JPH0563938B2 - - Google Patents

Description

[Detailed description of the invention]

【0001】

[Industrial Application Field] This invention includes, for example,
Regarding the improvement of equipment for sealing and molding electronic components such as ICs, LSIs, diodes, and capacitors with resin,
In particular, the present invention relates to something that prevents voids from forming in a resin molded body.

【0002】

[Prior Art] Conventionally, electronic components have been molded with resin by the transfer molding method. It is usually carried out as follows. That is, the upper mold (fixed mold) and the lower mold (movable mold) are heated in advance to the resin molding temperature using heating means. Next, the lead frame with the electronic component mounted thereon is fitted and set in a predetermined position in a setting recess provided on the lower mold surface, and a resin material is supplied into the pot (see FIG. 2). Next, move the lower mold upward to clamp both the upper and lower molds.
At this time, the electronic component and the lead frame surrounding it are fitted into both upper and lower cavities that are placed opposite to the mold surfaces, and the resin material in the pot is heated and sequentially melted. Ru. Next, the resin material in the pot is pressurized by a plunger, and the molten resin material is injected into both cavities through the resin passage provided between the pot and both cavities (see FIG. 3). In addition,
The cavity is communicated with the outside through a suitable air vent, and the air inside the cavity is pushed out to the outside by utilizing the action of injecting and filling the molten resin material into both cavities. Therefore, the electronic components and the surrounding lead frame are sealed and molded inside the resin molding body, which is molded to correspond to the shape of both cavities. When both the upper and lower molds are opened, almost simultaneously, the resin molded body (mold package) in both cavities, the lead frame, and the cured resin in the resin passage are released by a mold release mechanism. (See Figure 4).

[0003] By the way, as mentioned above, it is considered that the residual air existing in the pot, the resin passage, and the cavity is naturally discharged to the outside from the air vent, but when using this residual air discharge means, , there is a problem that the formation of internal voids in the resin molded product cannot be effectively prevented due to the uncertainty of its discharge action.

[0004] In order to solve the problem of void formation inside the resin molded body, for example, it is conceivable to forcibly exhaust the residual air existing in the pot, the resin passage, and both cavities to the outside. However, although this forced exhaust means is superior in that the residual air is not mixed into the molten resin material, it has not been put into practical use due to the following technical problems. . That is, both the upper mold and the lower mold in the mold of the resin encapsulation molding apparatus are opened and closed (mold clamping and mold opening) each time the resin is molded. When the molds are clamped, at least the pots, resin passages, and cavity portions of both molds must be isolated from the outside air, and the residual air within these areas must be exhausted. In addition, as a means for blocking such outside air, for example, O-rings are placed on the mold surfaces of both molds, that is, on the parting line surfaces of both molds, and the O-rings are pressed when the molds are clamped. A device that blocks the area set by the O-ring from the outside air, or a fitting concave and convex portion is arranged facing each other on the mold surfaces of both molds, and when the mold is clamped, the concave and convex portions are fitted, and the concave and convex portions are fitted. It is conceivable to press an O-ring provided on the fitting surface of the part to block the outside air from the area set by the O-ring.

【0005】

[Problems to be Solved by the Invention] However, in the configuration of the conventional device in which external air blocking means such as O-rings and fitting uneven parts are provided on the mold surfaces of both molds,
Since the mold clamping of both molds and the outside air blocking action by the outside air blocking means are performed almost simultaneously, for example, if the lead frame supplied to the both mold surfaces is set in a predetermined position and state for some reason. There is a problem in that even in an abnormal situation where the mold is not closed, the mold clamping action and the outside air blocking action are performed almost simultaneously, damaging the mold surfaces of both molds, the lead frame, and the outside air blocking itself.

