JPH0547904A - Equipment and method for positioning - Google Patents

Abstract

PURPOSE:To surely position a product accommodated in a pallet. CONSTITUTION:A positioning plate 2 which is equipped with positioning pins 2a having tapered tips and moves up and down, and a pushing-up pin 7 which is arranged below the positioning plate 2 and equipped with a constant pressure mechanism 8 are installed. The pushing-up pin 7 raises semiconductor 3 on a pallet 4 through a penetrating hole 4c of the pallet 4, and presses the semiconductor against the positioning plate 2, thereby performing positioning. Hence positioning is possible independently of pallet precision, and positioning in the height direction also is possible.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for positioning workpieces such as semiconductors having mounting holes arranged in a pallet.

[0002]

2. Description of the Related Art FIG. 3 shows a pallet of a carrying jig, FIG. 4 shows a state in which semiconductors are stored in this pallet, and FIG. 5 shows a conventional positioning device. In these figures, 1 is a cylinder, 2 is a positioning plate having a vertical guide mechanism (not shown), 2a is a positioning pin having a tapered tip attached to this positioning plate, 3 is a semiconductor, 3a is a semiconductor 3 Positioning holes processed in 4 are pallets for accommodating the semiconductors 3, 4a are holes for accommodating and accommodating the semiconductors 3, 4b is a work guide plate having several accommodating holes 4a.

Next, the operation will be described. When the pallet 4 containing the semiconductor 3 is carried into the positioning device and the vertical cylinder 1 is lowered, the positioning plate 2 having a guide mechanism (not shown) in the vertical direction and the positioning pin 2a are simultaneously lowered. Positioning pin 2a lowered
Enters the positioning hole 3a of the semiconductor 3 in the pallet,
Perform positioning.

[0004]

Although the conventional positioning device is configured as described above, the position of the semiconductor 3 is corrected by the taper of the tip of the positioning pin 2a when the positioning pin 2a is lowered. However, there is a problem in that the clearance changes due to the variation in the accuracy of the work guide 4b, and a positioning error such as interference or positional deviation occurs.

The present invention has been made in order to solve the above-mentioned problems, and it is possible to position the semiconductors in the pallet regardless of the accuracy and also to position the semiconductor in the height direction with respect to the work from above. The purpose is to get the device.

[0006]

A positioning device according to the present invention is provided with a through hole at the center of a pallet on which a work having a mounting hole is placed, and a pusher with a constant pressure mechanism for moving the through hole up and down. With a lifting pin, the work stored in the pallet is pre-positioned in the pallet by the tapered part of the positioning pin, and then the work is pushed up to the positioning plate on the pallet with the lifting pin to position it, It is stored in and is positioned.

[0007]

In the present invention, the first step of pre-positioning the semiconductor in the pallet by the taper portion of the positioning pin,
Since positioning is performed by the second step of pushing up and positioning the semiconductor to the positioning plate on the pallet and the third step of storing the semiconductor in the pallet again, stable positioning can be performed without being affected by pallet accuracy. Further, since the semiconductor is pressed against the positioning plate, the work surface with respect to the upper surface of the semiconductor becomes constant, and a stable work height can be obtained.

[0008]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to the drawings. 1 is a front view of the positioning device, FIG.
(a)-(d) is a figure which shows the positioning process. In the figure, reference numerals 1 to 4, 4a, and 4b indicate the same or corresponding portions as those of the above-mentioned conventional example, and therefore the description thereof will be omitted. 4c is a storage hole 4a
A through hole 5 between them is a pallet guide for guiding the pallet, 6 is an upper / lower slider for transmitting and guiding the elevation of the cylinder 1 to the positioning plate 2, and 7 is located below the through hole 4c of the pallet 4, A push-up pin that pushes up the semiconductor 3 from the bottom, and 8 is a constant pressure mechanism that presses the push-up pin 7 at a constant rate. Have a source.

Next, the operation will be described. The pallet 4 accommodating the semiconductor 3 is guided by the pallet guide 5 and carried into the positioning device (initial state in FIG. 2A). When the cylinder 1 descends here, the positioning pin 2a of the positioning plate 2 guided by the upper and lower sliders 6 descends to such a height that the taper portion of the positioning hole 3a of the semiconductor 3 is applied (preliminary positioning in FIG. 2B). .. Next, in this state, the push-up pin 7 installed on the lower portion of the pallet 4 pushes up the semiconductor 3 to the positioning plate 2 through the through hole 4c while preventing overload by the constant pressure mechanism 8. At this time, the preliminarily positioned positioning hole 3a is guided and positioned by the taper portion of the positioning pin 2a as the push-up pin 7 rises (FIG. 2 (c)).
Positioning). Next, when the push-up pin 7 descends, the semiconductor 3 also descends and is housed in the pallet again (Fig. 2 (d)).
Storage). When the positioning plate 2 is raised, the initial state (state of FIG. 2 (a)) is returned to complete the work.

Embodiment 2. In the above-mentioned embodiment, the object is a semiconductor, but it may be another work housed in a pallet and having a positioning hole, and the same effect as that of the above-mentioned embodiment is obtained.

[0011]

As described above, according to the present invention, the positioning is a two-step operation of the preliminary positioning and the positioning, and the positioning is performed by pressing the positioning plate on the upper part of the pallet. There is an effect that reliable positioning can be performed without being affected by, and a work surface becomes constant in a work using the semiconductor upper surface (pressing surface) as a reference, and stable positioning accuracy can be obtained.

[Brief description of drawings]

FIG. 1 is a front view of a positioning device according to an embodiment of the present invention.

2A to 2D are process diagrams according to FIG.

FIG. 3 is a perspective view of a pallet.

FIG. 4 is a perspective view showing a state where semiconductors are stored in a pallet.

FIG. 5 is a front view showing a conventional semiconductor positioning device.

[Explanation of symbols]

 2 Positioning plate 2a Positioning pin 3 Semiconductor 4 Pallet 4c Through hole 7 Push-up pin 8 Constant pressure mechanism

Claims (2)

[Claims] 1. A pallet for positioning and mounting a work having a mounting hole, processing a through hole on a mounting surface of the work to accommodate a large number of the works, and a pallet facing the mounting holes of the work. It is characterized by including a positioning pin having a tapered tip, a positioning plate that supports the positioning pin and moves up and down, and a push-up pin that advances and retreats through the through hole of the pallet and presses the workpiece against the positioning plate with a constant pressure. Positioning device. 2. The apparatus according to claim 1, wherein the taper portion of the positioning pin is inserted into the mounting hole of the work for preliminary positioning, and then the work is pressed against the positioning plate by the push-up pin to position the work. A positioning method characterized by the above.