JPH0556770B2 - - Google Patents
Info
- Publication number
- JPH0556770B2 JPH0556770B2 JP61131315A JP13131586A JPH0556770B2 JP H0556770 B2 JPH0556770 B2 JP H0556770B2 JP 61131315 A JP61131315 A JP 61131315A JP 13131586 A JP13131586 A JP 13131586A JP H0556770 B2 JPH0556770 B2 JP H0556770B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- bisphenol
- diglycidyl ether
- room temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 11
- 239000002253 acid Substances 0.000 claims description 5
- 239000000539 dimer Substances 0.000 claims description 5
- -1 glycidyl ester Chemical class 0.000 claims description 5
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- 150000008065 acid anhydrides Chemical class 0.000 claims description 3
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 2
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 claims description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000012360 testing method Methods 0.000 description 10
- 238000001816 cooling Methods 0.000 description 9
- 238000001723 curing Methods 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000374 eutectic mixture Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、エポキシ樹脂組成物に関し、特に、
電気、電子部品の注型に好適とされる組成物に関
する。
（背景技術と従来技術）
近年、セラミツクコンデンサ、フオーカス抵
抗、ハイブリツドICなどのセラミツク電子部品
の絶縁を目的としてエポキシ樹脂系の注型材料が
使用されている。
しかし一般に、絶縁処理されるセラミツク電子
部品と注型材料との間には熱膨張係数の差がある
ため、注型材料を硬化させる際の冷却時や冷熱サ
イクル時にクラツクが発生し絶縁不良を起こすと
いう問題がある。
従来、上記のような問題を解決することを目的
として硬化樹脂に可撓性を付与することが行われ
ている。可撓性を有する硬化樹脂を得るためのエ
ポキシ樹脂組成物において、例えばダイマー酸グ
リシジルエステル、側鎖型ビスフエノールＡグリ
シジルエーテル、ポリプロピレングリコールグリ
シジルエーテルなどのような硬化して可撓性を有
する硬化物を与えるエポキシ樹脂(イ)と、ポリアミ
ドアミン、ポリオキシプロピレンジアミン、ポリ
酸ポリ無水物などの可撓性硬化剤(ロ)と、ポリオー
ル、フタル酸エステル、高級脂肪酸などの可撓性
付与剤(ハ)とが、単独又は組合せで配合されてい
る。
このようなエポキシ樹脂組成物を電気、電子部
品の絶縁用注型樹脂として使用した場合、冷熱サ
イクル時のクラツクは生じにくくなるものの、セ
ラミツクとの接着性や耐湿性が著しく劣るという
不利がある。
（発明の目的と構成）
本発明は、注型絶縁処理されたセラミツク電子
部品において冷熱サイクル時にクラツクが生じに
くく、セラミツクとの密接性ないし固着性や耐湿
性の良好な硬化物を与えるエポキシ樹脂組成物を
提供することを目的とする。
本発明は、ビスフエノールＡジグリシジルエー
テル、水添ビスフエノールＡジグリシジルエーテ
ル、ビスフエノールＦジグリシジルエーテル、ビ
スフエノールADジグリシジルエーテルの群から
選ばれるエポキシ樹脂の１種又は２種以上(A)15〜
85重量部、ダイマー酸グリシジルエステル(B)85〜
15重量部〔(a)成分と(b)成分の合計量を100重量部
とする。〕、常温で液状のポリカルボン酸無水物硬
化剤(C)有効量、常温で液状の末端にカルボキシル
基を有するブタジエン・アクリロニトリル共重合
オリゴマー(D)５〜50重量部を必須成分とするエポ
キシ樹脂組成物である。
本発明における(A)成分のエポキシ樹脂として
は、性状、エポキシ当量、分子量に制限はなく、
常温で液状の組成物を与えるものであればよい。
本発明における(B)成分のダイマー酸グリシジル
エステルは、ダイマー酸とエピクロルヒドリンを
反応させて得られる常温で液状のエポキシ樹脂
で、市販品としてはエピコート871（油化シエルエ
ポキシ株式会社）があげられる。
本発明における(C)成分の常温で液状のポリカル
ボン酸無水物硬化剤は、分子量、分子構造などに
制限はなく公知の種々のものを使用することがで
きる。
具体的にはメチルヘキサハイドロ無水フタル
酸、メチルテトラハイドロ無水フタル酸、ドデセ
ニル無水コハク酸、無水メチルナデイツク酸など
をあげることができる。これらの１種又は２種以
上を任意の割合で使用することができる。また、
常温で固体の無水フタル酸、テトラハイドロ無水
フタル酸、ヘキサハイドロ無水フタル酸などは他
の酸無水物と常温で液状の共融混合物を形成せし
めることにより使用することができる。
本発明における(D)成分の常温で液状の末端にカ
ルボキシル基を有するブタジエン・アクリロニト
リル共重合体オリゴマーは常温で液状であればブ
タジエンとアクリロニトリルとの共重合割合など
に特に制限はなく、公知の種々のものを使用する
ことができる。
本発明における(A)成分と(B)成分の合計量100重
量部に占める(B)成分の量は85〜15重量部の範囲で
あり、好ましくは70〜30重量部の範囲である。85
重量部を超えると硬化樹脂の耐湿性が劣り、15重
量部末端では硬化させる際の冷却時や冷熱サイク
ル時にクラツクが発生しやすくなる。
本発明における(C)成分の量は(A)成分と(B)成分か
らなるエポキシ樹脂を硬化させる有効量であれば
よく、好ましくはエポキシ１当量に対し酸無水物
0.55〜1.45当量である。
本発明における(D)成分の量は(A)成分と(B)成分の
合計量100重量部に対し５〜50重量部の範囲であ
る。５重量部より少いと硬化させる際の冷却時や
冷熱サイクル時にクラツクが発生しやすく、かつ
セラミツクに対する接着性が劣る。50重量部より
多いと硬化樹脂の耐湿性が著しく悪くなる。
本発明の組成物には、本発明の目的を阻害しな
い限り、他の成分、例えば硬化促進剤、無機質充
てん剤、希釈剤、難燃化剤、消泡剤、着色剤など
を添加配合してもよい。
硬化促進剤としては、第３級アミン化合物およ
びその塩、DBU〔1.8−ジアザビシクロ（５、４、
０）ウンデセン−７〕およびその塩、イミダゾー
ル化合物、第４級アンモニウム塩、有機金属塩な
どを例示することができ、また無機質充てん剤と
しては、シリカ、アルミナ、水酸化アルミニウ
ム、酸化マグネシウム、炭酸カルシウム、タル
ク、マイカ、クレーなどをあげることができる。
本発明の組成物は、上記した(A)〜(D)成分および
任意成分を均一に混合することにより調製され
る。
（発明の効果）
上記したような組成からなる本発明のエポキシ
樹脂組成物を電気、電子部品の絶縁処理に適用し
た場合、加熱硬化後の冷却時や絶縁処理部品が冷
熱サイクルをうけても絶縁処理被膜が剥離したり
クラツクを発生することがなく、また部品と強固
に接着し、耐湿性にきわめてすぐれる。
（実施例と比較例）
