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JPH0539630Y2 - - Google Patents

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Publication number
JPH0539630Y2
JPH0539630Y2 JP1987080603U JP8060387U JPH0539630Y2 JP H0539630 Y2 JPH0539630 Y2 JP H0539630Y2 JP 1987080603 U JP1987080603 U JP 1987080603U JP 8060387 U JP8060387 U JP 8060387U JP H0539630 Y2 JPH0539630 Y2 JP H0539630Y2
Authority
JP
Japan
Prior art keywords
lead
clamper
capillary
thin metal
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987080603U
Other languages
Japanese (ja)
Other versions
JPS63188945U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987080603U priority Critical patent/JPH0539630Y2/ja
Publication of JPS63188945U publication Critical patent/JPS63188945U/ja
Application granted granted Critical
Publication of JPH0539630Y2 publication Critical patent/JPH0539630Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【考案の詳細な説明】 産業上の利用分野 本考案はリードフレーム上の半導体ペレツトと
リードとを金属細線にて電気的に接続する装置に
関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a device for electrically connecting semiconductor pellets on a lead frame and leads using thin metal wires.

従来の技術 リードフレームを使用した半導体装置は、リー
ドフレームのランド部に半導体ペレツトをマウン
トするペレツトマウント工程、上記ランド部上の
半導体ペレツトとリードとを金属細線で電気的に
接続するワイヤボンデイング工程、半導体ペレツ
トを含む主要部分を外装樹脂材でモールドする樹
脂モールド工程などを経て製造される。Prior Art Semiconductor devices using lead frames are manufactured using a pellet mounting process in which semiconductor pellets are mounted on the land portions of the lead frame, and a wire bonding process in which the semiconductor pellets on the land portions are electrically connected to the leads using thin metal wires. It is manufactured through a resin molding process in which the main parts, including the semiconductor pellets, are molded with an exterior resin material.

上記ワイヤボンデイング工程で使用されるワイ
ヤボンダの従来例を第３図及び第４図を参照しな
がら説明する。同図において、１はデユアル・イ
ン・ライン形半導体装置用の金属製リードフレー
ムで、吊りピン２，２で支持されたランド部３
と、先端部がこのランド部３の近傍に配置され、
他端部が平行に延びる複数のリード４，４……と
からなり、各リード４，４……をタイバー５，５
……により連結一体化したものである。６は上記
リードフレーム１のランド部３上に導電性接着材
等によりマウントした半導体ペレツトで、その上
面周縁部に沿つて複数の電極７，７……が形成さ
れている。８は上記リードフレーム１を位置決め
載置した状態で定方向に定ピツチで間欠送りする
搬送レールで、この搬送レール８の凹溝９内にリ
ードフレーム１のランド部３が収納配置される。
１０は搬送レール８の上方に昇降動自在に配設し
た矩形枠状のクランパで、ワイヤボンデイング
時、搬送レール８上のリードフレーム１のリード
先端部４ａ，４ａ……を位置決め固定するため、
上記リード中間部をリード先端部４ａ，４ａ……
が内方に突出するように押圧する。１１は搬送レ
ール８の上方に所望の方向で移動可能に配設した
キヤピラリで、このキヤピラリ１１の先端部には
挿通されたAu等の金属細線１２が導出される。
尚、図示しないがキヤピラリ１１には超音波振動
を金属細線１２に付与するための手段が設けられ
ている。 A conventional example of a wire bonder used in the wire bonding process will be described with reference to FIGS. 3 and 4. In the figure, 1 is a metal lead frame for a dual-in-line type semiconductor device, and a land portion 3 is supported by hanging pins 2, 2.
and the tip portion is arranged near this land portion 3,
It consists of a plurality of leads 4, 4... whose other ends extend in parallel, and each lead 4, 4... is connected to a tie bar 5, 5.
It is connected and integrated by... Reference numeral 6 denotes a semiconductor pellet mounted on the land portion 3 of the lead frame 1 with a conductive adhesive or the like, and a plurality of electrodes 7, 7, . . . are formed along the periphery of its upper surface. Reference numeral 8 denotes a conveyance rail that intermittently feeds the lead frame 1 in a fixed direction at a fixed pitch in a state in which the lead frame 1 is positioned thereon.
Reference numeral 10 denotes a rectangular frame-shaped clamper disposed above the transport rail 8 so as to be movable up and down, and used to position and fix the lead tips 4a, 4a, . . . of the lead frame 1 on the transport rail 8 during wire bonding.
The middle part of the lead is connected to the lead tip part 4a, 4a...
Press so that it protrudes inward. A capillary 11 is disposed above the transport rail 8 so as to be movable in a desired direction, and a thin metal wire 12 made of Au or the like is inserted into the tip of the capillary 11 and led out.
Although not shown, the capillary 11 is provided with means for applying ultrasonic vibration to the thin metal wire 12.