[0006] In addition, when the outside air blocking means is fixedly installed on the mold surfaces of both molds, there is a problem that mounting and replacing chase blocks for both molds is troublesome, and furthermore, In resin encapsulation molding equipment for electronic parts, which requires frequent replacement of chase blocks in response to demands for low-volume production of various types,
This chase block replacement work requires a lot of effort, leading to problems such as a decrease in overall productivity.

[0007] The present invention aims to improve the workability and operability by simplifying the configuration of the external forced exhaust means for the residual air described above, and also to improve the workability and operability of both the fixed side and the movable side for both fixed and movable types. It is an object of the present invention to provide a resin sealing molding apparatus for electronic components that can easily and reliably perform the work of attaching and detaching an is block.

[0008]

[Means for Solving the Problems] An apparatus for resin-sealing electronic components according to the present invention is equipped with a resin-molding mold in which a fixed mold 1 and a movable mold 2 are arranged facing each other. The molding apparatus includes at least a pot 9 for supplying resin material, resin passages 25 and 26, and cavities 10 and 20 for resin molding in both the molds 1 and 2, respectively.
Outside air blocking members 33, 30 that cover the outer periphery of the
are slidably fitted into each other, and when both the molds 1 and 2 are clamped, both the outside air blocking members 33 and 30 are disposed so as to be freely fitted, and both the molds 1 and 2 are fitted together. A sealing member is interposed between each of the fitting surfaces of the outside air blocking members 33, 30 and the fitting surfaces of both the outside air blocking members 33, 30, and further, both the outside air blocking members 33, 30 is characterized in that when both molds 1 and 2 are fitted, an outside air blocking space 38 set between both molds 1 and 2 is connected to the vacuum source 40 side through a vacuum path 39.

[0009] In addition, the resin sealing molding apparatus for electronic components according to the present invention has a fixed mold 1 and a movable mold 2 disposed facing each other, and chase blocks 7 and 8 are removably fitted to both molds. In this apparatus, the fixed mold 1 and the movable mold 2 are provided with at least a pot 9 and a resin passage 25 for supplying resin material in each of the fixed mold 1 and the movable mold 2. , 26・Cavity 10, 20 for resin molding
Outside air blocking members 33, 30 that cover the outer periphery of the
are slidably fitted into each other, and both of the outside air blocking members 33 and 30 are disposed such that they can be fitted together when the molds are clamped, and the chase block 7 for both the molds is fitted. . A sealing member is interposed between the fitting surfaces of both the members 33 and 30, and an outside air blocking space 38 is provided between the molds 1 and 2 when both the outside air blocking members 33 and 30 are fitted together. This is characterized in that it is configured to be connected to the vacuum source 40 side via a vacuum path 39.

[0010] Furthermore, the resin sealing molding apparatus for electronic components according to the present invention includes both the outside air blocking members 33,
30 are each fitted slidably onto the outer circumferential surfaces of both the fixed and movable mold bases 3 and 4.

【0011】

[Function] According to the configuration of the present invention, when both the fixed and movable molds 1 and 2 are clamped, both outside air blocking members 3
3, 30 to slide the outside air blocking members 33,
By fitting both the molds 1 and 30, the two molds 1,
The outside air-blocking space 38 can be easily formed by covering at least the outer periphery of the pot, the resin passage, and the cavity in 2. Therefore, by operating the vacuum source 40 connected in communication with the outside air shutoff space 38, the residual air in the outside air shutoff space 38 is efficiently and reliably exhausted through the vacuum path 39. be able to. Further, by performing resin sealing molding of the electronic component in this state, it is possible to prevent residual air in the outside air shielding space 38 from mixing into the molten resin material.
Furthermore, even if the air inside the resin material flows out into the outside air blocking space 38 during the process of heating and melting the resin material R, it is possible to prevent the air from mixing into the molten resin material. . Moreover, the fitting action of both the outside air blocking members 33, 30 can be performed independently of the mold opening/closing action of the molds 1, 2.

