JPH0568856B2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to semiconductor manufacturing equipment, and in particular to a general-purpose bonder, typified by a wire bonder, that achieves consistent automation and high processing efficiency of assembly into various types of lead frames. It is something.

[Background technology]

With the increase in the variety of semiconductor devices such as ICs and LSIs in recent years, general-purpose machines capable of manufacturing a wide variety of semiconductor manufacturing equipment are being used instead of specialized machines that produce only one type of semiconductor manufacturing equipment. For example, the same applies to pellet bonders for fixing element pellets on lead frames and wire bonders for connecting ultrafine wires between fixed pellets and lead frames, and these devices are becoming more and more versatile.

By the way, taking a wire bonder as an example, in a wire bonder, a lead frame (referred to as a workpiece) to which element pellets are fixed is placed on a bonding stage, and then multiple parts are formed using a transfer mechanism called a frame feeder. A method is adopted in which the workpiece is moved in steps and bonding parts on the workpiece are sequentially set at positions corresponding to the bonding tool to perform wire bonding. When step-feeding the workpiece at this time, a mechanism is established in which a feed pin on the frame feeder side is fitted into a positioning hole formed in the workpiece, and the workpiece is integrally moved using this feed pin. It's being used. In this case, the frame feeder is configured based on the type of workpiece, that is, the shape, dimensions, etc. of the workpiece, and it goes without saying that the feed pin in particular is configured to fit into the positioning hole of the workpiece.

For this reason, even though there is a demand for general-purpose equipment as mentioned above, the shapes and dimensions of each workpiece, as well as the position and dimensions of positioning holes, etc., differ depending on the product type (currently lead frames (These standards differ depending on each manufacturer.), accurate positioning using the frame feed described above is impossible for different types of workpieces. Therefore, in conventional devices of this type, the bonding stage or frame feeder is made into a unit.
These can be exchanged depending on the product type to support generalization.

However, with this approach, the unit must be replaced every time the product type changes, and the replacement work as well as subsequent adjustment work is extremely troublesome and takes a long time, resulting in poor work efficiency and manufacturing efficiency. There is. There is also the problem that an operator must perform an operation every time the product type changes, making it impossible to achieve consistent automation of the device.

A detailed explanation of wire bonding technology can be found in Electronic Materials published by the Industrial Research Council in 1982.
November issue special issue, published November 15, 1981, p163-p168
There is.

[Purpose of the invention]

The purpose of the present invention is to eliminate the need to replace parts of devices such as frame feeder units for different types of workpieces, to improve work efficiency, and to enable the equipment itself to automatically follow changes in types to ensure accurate work. The purpose of the present invention is to provide an automatic, general-purpose bonder that enables (consistent) bonding.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the bonder of the present invention includes a moving means for substantially continuously moving a workpiece placed on a bonding stage facing a bonding tool in the length direction along a frame chute, and a moving means for detecting at least a portion of the workpiece. a first detection means for detecting workpiece position information, a second detection means for detecting workpiece type information, and movement based on the workpiece position information and type information obtained from the first and second detection means. and a control means for controlling the means, the moving means comprises a pinch roller that pinches the workpiece and transports and positions the workpiece by forward and reverse motion, and the first detection means is disposed at the bonding position. an imaging device that detects an image of at least a portion of the workpiece and identifies the position of the workpiece; The apparatus includes an imaging device that detects the relative positional relationship between the bonding site on the workpiece and the bonding position, and automatically positions the workpiece at a predetermined bonding position.

The bonder of the present invention also includes a moving means for substantially continuously moving the workpiece placed on the bonding stage facing the bonding tool in the length direction along the frame chute, and a moving means for moving the frame chute in the feeding direction. A chute moving means performs a positioning operation in the width direction of the workpiece by moving it in an orthogonal direction, and a chute moving means detects at least a part of the workpiece and determines the position of the workpiece on the frame chute and the bonding site on the workpiece. a first detection means for detecting workpiece position information;
a second detection means for detecting workpiece type information;
It is equipped with a control means for controlling a moving means and a chute moving means based on workpiece position information and product type information, and performs a positioning operation of a bonding part on a workpiece with respect to a bonding position in the length direction and width direction of the workpiece. be.

This eliminates the need for complicated operations such as replacing component parts even when bonding workpieces of different types, improving work efficiency.