このリードフレーム１を使用した半導体装置の
製造において、リードフレーム１のランド部３に
半導体ペレツト６をマウントした後、搬送レール
８上のリードフレーム１をワイヤボンデイングボ
ジシヨンへ移送する。このワイヤボンデイングポ
ジシヨンでは、まずクランパ１０を下降させて全
てのリード４，４……を押圧し、そのリード先端
部４ａ，４ａ……を位置決め固定する。この状態
でキヤピラリ１１を下降させて金属細線１２の導
出端を半導体ペレツト６上の所望の電極７に押圧
して超音波を付与し電気的に接続する。このフア
ーストボンデイング後、上記キヤピラリ１１を移
動させて金属細線１２を、その導出部分を上記電
極７と対応するリード先端部４ａにキヤピラリ１
１で押圧して超音波振動を金属細線１２の導出部
分に付与して電気的に接続する。このセカンドボ
ンデイング後は金属細線１２をキヤピラリ導出部
から引きちぎり、再度次のフアーストボンデイン
グ動作へと移行し、上述した動作を繰返して全て
のワイヤボンデイングを完了する。尚、第４図に
示すようにリードフレーム移送方向に沿うランド
部３の前後位置にあるリード先端部４ａ，４ａ…
…については搬送レール８の凹溝９内に昇降動自
在に設けた基台１３，１３が上昇することにより
上記リード先端部４ａ，４ａ……を下から支持す
る。 In manufacturing a semiconductor device using this lead frame 1, after semiconductor pellets 6 are mounted on the land portions 3 of the lead frame 1, the lead frame 1 on the transport rail 8 is transferred to a wire bonding position. In this wire bonding position, first, the clamper 10 is lowered to press all the leads 4, 4, . . . and position and fix the lead tips 4a, 4a, . In this state, the capillary 11 is lowered and the lead-out end of the thin metal wire 12 is pressed against a desired electrode 7 on the semiconductor pellet 6 to apply ultrasonic waves to electrically connect it. After this first bonding, the capillary 11 is moved and the lead-out portion of the thin metal wire 12 is attached to the lead tip 4a corresponding to the electrode 7.
1 to apply ultrasonic vibration to the lead-out portion of the thin metal wire 12 to electrically connect it. After this second bonding, the thin metal wire 12 is torn off from the capillary lead-out portion, and the next first bonding operation is started again, and the above-mentioned operation is repeated to complete all wire bonding. Incidentally, as shown in FIG. 4, lead tip portions 4a, 4a, .
..., the bases 13, 13 provided movably up and down in the groove 9 of the transport rail 8 rise to support the lead tips 4a, 4a... from below.