【0012】

[Example] Fig. 1 schematically shows the configuration of a resin sealing molding apparatus for electronic components, and Figs.
4 schematically shows the main parts of the mold in the apparatus, and FIGS. 5 and 6 show the main parts of the mold in an enlarged manner.

[0013] This device includes a fixed mold 1 (upper mold) installed on an upper fixed platen and a movable mold 2 (lower mold) installed on a lower movable platen.

[0014] Furthermore, the fixed mold base 3 and the movable mold base 4 are provided with resin material heating means 5, 6 such as heaters, respectively. Further, a stationary chase block 7 is removably installed on the stationary mold base 3 by means of fitting means such as a dovetail groove 3a and a dovetail portion 7a. Further, a movable chase block 8 is detachably mounted on the movable mold base 4 by means of fitting means such as a dovetail groove 4a and a dovetail portion 8a. Further, both chase blocks 7 and 8 fitted to both mold bases 3 and 4 are fitted in predetermined positions via appropriate blocks 7b and 8b fixed to both front and rear ends thereof. It is being Although FIG. 1 shows a case in which both the front and rear ends of both chase blocks 7 and 8 are fixed by blocks 7b and 8b, either one of the blocks 7b and 8b may be omitted. For example, a portion corresponding to the block on one side and both mold bases 3, 4 may be formed integrally. Further, a suitable sealing member (not shown) may be interposed between the chase blocks 7, 8 and the fixing blocks 7b, 8b.

[0015] In addition, the movable chase block 8 is provided with a required plurality of resin material supply pots 9, and furthermore, at predetermined positions around each pot 9, a required plurality of resin material supply pots 9 are provided. Cavities 10 are respectively arranged. Further, the movable chase block 8 is equipped with a dedicated heating means 11 such as a heater. Further, at a lower position of the movable chase block 8, there is a lower ejector plate 12 equipped with an ejector pin 12a for releasing the resin molded product molded in the cavity 10, and a lower ejector plate 12 provided with ejector pins 12a for releasing the resin molded product molded in the cavity 10, and a lower ejector plate 12 provided with ejector pins 12a for releasing the resin molded product molded in the cavity 10. A plunger holder 13 is provided with a plunger 13a for pressurizing each resin material R separately. Further, the upper end portion of each ejector pin 12a is fitted into a pin hole 14 communicating with each cavity 10, respectively. The upper end of each plunger 13a is connected to the movable mold base 4 and the ejector plate 12.
They are fitted into the respective pots 9 through insertion holes 15 and 16 provided in the holes 15 and 16, respectively. Further, the plunger holder 13 is detachably attached to a rail member 13b provided at the lower part of the movable mold base 4. A suitable seal is provided between the fitting space of the lower ejector plate 12 provided on the movable mold base 4 and the outside, and between the fitting space of the plunger holder 13 and the outside. A member (not shown) may be interposed.

[0016] Further, cavities 20 corresponding to the positions and numbers of the cavities 10 are provided in the fixed side chase block 7, respectively. Further, the stationary chase block 7 is equipped with a dedicated heating means 21 such as a heater. Further, at a position above the fixed side chase block 7, there is an upper ejector plate 22 equipped with an ejector pin 22a for releasing the resin molded product molded in the cavity 20, and a support for the upper ejector plate. pin 22b and support pin 22b
An elastic member 23 for pushing down the upper ejector plate 22 via the upper ejector plate 22 is provided. Further, the lower end of each ejector pin 22a has a pin hole 24 communicating with each cavity 20, and a cull portion 25 provided opposite the position of each pot 9.
The pin holes 24a communicate with each other. The ejector plate 22 is shown in FIGS. 2 and 4.
When the molds 1 and 2 shown in the figure are opened, the elastic member 23 is pressed down by the elasticity of the elastic member 23, thereby forming a resin passage section of a required length (example in the figure) provided inside the cavity 20 and between the pot 9 and the cavity 20. These are provided so that the resin molded body P cured within the cull portion 25 and the gate portion 26) can be released from the mold.

