JPH0567712A - Cooling mechanism of integrated circuit - Google Patents

Abstract

PURPOSE:To reduce thermal resistance from an integrated circuit to a refrigerant. CONSTITUTION:An opening section formed on the base side of a cylindrical cooling block 4 is fixed to an integrated circuit 2 loaded on a wiring board 1 by a sealing medium 3. A liquid refrigerant 8 flowing in from the refrigerant inflow port 7 of the cooling block 4 is injected directly to the integrated circuit 2 without through a heat transfer plate, etc. The liquid refrigerant 8 stored in the cooling block 4 is discharged from a refrigerant discharge opening 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling mechanism for an integrated circuit, and in particular, a liquid refrigerant such as water is circulated in the vicinity of the integrated circuit element that constitutes an electronic device such as an information processing device, and heat generated in the integrated circuit element is liquefied. The present invention relates to a cooling structure for propagating to and cooling.

[0002]

2. Description of the Related Art Conventionally, in this type of cooling structure, FIG.
As shown in FIG.
The piston 42 is pressed by 3. Integrated circuit 4
When the piston 42 takes away the heat generated in No. 1, the heat is transferred to the hat 44 and the intervening layer 45 through the space filled with the helium gas 48, is transferred from the intervening layer 45 to the cooling plate 46, and is radiated into the refrigerant 47. It has become so. The above cooling method is `` A Conduction-Cooled Module for Hig
h-Performance LSI Devices "(S.Oktay, HCKammere
r, IBM Journal of Reseach and Development.Vol.26 N
o.1 Jan.1982).

Further, as shown in FIG. 9, the printed circuit board 5
The heat generated in the chip 51 on the 0 is transmitted to the heat transfer substrate 52, the deformable heat transfer body 53, and the heat transfer plate 54, respectively, and the liquid refrigerant is supplied from the nozzle 55 to the heat transfer plate 54 in the bellows 56. It is jetted and cooled. The liquid refrigerant ejected from the nozzle 55 is passed from the bellows 56 to the cooling header 5
It is discharged to the flow path in 7. The cooling method described above is disclosed in JP-A-60-160150.

In such a conventional cooling structure, the spring 43 is used.
When the piston 42 urged by is contacted with the integrated circuit 41 for cooling, a force is constantly applied to the integrated circuit 41, which adversely affects the reliability of the connection portion between the integrated circuit 41 and the wiring board 40. There is a problem that it may cause

Further, in order to follow variations in height and inclination that occur when the integrated circuit 41 is attached to the wiring board 40, the contact surface of the piston 42 with the integrated circuit 41 is made spherical, and the hat 44 and the piston 42 are made contact with each other. Although a gap is provided between them, this causes a problem that the effective heat transfer area is reduced and the cooling capacity is reduced.

Further, the flow path of the refrigerant 47 in the cooling plate 46 is formed for the purpose of heat transfer by forced convection, and the obtained heat transfer coefficient is about 0.1 to 0.5 w / cm ² ° C.
If the power consumption increases as the degree of integration of the integrated circuit 41 increases, there is a problem that the cooling capacity becomes insufficient.

On the other hand, when the chip 51 is cooled by the liquid refrigerant ejected from the nozzle 55,
Since the heat transfer substrate 52, the deformable heat transfer body 53, and the heat transfer plate 54 are interposed between the liquid refrigerant ejected from the chip and the chip 51, a high heat transfer rate cannot be obtained and the cooling capacity is insufficient. There is a problem of doing.

[0008]

SUMMARY OF THE INVENTION The present invention has been made to eliminate the above-mentioned problems of the prior art, and an object thereof is to provide a cooling mechanism for an integrated circuit which can reduce the thermal resistance from the integrated circuit to the refrigerant. To do.

[0009]

A cooling mechanism for an integrated circuit according to the present invention has an opening on the bottom surface side, a storage member for storing a liquid refrigerant for cooling the integrated circuit, the opening of the storage member and the integrated member. It is characterized by including a seal material for fixing the circuit to the circuit, and a nozzle provided on the storage member for directly injecting the liquid refrigerant to the integrated circuit fixed to the bottom surface side.