考案が解決しようとする問題点 ところで、従来のワイヤボンダでは、リード先
端部４ａ，４ａ……側の金属細線１２の接続に際
して、上記リード先端部４ａ，４ａ……近傍をク
ランパ１０にて押圧することにより、キヤピラリ
１１で上記金属細線１２に超音波振動を効率良く
付与できるようにしている。しかしながら、リー
ドフレーム１はその下降精度上、部分的に板厚が
ばらついたり、或いは局部的にバリが発生するこ
とが多く、例えばリードフレーム１のリード先端
部４ａ，４ａ……でその厚みにばらつきがあつた
り或いはバリが発生していると、ワイヤボンデイ
ング時、上記リード先端部４ａ，４ａ……の全て
を押圧するクランパ１０ではそのリード先端部４
ａ，４ａ……の全てを均一に押圧することが困難
で、その位置決め固定が不充分である箇所ではリ
ードが働き、超音波エネルギーが逃げるためボン
デイング不良が発生し易いという問題があつた。Problems to be Solved by the Invention Incidentally, in the conventional wire bonder, when connecting the thin metal wires 12 on the lead tip portions 4a, 4a, . . . , the vicinity of the lead tip portions 4a, 4a, . This allows the capillary 11 to efficiently apply ultrasonic vibration to the thin metal wire 12. However, due to the lowering accuracy of the lead frame 1, the thickness of the lead frame 1 often varies locally or burrs occur locally. For example, the thickness varies at the lead tips 4a, 4a, . If there is heat or burrs, the clamper 10 that presses all of the lead tips 4a, 4a, etc. during wire bonding will
It is difficult to uniformly press all of a, 4a, . . . , and where the positioning and fixing is insufficient, the leads work and the ultrasonic energy escapes, resulting in a problem that poor bonding is likely to occur.

それ故に本考案の目的は、ワイヤボンデイング
時、全てのリード先端部を均一に位置決め固定し
て超音波振動を金属細線に効率良く付与できるよ
うにしたワイヤボンダを提供することにある。 Therefore, an object of the present invention is to provide a wire bonder that can uniformly position and fix all lead tips during wire bonding and efficiently apply ultrasonic vibrations to a thin metal wire.

問題点を解決するための手段 本考案は前記問題点に鑑みて創案されたもの
で、リードフレームのランド部にマウントされた
半導体ペレツト上の電極と半導体ペレツト近傍に
配設された複数のリード先端部とを、そのリード
先端部をクランパにて押圧固定した状態でキヤピ
ラリにより金属細線で電気的に接続するものにお
いて、複数のリードのうちボンデイングされるリ
ードを含む一部のリード中間部を押圧固定するク
ランパを、上記キヤピラリのボンデイング位置を
制御する第１のXYテーブルと同期させた第２の
XYテーブルにて移動可能に配置したことにより
前記目的を達成したワイヤボンダである。Means for Solving the Problems The present invention was devised in view of the above problems, and consists of an electrode on a semiconductor pellet mounted on a land portion of a lead frame, and a plurality of lead tips disposed near the semiconductor pellet. In a device that electrically connects a capillary with a thin metal wire using a capillary with the tip of the lead pressed and fixed with a clamper, the middle part of some of the leads, including the lead to be bonded, is pressed and fixed. A second XY table synchronized with the first XY table controls the bonding position of the capillary.
This wire bonder achieves the above objective by being movably arranged on an XY table.

作 用 本考案によれば、キヤピラリの動作にクランパ
のリード固定動作を連動させ、ボンデイングする
リードを上記クランパで押圧するから、その固定
が確実となりリードフレームの加工精度により発
生する不具合に十分対応し得る。Effect According to the present invention, the lead fixing operation of the clamper is linked to the operation of the capillary, and the lead to be bonded is pressed by the clamper, so the fixation is ensured and problems caused by the machining accuracy of the lead frame can be sufficiently addressed. obtain.

実施例 本考案に係るワイヤボンダの一実施例を第１図
及び第２図を参照しながら説明する。但し、第３
図及び第４図と同一部分には同一参照符号を付し
てその説明は省略する。Embodiment An embodiment of the wire bonder according to the present invention will be described with reference to FIGS. 1 and 2. However, the third
Components that are the same as those in the figures and FIG.