[0017] When the molds 1 and 2 are opened, the lower ejector plate 12 is pushed up by the ejector bar 12b, and the ejector pins 12a touch the resin molded body in each cavity 10. P is released from the mold respectively (see FIG. 4), but when the mold is clamped, the upper and lower return pins (not shown) arranged opposite to the upper and lower ejector plates 22, 12 , 12 upwardly and downwardly, respectively (see FIG. 3).

[0018] Therefore, the electronic component 2 mounted on the lead frame 27 using the resin sealing molding apparatus described above.
When molding 7a with resin, first, as shown in FIG. 2, the lead frame 27 is placed at a predetermined position in a setting recess 29 provided on the movable mold (lower mold) surface via an appropriate supply/take-out mechanism 28. At the same time, a resin material (resin tablet) is placed in each pot 9.
As shown in FIG. is pressurized by the plunger 13a and the heating means 5, 6,
The resin material heated and melted by 11 and 21 is passed through the resin passages 25 and 26 into both cavities 10 and 21.
By injecting and filling the electronic component 27a into the resin molded body P (see FIG. 4), the electronic component 27a can be sealed and molded within the resin molded body P (see FIG. 4).

[0019] The apparatus of the present invention is a resin sealing molding apparatus for electronic components as described above, and is characterized by having the following configuration.

[0020] That is, the movable mold base 4 described above
Into the mold surface of the movable mold 2, an external air blocking member 30 having a round or square cylinder shape is fitted to cover at least the outer periphery of each pot 9 and each cavity 10, and the external air blocking member 30 is fitted. Required drive mechanism 3
1 so as to be slidable in the mold opening/closing direction, and furthermore, the movable mold base 4 and the outside air blocking member 3
A suitable sealing member 32 is interposed on the fitting surface with 0.

[0021] In addition, the fixed side mold base 3 described above
In addition, an outside air blocking member 33 in the shape of a round cylinder or a square cylinder is fitted to cover at least the outer periphery of each resin passage (cull part 25 and gate part 26) and each cavity 20 on the mold surface of the fixed mold 3. , the external air blocking member 33 is slidably fitted in the mold opening/closing direction via a required drive mechanism 34, and a fitting surface between the stationary mold base 3 and the external air blocking member 33 is fitted. A suitable sealing member 35 is interposed.

[0022] Furthermore, when the molds 1 and 2 are clamped, when the outside air blocking members 30 and 33 are respectively moved forward in the mold clamping direction via the driving mechanisms 31 and 34, the outside air is The distal ends of both the blocking members 30 and 33 are provided to fit together (Fig. 3
reference). In FIG. 3, the upper end of the outside air blocking member 30 fitted to the movable mold base 4 is moved up to near the mold surface of the movable mold 4, and the upper end of the outside air blocking member 30 fitted to the fixed mold base 3 is moved upward. The case where the outside air blocking member 33 is fitted to the outer peripheral surface of the outside air blocking member 30 of the movable mold base 4 is illustrated.

[0023] Also, both of the outside air blocking members 30, 3
3. A suitable sealing member 36 is interposed between the fitting surfaces of the two. Further, between both mold bases 3, 4 and both chase blocks 7, 8, between both chase blocks 7, 8 and each ejector pin 22a, 12a
A suitable sealing member 37 is also interposed between the movable chase block 8, the pot 9, and the plunger 13a. Therefore, when the molds 1 and 2 shown in FIG. , the outside air blocking members 30, 33 and the sealing members 32, 35, 36, 37 form a space 38 that is shut off from outside air. Incidentally, since the surfaces of both the molds 1 and 2 are substantially isolated from the outside air by the seal members 35 and 36, the intervening arrangement of the seal members 37 is unnecessary. In addition, in place of the intervening arrangement of each of the seal members 37, or when omitting this, as described above, the space between both chase blocks 7, 8 and both fixed blocks 7b, 8b, and between the plunger It is preferable that a suitable sealing member be interposed between the fitting space of the ear holder 13 and the outside.