Another integrated circuit cooling mechanism according to the present invention is
A storage member that has an opening on the bottom surface side and stores a liquid refrigerant for cooling the integrated circuit; a frame member that is provided in close contact with the storage member installation side of the integrated circuit; A sealing material for fixing one of the inner wall and the outer wall of the opening and one of the outer wall and the inner wall of the frame member in a close contact state, and the integrated circuit provided on the storage member and fixed to the bottom surface side. And a nozzle for directly injecting the liquid refrigerant.

Another integrated circuit cooling mechanism according to the present invention is
A storage member that has an opening on the bottom surface side and stores a liquid refrigerant for cooling the integrated circuit; a frame member that is provided in close contact with the storage member installation side of the integrated circuit; A member provided between the opening and the frame member for maintaining a sealed state of a space formed by the storage member and the frame member, and the integrated circuit provided on the storage member and fixed to the bottom surface side. And a nozzle for directly injecting the liquid refrigerant.

Still another integrated circuit cooling mechanism according to the present invention has an accumulation member for accumulating a liquid refrigerant for cooling the integrated circuit, the accumulation member having an opening on the bottom side, and the accumulation member installation side of the integrated circuit. A frame member that is provided in close contact with the storage member, and is provided between the opening of the storage member and the frame member, and maintains the space formed by the storage member and the frame member in a sealed state and provides flexibility. It is characterized by including a joint member which has, and a nozzle which is provided in the accumulation member and directly injects the liquid refrigerant to the integrated circuit fixed to the bottom surface side.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a vertical sectional view showing a first embodiment of the present invention. In the figure, a cylindrical cooling block 4 having an opening on the bottom surface side is fixed to the integrated circuit 2 mounted on the wiring board 1 by a sealing material 3. Here, as the integrated circuit 2, a shape such as a chip carrier in which an LSI is housed in a case or a flip chip in which the LSI is mounted in a bare state can be considered. Further, as the sealing material 3, an epoxy-based or silicon-based adhesive or the like is used.

The cooling block 4 has a refrigerant inlet 7 for introducing the liquid refrigerant 8, a nozzle 5 for injecting the liquid refrigerant 8 flowing from the refrigerant inlet 7, and a liquid refrigerant accumulated therein. A coolant discharge port 6 for discharging 8 is provided. Therefore, since the liquid refrigerant 8 flowing in from the refrigerant inlet 7 is directly jetted to the integrated circuit 2 by the nozzle 5, the integrated circuit 2 is directly cooled by the liquid refrigerant 8 without interposing a heat transfer plate or the like.

At this time, since the connecting portion between the integrated circuit 2 and the cooling block 4 is sealed by the sealing material 3, the liquid coolant 8 does not leak onto the wiring board 1. Therefore, the liquid coolant 8 does not need to be a liquid coolant having an insulating property, and a non-insulating liquid coolant such as water can be used. As a result, the liquid coolant 8 having a high cooling capacity can be used regardless of the insulation property.

FIG. 2 is a vertical sectional view showing a second embodiment of the present invention. In the figure, the second embodiment of the present invention is different from the first embodiment of the present invention shown in FIG. 1 except that the cooling block 9 is composed of a penetrating cylinder 9a and a lid 9b attached to the upper surface of the cylinder 9a. The configuration is similar to that of the embodiment, and the same components are designated by the same reference numerals. The operation of those same components is also the same as that of the first embodiment of the present invention.

In the second embodiment of the present invention, the lid 9b is provided with a refrigerant inlet 7, a nozzle 5 and a refrigerant outlet 6, and the lid 9b
b is fixed to the cylinder 9a by brazing or an adhesive. Therefore, also in the second embodiment of the present invention, as in the first embodiment of the present invention, the liquid refrigerant 8 flowing from the refrigerant inlet port 7 is introduced.
Is directly jetted to the integrated circuit 2 by the nozzle 5, and the integrated circuit 2 is directly cooled by the liquid refrigerant 8 without the interposition of a heat transfer plate or the like.