In addition, since the workpiece is accurately positioned at the bonding position, the equipment itself can automatically follow changes in product types and perform accurate bonding, leading to integrated automation of the bonding process and generalization of bonders. It can be realized.

The present invention is particularly effective when applied to wire bonders and pellet bonders.

Embodiment 1 FIGS. 1 to 5 show an embodiment of the present invention, and in particular, are diagrams showing the overall configuration of a stand-alone wire bonder to which the present invention is applied.

As shown in the figure, this wire bonder 1 is driven by a motor 3 etc. from the rear of the top surface of the machine base 2.
An XY table 4 is provided, and a lightweight bonding head 5 is mounted on the XY table 4. This bonding head 5 is equipped with a cam mechanism (not shown).
By vertically swinging the bonding arm 6 that projects forward, a bonding tool (capillary) 7 fixed to the tip of the arm 6 can be moved up and down. Further, a cupanra 8 and a wire guide 9 are protruded from the bonding head 5 located above the bonding arm 6, and a spool 10 is provided above the bonding head 5. An extremely thin wire 11 for wire bonding is wound around the structure (structure), and this wire 11 is passed between the wire guide 9 and the clamper 8, and its tip is inserted into the bonding tool 7. The clamper 8 is also driven by the cam mechanism. Further, in the upper part of the bonding head 5, there is specifically an optical system 12 which is an imaging device for detecting the position of a workpiece for automatic wire bonding such as detecting the pellet position on the lead frame and the lead position of the lead frame. A TV camera 13 (first detection means) is installed to take an enlarged image of the work being moved onto the bonding stage 17, which will be described later, and detect the pellet position, lead position, or both by a recognition device (not shown). detection and enables bonding position control. Furthermore, a microscope 15 is disposed alongside the TV camera 13, allowing the operator to enlarge and observe the workpiece.

On the other hand, a stage frame 16 is provided on the machine stand 2 in front of the bonding head 5, and a bonding stage 17 is configured here. stage frame 1
A frame chute 18 consisting of a pair of chute arranged in parallel in the front-rear direction and extending in the left-right direction is provided on the frame chute 6, and a frame feeder 19 as a workpiece moving means is provided adjacent to the frame chute 18.
is arranged, the workpiece fed into the frame chute 18 is moved from left to right in FIG. 1 by the action of the frame feeder 19, and stopped at a position directly below the bonding tool 7,
Perform the wire bonding described above on the workpiece.
A heat block 20 is arranged below the frame shoot 18.
Heating a workpiece that is moved over and stopped.
Further, a case 21 containing workpieces is set on the left side of the bonding stage 17, and a loader 22 (second detection means) is provided for taking out the workpieces one by one and sending them to the frame chute 18. Set the empty case 23 on the right side,
An unloader 24 is provided for storing the workpiece, which has been moved to the right end of the frame chute 18 and has undergone wire bonding, into a case. In addition,
In FIGS. 1 to 3, reference numeral 25 designates various units housing electric circuit components, etc., 26 an ultrasonic oscillator provided as necessary, 27 an operation panel, and 28 a manipulator.

The structure of the bonding stage 17 is changed to the fourth
As shown in FIG. A pair of chute 30, 30 constituting the frame chute 18 as a chute moving means are each configured as a rail member having a substantially U-shaped cross section, and grooves 30a, 3, respectively.
0a facing each other and the lead frame
Both sides of the work illustrated in are exactly these grooves 30a,
They are arranged at appropriate intervals so that they can penetrate into 30a. In this example, brackets 31, 31 are integrally fixed to these chutes 30, 30, and these brackets 31, 31 are connected by motors 32, 32 (shute moving means) and gear mechanisms 33, 33. Axially rotated screw 34,
34 are screwed together in the width direction (direction perpendicular to the length direction) of the chute 30, 30. These motors 3
2, 32, gear mechanism 33, 33, screw 34,
34 constitutes a chute adjustment section 35, and the motor 3
Gear mechanisms 33, 3 by driving 2, 32
The screws 34, 34 are rotated through the screws 3, whereby the chute 30, 30 is independently slightly moved in the width direction, and the position in the width direction is finely adjusted.

