JPH0558277B2 - - Google Patents
Info
- Publication number
- JPH0558277B2 JPH0558277B2 JP58068394A JP6839483A JPH0558277B2 JP H0558277 B2 JPH0558277 B2 JP H0558277B2 JP 58068394 A JP58068394 A JP 58068394A JP 6839483 A JP6839483 A JP 6839483A JP H0558277 B2 JPH0558277 B2 JP H0558277B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- holes
- double
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、単独で使用する場合および2枚を
貼付して両面プリント基板として使用する場合で
も電子部品が位置ずれなく装着できるプリント基
板に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a printed circuit board on which electronic components can be mounted without misalignment even when used alone or when two boards are pasted together to form a double-sided printed circuit board. It is.
従来、部品装着装置で位置決めして電子部品
(例えば、チツプ状のIC、タンタルコンデンサ
等)を実施するプリント基板は、第1図に示すよ
うにプリント基板1の側端面2から所定距離にあ
る基準線Lに第1,第2の基準穴3,4が設けて
ある。なお、第1の基準穴3の穴径と小判形の第
2の基準穴4の幅Wは同一とし、第2の基準穴4
は第1の基準穴3を基準として所定間隔で設けて
あり、この構成によれば部品装着装置の基準ピン
間と、第1,第2の基準穴3,4間の間隔が完全
に一致しなくともプリント基板1の位置決めに支
障となることはない。
Conventionally, printed circuit boards on which electronic components (e.g., chip-shaped ICs, tantalum capacitors, etc.) are mounted by positioning with a component mounting device are placed on a reference board located at a predetermined distance from the side end surface 2 of the printed circuit board 1, as shown in FIG. First and second reference holes 3 and 4 are provided on the line L. Note that the hole diameter of the first reference hole 3 and the width W of the oval-shaped second reference hole 4 are the same, and the second reference hole 4
are provided at predetermined intervals with the first reference hole 3 as a reference, and with this configuration, the distance between the reference pins of the component mounting device and the distance between the first and second reference holes 3 and 4 completely match. At least, the positioning of the printed circuit board 1 will not be hindered.
したがつて、このプリント基板1の片面(第1
図の表面)に設けた配線パターン(図示省略)へ
電子部品を装着する場合、部品装着装置の基準ピ
ンを第1,第2の基準穴3,4に挿通して位置決
めし、プリント基板1の配線パターンに対応して
クリームはんだを塗布した上に電子部品を装着す
ればよい。そして、加熱により電子部品をプリン
ト基板1の配線パターンにはんだ付けする。 Therefore, one side (first side) of this printed circuit board 1
When mounting electronic components onto a wiring pattern (not shown) provided on the surface of the figure, the reference pins of the component mounting device are inserted into the first and second reference holes 3 and 4 for positioning, and then All you have to do is apply cream solder in accordance with the wiring pattern and then mount the electronic components. Then, the electronic components are soldered to the wiring pattern of the printed circuit board 1 by heating.
また、プリント基板1の両面に電子部品を装着
する場合は、配線パターンをプリント基板1の両
面に形成し、電子部品を装着、はんだ付けする工
程を表裏で2度行えばよい。 Furthermore, when mounting electronic components on both sides of the printed circuit board 1, wiring patterns may be formed on both surfaces of the printed circuit board 1, and the process of mounting and soldering the electronic components may be performed twice on the front and back sides.
しかしながら、この2度目の工程においては、
先に電子部品を装着、はんだ付けした面を下面と
して上面に装着した電子部品のはんだ付けのため
に加熱するので、電子部品の実装が終了している
下面のはんだが加熱によつて再度溶融してしまう
ため、電子部品が落下しないように接着剤を併用
する必要がある。 However, in this second step,
Since the electronic components are mounted first and the soldered surface is placed on the bottom surface and heated to solder the electronic components mounted on the top surface, the solder on the bottom surface where the electronic components have already been mounted will melt again due to the heating. Therefore, it is necessary to use an adhesive to prevent the electronic components from falling.
そこで、2枚のプリント基板1の配線パターン
をそれぞれ外側にして貼付し、両面に配線パター
ンを設けた第2図、第3図に示す両面プリント基
板7を形成すると、表側のプリント基板1から裏
側のプリント基板1への熱伝導が悪くなり、前述
の接着剤を併用する点は省略することができる。
このような両面プリント基板7は第1図のプリン
ト基板1を2枚用意し、一方のプリント基板1を
左右方向に裏返し、他方のプリント基板1に貼付
して第2図のようにしてもよく、または第1図に
二点鎖線で示すように第1の基準穴3を基準にし
て第1,第2の基準穴3,4と同様な第3,第4
の基準穴5,6を所定間隔をおいて第1,第2の
基準穴3,4と対向して設けた2枚のプリント基
板1を用意し、一方のプリント基板1を上下方向
に裏返し、他方のプリント基板1に貼付して第3
図のように両面プリント基板7としてもよい。 Therefore, if the two printed circuit boards 1 are pasted with their wiring patterns on the outside to form a double-sided printed circuit board 7 shown in FIGS. Since the heat conduction to the printed circuit board 1 becomes poor, the above-mentioned use of the adhesive can be omitted.