実施例１〜５および比較例１〜４
下記の表に示すような組成からなるエポキシ樹
脂組成物を調製した。このものから得られる硬化
物について、下記に説明する接着強さ、耐クラツ
ク性、重量増加率および体積固有抵抗値を調べる
ために、エポキシ樹脂組成物を使用し各物性の測
定に適合する硬化物（試験サンプル）を作製し
た。
硬化物を作製するための硬化条件は、全て80℃
で３時間、更に110℃で５時間の加熱で行つた。
接着強さ：JIS K6850（接着剤の引張りせん断接
着強さ試験方法）による引張りせん断接着強さ
に従い測定した。
耐クラツク性：JIS C2105（電気絶縁用無溶剤液
状レジン試験方法）に準じて５個の試験片を作
製し、この各試験片についてクラツクの発生す
るサイクルを測定し、このサイクルの平均値を
算出した。
重量増加率〔プレツシヤークツク試験後のも
の〕：試験片を120℃、２気圧で、24時間加湿し、
この加湿後の試験片の重量を測定し、加湿前の
試験片の重量に対する百分率を算出した。
体積固有抵抗値〔プレツシヤークツク試験後のも
の〕：試験片を120℃、２気圧で24時間加湿しこの
加湿後の体積固有抵抗値を測定した。
【表】DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an epoxy resin composition, in particular,
The present invention relates to a composition suitable for casting electrical and electronic parts. (Background Art and Prior Art) In recent years, epoxy resin-based casting materials have been used for the purpose of insulating ceramic electronic components such as ceramic capacitors, focus resistors, and hybrid ICs. However, in general, there is a difference in thermal expansion coefficient between the ceramic electronic components to be insulated and the casting material, which causes cracks to occur during cooling and cooling cycles during curing of the casting material, resulting in poor insulation. There is a problem. Conventionally, flexibility has been imparted to cured resins in order to solve the above problems. In an epoxy resin composition for obtaining a cured resin having flexibility, a cured product having flexibility after being cured, such as dimer acid glycidyl ester, side chain type bisphenol A glycidyl ether, polypropylene glycol glycidyl ether, etc. An epoxy resin (a) that gives c) is blended alone or in combination. When such an epoxy resin composition is used as an insulating casting resin for electric or electronic parts, cracks are less likely to occur during cooling and heating cycles, but there are disadvantages in that the adhesiveness with ceramics and moisture resistance are significantly poor. (Objects and Structure of the Invention) The present invention provides an epoxy resin composition that is less likely to cause cracks during cooling and heating cycles in cast-insulated ceramic electronic components, and provides a cured product with good adhesion or adhesion to ceramics and moisture resistance. The purpose is to provide something. The present invention provides one or more epoxy resins (A) selected from the group of bisphenol A diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, and bisphenol AD diglycidyl ether. 15～
85 parts by weight, dimer acid glycidyl ester (B) 85~
15 parts by weight [total amount of components (a) and (b) is 100 parts by weight. ], an effective amount of a polycarboxylic anhydride curing agent (C) that is liquid at room temperature, and an epoxy resin containing 5 to 50 parts by weight of a butadiene-acrylonitrile copolymer oligomer (D) that has a terminal carboxyl group and is liquid at room temperature. It is a composition. The epoxy resin as component (A) in the present invention is not limited in properties, epoxy equivalent, or molecular weight,
Any material that provides a liquid composition at room temperature may be used. Dimer acid glycidyl ester, component (B) in the present invention, is an epoxy resin that is liquid at room temperature and is obtained by reacting dimer acid with epichlorohydrin, and a commercially available product is Epicote 871 (Yuka Ciel Epoxy Co., Ltd.). The polycarboxylic anhydride curing agent that is liquid at room temperature and is component (C) in the present invention is not limited in molecular weight, molecular structure, etc., and various known ones can be used. Specific examples include methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, dodecenylsuccinic anhydride, and methylnadic anhydride. One or more of these can be used in any proportion. Also,
Phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, etc. that are solid at room temperature can be used by forming a eutectic mixture that is liquid at room temperature with other acid anhydrides. In the present invention, the butadiene-acrylonitrile copolymer oligomer having a carboxyl group at a terminal which is liquid at room temperature as the component (D) is not particularly limited in the copolymerization ratio of butadiene and acrylonitrile as long as it is liquid at room temperature. can be used. In the present invention, the amount of component (B) in 100 parts by weight of the total amount of components (A) and (B) is in the range of 85 to 15 parts by weight, preferably in the range of 70 to 30 parts by weight. 85
If it exceeds 15 parts by weight, the moisture resistance of the cured resin will be poor, and at the end of 15 parts by weight, cracks will easily occur during cooling during curing or during cold/heat cycles. The amount of component (C) in the present invention may be any effective amount for curing the epoxy resin consisting of components (A) and (B), and preferably an acid anhydride per equivalent of epoxy.
It is 0.55-1.45 equivalent. The amount of component (D) in the present invention is in the range of 5 to 50 parts by weight based on 100 parts by weight of the total amount of components (A) and (B). If it is less than 5 parts by weight, cracks are likely to occur during cooling during curing or during cooling/heating cycles, and the adhesiveness to ceramics will be poor. If the amount exceeds 50 parts by weight, the moisture resistance of the cured resin will deteriorate significantly. The composition of the present invention may contain other components such as a curing accelerator, an inorganic filler, a diluent, a flame retardant, an antifoaming agent, a coloring agent, etc., as long as they do not impede the purpose of the present invention. Good too. As curing accelerators, tertiary amine compounds and their salts, DBU [1.8-diazabicyclo(5,4,
0) undecene-7] and its salts, imidazole compounds, quaternary ammonium salts, organic metal salts, etc., and examples of inorganic fillers include silica, alumina, aluminum hydroxide, magnesium oxide, and calcium carbonate. , talc, mica, clay, etc. The composition of the present invention is prepared by uniformly mixing the above-mentioned components (A) to (D) and optional components. (Effects of the Invention) When the epoxy resin composition of the present invention having the composition described above is applied to the insulation treatment of electrical and electronic parts, the insulation can be maintained even when cooling after heat curing or when the insulation treatment parts are subjected to cooling and heating cycles. The treated film does not peel or crack, it firmly adheres to parts, and has excellent moisture resistance. (Examples and Comparative Examples) Examples 1 to 5 and Comparative Examples 1 to 4 Epoxy resin compositions having compositions shown in the table below were prepared. In order to examine the adhesive strength, crack resistance, weight increase rate, and volume resistivity of the cured product obtained from this product, we used an epoxy resin composition to examine the cured product that meets the measurements of each physical property. (Test sample) was prepared. The curing conditions for producing cured products are all 80℃.