[0024] In addition, one end side of a vacuum path 39 such as a vacuum pipe is connected to the above-mentioned outside air insulation space 38, which is formed when both the outside air insulation members 30 and 33 are fitted, and the vacuum route 39
The other end is a vacuum pump or other suitable vacuum source 40.
It is connected to the side. Therefore, when the vacuum source 40 is activated when both the molds 1 and 2 shown in FIG.
The inside of the outside air cutoff space 38 can be brought into a vacuum state.

[0025] As described above, the outside air blocking space 38 is provided with both outside air blocking members 30, 33 and each sealing member 32, 35, when the molds 1, 2 are clamped.
36 and 37 is a space defined between the two molds and cut off from outside air. Therefore, when both molds 1 and 2 are clamped, at least the resin material supply pots 9 and 2 in both molds are closed.
Resin passages 25, 26/cavity 1 for resin molding
The outer periphery of the 0.20 parts is cut off from the outside air, but the residual air in this outside air isolation space 38 is removed through an air vent etc. provided between the joint surfaces of the two molds or on one of the mold surfaces. Mutual circulation is possible.

[0026] Furthermore, the operation of the vacuum source 40 described above is as follows:
The process may not only start after the mold clamping actions of both molds 1 and 2 are completed, but also may be performed in parallel with the mold clamping actions of both molds, for example. That is, during the period from the mold open state shown in FIG. 2 to the complete mold clamp state shown in FIG.
In the process of mold clamping, in which the movable mold 2 is raised to the complete mold clamping position, when the movable mold 2 is raised to the intermediate mold clamping position, the vacuum is Source 40 may also be activated. At this time, the exhaust action between the molds 1 and 2 precedes the time when the molds are completely clamped, so the exhaust efficiency is better than if the exhaust action is started after the molds are completely clamped. There are advantages.

[0027] Also, both of the outside air blocking members 30, 3
3 is moved backward through the drive mechanisms 31 and 34 to a position (see FIG. 2) that does not hinder the attachment/detachment/replacement of the chase blocks 7 and 8 to the mold bases 3 and 4. It is set up like this. Therefore, both the outside air blocking members 30, 33
Since both molds 1 and 2 can be opened and closed with the molds 1 and 2 moved forward to the forward positions shown in FIG.
It is not necessarily necessary to move the outside air blocking members 30 and 33 backward every normal resin molding cycle.

[0028] According to the configuration of the embodiment described above, when both the fixed and movable molds 1 and 2 are clamped, both the outside air blocking members 33 and 30 are slid and the outside air blocking members 33 and 30 are closed. By fitting both, at least the pot 9 and the resin passage 2 in both the molds 1 and 2
5, 26. The outside air-blocking space 38 can be easily formed by covering the outer periphery of the cavities 20, 10. Further, the configuration of this external forced air exhaust means, particularly the fitting configuration of both external air blocking members 33 and 30, and the workability and operability thereof are extremely simplified. Therefore, by operating the vacuum source 40 connected to the outside air shutoff space 38, the residual air in the outside air shutoff space 38 is efficiently and reliably released outside through the vacuum path 39. Can be forcibly ejected. Further, by performing resin sealing molding of the electronic component in this state, it is possible to prevent residual air in the outside air shielding space 38 from mixing into the molten resin material. Furthermore, even if the air inside the resin material flows out into the outside air shielding space 38 during the process of heating and melting the resin material R, the air can be similarly exhausted, so that it will not get mixed into the molten resin material. can be prevented. Further, since the fitting action of both the outside air blocking members 33 and 30 can be performed independently of the mold opening/closing action of the two molds 1 and 2, this fitting action can be performed to completely close the molds of the two molds. By performing this after or after intermediate mold clamping, for example, the lead frame 27 and the resin material R
When the molds 1 and 2 are improperly set, the clamping action of both dies 1 and 2 and the fitting action of both outside air shielding members 33 and 30 are performed simultaneously, and the mold surfaces of the two molds, the lead frame, and the outside air shielding members 33 and 30 are simultaneously performed. It is possible to prevent operational dangers such as damage to the parts used.