The frame feeder 19 is located at several locations along the length of the frame chute 18 (two locations in this example).
Pinch rollers 36, 36 (moving means) arranged in
has. The pinch rollers 36, 36 are connected to upper and lower drive shafts 3 extending in the width direction of the chute 18, respectively.
7, 37 and reversing shafts 38, 38, for example, resin rollers 39, 39, and in particular springs 40, 4 hung on the reversing shafts 38, 38.
With zero force, each roller 39, 39 holds the workpiece X between the upper and lower sides. The drive shaft 37, 3
The motors 41 and 41 are attached with a rotation angle detection mechanism and gear mechanisms 42 and 42 (not shown) to constitute a roller drive section 43, and by driving the motors 41 and 41, the drive shaft is connected via the gear mechanisms 42 and 42. 3
7, 37 and rollers 39, 39 can be rotated in the forward or reverse direction, thereby allowing the workpiece X to be moved along the frame chute 18. In this case, by driving the motors 41, 41 to rotate at a desired angle, the rollers 39, 39 are also rotated, and the pinch rollers 19, 19 can feed the work X by a desired amount.

As shown in FIG. 4, the heat block 20 includes a plurality of (four in this example) block portions 46a to 46d divided in the length direction on a support block 45 supported at the upper end of a vertically moving shaft 44. are arranged in a row via heat insulating walls 47a to 47c. and,
Inside each block portion 46a to 46d, heaters 48a to 48d and temperature sensors 49a to 49 are provided independently.
d is buried, and each heater 48a to 48d and temperature sensor 49a to 49d form a pair to control the temperature control unit 5.
0a to 50d, and further temperature distribution control section 51
is connected to. Here, the temperature control units 50a to 5
0d can be feedback-controlled to the set temperature using the temperature heaters 48a to 48d and temperature sensors 49a to 49d of each of the block parts 46a to 46d, and the temperature distribution control part 51 controls the temperature of each of the temperature control parts 50a to 50d. You can control the set temperature. The heat block 20 contacts the lower surface of the work X on the frame shoot 18 and heats the work X to a temperature suitable for wire bonding.

In addition to this configuration, as shown in FIG. can be centrally controlled. Of course, the central control section 52 includes the cam mechanism of the bonding head 5 and the like.
The drive systems of the XY table 4 may be associated. The central control unit 52 is configured to receive the signal S ₁ from the TV camera 13 and the work type signal S ₂ from the loader 22, and uses an internal arithmetic circuit to
The optimal bonding position and temperature (including temperature distribution) of the workpiece are calculated. It goes without saying that the central control section 52 is usually mainly composed of a microcomputer and stores various data. Next, the operation of the wire bonder having the above configuration will be explained. A workpiece (in this case, a lead frame to which an element pellet is fixed) taken out from inside the case 21 set in the loader 22 is placed in the grooves 30a and 30 of the chute 30 on both sides by a loader mechanism (not shown).
It is moved to the frame chute 18 while being guided within a. At this time, the type of workpiece X and other data are sent to the central control unit 52 as a signal _S2 . The adjustment signal from the control section 52 is also output to the chute adjustment section 53 in advance, and one or both of the chute 30, 30 is slightly moved in the width direction, and finally both chute 30, 30 adjusts both sides of the workpiece X. be held with enough clearance to allow movement. Thereby, the position of the work X in the width direction can be determined. The workpiece X transferred onto the frame chute 18 is held by the pinch rollers 19 on its upper and lower surfaces, and is rotated by the action of the roller drive section 43.
8 in the length direction. Then, when the workpiece X configured as a multiple lead frame has been moved to the vicinity of the first bonding position,
The TV camera 13 detects the workpiece X, stops the movement of the pinch roller 19 via the central control unit 52, and images the surface of the workpiece X to capture the element pellet pattern (pad position), lead shape, outer shape of the workpiece, etc. The central control unit 5 uses the pattern as the signal _S1 .
Send to 2. In the central control unit 52, the above-mentioned signal
Based on S ₂ and this signal S _1, determine the optimal position and current position of the workpiece X, as well as its displacement amount, output an adjustment signal based on this to the roller drive unit 43, and rotate the pinch roller by the required rotation angle. let Thereby, the pinch roller 19 operates in the forward or reverse direction to slightly move the workpiece X and determine the position of the workpiece X in the length direction. During movement and positioning, the heating block and presser plate are retracted to a position where they do not come into contact with the workpiece in order to improve positional accuracy. Furthermore, at the same time or in advance, information regarding the temperature is output from the central control section 52 to the temperature distribution control section 51.
1, a heat block 20 is used to perform optimal heating based on the material, shape, dimensions, etc. of the workpiece.
The entire temperature distribution (gradient) is calculated, and a set temperature signal is outputted from this to each temperature control section 50a to 50d. As a result, each temperature control section 50a to 5
0d independently sets the temperature of each block 46a to 46d by feedback control, and heats the workpiece X appropriately. Wire bonding using the bonding tool 7 is carried out as usual, and its explanation will be omitted.