Such a double-sided printed circuit board 7 may be obtained by preparing two printed circuit boards 1 shown in FIG. 1, turning one printed circuit board 1 over in the left-right direction, and pasting it on the other printed circuit board 1 as shown in FIG. , or as shown by the two-dot chain line in FIG.
Prepare two printed circuit boards 1 with reference holes 5 and 6 facing the first and second reference holes 3 and 4 at a predetermined interval, turn one of the printed circuit boards 1 over in the vertical direction, Attach it to the other printed circuit board 1 and attach it to the third
A double-sided printed circuit board 7 may be used as shown in the figure.
しかし、第2図の場合は上,下のプリント基板
1,1の第1,第2の基準穴3,4を、第3図の
場合は上、下のプリント基板1,1の第1,第3
の基準穴3,5および第2,第4の基準穴4,6
を完全に一致させて両面プリント基板7とするこ
とは困難である。したがつて、両面プリント基板
7は部品装着装置にセツトできなくなつたり、部
品装着装置の基準ピンで位置決めして電子部品を
精度よく装着することができない。また、第3図
の場合は両面プリント基板7を左右方向に搬送す
るので、搬送方向と直角方向に両面プリント基板
7を電子部品の実装ラインで裏返すこととなり、
実装ラインへのインライン化を困難にするという
問題がある。 However, in the case of Fig. 2, the first and second reference holes 3, 4 of the upper and lower printed circuit boards 1, 1 are inserted, and in the case of Fig. 3, the first and second reference holes of the upper and lower printed circuit boards 1, 1 are Third
reference holes 3 and 5 and second and fourth reference holes 4 and 6
It is difficult to make a double-sided printed circuit board 7 by matching the two sides completely. Therefore, the double-sided printed circuit board 7 cannot be set on the component mounting device, and electronic components cannot be accurately mounted by positioning it using the reference pins of the component mounting device. In addition, in the case of FIG. 3, since the double-sided printed circuit board 7 is transported in the left-right direction, the double-sided printed circuit board 7 is turned over at the electronic component mounting line in a direction perpendicular to the transport direction.
There is a problem in that it makes it difficult to inline the implementation line.
この発明は、上記の点にかんがみてなされたも
ので、単独で使用する場合および2枚を貼付して
両面プリント基板として使用する場合でもその第
1,第2の基準穴で位置決めし、精度よく電子部
品が装着でき、実装ラインへのインライン化を容
易にしたプリント基板を提供するものである。
This invention was made in view of the above points, and even when used alone or when two sheets are pasted together to form a double-sided printed circuit board, the first and second reference holes are used to position the board with high precision. The present invention provides a printed circuit board on which electronic components can be mounted and which can be easily installed in-line to a mounting line.
この発明は、上記の目的を達成するため、プリ
ント基板の一側端面から所定距離にある基準線上
に所定間隔をおいて第1,第2の基準穴と、所定
間隔をおいて第1,第2の基準穴よりも大きい第
1,第2の穴を設け、単独で使用する場合および
2枚を貼付して両面プリント基板として使用する
場合でもその第1,第2の基準穴で位置決めし、
精度よく電子部品が装着でき、実装ラインへのイ
ンライン化を容易にできるようにしたものであ
る。
In order to achieve the above object, the present invention provides first and second reference holes arranged at a predetermined interval on a reference line located at a predetermined distance from one side end surface of a printed circuit board, and first and second reference holes arranged at a predetermined interval from a reference line located at a predetermined distance from one side end surface of a printed circuit board. First and second holes larger than the second reference hole are provided, and the first and second reference holes are used for positioning even when used alone or when two sheets are attached and used as a double-sided printed circuit board,
This allows electronic components to be mounted with high precision and allows for easy in-line installation on the mounting line.
第4図はこの発明の一実施例を示すプリント基
板の平面図、第5図は2枚の第4図に示すプリン
ト基板を貼付して両面プリント基板とした平面図
である。
FIG. 4 is a plan view of a printed circuit board showing an embodiment of the present invention, and FIG. 5 is a plan view of a double-sided printed circuit board formed by pasting two printed circuit boards shown in FIG. 4 together.