FIG. 3 is a vertical sectional view showing a third embodiment of the present invention. In the figure, an integrated circuit 2-1 is provided on the wiring board 1.
2-5 are arranged and mounted in a matrix. A board frame 10 is fixed so as to surround the outer edge of the wiring board 1.

The cooling block 11 is provided with accumulating portions 12-1 to 12-5 in which the cooling medium 8 is accumulated and the bottom side is opened at positions corresponding to the integrated circuits 2-1 to 2-5 on the wiring board 1. ing. The cooling block 11 is attached to the substrate frame 10 such that the openings of the accumulating units 12-1 to 12-5 are on the upper surfaces of the integrated circuits 2-1 to 2-5, and the accumulating units 12-1 to 12-5. -Five
Each opening and the upper surface of each of the integrated circuits 2-1 to 2-5 are fixed by a sealing material 3, respectively. Further, refrigerant inlets 7-1 to 7-5 and refrigerant outlets 6-1 to 6-5 are provided at predetermined positions of the accumulating sections 12-1 to 12-5 of the cooling block 11, respectively. Nozzles 13-1 to 13-5 for injecting the liquid refrigerant 8 into the integrated circuits 2-1 to 2-5 at the inlets 7-1 to 7-5.
Are installed respectively.

A header 14 is mounted on the cooling block 11, and the header 14 is provided with a refrigerant inlet 15, a refrigerant introducing passage 16, a refrigerant discharging passage 17 and a refrigerant outlet 18. That is, the liquid refrigerant 8 flowing from the refrigerant inlet 15 is distributed to a plurality of systems by the refrigerant introducing passage 16 provided near the refrigerant inlet 15, and the refrigerant discharged from the plurality of systems is a refrigerant provided near the refrigerant outlet 18. After being collected in the discharge passage 17, it is discharged from the refrigerant outlet 18.

Further, the header 14 has a counterbore groove 19-1 for connecting the refrigerant outlet 6-1 of the accumulator 12-1 and the refrigerant inlet 7-2 of the accumulator 12-2, and the accumulator 12. -2 refrigerant outlet 6-2 and the refrigerant inlet 7-3 of the accumulator 12-3, and a counterbore groove 19-2 for connecting the refrigerant outlet 6-3 of the accumulator 12-3 and the accumulator. The counterbore groove 19-3 for connecting with the refrigerant inlet 7-4 of 12-4, the refrigerant outlet 6-4 of the accumulating portion 12-4 and the refrigerant inlet 7-5 of the accumulating portion 12-5. Counterbore for connection 1
9-4 and are provided.

When the liquid refrigerant 8 flows in from the refrigerant inlet 15 of the header 14, the liquid refrigerant 8 fills the refrigerant introduction passage 16 and is then jetted from the nozzle 13-1 onto the upper surface of the integrated circuit 2-1 to collide with it. Liquid refrigerant 8 colliding with the upper surface of integrated circuit 2-1
Fills the accumulating portion 12-1, and then passes through the refrigerant discharge port 6-1 and the counterbore groove 19-1 from the nozzle 13-2 to the integrated circuit 2-2.
Is sprayed on the upper surface of and collides with it.

Liquid refrigerant 8 colliding with the upper surface of integrated circuit 2-2
In the same manner as above, respectively, the refrigerant discharge ports 6-2, 6-3, 6
-4 and the counterbores 19-2, 19-3, 19-4 to the integrated circuits 2-3, 2-4, 2 from the nozzles 13-3, 13-4, 13-5.
-It is jetted to the upper surface of -5 and collides.

Liquid refrigerant 8 colliding with the upper surface of integrated circuit 2-5
After being filled in the accumulating portion 12-5, they are collected from the refrigerant discharge port 6-5 to the refrigerant discharge passage 17 and then discharged from the refrigerant outlet 18 to the outside.

Therefore, the heat generated in the integrated circuits 2-1 to 2-5 is jetted from the nozzles 13-1 to 13-5 to the upper surfaces of the integrated circuits 2-1 to 2-5 and is collided with the liquid refrigerant 8. It is cooled by heat transfer.