When the first bonding is completed, a signal from the central control section 52 is outputted to the roller drive section 43 based on the pitch dimension data of the work X, and the pinch roller 19 moves the work X by the pitch dimension amount. Here, as in the case described above, the workpiece position is accurately set by slight rotation of the pinch roller 19. At this time, there is no need to adjust the frame shoot 18, but adjustment may be made if necessary.
Further, the heat block 20 may also adjust the temperature distribution appropriately as the workpiece X moves.

In this way, the workpiece X that has been bonded to a certain level is moved to the right by the pinch roller 19, and is moved to the right by the unloader 24 at the right end of the frame chute 18 by an unloader mechanism (not shown). Then, it is stored in the case 23, and a series of steps are completed. The next workpiece X is supplied onto the frame shoot 18. If this workpiece By carrying out the above-mentioned actions, optimal wire bonding can be performed.

Here, the pinch roller 19 roughly adjusts the position of the work X according to the pitch dimension of the work X without performing minute position adjustment of the work X by the pinch roller 19.
After setting the position of the work X from the reference position using the TV camera 13, the bonding tool (bonding head 5 and
Wire bonding can also be performed by controlling the XY table 4) side. However, in this case, highly accurate temperature control by the heat block 20 becomes difficult.

Therefore, according to this example, even if the types of workpieces to be wire bonded are different, there is no need to replace the frame feeder unit, etc.
It is possible to automatically wire bond various types of workpieces with high precision and high quality without interrupting work. In other words, a general-purpose wire bonder can be constructed.

Embodiment 2 FIG. 6 shows a continuous processing type wire bonder 6 using the present invention.
This is an example applied to 0, and its overall configuration diagram is shown.

In the figure, the wire bonder 60 is placed downstream of the pellet bonder 61 (a baking oven and a buffer are arranged between the wire bonder 61 and the pellet bonder 61), and element pellets are fixed to the lead frame as the work X by the pellet bonder 61. , the work X is directly moved to the wire bonder 60 and wire bonding is performed.

The wire bonder 60 has a bonding head 6 having a bonding tool 62 as in the previous example.
3 and a bonding stage 64, and the bonding stage 64 is provided with a frame chute 66 as a frame feeder 65, a pitch roller 67, and the like. Furthermore, the bonding head 63 is also provided with a TV camera 68 (first detection means) for capturing an image of the work X.

However, this wire bonder 60 is not provided with a loader or an unloader, but instead has a preliminary stage 69 disposed immediately upstream. This preliminary stage 69 includes, for example, a motor 70 and a pulley 7.
1. A transfer conveyor 73 consisting of a belt 72 and the like is provided to transfer the workpiece X sent from the pellet bonder 61 from the left to the right in the figure, and finally to the frame chute 66 via a conveyor not shown. Additionally, there is a TV above this preliminary stage 68.
A camera 74 (second detection means) is arranged and can image the work X on the conveyor 73. This TV camera 74 is the TV camera 68 of the wire bonder 60.
It is also connected to a central control unit (same as in Example 25) 75 (control means) to send out imaging data signals of the respective workpieces. The central control section 75 controls the chute adjustment section 66A, the roller drive section 67A, and the temperature distribution control section 77 of the heat block 76 in the bonding stage 64.

According to this configuration, when the pellet-bonded workpiece X is transferred onto the preliminary stage 69, the transfer conveyor 73 is operated and the transfer of the workpiece X is started. Then, when the workpiece X has been transferred to approximately the center position, the transfer conveyor 73 is temporarily stopped, and the workpiece X is imaged by the TV camera 74. This imaging data is sent to the central control unit 75, where the type, shape, dimensions, etc. of the workpiece X are confirmed and stored, and the optimal position for wire bonding of the workpiece Bonding stage 64
The data is converted to

Thereafter, the transfer conveyor 73 moves again to transfer the workpiece X to the right end, and further moves it to the frame chute 66 on the bonding stage 64 by a conveyor (not shown). In the bonding stage 64, the chute adjustment section 66A and the roller drive section 67 have already been adjusted based on the data from the previous preliminary stage 69.
A. Since the temperature distribution control section 77 is controlled,
By using this together with the imaging data from the TV camera 68, it is possible to quickly set the optimal bonding conditions for the workpiece X. The functions of the frame shoot 66, pitch roller 67, and heat block 76 by the shoot adjustment section 66A, roller drive section 67A, and temperature distribution control section 77 are generally the same as in the previous example. Thereby, optimal wire bonding can be quickly and automatically performed for various types of workpieces.