これらの図において、11は第4図の表面に配
線パターン(図示省略)を設けたプリント基板
で、側端面12から所定距離にある基準線Lの上
に第1,第2の基準穴13,14と、第1,第2
の穴15,16がそれぞれ所定間隔Dをおいて設
けてある。なお、第1の基準穴13の穴径と小判
形の第2の基準穴14の幅Wは同一とし、第1,
第2の穴15,16は第1,第2の基準穴13,
14よりも大きく形成してある。 In these figures, 11 is a printed circuit board with a wiring pattern (not shown) on the surface shown in FIG. 4, and first and second reference holes 13, 14, 1st, 2nd
Holes 15 and 16 are provided at a predetermined distance D from each other. Note that the hole diameter of the first reference hole 13 and the width W of the oval-shaped second reference hole 14 are the same, and the first,
The second holes 15 and 16 are the first and second reference holes 13,
It is formed larger than 14.
17は前記プリント基板11を2枚それぞれの
配線パターンを外側にして貼付した両面プリント
基板である。 Reference numeral 17 denotes a double-sided printed circuit board in which two of the printed circuit boards 11 are attached with their respective wiring patterns facing outside.
上記のように第1,第2の基準穴13,14
と、第1,第2の穴15,16を設けたこの発明
のプリント基板11は、単独で使用する時は部品
装着装置の基準ピンを第1,第2の基準穴13,
14に挿通して位置決めし、精度よく電子部品を
装着できる。 As mentioned above, the first and second reference holes 13 and 14
When the printed circuit board 11 of the present invention having the first and second holes 15 and 16 is used alone, the reference pin of the component mounting device is inserted into the first and second reference holes 13 and 16.
14 for positioning and mounting of electronic components with high precision.
また、第4図に示す2枚のプリント基板11の
一方を左右方向に裏返し、他方のプリント基板1
1に貼付すると、第1,第2の基準穴13,14
と第1,第2の穴15,16は所定間隔Dで、第
1,第2の穴15,16は第1,第2の基準穴1
3,14よりも大きく形成してあるので、第5図
に示す両面プリント基板17となる。したがつ
て、上、下のプリント基板11,11は第1,第
2の基準穴13,14と第1,第2の穴15,1
6を精度よく貼付する必要がなくなる。また、上
側のプリント基板11は部品装着装置の基準ピン
をその第1,第2の基準穴13,14を挿通して
位置決めし、精度よく電子部品を装着できる。そ
して、両面プリント基板17を左右方向に裏返す
と、下側のプリント基板11は上側になり、その
第1,第2の基準穴13,14に部品装着装置の
基準ピンを挿通して位置決めし、精度よく電子部
品を装着できる。さらに、両面プリント基板17
は第6図に示すように矢印で記す搬送方向、すな
わち第5図の左右方向に裏返すことで両面に電子
部品が装着できるので、実装ラインへのインライ
ン化が容易になる。 In addition, one of the two printed circuit boards 11 shown in FIG. 4 is turned over in the left-right direction, and the other printed circuit board 1
1, the first and second reference holes 13 and 14
and the first and second holes 15 and 16 are at a predetermined interval D, and the first and second holes 15 and 16 are connected to the first and second reference hole 1.
3 and 14, the double-sided printed circuit board 17 shown in FIG. 5 is obtained. Therefore, the upper and lower printed circuit boards 11 and 11 have first and second reference holes 13 and 14 and first and second holes 15 and 1.
There is no need to paste 6 with high accuracy. Moreover, the upper printed circuit board 11 is positioned by inserting the reference pin of the component mounting device through the first and second reference holes 13 and 14, so that electronic components can be mounted with high precision. Then, when the double-sided printed circuit board 17 is turned over in the left-right direction, the lower printed circuit board 11 becomes the upper side, and the reference pins of the component mounting device are inserted into the first and second reference holes 13 and 14 for positioning. Electronic components can be mounted with high precision. Furthermore, the double-sided printed circuit board 17
As shown in FIG. 6, electronic components can be mounted on both sides by flipping it over in the transport direction indicated by the arrow, that is, in the left-right direction in FIG. 5, making it easy to inline the mounting line.
なお、上記実施例は2枚のプリント基板11を
貼付した例で説明したが、この貼付は2枚のプリ
ント基板11を接着剤で接着して積層基板として
もよく、2枚のプリント基板11の対向する端面
を接着テープで仮固定して両面プリント基板17
としてもよい。後者の場合は、後で2枚のプリン
ト基板11に分離して使用することができる利点
がある。 Although the above embodiment has been described with reference to an example in which two printed circuit boards 11 are pasted together, this pasting may also be done by bonding two printed circuit boards 11 with adhesive to form a laminated board. Double-sided printed circuit board 17 by temporarily fixing the opposite end faces with adhesive tape
You can also use it as In the latter case, there is an advantage that the two printed circuit boards 11 can be separated and used later.