FIG. 4 is a vertical sectional view showing a fourth embodiment of the present invention. In the figure, the fourth embodiment of the present invention is the same as that of the present invention shown in FIG. 1 except that a cylindrical cooling block 20 having an opened lower surface is fitted into a frame 21 provided in close contact with the integrated circuit 2. The configuration is similar to that of the first embodiment of
The same components are designated by the same reference numerals. The operation of those same components is also the same as that of the first embodiment of the present invention.

In the fourth embodiment of the present invention, a coolant inlet 7, a nozzle 5 and a coolant outlet 6 are provided on the upper surface of a cylindrical cooling block 20 having an open lower surface, and the opening end of the cooling block 20 is provided. It is fitted in a frame 21 provided on the integrated circuit 2. The frame 21 is processed to have an L-shaped cross section.
The inner wall of No. 1 comes into contact with the outer wall of the open end of the cooling block 20 in which it is fitted.

The outer wall of the open end of the cooling block 20 and the inner wall of the frame 21 which are in contact with each other are fixed by a seal material 22. As the sealing material 22, an epoxy-based or silicon-based adhesive, solder, or the like is used.

In the fourth embodiment of the present invention, the open end of the cooling block 20 is fitted inside the frame 21, but conversely, the frame 21 is placed inside the open end of the cooling block 20. A structure that fits in is also conceivable.

Further, since the opening end of the cooling block 20 and the side wall of the frame 21 are adhered to each other with the sealing material 22, a large adhesion area can be taken, and the adhesion strength of the cooling block 20 can be increased. .. At the same time, cooling block 2
It is also possible to change the distance between the cooling block 20 and the integrated circuit 2 by changing the bonding position between the outer wall at the opening end of 0 and the inner wall of the frame 21, and the variation in the distance between the cooling block 20 and the integrated circuit 2 can be made. Can be absorbed.

Further, a solder having a melting point lower than that of the solder used for connecting the integrated circuit 2 and the wiring board 1 is used as the sealing material 2.
By using it as 2, the cooling block 20 on the integrated circuit 2 can be attached and detached without melting the solder used for connecting the integrated circuit 2 and the wiring board 1.

Therefore, also in the fourth embodiment of the present invention, as in the first embodiment of the present invention, the liquid refrigerant 8 flowing from the refrigerant inlet port 7 is directly injected by the nozzle 5 to the integrated circuit 2 and the integrated circuit 2 is directly cooled by the liquid refrigerant 8 without the interposition of a heat transfer plate or the like.

FIG. 5 is a vertical sectional view showing a fifth embodiment of the present invention. In the figure, the fifth embodiment of the present invention shows an integrated circuit 2 and an open end of a cylindrical cooling block 23 having an open lower surface.
A packing 25 is provided between the upper surface of the frame 24 and the upper surface of the frame 24.
1 has the same structure as that of the first embodiment of the present invention shown in FIG. 1, except that the same components are designated by the same reference numerals. The operation of those same components is also the same as that of the first embodiment of the present invention.

The packing 25 is made of a soft material such as rubber. By pressing the cooling block 23 from above toward the integrated circuit 2, the open end of the cooling block 23 and the frame 2 are pressed.
It comes into close contact with the upper surface of 4. As a result, the integrated circuit 2
The liquid refrigerant 8 in the space formed by the cooling block 23 and the frame 24 does not leak outside. The cooling block 23
As a method of applying pressure to the integrated circuit 2, a method of placing a heavy object on the upper surface of the cooling block 23 can be considered.

Further, by providing grooves at the open end of the cooling block 23 and the upper surface of the frame 24, respectively, in which the packing 25 is accommodated, it is possible to prevent the packing 25 from being displaced from between the open end of the cooling block 23 and the upper surface of the frame 24. , Packing 25
It is possible to improve the adhesion to the cooling block 23 and the frame 24. In addition, the packing 25 is the cooling block 2 in advance.
It may be fixed to the open end of 3 or the upper surface of the frame 24 with an adhesive or the like.

Furthermore, since the cooling block 23 and the frame 24 are not fixed to each other in the fifth embodiment of the present invention, the cooling block 23 can be easily attached to and detached from the integrated circuit 2.