Here, in order to improve the efficiency of wire bonding, a plurality of wire bonders 80 (three in the figure) may be arranged in parallel as shown in FIG. Each wire bonder 80 includes a frame supply conveyor section 81, a frame discharge conveyor section 82, and a loader side frame transfer conveyor section 8, which are moved in the direction of the arrow shown in the figure.
3. It has a loading conveyor section 84, an unloading conveyor section 85, and an unloader side frame transfer conveyor section 86. In particular, this unloader side frame transfer conveyor section 86 can also reciprocate in the direction of the double arrow.

Therefore, the work X transferred onto the preliminary stage 87 at the most upstream position of these wire bonders 80 is sequentially transferred to the right by the frame supply conveyor section 81, and is sequentially transferred to the loader side frame of each wire bonder 80. It is scooped up by the loading conveyor section 83 and transferred to each loading conveyor section 84, and then transferred to the frame chute 89 of the bonding stage 88. The wire-bonded works X are transferred from the unloading conveyor section 85 to the frame transfer conveyor section 8 on the unloader side.
6, and further transferred to the frame discharge conveyor section 82.
It is then transferred to the right storage section 93. In the figure, 94 is a bonding head, and 95 is a bonding tool.

Since each wire bonder 80 operates in parallel,
There is no waiting time for work X, and efficient bonding can be performed. In addition, each wire bonder 80 receives data and control signals for the workpieces transferred one after another through the TV camera 90 and central control unit 91 of the preliminary stage 87, and based on this data, each bonding stage 88 controls the frame shoot and pitch roller. , and a heat block (none of which are shown), and can set optimum bonding conditions in cooperation with its own TV camera 92.

Note that in each wire bonder 80, the loader side frame transfer conveyor section 83, loading conveyor section 84, and unloading conveyor section 85 can be removed and a loader case and an unloader case can be attached instead. It can also be used as a standalone machine.

Embodiment 3 FIG. 8 is a plan view of an embodiment in which the present invention is applied to a pellet bonder. pellet bonder 100
has a bonding head 102 and a bonding stage 103 on a machine stand 101, and the bonding head 102 has a bonding arm with a collect 104 as a bonding tool that grips an element pellet Y and fixes it onto a work X such as a lead frame. It is fixed to the tip of 105. Also, stage 1 is mounted on the bonding head 102.
A TV camera 106 (first detection means) is attached facing upward.

On the other hand, on the bonding stage 103, there is a frame shoot 107, which is roughly similar to the first embodiment.
A pinch roller 108 and a heat block 109 are provided, and the work X guided to the frame chute 107 is moved to the right in the figure by the pinch roller 108, stopped at the bonding position, and is heated by the heat block 109. Also,
A pellet intermediate receiving section 110 is disposed in a part of the stage, and element pellets Y to be bonded are conveyed from a wafer position (not shown) to this pellet intermediate receiving section 110 by a supply system 111. The collet 104 is attached to the pellet Y on this intermediate receiving part 110.
This is carried onto the workpiece at the bonding position, where it is fixed.

A work supply section 112 is arranged upstream of the pellet bonder 100. The work supply section 112 has a case feeder 114 that supports a plurality of cases 113, each housing a different type of work, in parallel.The case feeder can be moved in the direction in which the case feeders are arranged side by side by means of a driving means 115 such as a belt mechanism. A loader 116 is located below the feeder 114.
The case 113 on the feeder 114 stopped on the loader 116 can be moved to the right in the figure. A take-out mechanism 117 having a lifter or pusher structure is provided on the right side of the loader 116, and the workpiece X in the case 113 can be taken out onto the adjacent preliminary chute 118. A preliminary chute 118 is connected to the frame chute 107 of the pellet bonder 100,
A TV camera 119 (second detection means) is installed above it. Then, this TV camera 119 is connected to the central control unit 1 along with the TV camera 106.
20 (control means), and further connected to each part of the bonding stage 103. Also,
The driving means 112 of the case feeder 114 is driven by a feeder control section 121, and a pellet type signal from the pellet supply section 111 is inputted to the feeder control section 121.

