JPH0567008U - Semiconductor device - Google Patents

Abstract

(57) [Summary] [Object] An object of the present invention is to provide a semiconductor device in which soldering characteristics can be easily checked visually and by an optical system and which can be mounted with high reliability. [Structure] In the present invention, the lead shape of the portion led out from the package has an inverted J shape.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor device, and more particularly to a lead shape thereof.

[0002]

[Prior Art]

 In recent years, the trend toward light, thin, short, small, and high functionality in high-density packaging of semiconductor integrated circuits has been increasing. Therefore, even in the mounting structure of the semiconductor device, the so-called surface mounting structure in which the leads are brought into surface contact with the surface of the semiconductor substrate to be connected is increasing in number. As the lead shape of the semiconductor device having such a surface mounting structure, an L-shaped shape called a gull-wing type, a straight type, and a J-shaped type have been widely used.

When mounting such a semiconductor device on the surface of the printed board 1, as shown in FIGS. 2A and 2B, the leads 4 and the solder 5 are formed on the wiring pattern 3 formed on the printed board 1. However, the amount of the solder 5 is small on the outer lead surface of the package 2, and it is difficult to visually confirm the solderability by an optical system. Therefore, it is conceivable to increase the amount of solder, but the wicking phenomenon of the lead shoulder causes a problem such as deterioration of package reliability. For this reason, it is difficult to increase the amount of solder, and there are problems such as an increase in inspection work time and a deterioration in quality when visually confirming solderability by an optical system.

[0004]

[Problems to be solved by the device]

 As described above, in the conventional mounting method, it is difficult to firmly fix the solder, and there are problems such as an increase in inspection work time and deterioration of quality in visually checking the solder and checking the solderability by the optical system. .

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a semiconductor device in which soldering characteristics can be easily checked visually and by an optical system, and highly reliable mounting can be performed. And

[0006]

[Means for Solving the Problems]

 Therefore, in the present invention, the lead shape of the portion led out from the package has an inverted J-shaped structure.

[0007]

[Action]

 According to the above method, since the lead shape of the part led out from the package has an inverted J-shape, even if the amount of solder on the lead surface in the package outer direction is increased, the wicking phenomenon on the lead shoulder does not occur. There is no problem and the amount of solder on the lead surface in the package outer direction can be increased, which improves reliability and facilitates visual inspection and solderability confirmation with an optical system. In this way, inspection work time can be shortened and quality can be stabilized.

[0008]

【Example】

 Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing a semiconductor device according to an embodiment of the present invention. As shown in FIG. 1, this semiconductor device is characterized in that the leads 4 are formed in an inverted J shape in the outer region portion of the package 2.

The printed circuit board 1 is formed by adhering a copper foil on a laminated board and patterning the copper foil to form a wiring pattern 3. A semiconductor device package 2 is mounted on the printed circuit board 1 and a wiring pattern is formed. Mounting is carried out by placing an inverted J-shaped lead 4 on top of 3 and fixing them via solder 5.

According to this structure, the solder 5 is sufficiently adhered to the lead surface in the package outer direction, and even if the amount of solder is increased, the solder flows into the J-shaped recess from the outside of the lead, and the reliability is improved. Can be firmly fixed. Therefore, even if the amount of solder is increased, the reliability of the package is not deteriorated due to the wicking phenomenon from the lead, and the solder fillet is formed on the lead surface in the package outer direction so as to be easily visible. Also, in the inspection process, the inspection work time can be shortened and the quality can be improved. The lead may be formed so as to have a substantially inverted J shape, and can be appropriately modified.

Further, in the above-mentioned embodiment, the laminated substrate is used as the printed circuit board, but a glass substrate, a ceramic substrate, a resin substrate or the like may be used, and the wiring pattern is not limited to the copper foil and can be changed appropriately. Is.

[0012]

[Effect of the device]

 As described above, in the present invention, since the lead shape of the part led out from the package is an inverted J-shape, it is possible to reduce the inspection work time for solder sticking property and stabilize the quality. You can

[Brief description of drawings]

FIG. 1 is a diagram showing an example of mounting a semiconductor device according to an embodiment of the present invention on a printed circuit board.

FIG. 2 is a diagram showing an example of mounting a conventional semiconductor device on a printed circuit board.

[Explanation of symbols]

 1 Printed circuit board 2 Package 3 Wiring pattern 4 Lead 5 Solder

Claims (1)

[Scope of utility model registration request] 1. A lead frame having a plurality of leads, a semiconductor chip mounted on the lead frame and electrically connected to at least one of the plurality of leads, the semiconductor chip and a part of the lead are covered. A semiconductor device comprising a resin package, wherein the lead is formed in an inverted J shape outside the package.