JPH0559593U - Heat sensor - Google Patents

Abstract

(57) [Abstract] [Purpose] Regarding a heat detector that electrically detects temperature to detect a fire, it is not necessary to mount a heat-sensitive element as a component, and a quick response and high-precision temperature detection are possible. With the goal. [Structure] An insulating layer is formed on an inner surface of a heat collecting plate provided in a sensor body, and a thin film temperature sensing element pattern is formed on the insulating layer. Further, a thin temperature measuring element pattern is formed on the outer surface of the sensor body, and the temperature measuring element pattern is further coated with a protective layer.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a heat detector that electrically detects temperature to detect a fire.

[0002]

[Prior Art]

 Conventionally, as a heat sensor for reducing the cost by reducing the number of parts, for example, the one shown in FIG. 4 is known (Japanese Patent Laid-Open No. 63-284697). In FIG. 4, reference numeral 1 is a casing forming the sensor body, 2 is a wiring board, 3 is a heat sensitive element, and 4 is an electronic component. As shown in FIG. 5, the wiring board 2 has an insulating layer 12 formed on a metal substrate 11 and a conductive layer 13 such as a circuit pattern formed thereon.

According to the heat sensor having such a structure, the heat-sensitive element 3 can be easily attached, and the heat-sensitive plate and the circuit board on which the electronic component 4 is mounted are both used by the same wiring board 2. Thus, the number of parts can be reduced and the cost can be reduced.

[0004]

[Problems to be solved by the device]

 However, in such a conventional thermal sensor, the thermal element 3 prepared as a chip component is mounted on the circuit pattern as the conductive layer 13 formed on the insulating layer 11 on the back surface of the wiring board 2. Therefore, there is a problem that it takes time to mount the thermosensitive element 3.

Further, the mounted heat-sensitive element 3 is in a state where the lead portion is soldered to the circuit pattern, and the heat-sensitive element 3 itself is not in close contact with the surface of the wiring board 2. Therefore, the metal substrate 11 is used. However, the propagation of heat to the heat sensitive element 3 is not sufficient, and the response delay cannot be sufficiently improved. Further, since the heat-sensitive element 3 is a minute chip component, it only detects the temperature of a minute portion of the heat collecting plate, and if the temperature distribution of the heat collecting plate is uneven, the error with the actual ambient temperature is large. There was a fear of becoming.

The present invention has been made in view of the above conventional problems, and it is an object of the present invention to provide a heat sensor which does not require mounting as a component of a heat sensitive element and has a quick response and high accuracy temperature detection. To aim.

[0007]

[Means for Solving the Problems]

 In order to achieve this purpose, in the heat sensor of the present invention, an insulating layer is formed on the inner surface of the heat collecting plate provided in the sensor body, and a thin film temperature sensing element pattern is formed on this insulating layer. Is characterized by. Further, the heat detector of the present invention is characterized in that a thin film temperature sensing element pattern is formed on the outer surface of the sensor body, and the temperature sensing element pattern is further coated with a protective layer.

[0008]

[Action]

 According to the heat sensor of the present invention having such a configuration, since the heat sensitive element is formed in advance as a thin film temperature sensing pattern on the insulating layer on the inner surface of the heat collecting plate or on the outer surface of the sensor body. It is not necessary to treat the thermosensitive element as one component, and the mounting of the thermosensitive element can be eliminated.

Further, since the temperature measuring element pattern is formed with a relatively large heat collecting area, it is possible to detect an average temperature even if the temperature distribution is biased when the temperature rises immediately after the occurrence of a fire. The temperature can be detected with higher accuracy.

[0010]

【Example】

 FIG. 1 is a sectional view showing an embodiment of the present invention. In FIG. 1, reference numeral 1 is a sensor main body as a casing, and an opening 5 with a collar is provided inside the lower part. A heat collecting plate 6 is incorporated inside the opening 5 of the sensor body 1. The heat collecting plate 6 has an insulating layer 12 formed on the back surface of the metal substrate 11, a thin film temperature measuring element pattern 7 functioning as a heat-sensitive element is formed at the center of the insulating layer 12, and a circuit pattern is formed. A layer 13 is provided.

FIG. 2 shows the back surface of the heat collecting plate 6 of FIG. 1. A thin temperature measuring element pattern 7 is formed in a substantially comb shape on the insulating layer 12 on the back surface, and both ends of the comb pattern are formed. The terminal portion 8 is integrally provided. In FIG. 2, the conductive layer 13 forming the circuit pattern is omitted. The thin film temperature sensing element pattern 7 is, for example, a pattern of a material forming a thermistor and is heated and fixed, and is not limited to the thermistor, and an appropriate heat sensitive semiconductor or temperature sensing resistor is used as the thin film pattern. It should be formed.