本考案の特徴はリードフレーム１のリード先端
部４ａ，４ａ……を押圧固定するクランパ２０に
ある。第１図及び第２図において、２１はキヤピ
ラリ１１が設けられたボンデイングヘツドで、こ
のボンデイングヘツド２１を第１のXYテーブル
２２上に装着し、上記キヤピラリ１１を昇降機構
〔図示せず〕により昇降動させると共に、上記第
１のXYテーブル２２でキヤピラリ１１を水平動
させてそのボンデイング位置を制御することによ
り、上記キヤピラリ１１をボンデイング動作させ
る。２３はクランパ２０が設けられたクランパヘ
ツドで、このクランパヘツド２３を第１のXYテ
ーブル２２と同期して移動する第２のXYテーブ
ル２４に上に配置する。このクランパ２０はリー
ドフレーム１の複数のリード先端部４ａ，４ａ…
…のうちボンデイングされるリードを含む一部の
リード、例えば１〜２本〔図では１本〕のリード
先端部４ａを押圧するような屈曲形状を有するも
のである。尚、第２図ではランド部３に対して左
半分及び右半分のリード先端部４ａ，４ａを夫々
押圧する左右クランパ２０，２０を設けた場合を
示す。２５はクランパヘツド２３に設けられたク
ランパ昇降機構で、第２のXYテーブル２４に固
設した支持アーム２６にクランパ２０を回転自在
に軸支し、上記クランパ２０の基端部にカムフオ
ロワ２７を取付けて、ポルスモータやサーボモー
タ〔図示せず〕で回転するクランパ昇降用カム２
８に引張りバネ２９で常時当接するように付勢し
ている。 A feature of the present invention is a clamper 20 that presses and fixes the lead end portions 4a, 4a, . . . of the lead frame 1. In FIGS. 1 and 2, 21 is a bonding head provided with a capillary 11. This bonding head 21 is mounted on a first XY table 22, and the capillary 11 is raised and lowered by a lifting mechanism (not shown). At the same time, the first XY table 22 moves the capillary 11 horizontally to control its bonding position, thereby causing the capillary 11 to perform a bonding operation. 23 is a clamper head provided with a clamper 20, and this clamper head 23 is placed above a second XY table 24 that moves in synchronization with the first XY table 22. This clamper 20 includes a plurality of lead tips 4a, 4a, . . . of the lead frame 1.
Among them, some of the leads including the leads to be bonded, for example, one or two leads (in the figure, one lead) have a bent shape so as to press the tip ends 4a of the leads. FIG. 2 shows a case in which left and right clampers 20, 20 are provided to press the left and right half lead tips 4a, 4a, respectively, against the land portion 3. Reference numeral 25 denotes a clamper elevating mechanism provided on the clamper head 23, in which the clamper 20 is rotatably supported on a support arm 26 fixed to the second XY table 24, and a cam follower 27 is attached to the base end of the clamper 20. , a cam 2 for lifting and lowering the clamper rotated by a porce motor or a servo motor (not shown)
8 is biased by a tension spring 29 so as to be in constant contact.