Therefore, also in the fifth embodiment of the present invention, as in the first embodiment of the present invention, the liquid refrigerant 8 flowing from the refrigerant inlet port 7 is directly injected into the integrated circuit 2 by the nozzle 5, and the integrated circuit 2 is discharged. 2 is directly cooled by the liquid refrigerant 8 without the interposition of a heat transfer plate or the like.

FIG. 6 is a vertical sectional view showing a sixth embodiment of the present invention. In the figure, the sixth embodiment of the present invention is
The open end of the cooling block 26 processed into a shape and the upper surface of the frame 27 closely attached to the integrated circuit 2 are overlapped with each other, and the seal ring 28 is provided on the inner wall of each overlapping portion of the cooling block 26 and the frame 27. The configuration is the same as that of the first embodiment of the present invention shown in FIG. 1 except that it is provided, and the same reference numerals are given to the same components. The operation of those same components is also the same as that of the first embodiment of the present invention.

The seal ring 28 is made of a soft material such as rubber, and when the internal pressure of the cooling block 26 rises due to the liquid refrigerant 8 flowing in from the refrigerant inlet 7, the internal pressure rises and the cooling block 26 and It is pressed against the inner wall of the overlapping portion of each frame 27.

As a result, the seal ring 28 closes the gap between the overlapping portions of the cooling block 26 and the frame 27, so that the liquid refrigerant 8 in the space consisting of the integrated circuit 2, the cooling block 26 and the frame 27 leaks to the outside. There is no. still,
The seal ring 28 is previously provided with the cooling block 27 or the frame 24.
It may be fixed to the inner wall of the adhesive with an adhesive or the like.

In the sixth embodiment of the present invention, the cooling block 2
Since the 6 and the frame 27 are not fixed to each other, the cooling block 26 can be easily attached to and detached from the integrated circuit 2.

Therefore, also in the sixth embodiment of the present invention, as in the first embodiment of the present invention, the liquid refrigerant 8 flowing in from the refrigerant inlet port 7 is directly injected into the integrated circuit 2 by the nozzle 5, and the integrated circuit 2 is discharged. 2 is directly cooled by the liquid refrigerant 8 without the interposition of a heat transfer plate or the like.

FIG. 7 is a vertical sectional view showing a seventh embodiment of the present invention. In the drawing, the seventh embodiment of the present invention is shown in FIG. 1 except that a joint 31 connects the open end of the cooling block 29 and the upper surface of the frame 30 closely provided on the integrated circuit 2. The configuration is the same as that of the first embodiment of the present invention, and the same reference numerals are given to the same components.
The operation of those same components is also the same as that of the first embodiment of the present invention.

The joint 31 is an H-shaped joint 31a, 3
1b and a seal ring 31c sandwiched between the joints 31a and 31b. Seal ring 31
c is made of a flexible material such as rubber, and is fixed to the joints 31a and 31b by a sealing material or the like. The joint 31 and the open end of the cooling block 29, and the joint 31 and the upper surface of the frame 30 are also fixed by a sealing material or the like.

The seal ring 31c of this joint 31
Is flexible, the cooling block 29 and the integrated circuit 2
It is possible to absorb the positional deviation and the height change. Further, the seal ring 31c can be attached to the open end of the cooling block 29 or the upper surface of the frame 30 in advance, and in this case, one of the joints 31a and 31b can be removed.

Therefore, also in the seventh embodiment of the present invention, as in the first embodiment of the present invention, the liquid refrigerant 8 flowing from the refrigerant inlet port 7 is directly injected into the integrated circuit 2 by the nozzle 5, and the integrated circuit 2 is discharged. 2 is directly cooled by the liquid refrigerant 8 without the interposition of a heat transfer plate or the like.