According to the above configuration, the pellet type signal is input to the feeder control section 121 at the same time that pellets are supplied from the pellet supply section 111 to the intermediate receiving section 110. Then, the feeder control section 121 selects a workpiece suitable for the pellet, and operates the case feeder 114 by the drive means 115 to move and position the desired case 113 onto the loader 116. Then, the loader 116
3 from the feeder 114, and the extraction mechanism 117
The work X in the case 113 is transferred onto the preliminary chute 118.

In the preliminary shoot 118, a TV camera 119 images the workpiece X, sends the signal to the central control unit 120, and confirms the type of workpiece and its suitability based on the shape, dimensions, etc. of the workpiece. In addition, the relative position of the tab on the workpiece X can also be taken in as data. Then, the work X is transferred to the frame shoot 107 of the pellet bonder 100,
Here, the pinch roller 108 performs transfer and position setting. At this time, the chute adjustment section,
A signal from the central control unit 120 is input to the roller drive unit and the temperature distribution control unit (none of which are shown).
Needless to say, the chute 107, the pinch roller 108, and the heat block 109 are each controlled to set the workpiece X to optimal bonding conditions.

Here, if the relative positions of the preliminary chute 118 and the frame chute 107 can be maintained constant or in a specific relationship, either the TV camera 106 or 119 can be omitted. Moreover, either one can be replaced with another detector such as a position detection sensor.

According to this example, even when pellet bonding is performed on semiconductor devices of different types, there is no need to replace the work housing case or the frame feeder unit of the bonding stage every time the type is changed, and the bonding process is automatically performed. Moreover, pellet bonding of a wide variety of types can be performed continuously with high precision.

〔effect〕

(1) A moving means for substantially continuously moving the workpiece placed on the bonding stage facing the bonding tool in the length direction along the frame chute, and a means for detecting at least a part of the workpiece to obtain workpiece position information. a first detection means for detecting the workpiece type information; a second detection means for detecting the workpiece type information; and control for controlling the moving means based on the workpiece position information and the type information obtained from the first and second detection means. The moving means includes a pinch roller that pinches the workpiece and transports and positions the workpiece by forward and reverse motion, and the first detection means is disposed at the bonding position and detects at least one of the workpieces. An imaging device that detects a part of the image to identify the position of the workpiece, or an imaging device that is placed upstream of the bonding position in the movement direction of the workpiece and detects at least a part of the image of the workpiece to identify the position of the workpiece. It consists of an imaging device that detects the relative positional relationship between the upper bonding part and the bonding position, and has a structure that automatically positions the workpiece at a predetermined bonding position, so that the type of workpiece obtained from the second detection means can be easily detected. By controlling the moving means consisting of pinch rollers based on the workpiece position information obtained from the data and the first detection means, bonding parts of various workpieces can be automatically set to bonding positions, and workpieces of different types can be automatically set to bonding positions. Even in bonding work, complicated work such as replacing component parts is no longer necessary, improving work efficiency.

In addition, the equipment itself can automatically follow changes in product types and perform accurate bonding.
It is possible to realize integrated automation of the bonding process and general-purpose bonders.

(2) A moving means for substantially continuously moving the workpiece placed on the bonding stage facing the bonding tool in the length direction along the frame chute, and moving the frame chute in a direction perpendicular to the feeding direction. A chute moving means for positioning the workpiece in the width direction and at least a part of the workpiece are detected by detecting the workpiece position on the frame chute and the workpiece position information such as the bonding site on the workpiece. a first detection means for detecting workpiece type information, a second detection means for detecting workpiece type information, and a control means for controlling the movement means and the chute movement means based on the workpiece position information and type information. of the bonding area,
Since the positioning operation for the bonding position in the length direction and width direction of the workpiece is automatically performed, there is no need for complicated work such as replacing component parts, even when bonding workpieces of different types with various width dimensions. Increased efficiency.

In addition, the equipment itself can automatically follow changes in product types and perform accurate bonding.
It is possible to realize integrated automation of the bonding process and general-purpose bonders.