[0029] The present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately modified and selected as necessary without departing from the spirit of the present invention. It is. For example, in a configuration in which both outside air blocking members 33 and 30 are fitted together, the outside air blocking member 30 fitted to the movable mold base 4 is fitted to the fixed mold base 3, and the outside air blocking member 30 fitted to the fixed mold base 3 is It is also possible to adopt a configuration opposite to that shown in the embodiment drawings, in which the member 33 is fitted onto the outer circumferential surface of the member 33. Further, the fitting surfaces of both outside air blocking members 33 and 30 may be vertical cross-sectional surfaces 41 in the vertical direction as shown in FIGS. 2 to 5, or may be tapered surfaces 42 as shown in FIG. In short, any configuration is sufficient as long as the seal member 36 interposed between the fitting surfaces of the two can block the flow of air between the two. In addition, in the embodiment diagram, the outside air blocking space 3
8 is constructed between the joining surfaces of both molds 1 and 2 and around the outer side thereof, but the outside air blocking space 3
8 and both ejector plates 1 in both types.
A configuration may also be adopted in which a ventilation hole is provided between the fitting spaces 2 and 22 and the residual air in the fitting spaces is also discharged to the outside at the same time. Further, the present invention is not limited to the type in which both the chase blocks 7 and 8 are frequently attached and detached as shown in the embodiment, but can be similarly applied to a resin sealing molding apparatus for electronic components having a normal type configuration. It is clear that it can be applied to The drive mechanisms 31 and 34 for the outside air blocking members 33 and 30 may be, for example, a mechanical drive mechanism such as a suitable rack and pinion mechanism, an electric drive mechanism such as an electric motor, or a hydraulic or pneumatic drive mechanism. Although any fluid drive mechanism such as pressure may be employed, from the viewpoint of resin sealing molding of electronic components, it is preferable to employ the above-mentioned electric drive mechanism or pneumatic drive mechanism.

【0030】

[Effects of the Invention] According to the present invention, the residual air existing in the constituent spaces of the pot, the resin passage, and the cavity when the mold is clamped and the air contained in the resin material are forced to the outside. can be discharged. In addition, it is possible to simplify not only the configuration of the external forced exhaust means for this air but also the overall configuration of the device, and to provide a resin encapsulation molding device for electronic components with excellent workability and operability. It is effective.

[0031] Furthermore, since the above-mentioned residual air and the like are not mixed into the molten resin material, it is possible to efficiently and reliably prevent the formation of voids and defects inside and on the surface of the resin molded body. This has the effect of providing a resin sealing molding device for electronic parts.

[0032] In addition, especially when applied to a type of resin sealing molding equipment for electronic components in which both chase blocks on the fixed side and movable side are frequently attached and detached from both fixed and movable molds, synergistic It is effective.

[0033] In addition to the various effects described above, the present invention also provides excellent practical effects such as being able to mold this type of product with high quality and high reliability.

[Brief explanation of the drawing]

FIG. 1 is a partially exploded perspective view schematically showing the configuration of an apparatus for resin sealing and molding electronic components.

FIG. 2 is a partially cutaway vertical cross-sectional view showing an enlarged main part of the mold in the resin encapsulation molding apparatus for electronic components according to the present invention, showing the mold in an open state before resin encapsulation molding.

FIG. 3 is a partially cutaway vertical sectional view of the main part of the mold corresponding to FIG. 2, showing the mold clamping state during resin sealing molding.

FIG. 4 is a partially cutaway vertical sectional view of the main part of the mold corresponding to FIG. 2, showing the mold in an open state after resin sealing molding.