以上説明したように、この発明のプリント基板
は基準線上に第1,第2の基準穴と、第1,第2
の穴をそれぞれ所定間隔で設けたので、単独で使
用する場合および2枚を貼付して両面プリント基
板として使用する場合でも精度よく電子部品を装
着できる。また、両面プリント基板とした場合は
搬送方向に裏返すことで両面に電子部品が装着で
きるので、電子部品の実装ラインへのインライン
化が容易になる等の利点がある。
As explained above, the printed circuit board of the present invention has the first and second reference holes on the reference line, and the first and second reference holes.
Since the holes are provided at predetermined intervals, electronic components can be mounted with high precision even when used alone or when two sheets are attached to form a double-sided printed circuit board. Furthermore, in the case of a double-sided printed circuit board, electronic components can be mounted on both sides by flipping it over in the transport direction, which has the advantage of facilitating in-line mounting of electronic components.
第1図は従来のプリント基板を示す平面図、第
2図,第3図は2枚の第1図に示すプリント基板
を貼付して両面プリント基板とした平面図、第4
図はこの発明の一実施例を示す平面図、第5図は
2枚の第4図に示すプリント基板を貼付して両面
プリント基板とした平面図、第6図は両面プリン
ト基板をライン上で反転するときの説明図であ
る。
図中、11はプリント基板、12は側端面、1
3は第1の基準穴、14は第2の基準穴、15は
第1の穴、16は第2の穴、17は両面プリント
基板、Lは基準線である。
Figure 1 is a plan view showing a conventional printed circuit board, Figures 2 and 3 are plan views of a double-sided printed circuit board made by pasting two printed circuit boards shown in Figure 1, and Figure 4 is a plan view showing a conventional printed circuit board.
The figure is a plan view showing an embodiment of the present invention, FIG. 5 is a plan view of a double-sided printed circuit board made by pasting two printed circuit boards shown in FIG. 4, and FIG. It is an explanatory view when inverting. In the figure, 11 is a printed circuit board, 12 is a side end surface, 1
3 is a first reference hole, 14 is a second reference hole, 15 is a first hole, 16 is a second hole, 17 is a double-sided printed circuit board, and L is a reference line.
Claims (1)
いる基準線上に位置決め用の第1の基準穴と、基
準線と直角方向に前記第1の基準穴と同一の幅を
有し前記基準線方向に伸びている第2の基準穴と
を所定の間隔をおいて設け、 さらに、前記基準線に直交する方向を回転軸と
して前記プリント基板を180度回転して裏返し、
上記プリント基板を2枚重ねた場合に前記第1、
及び第2の基準穴が位置する点に、前記第1、第
2の基準穴の開孔面積より大きい開孔面積を有す
る第1、及び第2の穴が前記プリント基板に設け
られていることを特徴とするプリント基板。[Claims] 1. A first reference hole for positioning on a reference line separated from one side of a printed circuit board by a predetermined distance, and having the same width as the first reference hole in a direction perpendicular to the reference line. a second reference hole extending in the direction of the reference line is provided at a predetermined interval, and further, the printed circuit board is rotated 180 degrees with a rotation axis perpendicular to the reference line and turned over;
When the two printed circuit boards are stacked, the first
and first and second holes having opening areas larger than the opening areas of the first and second reference holes are provided in the printed circuit board at the point where the second reference hole is located. A printed circuit board featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58068394A JPS59194484A (en) | 1983-04-20 | 1983-04-20 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58068394A JPS59194484A (en) | 1983-04-20 | 1983-04-20 | Printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59194484A JPS59194484A (en) | 1984-11-05 |
JPH0558277B2 true JPH0558277B2 (en) | 1993-08-26 |
Family
ID=13372438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58068394A Granted JPS59194484A (en) | 1983-04-20 | 1983-04-20 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59194484A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6349273U (en) * | 1986-09-18 | 1988-04-04 | ||
JPH056867U (en) * | 1991-07-10 | 1993-01-29 | 株式会社三協精機製作所 | Printed circuit board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5612375B2 (en) * | 1977-08-11 | 1981-03-20 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5926616Y2 (en) * | 1979-07-05 | 1984-08-02 | ミツミ電機株式会社 | Board terminal hole structure |
-
1983
- 1983-04-20 JP JP58068394A patent/JPS59194484A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5612375B2 (en) * | 1977-08-11 | 1981-03-20 |
Also Published As
Publication number | Publication date |
---|---|
JPS59194484A (en) | 1984-11-05 |
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