According to the experiment, when water is used as the liquid refrigerant 8 and the ejection speed of the liquid refrigerant 8 from the nozzles 5, 13-1 to 13-5 is changed at 0.5 to 3.0 m / s, 1 ~ 3
A thermal conductivity of w / cm ² ° C was obtained. Further, the open ends of the cooling blocks 4, 9, 11, 20, 23, 26, 29 are fixed to the integrated circuits 2, 2-1 to 2-5 through the sealing material 3 and the frames 21, 24, 27, 30. By directly colliding the liquid refrigerant 8 with the integrated circuits 2, 2-1 to 2-5 of the heat generation source, not only the air having a small heat conductivity but also the heat conductive compound and the metal do not intervene in the heat conduction path. Therefore, the thermal resistance value from the PN junction of the integrated circuits 2, 2-1 to 2-5 to the liquid refrigerant 8 can be suppressed to 0.5 to 1 ° C./w or less.

As described above, the integrated circuit 2 mounted on the wiring board 1 in the openings provided on the bottom side of the cooling blocks 4 and 9.
PN junction of the integrated circuit 2 by directly injecting the liquid refrigerant 8 from the nozzles 5 provided in the cooling blocks 4 and 9 to the integrated circuit 2 without interposing a heat transfer plate or the like. The heat resistance from the liquid refrigerant to the liquid refrigerant 8 can be made very small.

Further, the board frame 10 is fixed to the wiring board 1 on which a plurality of integrated circuits 2-1 to 2-5 are mounted, and the cooling block 11 is provided.
A plurality of integrated circuits 2-1 to 2-5 are fixed to the opening of the substrate with a sealant 3 and the cooling block 11 is attached to the substrate frame 10. By mounting the header 14 in which the flow path is formed so as to directly inject the liquid refrigerant 8 on the 2-1 to 2-5, it is possible to provide a cooling structure having a small thermal resistance by mounting the header 14 on the cooling block 11.

Further, the cooling blocks 20, 23, 26,
Frames 21, 24, 27, 3 in which openings provided on the bottom surface side of 29 are closely attached to the integrated circuit 2 mounted on the wiring board 1.
To the cooling block 20, the sealing material 22 and the packing 25, or the sealing ring 28 and the joint 31.
By directly injecting the liquid refrigerant 8 from the nozzles 5 provided in 23, 26, and 29 to the integrated circuit 2 without interposing a heat transfer plate or the like, the thermal resistance from the PN junction of the integrated circuit 2 to the liquid refrigerant 8 is increased. Can be very small.

Furthermore, the cooling blocks 4, 9, 11,
The openings of 20, 23, 26 and 29 are respectively connected to the integrated circuit 2,
The liquid coolant 8 does not leak to the outside of the flow path such as on the wiring board 1 by being fixed to the 2-1 to 2-5 with the sealing materials 3 and 22, the packing 25, or the seal ring 28 and the joint 31. Therefore, a non-insulating liquid coolant such as water can be used as the liquid coolant 8.

In the first and second embodiments and the fourth to seventh embodiments of the present invention, the cooling blocks 4, 9, 2 are used.
Although 0, 23, 26, and 29 have a hollow cylindrical shape, they may have a hollow rectangular parallelepiped shape. Further, in the third embodiment of the present invention, the cooling medium introducing passage 16 and the cooling medium discharging passage 1 are provided on the cooling block 11.
7 and the header 14 having the counterbores 19-1 to 19-4 are attached to form the refrigerant flow path connecting the accumulators 12-1 to 12-5 of the cooling block 11 to each other. 1 ~
A coolant flow path for circulating the liquid coolant 8 may be independently formed in each of 12-5, but is not limited thereto.

[0054]

As described above, according to the cooling mechanism for an integrated circuit of the present invention, the integrated circuit is fixed to the opening of the accumulation member for accumulating the liquid refrigerant by the sealing material and provided on the accumulation member. By directly injecting the liquid refrigerant from the nozzle to the integrated circuit, it is possible to reduce the thermal resistance from the integrated circuit to the liquid refrigerant.

Further, according to another integrated circuit cooling mechanism of the present invention, the frame member provided in close contact with the opening on the bottom surface side of the storage member for storing the liquid refrigerant and the storage member installation side of the integrated circuit. By fixing and with the sealing material and directly injecting the liquid refrigerant into the integrated circuit from the nozzle provided in the storage member, the thermal resistance from the integrated circuit to the liquid refrigerant can be reduced.