FIG. 5 is an enlarged vertical cross-sectional view of the fitting surfaces of both outside air blocking members.

FIG. 6 shows another example of the shape of the outside air blocking members, and is a longitudinal cross-sectional view of the fitting surfaces of the two.

[Explanation of symbols]

1 Fixed type 2 Movable type 3 Fixed side mold base 4 Movable mold base 5 Heating means 6 Heating means 7 Fixed side chase block 7b block 8 Movable side chase block 8b block 9 pots 10 Cavity 11 Heating means 12 Lower ejector plate 12a Ejector pin 13 Plunger holder 13a Plunger 13b Rail member 20 Cavity 21 Heating means 22 Ejector plate 22a Ejector pin 25 Cal Club 26 Gate section 27 Lead frame 27a Electronic parts 28 Supply and extraction mechanism 30 Outside air blocking member 31 Drive mechanism 32 Seal member 33 Outside air blocking member 34 Drive mechanism 35 Seal member 36 Seal member 37 Seal member 38 Outside air isolation space 39 Vacuum path 40 Vacuum source 41 Cross section vertical plane 42 Tapered surface R Resin material P Resin molded body.

Claims (3)

[Claims] 1. A resin sealing molding apparatus for electronic components, comprising a resin molding mold in which a fixed mold 1 and a movable mold 2 are disposed facing each other, the fixed mold 1 and the movable mold 2 being arranged opposite to each other.
Outside air blocking members 33 and 30 that cover at least the outer periphery of the resin material supply pot 9, the resin passages 25 and 26, and the resin molding cavities 10 and 20 in both molds 1 and 2 are slid onto the molds 1 and 2, respectively. Both of the outside air blocking members 33 and 30 are arranged to be movably fitted together, and both of the outside air blocking members 33 and 30 are fitted together when the molds 1 and 2 are clamped. Seal members are interposed between the fitting surfaces of the outside air blocking members 33, 30 and the fitting surfaces of both the outside air blocking members 33, 30, and
0 Resin for an electronic component characterized in that when the two molds are fitted, the outside air blocking space 38 set between the molds 1 and 2 is connected to the vacuum source 40 side through a vacuum path 39. Sealing molding equipment. 2. An electronic device comprising a resin molding mold in which a fixed mold 1 and a movable mold 2 are disposed facing each other, and chase blocks 7 and 8 are removably fitted to the molds 1 and 2. This is a resin sealing molding apparatus for parts, and each of the fixed mold 1 and the movable mold 2 is provided with at least a pot 9 for supplying resin material, resin passages 25 and 26, and a cavity for resin molding in both molds 1 and 2. Outside air blocking members 33 and 30 covering the outer periphery of the parts 10 and 20 are slidably fitted, and
Both of the external air blocking members 33 and 30 are arranged so that they can be fitted together when the molds 1 and 2 are clamped, and when the chase blocks 7 and 8 are attached to and removed from the molds 1 and 2, It is arranged so as to be freely retractable to a position that does not obstruct the attachment/detachment work, and each of the fitting surfaces of the molds 1 and 2 and the outside air blocking members 33 and 30, as well as
A sealing member is interposed between the fitting surfaces of both the external air blocking members 33 and 30, and furthermore, when both the external air blocking members 33 and 30 are fitted, both molds 1 and 2
The outside air isolation space 38 and the vacuum source 40 are set between
A resin sealing molding apparatus for electronic parts, characterized in that the apparatus is configured such that the two sides are connected to each other via a vacuum path 39. 3. Both the outside air blocking members 33 and 30 are connected to both the mold bases 3 and 4 on the fixed side and the movable side, respectively.
3. The apparatus for resin sealing and molding electronic parts according to claim 1, wherein the resin sealing molding apparatus for electronic parts is slidably fitted onto the outer circumferential surface of the electronic parts.