22は共通
電極14によつて十分カバーされるようになつて
いる。 6 to 9, first, on the substrate 11 made of an insulating material, there is a rectangular electrode portion 22 having a width LA for configuring the light receiving portion 15 which is a functional portion, and other An electrode section 21 for extraction, whose width in the direction perpendicular to the direction in which the end of the electrode (hereinafter referred to as "common electrode") 14 changes is LB.
A plurality of divided electrodes 20 and a substantially U-shaped electrode 12 for leading out other electrodes are formed as shown in the figure. Among these, on the divided electrode 20,
A photoelectric conversion film 13 is formed to sufficiently cover at least the electrode section 20 , and a common electrode 14 is further provided to cover this photoelectric conversion film 13 and have an end thereof overlapped with the electrode 12 . The degree of overlap between this common electrode 14 and the divided electrodes 20 is the ninth
As shown in the figure, at least the electrode portion 22 is sufficiently covered by the common electrode 14.
なお、以上の構成部分に使用する材料は、従来
と同様である。 Note that the materials used for the above-mentioned components are the same as conventional ones.
次に、分割電極20の形状について説明する。
第9図に示す如く、共通電極14と、分割電極2
0とは、前述したように、電極部22の部分にお
いては完全に交差して重なつており、この部分全
体が受光部15としての機能を有する。他方、電
極部21と、共通電極14とは、電極部22付近
において一部交差し、重なつているにすぎない。
この重なつた部分(以下「交差面積」という)に
ついては受光部としての機能を有する。この共通
電極14と電極部21との重なりの大きさを第9
図に示すようにLC(ただしLC≠0)とすると交
差面積SBは
SB=LC・LB ……(1)
となる。電極部22の面積すなわち受光部15の
面積をSAとすると、この部分のみによる信号に
対する余分な大きさの程度GSは
GS=SB/SA ……(2)
で表わされる。実用上許容されるGSの値として
は、信号の多値化の容易性あるいは信号処理回路
の設計上、コスト上の観点から0.1以上、したが
つてSBによる信号がSAによる信号の10%以下で
あることが望ましいことが判明した。すなわち、
GS≦0.1 ……(3)
一般に長さ(主走査方向)が100mm以上の大き
さの薄膜受光素子を作製しようとする場合には、
通常のパターニングの手段による限り概略±10μ
m程度の誤差が生ずるとされている。従つて、前
記重なりの大きさLCは、最大で20μm程度とな
る。従つてLAが100μm、SAが10000μm2程度す
なわち8ビツト/mm程度の解像度を有する薄膜受
光素子において、GSを0.1以下とするためには、
前記(1)乃至(3)式からLB≦50μmとなる。すなわ
ち、電極部22の幅LAに対し、その半分の幅LB
以下で電極部21を形成すれば、GS≦0.1となつ
て共通電極14の端部位置に不揃いが生じても、
受光部の解像度の変化ないしはばらつきを実用上
無視し得る程度に低減することが可能となる。 Next, the shape of the divided electrode 20 will be explained.
As shown in FIG. 9, the common electrode 14 and the divided electrode 2
0, as described above, completely intersect and overlap in the electrode portion 22, and this entire portion functions as the light receiving portion 15. On the other hand, the electrode section 21 and the common electrode 14 only partially intersect and overlap near the electrode section 22.
This overlapping portion (hereinafter referred to as "intersection area") has a function as a light receiving section. The size of the overlap between the common electrode 14 and the electrode part 21 is determined by the ninth
As shown in the figure, if LC is assumed (LC≠0), the intersection area SB is SB=LC・LB...(1). If SA is the area of the electrode section 22, that is, the area of the light receiving section 15, then the amount of extra signal GS due to only this section is expressed as GS=SB/SA (2). The practically acceptable value of GS is 0.1 or more from the viewpoint of ease of signal multi-level conversion, design of the signal processing circuit, and cost, so that the signal from SB is 10% or less of the signal from SA. It turns out that something is desirable. In other words, GS≦0.1...(3) Generally, when trying to fabricate a thin film photodetector with a length (main scanning direction) of 100 mm or more,
Approximately ±10μ as long as normal patterning methods are used.
It is said that an error of about m is generated. Therefore, the size of the overlap LC is approximately 20 μm at maximum. Therefore, in a thin film photodetector having a resolution of about 100 μm LA and 10000 μm 2 , that is, about 8 bits/mm, in order to make GS less than 0.1,
From the above formulas (1) to (3), LB≦50 μm. That is, with respect to the width LA of the electrode part 22, half the width LB
If the electrode part 21 is formed as follows, even if GS≦0.1 and unevenness occurs in the end position of the common electrode 14,
Changes or variations in the resolution of the light receiving section can be reduced to a practically negligible extent.