(3) The heat block installed in the bonding stage is divided in the length direction, and each block is configured so that the temperature can be controlled independently.
The heating temperature distribution of the workpiece can be set to a desired distribution.

[Application field]

In the above explanation, the invention made by the present inventor was mainly applied to the bonding technology of a lead frame type semiconductor device, which is the background field of application, but the invention is not limited to this. It can be applied to semiconductor devices using ceramic bases or other package bases, and also as a device for processing workpieces other than semiconductor devices.

[Brief explanation of drawings]

FIG. 1 is a front view of the first embodiment of the present invention, FIG. 2 is a side view, FIG. 3 is a plan view, FIG. 4 is a front view of the main parts of the bonding stage, and FIG. 5 is a side view thereof. FIG. 6 is a schematic front view of the second embodiment, FIG. 7 is a schematic plan view of a modified example, and FIG. 8 is a schematic plan view of the third embodiment. 1...Wire bonder, 4...XY table, 5
...Bonding head, 7...Bonding tool (capillary), 11...Wire, 13...
TV camera, 17...Bonding stage, 1
8... Frame shoot, 19... Frame feeder, 20... Heat block, 22... Loader, 24... Unloader, 30... Shoot, 3
5...Chute adjustment section, 36...pinch roller,
43...Roller drive section, 46a-46d...Block section, 50a-50d...Temperature control section, 51...
...Temperature distribution control section, 52... Central control section, 60...
...Wire bonder, 61...Pellet bonder, 62
...Bonding tool, 63...Bonding head, 64...Bonding stage, 66...
...Frame shoot, 67...Pinch roller, 6
8...TV camera, 69...Preliminary stage, 73
...Transfer conveyor, 74...TV camera, 75...
...Central control unit, 76...Heat block, 80...
...Wire bonder, 87...Preliminary stage, 88...
...Bonding stage, 100...Pellet bonder, 102...Bonding head, 103...
Bonding stage, 104...Collection, 1
06...TV camera, 107...Frame shoot, 108...Pinch roller, 109...Heat block, 110...Pellet intermediate receiver, 112
... Work supply section, 114 ... Case feeder,
116...Loader, 118...Spare chute, 1
19...TV camera, 120...Central control unit, 1
21...Feeder control unit, X...Work (lead frame), Y...Pellet.

Claims (1)

[Claims] 1. A moving means for substantially continuously moving a workpiece placed on a bonding stage facing a bonding tool in the length direction of the frame chute, and detecting at least a portion of the workpiece. a first detection means for detecting workpiece position information;
a second detection means for detecting type information of the workpiece; and a control means for controlling the moving means based on the workpiece position information and type information obtained from the first and second detection means, The moving means includes a pinch roller that pinches the workpiece and transports and positions the workpiece by forward and reverse motion, and the first detection means is disposed at the bonding position and detects at least one of the workpieces. an imaging device that detects a part of the image to identify the position of the work; or an imaging device that is located upstream of the bonding position in the movement direction of the work and detects at least a part of the image of the work; A bonder comprising an imaging device that detects a relative positional relationship between a bonding site on the workpiece and the bonding position, and automatically positioning the workpiece at a predetermined bonding position. 2. A moving means for substantially continuously moving the workpiece placed on the bonding stage facing the bonding tool in the length direction along the frame chute, and moving the frame chute in a direction perpendicular to the feeding direction. By this, a chute moving means for positioning the workpiece in the width direction, detecting at least a part of the workpiece, and obtaining workpiece position information such as the position of the workpiece on the frame chute and the bonding site on the workpiece. a first detection means for detecting; a second detection means for detecting type information of the work; and a control means for controlling the moving means and the chute moving means based on the work position information and the type information. A bonder comprising: a positioning operation of the bonding part on the workpiece relative to the bonding position in the length direction and the width direction of the workpiece. 3. The frame chute is arranged in parallel to the transport direction of the workpiece and is composed of a pair of chutes that are movable independently of each other, and the chute moving means moves the pair of chutes individually. 3. The bonder according to claim 2, wherein the bonder performs a positioning operation in the width direction of the workpiece. 4. The workpiece consists of a lead frame and a plurality of pellets mounted at desired pitches in the longitudinal direction of the lead frame, and is a wire bonder that performs wire bonding between each pellet and the lead frame. A bonder according to claim 2 or 3, characterized in that: