JPH056715Y2 - - Google Patents

Description

[Detailed description of the invention] (a) Industrial application field The present invention relates to hybrid integrated circuits, and in particular to improvements in fixing the substrate and case of a hybrid integrated circuit consisting of two substrates separated by an insulating film. Regarding.

(b) Prior Art As shown in FIG. 2, a conventional hybrid integrated circuit includes two metal substrates 11 and 12, an insulating film 13 connecting the substrates 11 and 12, and a conductive path 14 provided on the film 13. and a plurality of circuit elements 15 such as semiconductor integrated circuits, chip resistors, or chip capacitors fixed on conductive paths 14.

The metal substrates 11 and 12 are made of aluminum with good thermal conductivity and have a thickness of 0.5 to 1.0 mm.The substrates 11 and 12 are separated by their respective thicknesses using an adhesive such as epoxy resin, and connected by an insulating film 13 such as polyimide. . A conductive path 1 is provided on the opposite main surface of the insulating film 13.
A copper foil No. 4 is pasted, and the copper foil is selectively etched to form a conductive path 14 of a desired shape.
For the conductive path 14, pads to which external leads 16 are soldered are arranged at the end of one substrate 12, and the conductive path 14 extends from the pads onto the insulating film 13. The part of the conductive path 14 that fixes the circuit element 15 is designed to be located on both the substrates 11 and 12, and
No circuit element 15 is provided in the spaced apart portions 1 and 12 for bending.

After incorporating the circuit element 15, fold the insulating film 13 between the substrates 11 and 12 and separate the substrates 11 and 12.
12 are brought into contact with each other, and the entire body is molded with resin 17, leaving the external leads 16, and is completed.

The above-mentioned technique is described in Japanese Patent Publication No. 11809/1983.

In such a hybrid integrated circuit with a folded structure, the exposed surface of the folded board is brought into contact with the board and fixed with a resin mold, so it is fine if it does not generate much heat, but if it generates a lot of heat, the board Some circuit elements are bent so that they face each other without contacting the exposed surfaces, and are fixed and integrated by a case material.

(c) Problems to be solved by the invention If heat is generated, the circuit elements may be bent and arranged accordingly. However, when the bent board and the case material are adhesively fixed using an adhesive sheet, there is a problem in that the board and the case are misaligned, and the board and the case are stuck together, resulting in a defect. In addition, this kind of problem can be solved by forming grooves in the case material to house and fix the board in large hybrid integrated circuits, but in small hybrid integrated circuits, in order to make the circuit board compact, the above-mentioned grooves are not formed and the board is fixed. As a result, the above-mentioned problem was exacerbated.

(d) Means for solving the problem The present invention was made in view of the problems mentioned above, and as shown in FIG. 1, a plurality of holes 6 are provided in the substrates 1 and 2, and the Case material 8 to correspond
A protrusion 7 is provided in the case member 8, and the case member 8 is sandwiched and fixed between the substrates 1 and 2 so that the hole 6 and the protrusion 7 are fitted.

(E) Function By fitting the plurality of holes 6 provided in the substrates 1 and 2 with the protrusions 7 provided in the case material 8 during bending and arrangement in this way, the substrates 1 and 2 can be easily and easily assembled. 2 can be fixed.

(F) Embodiments The present invention will be described in detail below based on embodiments shown in the drawings.

FIG. 1 shows a hybrid integrated circuit of the present invention, which shows two substrates 1 and 2, an insulating film 3 that connects the substrates 1 and 2 at a distance, and a desired shape provided on the film 3. It has a protrusion 7 for arranging the conductive path 4, the circuit element 5 fixed on the conductive path 4, and the circuit element 5 provided on the two substrates 1 and 2 facing each other and fitting into the hole 6. It is composed of a case material 8.

The two substrates 1 and 2 can be used as long as they are insulating substrates, such as phenol substrates, paper phenol substrates, glass epoxy substrates, paper polyester substrates, alumite-treated aluminum substrates, etc., and are usually used as insulating substrates. It is used,
It is not limited. Holes 6 are provided at the peripheral ends of the substrates 1 and 2 of the present invention to fit into the protrusions 7 of the case material 8.
is formed. In this embodiment, an aluminum substrate with excellent mechanical and heat dissipation properties is used, and a hole 6 is formed at the peripheral edge of the substrate by drilling, punching, or the like.

The insulating film 3 is preferably made of a polyimide resin that can withstand the temperature of solder dip or solder reflow necessary for connecting the circuit element 5 and the conductive path 4, and the insulating film 3 and the substrates 1 and 2 are made of thermosetting resin or double-sided adhesive tape. The substrates 1 and 2 can be bonded together with a distance corresponding to their respective thicknesses.

A copper foil of a desired thickness is previously pasted on the insulating film 3, and a conductive path 4 of a desired shape is formed on the copper foil by photoresist or etching. On the conductive path 4, chipped resistors, capacitors, transistors, ICs, etc. are fixed by solder reflow. The conductive path 4 is designed to be placed over the entire substrates 1 and 2, and a plurality of external leads 9 and 10 are provided on conductive pads (not shown) formed on the peripheral edges of the substrates 1 and 2. It is fixed with solder.

The external leads 9 and 10 are led out horizontally from the terminal sides of the substrates 1 and 2 (as shown by the dotted line), or when the mounting height of the hybrid integrated circuit is to be lowered, they are led out from the terminal sides of the substrates 1 and 2. The leads 9 and 10 may be bent at substantially right angles in the same direction. At this time, the bending positions of the leads 9 and 10 are shifted from each other.

The hybrid integrated circuit formed in this way is made of case material 8.
is fixed and integrated. The case material 8 of this embodiment has protrusions 7 corresponding to the holes 6 provided in the substrates 1 and 2.
is formed. The case material 8 is formed into a frame shape or a U-shape, and the protrusion 7 is connected to the insulating film 3.
are formed on both sides of both ends that are not in contact.

The case material 8 and the substrates 1, 2 are integrated by folding the films 3 of the substrates 1, 2 so that the protrusions 7 of the case material 8 and the holes 6 of the substrates 1, 2 fit together. At this time, since the adhesive sheet is placed on the case material 8, the substrates 1 and 2 are firmly integrated with the case material 8.

In this invention, the protrusion 7 of the case material 8 and the holes 6 of the substrates 1, 2 are fitted, and there is no fear that the substrates 1, 2 and the case material 8 will be displaced when they are fixed, so that the substrates 1, 2 can be attached very easily. 2 and the case material 8 can be fixed together.

(g) Effects of the invention As described above, according to the invention, by fitting the protrusion 7 of the case material 8 and the hole 6 of the substrates 1, 2, the connection between the substrates 1, 2 and the case material 8 is easily achieved. This has the advantage of being able to be fixed and improving workability.

Furthermore, by bending the external leads 8 and 9 at right angles, it is possible to provide a hybrid integrated circuit with a low mounting height.

[Brief explanation of the drawing]

FIG. 1 is a perspective exploded view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional example. 1, 2...Substrate, 3...Insulating film, 4...
Conductive path, 5...Circuit element, 6...Hole, 7...Protrusion, 8...Case material, 9, 10...External lead.

Claims (1)

[Claims for Utility Model Registration] (1) Two substrates provided with a plurality of holes, and an insulating film that separates and fixes the two substrates,
a circuit element provided on the insulating film;
A hybrid integrated circuit comprising: a case material that is provided with protrusions corresponding to a plurality of holes provided in the two substrates and fixes the two substrates. (2) Integrating the board and the case material by bending the insulating film between the two boards and fitting the protrusion provided in the case material into the hole provided in the board. The hybrid integrated circuit according to claim 1, characterized in that: (3) The hybrid integrated circuit according to claim 1, wherein the case material is formed in a frame shape. (4) Claim 1 characterized in that an external lead is led out from one side end of each of the two substrates.
Hybrid integrated circuit as described. (5) The hybrid integrated circuit according to claim 4, wherein the external leads are led out perpendicularly from the terminal edge of the substrate or bent in the same direction. (6) The hybrid integrated circuit according to any one of claims 1 to 5, wherein the two substrates are metal substrates.