The mixture was heated at 110° C. for 3 hours, and then heated at 110° C. for 5 hours. Adhesive strength: Measured according to tensile shear adhesive strength according to JIS K6850 (tensile shear adhesive strength testing method for adhesives). Cracking resistance: Prepare 5 test pieces according to JIS C2105 (test method for solvent-free liquid resins for electrical insulation), measure the cycle in which cracks occur for each test piece, and calculate the average value of these cycles. did. Weight increase rate [after pressure test]: The test piece was humidified at 120℃ and 2 atm for 24 hours,
The weight of the test piece after humidification was measured, and the percentage with respect to the weight of the test piece before humidification was calculated. Volume resistivity value [after pressure test]: The test piece was humidified at 120° C. and 2 atm for 24 hours, and the volume resistivity value after this humidification was measured. 【table】
Claims (1)
添ビスフエノールＡジグリシジルエーテル、ビス
フエノールＦジグリシジルエーテル、ビスフエノ
ールADジグリシジルエーテルの群から選ばれる
エポキシ樹脂の１種又は２種以上(A)15〜85重量
部、ダイマー酸グリシジルエステル(B)85〜15重量
部〔(A)成分と(B)成分の合計量を100重量部とす
る。〕、常温で液状のポリカルボン酸無水物硬化剤
(C)有効量、常温で液状の末端にカルボキシル基を
有するブタジエン・アクリロニトリル共重合体オ
リゴマー(D)５〜50重量部を必須成分とするエポキ
シ樹脂組成物。[Scope of Claims] 1. One or more epoxy resins selected from the group of bisphenol A diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, and bisphenol AD diglycidyl ether. (A) 15 to 85 parts by weight, dimer acid glycidyl ester (B) 85 to 15 parts by weight [The total amount of components (A) and (B) is 100 parts by weight. ], a polycarboxylic acid anhydride curing agent that is liquid at room temperature.
(C) An epoxy resin composition containing as an essential component an effective amount of 5 to 50 parts by weight of butadiene-acrylonitrile copolymer oligomer (D) having a terminal carboxyl group, which is liquid at room temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13131586A JPS62288625A (en) | 1986-06-05 | 1986-06-05 | epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13131586A JPS62288625A (en) | 1986-06-05 | 1986-06-05 | epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62288625A JPS62288625A (en) | 1987-12-15 |
| JPH0556770B2 true JPH0556770B2 (en) | 1993-08-20 |
Family
ID=15055080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13131586A Granted JPS62288625A (en) | 1986-06-05 | 1986-06-05 | epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62288625A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04335556A (en) * | 1991-05-10 | 1992-11-24 | Murata Mfg Co Ltd | Hybrid integrated circuit |
| JP2007315843A (en) * | 2006-05-24 | 2007-12-06 | Takenaka Komuten Co Ltd | gamma-RAY SHIELDING PANEL MATERIAL, SEALANT, AND STRUCTURE |
| JP2014141584A (en) * | 2013-01-24 | 2014-08-07 | Toyama Prefecture | Thermosetting resin composition |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649729A (en) * | 1979-06-25 | 1981-05-06 | Basf Ag | Thermoplastic secmented elastomer copolymer ether ester and its use as pressureesensitive adhesive |
| JPS5718752A (en) * | 1980-07-07 | 1982-01-30 | Hitachi Ltd | Epoxy resin composition |
| JPS57187314A (en) * | 1981-05-15 | 1982-11-18 | Asahi Denka Kogyo Kk | Energy ray-curable resin composition |
| JPS6047015A (en) * | 1983-08-25 | 1985-03-14 | Nitto Electric Ind Co Ltd | Lining material for cast iron pipe joint |
-
1986
- 1986-06-05 JP JP13131586A patent/JPS62288625A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649729A (en) * | 1979-06-25 | 1981-05-06 | Basf Ag | Thermoplastic secmented elastomer copolymer ether ester and its use as pressureesensitive adhesive |
| JPS5718752A (en) * | 1980-07-07 | 1982-01-30 | Hitachi Ltd | Epoxy resin composition |
| JPS57187314A (en) * | 1981-05-15 | 1982-11-18 | Asahi Denka Kogyo Kk | Energy ray-curable resin composition |
| JPS6047015A (en) * | 1983-08-25 | 1985-03-14 | Nitto Electric Ind Co Ltd | Lining material for cast iron pipe joint |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62288625A (en) | 1987-12-15 |
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