Referring to FIG. 1 again, one end of the sensor body 1 is supported with respect to a predetermined portion of the conductive layer 13 forming the circuit pattern formed on the insulating layer 12 on the back surface of the heat collecting plate 6. The lower end of the fitting 9 is connected and fixed. The horizontal portion of the fitting 9 is mechanically and electrically fitted to the sensor base fixed to the ceiling surface. In the embodiment shown in FIGS. 1 and 2, the temperature sensing element pattern 7 functioning as a heat sensitive element is formed in advance on the back surface of the heat collecting plate 6 together with the circuit pattern of the conductive layer 13 to form one component. Therefore, it is not necessary to separately mount the heat sensitive element like the electronic component 4.

Further, as is apparent from FIG. 2, since the temperature sensing element pattern 7 is formed on the heat collecting plate 6 with a relatively large area, the temperature sensing element pattern 7 has a temperature deviation. However, since the average temperature is detected, and as a result, it is not affected by noise-like temperature changes, stable temperature detection can be performed and highly accurate temperature detection can be performed.

FIG. 3 is a cross-sectional view showing another embodiment of the present invention. In this embodiment, a partition plate 10 partitioned by the same resin mold is attached to the opening of the sensor body 1. is doing. Since the partition plate 10 is made of an insulating material, the conductive layer 13 forming the circuit pattern is directly formed on the back surface, and the electronic component 4 is mounted on the conductive layer 13.

On the outer surface of the partition plate 10, a thin film temperature measuring element pattern 7 that functions as the same thermosensitive element as shown in FIG. 2 is formed, and the temperature measuring element pattern 7 is exposed to the outside air. The protective coating portion 11 is formed in order to cut off the contact. The terminal portions at both ends of the temperature measuring element pattern 7 formed on the outer surface are electrically connected to the conductive layer 13 forming the circuit pattern on the back surface side by the conductive member 14 as a through hole penetrating through the partition plate 10. There is.

In the embodiment shown in FIG. 3, since the temperature measuring element pattern 7 functioning as a heat sensitive element is formed on the outside where it receives direct heat, it is necessary to provide an intermediate medium such as a heat collecting plate. In addition, it is possible to detect temperature changes during a fire with high sensitivity. Further, as is apparent from FIG. 2, the temperature sensing element pattern 7 has a certain amount of heat collecting area, so that it is not affected by noise due to a local temperature change and is stable and highly accurate. Detection can be done.

Although the back side is open in the embodiments shown in FIGS. 1 and 3, it is desirable to provide a back cover with a sealed structure in order to prevent intrusion of moisture and the like. Of course, it is also possible to block the contact with the outside air by providing a protective coating on the back side without providing a back cover. Further, the detector circuit implemented in the heat detector of the present invention is not limited to an ON / OFF type detector circuit that detects a fire by the detector itself and sends out a fire detection signal, and can detect a temperature of high accuracy. Since detection is possible, an analog sensor circuit that transmits the detected temperature as analog data may be mounted.

[0018]

[Effect of the device]

 As described above, according to the present invention, the temperature sensing element pattern that functions as a heat sensing element is formed in advance on the insulating layer inside the heat collecting plate or on the outer surface of the sensor body. It is not necessary to handle it as one component, and the mounting work can be simplified accordingly.

Further, since the temperature measuring element pattern is formed with a relatively large heat collecting area, it is possible to detect an average temperature even if the temperature distribution is uneven, and stable temperature detection can be performed with high sensitivity. Can be done at.

[Brief description of drawings]

FIG. 1 is a sectional view showing a position embodiment of the present invention.

FIG. 2 is an explanatory view of a temperature measuring element pattern of the present invention.

FIG. 3 is a sectional view showing another embodiment of the present invention.

FIG. 4 is an explanatory view of a conventional structure.

FIG. 5 is an enlarged view of a conventional wiring board.

[Explanation of symbols]

 1: Sensor main body (casing) 4: Electronic component 5: Opening part 6: Heat collecting plate 7: Temperature measuring element pattern 8: Terminal part 9: Fitting metal fitting 10: Partition plate 11: Protective coating part

Claims (2)

[Scope of utility model registration request] 1. A heat sensor characterized in that an insulating layer is formed on an inner surface of a heat collecting plate provided in a sensor body, and a thin temperature measuring element pattern is formed on the insulating layer. 2. A heat sensor characterized in that a thin film temperature sensing element pattern is formed on the outer surface of the sensor body, and the temperature sensing element pattern is coated with a protective layer.