なお、参考までにこの発明に関して試作した装
置の数値例を示す。まず第1の試作例は、200℃
のガラス基板上にクロムを電子ビーム蒸着法によ
つて2000Åの厚さに蒸着したのち、通常のフオト
リソグラフイ法によつて第6図等に示す分割電極
20のパターンとする。幅LAは100μm、LBは
25μmである。また、電極部22は正方形状とす
る。次に、この電極上に光電変換膜13として水
素化アモルフアスシリコン膜をプラズマCVD法
によつて1μmの厚さに形成する。更にこの上に
透明電極すなわち光入射電極を適宜のマスクを介
して100Åの厚さに形成する。このとき、LCは、
同一の素子内で30乃至40μm、また素子間では10
乃至40μmであつた。 For reference, a numerical example of a device prototyped in connection with this invention is shown. First of all, the first prototype example is 200℃
After chromium is deposited to a thickness of 2000 Å on a glass substrate by electron beam evaporation, a pattern of divided electrodes 20 as shown in FIG. 6 is formed by ordinary photolithography. Width LA is 100μm, LB is
It is 25 μm. Further, the electrode portion 22 has a square shape. Next, a hydrogenated amorphous silicon film with a thickness of 1 μm is formed as a photoelectric conversion film 13 on this electrode by plasma CVD. Furthermore, a transparent electrode, ie, a light incident electrode, is formed on this layer through a suitable mask to a thickness of 100 Å. At this time, LC is
30 to 40μm within the same element, and 10μm between elements
The thickness was between 40 μm and 40 μm.
以上のように作製した薄膜受光素子において、
各素子毎の出力信号を測定したところ、素子内で
±2%、素子間で±5%であり、上記(3)式を十分
満たすという結果が得られた。 In the thin film photodetector fabricated as described above,
When the output signal of each element was measured, it was found that it was ±2% within an element and ±5% between elements, which sufficiently satisfied the above equation (3).
次に第2の試作例は、セラミツクの上に10μm
の厚さでガラスを形成した基板を250℃に加熱し
た状態で、クロムを電子ビーム蒸着法によつて
3000Åの厚さに蒸着する。同様に第6図等に示し
た分割電極20の如くパターン加工を行う。幅
LAは80μm、幅LBは20μmである。なお光電変
換膜13及び共通電極14については、第1の試
作例と同様である。 Next, the second prototype example is a 10 μm thick film on ceramic.
Chromium was deposited on a glass substrate heated to 250°C using electron beam evaporation.
Deposit to a thickness of 3000 Å. Similarly, a pattern such as the divided electrode 20 shown in FIG. 6 etc. is processed. width
LA is 80 μm and width LB is 20 μm. Note that the photoelectric conversion film 13 and the common electrode 14 are the same as in the first prototype example.
この例において、LCは同一の素子内で20乃至
30μm、素子間で10乃至40μmであつた。同様に
各素子毎の出力信号を測定したところ、素子内で
±3%、素子間で±6%であつた。 In this example, LC varies from 20 to 20 within the same device.
The distance between the elements was 30 μm, and the distance between the elements was 10 to 40 μm. Similarly, when the output signal of each element was measured, it was ±3% within an element and ±6% between elements.
なお、上記実施例あるいは試作例においては、
基板11と光電変換膜13との間に介装される電
極を分割電極としたが、この電極を各素子に対し
て共通電極とし、他方共通電極14を各素子毎の
分割電極としてもよい。 In addition, in the above embodiment or prototype example,
Although the electrode interposed between the substrate 11 and the photoelectric conversion film 13 is a divided electrode, this electrode may be used as a common electrode for each element, and the common electrode 14 may be used as a divided electrode for each element.
以上説明したように、この発明にかかる薄膜受
光素子によれば、各素子ないしは各受光部ごとの
分割電極のうち引き出し部分の幅を狭くすること
によつて電極間の交差面積のばらつきを低減する
こととしたので、各素子の特性の均一性を向上さ
せることができ、解像度の不均一を実用上十分無
視できる程度に低減せしめることができるという
すぐれた効果を奏する。 As explained above, according to the thin film light receiving element according to the present invention, by narrowing the width of the lead-out portion of the divided electrode of each element or each light receiving part, variations in the cross area between the electrodes can be reduced. As a result, the uniformity of the characteristics of each element can be improved, and the non-uniformity of resolution can be reduced to a practically negligible level, which is an excellent effect.
第1図Aは従来の薄膜受光素子を示す斜視図、
同図Bは分解図、第2図は平面図、第3図は正面
図である。第4図は駆動回路の一例を示す回路
図、第5図は使用状態を示す斜視図である。第6
図はAはこの発明にかかる薄膜受光素子を示す斜
視図、同図Bは分解図、第7図は平面図、第8図
は正面図、第9図は電極の重なりを示す説明図で
ある。
11……共通電極、15……受光部、20……
分割電極、21……引き出し部分、22……受光
部形成部分、TA,TB……電極の幅。
FIG. 1A is a perspective view showing a conventional thin film light receiving element;
Figure B is an exploded view, Figure 2 is a plan view, and Figure 3 is a front view. FIG. 4 is a circuit diagram showing an example of the drive circuit, and FIG. 5 is a perspective view showing the state of use. 6th
In the drawings, A is a perspective view showing a thin film light receiving element according to the present invention, B is an exploded view, FIG. 7 is a plan view, FIG. 8 is a front view, and FIG. 9 is an explanatory view showing overlapping of electrodes. . 11... common electrode, 15... light receiving section, 20...