Further, according to another integrated circuit cooling mechanism of the present invention, a frame member provided in close contact with the bottom surface side opening of the storage member for storing the liquid refrigerant and the storage member installation side of the integrated circuit. A member for maintaining a sealed state of the space composed of the storage member and the frame member is provided between the storage member and the frame member, and the liquid refrigerant is directly injected from the integrated circuit by the nozzle provided in the storage member to directly inject the liquid refrigerant The effect is that the heat resistance up to can be reduced.

Further, according to still another integrated circuit cooling mechanism of the present invention, a frame provided in close contact with the opening on the bottom surface side of the storage member for storing the liquid refrigerant and the storage member installation side of the integrated circuit. A space between the storage member and the frame member is kept sealed and a flexible joint member is provided, and the liquid refrigerant is directly injected from the nozzle provided in the storage member to the integrated circuit. This has the effect of reducing the thermal resistance from the integrated circuit to the liquid refrigerant.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view showing a first embodiment of the present invention.

FIG. 2 is a vertical sectional view showing a second embodiment of the present invention.

FIG. 3 is a vertical sectional view showing a third embodiment of the present invention.

FIG. 4 is a vertical sectional view showing a fourth embodiment of the present invention.

FIG. 5 is a vertical sectional view showing a fifth embodiment of the present invention.

FIG. 6 is a vertical sectional view showing a sixth embodiment of the present invention.

FIG. 7 is a vertical sectional view showing a seventh embodiment of the present invention.

FIG. 8 is a vertical cross-sectional view showing a conventional example.

FIG. 9 is a vertical sectional view showing a conventional example.

[Explanation of symbols]

 2, 2-1 to 2-5 Integrated circuit 3,22 Sealing material 4, 9, 11, 20, 23, 26, 29 Cooling block 5, 13-1 to 13-5 Nozzle 6, 6-1 to 6-5 Refrigerant outlet 7, 7-1 to 7-5 Refrigerant inlet 8 Refrigerant 9a Tube 9b Lid 12-1 to 12-5 Accumulator 14 Header 15 Liquid refrigerant inlet 16 Refrigerant introduction path 17 Refrigerant discharge path 18 Liquid refrigerant outlet 19- 1-19-4 Counterbore groove 21, 24, 27, 30 Frame 25 Packing 28, 31c Seal ring 31 Joint 31a, 31b Joint

Claims (4)

[Claims] 1. A storage member having an opening on the bottom surface side for storing a liquid coolant for cooling an integrated circuit; a sealing material for fixing the opening of the storage member to the integrated circuit; A cooling mechanism for an integrated circuit, comprising: a nozzle provided on a storage member and directly injecting the liquid refrigerant to the integrated circuit fixed to the bottom surface side. 2. A storage member having an opening on the bottom surface side for storing a liquid refrigerant for cooling the integrated circuit, and a frame member closely attached to the storage member installation side of the integrated circuit, A sealing material for fixing one of the inner wall and the outer wall of the opening of the storage member and one of the outer wall and the inner wall of the frame member in a close contact state, and provided in the storage member,
A cooling mechanism for an integrated circuit, comprising: a nozzle for directly injecting the liquid refrigerant to the integrated circuit fixed to the bottom surface side. 3. A storage member having an opening on the bottom surface side for storing a liquid refrigerant for cooling the integrated circuit, and a frame member closely attached to the storage member installation side of the integrated circuit, A member that is provided between the opening of the storage member and the frame member and that maintains a space formed by the storage member and the frame member in a sealed state, and that is provided on the storage member and fixed to the bottom surface side. And a nozzle for directly injecting the liquid refrigerant into the integrated circuit. 4. A storage member, which has an opening on the bottom surface side and stores a liquid refrigerant for cooling the integrated circuit, and a frame member closely attached to the storage member installation side of the integrated circuit, A joint member which is provided between the opening of the storage member and the frame member, maintains the space formed by the storage member and the frame member in a sealed state, and has flexibility.
A cooling mechanism for an integrated circuit, comprising: a nozzle provided on the storage member and directly injecting the liquid refrigerant to the integrated circuit fixed to the bottom surface side.