リードフレーム１がワイヤボンデイングポジシ
ヨンの搬送されてくると、搬送レール８の凹溝９
内で受台１３，１３を突出させてリードフレーム
１の移送方向に沿うランド部３の前後位置のリー
ド先端部４ａ，４ａ……を下方から支持する。こ
の状態でキヤピラリ１１のボンデイング動作にク
ランパ２０のリード固定動作を同期させてワイヤ
ボンデイングを実行する。即ち、まずキヤピラリ
１１の第１のXYテーブル２２に同期させて、ク
ランパ２０の第２のXYテーブル２４を作動さ
せ、且つ、クランパ昇降機構２５によりクランパ
２０を下降させて１つのリード先端部４ａをクラ
ンパ２０で押圧する。このクランパ２０によりリ
ード先端部４ａの位置決め固定後、キヤピラリ１
１で金属細線１２の導出端を半導体ペレツト６上
の電極７に熱圧着して従来と同様にフアーストボ
ンデイングした後、キヤピラリ１１を移動させて
金属細線１２を、その導出部分を上記電極７と対
応するリード先端部４ａ、即ちクランパ２０で位
置決め固定したリード先端部４ａにキヤピラリ１
１で押圧して超音波振動を金属細線１２の導出部
分に付与して電気的に接続する。この時、リード
フレーム１の加工精度による影響で、リード先端
部４ａ，４ａ……の厚みがばらついたり或いはリ
ード先端部４ａ，４ａ……にバリがあつても、本
考案のクランパ２０では少数〔図では１本〕のリ
ード先端部４ａのみを押圧するので確実に位置決
め固定することができる。上記セカンドボンデイ
ング後は金属細線１２をリード先端部４ａから引
きちぎり、クランパ２０を移動させて新たに次の
リード先端部４ａを押圧すると共にキヤピラリ１
１を次のワイヤボンデイング動作に移行させる。 When the lead frame 1 is transported to the wire bonding position, the groove 9 of the transport rail 8
The pedestals 13, 13 protrude within the lead frame 1 to support the lead tips 4a, 4a, . . . at the front and back positions of the land portion 3 along the transport direction of the lead frame 1 from below. In this state, wire bonding is performed by synchronizing the lead fixing operation of the clamper 20 with the bonding operation of the capillary 11. That is, first, the second XY table 24 of the clamper 20 is operated in synchronization with the first XY table 22 of the capillary 11, and the clamper 20 is lowered by the clamper lifting mechanism 25 to remove one lead tip 4a. Press with the clamper 20. After positioning and fixing the lead tip 4a with this clamper 20, the capillary 1
1, the lead-out end of the thin metal wire 12 is thermocompression bonded to the electrode 7 on the semiconductor pellet 6 for first bonding as in the conventional method, and then the capillary 11 is moved to connect the thin metal wire 12 and the lead-out portion to the electrode 7. The capillary 1 is attached to the corresponding lead tip 4a, that is, the lead tip 4a that is positioned and fixed by the clamper 20.
1 to apply ultrasonic vibration to the lead-out portion of the thin metal wire 12 to electrically connect it. At this time, even if the thickness of the lead tips 4a, 4a... varies due to the processing accuracy of the lead frame 1, or even if there are burrs on the lead tips 4a, 4a..., the clamper 20 of the present invention will minimize the occurrence of burrs. Since only one lead tip 4a (in the figure) is pressed, positioning and fixing can be ensured. After the second bonding, the thin metal wire 12 is torn off from the lead tip 4a, the clamper 20 is moved to press the next lead tip 4a, and the capillary 1
1 to the next wire bonding operation.

尚、上記実施例ではデユアル・イン・ライン形
半導体装置に使用するデインプル構造のリードフ
レームについて説明したが、本考案はこれに限定
されることなく、上記デインプル構造以外のフラ
ツト構造のリードフレームにも適用することがで
き、更にデユアル・イン・ライン形以外のシング
ル・イン・ライン形やフラツトパツケージ形半導
体装置の製造で使用するリードフレームにも適用
可能であるのは勿論である。 Although the above embodiment describes a lead frame with a dimple structure used in a dual-in-line type semiconductor device, the present invention is not limited to this, and can also be applied to lead frames with a flat structure other than the above-mentioned dimple structure. It goes without saying that the present invention can be applied to lead frames used in manufacturing single-in-line type semiconductor devices other than dual-in-line type and flat package type semiconductor devices.