Divided electrode, 21... Extraction portion, 22... Light receiving portion forming portion, TA, TB... Width of electrode.
Claims (1)
と、透光性の共通電極とを順次堆積した薄膜受光
素子であつて、 前記分割電極は、導電性材料からなる受光部形
成部分と、これと同一材料からなり、該受光部形
成部分から延びる引き出し部分とを有して構成さ
れ、 前記引き出し部分は、その幅が前記受光部形成
部分の幅よりも狭く形成され、 前記受光部形成部分及び引き出し部分の一部が
共に前記光導電層及び前記共通電極によつて覆わ
れるよう前記光導電層及び前記共通電極が堆積さ
れる ことを特徴とする薄膜受光素子。[Claims] 1. A thin film light-receiving element in which a plurality of divided electrodes, a photoconductive layer, and a transparent common electrode are sequentially deposited on an insulating substrate, wherein the divided electrodes are made of a conductive material. a light-receiving portion forming portion; and a draw-out portion made of the same material and extending from the light-receiving portion-forming portion, the width of the draw-out portion being narrower than the width of the light-receiving portion forming portion. A thin film light receiving element, wherein the photoconductive layer and the common electrode are deposited so that both the light receiving part forming part and a part of the extraction part are covered by the photoconductive layer and the common electrode.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57082927A JPS58199561A (en) | 1982-05-17 | 1982-05-17 | Thin film photodetector |
US06/494,666 US4567374A (en) | 1980-12-10 | 1983-05-16 | Photoelectric converting device with a plurality of divided electrodes |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57082927A JPS58199561A (en) | 1982-05-17 | 1982-05-17 | Thin film photodetector |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58199561A JPS58199561A (en) | 1983-11-19 |
JPH0572111B2 true JPH0572111B2 (en) | 1993-10-08 |
Family
ID=13787862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57082927A Granted JPS58199561A (en) | 1980-12-10 | 1982-05-17 | Thin film photodetector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58199561A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0734464B2 (en) * | 1986-07-24 | 1995-04-12 | 株式会社東芝 | Reader |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5341192A (en) * | 1976-09-28 | 1978-04-14 | Nippon Telegr & Teleph Corp <Ntt> | Photoelectric conversion element |
JPS5349981A (en) * | 1976-10-18 | 1978-05-06 | Nippon Telegr & Teleph Corp <Ntt> | Photoelectric conversion element |
JPS5420687A (en) * | 1977-07-18 | 1979-02-16 | Nippon Telegr & Teleph Corp <Ntt> | Photo detecting array |
JPS54116890A (en) * | 1978-03-03 | 1979-09-11 | Hitachi Ltd | Photoelectric converter |
JPS5848456A (en) * | 1981-09-17 | 1983-03-22 | Fuji Electric Corp Res & Dev Ltd | pattern detector |
-
1982
- 1982-05-17 JP JP57082927A patent/JPS58199561A/en active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5341192A (en) * | 1976-09-28 | 1978-04-14 | Nippon Telegr & Teleph Corp <Ntt> | Photoelectric conversion element |
JPS5349981A (en) * | 1976-10-18 | 1978-05-06 | Nippon Telegr & Teleph Corp <Ntt> | Photoelectric conversion element |
JPS5420687A (en) * | 1977-07-18 | 1979-02-16 | Nippon Telegr & Teleph Corp <Ntt> | Photo detecting array |
JPS54116890A (en) * | 1978-03-03 | 1979-09-11 | Hitachi Ltd | Photoelectric converter |
JPS5848456A (en) * | 1981-09-17 | 1983-03-22 | Fuji Electric Corp Res & Dev Ltd | pattern detector |
Also Published As
Publication number | Publication date |
---|---|
JPS58199561A (en) | 1983-11-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2702131B2 (en) | Image reading apparatus and image information reading apparatus having the same | |
JPS622462B2 (en) | ||
GB2154368A (en) | Image reading unit using two-dimensional sensor array | |
US4714836A (en) | Photosensitive pixel with exposed blocking element | |
US5629517A (en) | Sensor element array having overlapping detection zones | |
US4567374A (en) | Photoelectric converting device with a plurality of divided electrodes | |
EP0119742B1 (en) | Two-dimensional image readout device | |
US4659920A (en) | Image sensor arrays with series redundancy | |
US4887166A (en) | Direct-contact-type image sensor | |
JPH0572111B2 (en) | ||
JPH0449787B2 (en) | ||
JPS6211792B2 (en) | ||
JPH0337744B2 (en) | ||
JPH022302B2 (en) | ||
JPS6322465B2 (en) | ||
JPH0747874Y2 (en) | Contact image sensor | |
JP2501107B2 (en) | Photoelectric conversion device | |
JP2573342B2 (en) | Light receiving element | |
JPH01302762A (en) | Contact type image sensor | |
JPS58171849A (en) | solid state imaging device | |
JPH021866Y2 (en) | ||
JPH0447973Y2 (en) | ||
JPS6211545B2 (en) | ||
JPH0567765A (en) | Image sensor | |
JPH0682851B2 (en) | Photo sensor array |