考案の効果 本考案によれば、リードフレームの加工精度
上、リードフレームの板厚がばらついたり或いは
バリが発生しても、ワイヤボンデイング時、リー
ド先端部をクランパで確実に位置決め固定するこ
とができ、キヤピラリによる超音波振動を金属細
線に効率良く付与することが実現されてボンデイ
ング性が良好で信頼性の高い半導体装置を提供で
きる。Effects of the invention According to the invention, even if the thickness of the lead frame varies or burrs occur due to the processing accuracy of the lead frame, the tip of the lead can be reliably positioned and fixed with a clamper during wire bonding. , it is possible to efficiently apply ultrasonic vibrations by a capillary to a thin metal wire, and a semiconductor device with good bonding properties and high reliability can be provided.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係るワイヤボンダの一実施例
を示す概略構成図、第２図は搬送レール上のリー
ドフレーム及び本考案のクランパを示す平面図で
ある。第３図はワイヤボンダの従来例を示す概略
構成図、第４図は搬送レール上のリードフレーム
及び従来のクランパを示す平面図である。 １……リードフレーム、３……ランド部、４…
…リード、４ａ……リード先端部、６……半導体
ペレツト、７……電極、１１……キヤピラリ、１
２……金属細線、２０……クランパ、２２……第
１のXYテーブル、２４……第２のXYテーブル。 FIG. 1 is a schematic configuration diagram showing an embodiment of a wire bonder according to the present invention, and FIG. 2 is a plan view showing a lead frame on a conveyance rail and a clamper according to the present invention. FIG. 3 is a schematic configuration diagram showing a conventional example of a wire bonder, and FIG. 4 is a plan view showing a lead frame on a conveyance rail and a conventional clamper. 1...Lead frame, 3...Land part, 4...
... Lead, 4a ... Lead tip, 6 ... Semiconductor pellet, 7 ... Electrode, 11 ... Capillary, 1
2...Thin metal wire, 20...Clamper, 22...First XY table, 24...Second XY table.

Claims (1)

【実用新案登録請求の範囲】 ランド部近傍に複数のリードの一端部を配設し
たリードフレームのランド部にマウントした半導
体ペレツト上の電極とリード端部とを金属細線に
て電気的に接続するものにおいて、 複数のリードのうちボンデイングされるリード
を含む一部のリード中間部を押圧固定するクラン
パを、金属細線をガイドしボンデイングするキヤ
ピラリの位置を制御する第１のXYテーブルと同
期させた第２のXYテーブルにて移動可能に配置
したことを特徴とするワイヤボンダ。[Claim for Utility Model Registration] Electrical connection between the electrodes on a semiconductor pellet mounted on the land portion of a lead frame with one end portion of a plurality of leads disposed near the land portion and the lead end portion using a thin metal wire. In this system, a clamper that presses and fixes the middle part of some of the leads including the lead to be bonded among the plurality of leads is synchronized with the first XY table that guides the thin metal wire and controls the position of the capillary for bonding. A wire bonder characterized by being movably arranged on a second XY table.
JP1987080603U 1987-05-26 1987-05-26 Expired - Lifetime JPH0539630Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987080603U JPH0539630Y2 (en) 1987-05-26 1987-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987080603U JPH0539630Y2 (en) 1987-05-26 1987-05-26

Publications (2)

Publication Number Publication Date
JPS63188945U JPS63188945U (en) 1988-12-05
JPH0539630Y2 true JPH0539630Y2 (en) 1993-10-07

Family

ID=30931558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987080603U Expired - Lifetime JPH0539630Y2 (en) 1987-05-26 1987-05-26

Country Status (1)

Country Link
JP (1) JPH0539630Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005340677A (en) * 2004-05-31 2005-12-08 Matsushita Electric Ind Co Ltd Wire bonder holding parts and support parts
JP6330765B2 (en) * 2015-09-11 2018-05-30 トヨタ自動車株式会社 Wire connection method and terminals

Also Published As

Publication number Publication date
JPS63188945U (en) 1988-12-05

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