JPH0538833A - Bonding device for electronic part - Google Patents

Abstract

PURPOSE:To carry out the positioning easily and precisely by a method wherein a rotation part of a supporting base for one electronic part corresponding to the angle formed between a reference line parallel to a wiring pattern in one electronic part and a reference line wherein wiring patterns of both electronic parts become parallel to each other. CONSTITUTION:Wiring patterns of a plurality of electronic parts 1, 2 are bonded to each other after the wiring patterns are positioned so as to be superposed on one another. In this case, the parts 1, 2 are supported by supporting bases 11, 12 respectively which move to each other and the base 12 is rotated about an axis normal to the supporting surface for an electronic part by means of a rotation part 14. A reference line parallel to the wiring pattern of, for example, the electronic part 2 is photographed by means of a camera 20. Further, the angle made by the photographed reference line with a reference line wherein the wiring patterns of both parts 1, 2 become parallel to each other is calculated by means of an angle calculation unit 61 of a control device 60. The rotation part 14 is driven by a rotation control unit 62 corresponding to the calculated angles.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for electronic parts, and more particularly to an electronic part for welding two electronic parts having wiring patterns arranged in a comb-like shape at corresponding wiring patterns. Of the bonding equipment.

[0002]

2. Description of the Related Art As an electronic component to be welded to each other of this kind, for example, an electronic component used in a thermal transfer printer will be described. As shown in FIG. 10, a head 1 having a heating element and a head decoder are mounted. Film carrier 2
, And each has wiring patterns 3 and 4 arranged in a comb-like shape. For example, 144 wiring patterns 3 and 4 are provided in a range of 20 mm, and the pitch thereof is 0.1 mm. The reference numeral 5 is a wiring pattern 4.
Is a common pattern connected to. Then, the two electronic components have wiring patterns 3 and 4 corresponding to each other.
Is welded at.

Conventionally, this head 1 and film carrier 2
When welding and, the wiring patterns 3 and 4 of the two electronic components are overlapped on a workbench, the overlapped portion is visually observed with a microscope, and the head 1 or the film carrier 2 is manually rotated. Each other's wiring pattern 3,
The parallelism of 4 is obtained, and the phases are aligned to perform the alignment, and then the aligned wiring patterns 3 and 4 of the electronic component are welded to each other.

[0004]

However, in the above-mentioned conventional welding work, the overlapping portions of the wiring patterns 3 and 4 are visually observed with a microscope and manually rotated to make the wiring patterns 3 and 4 parallel to each other. Since it is used for adjusting the degree, there is a problem that the work is complicated, the parallelism accuracy is poor, and defective welding easily occurs, resulting in poor yield of finished products.

For example, as shown in FIG. 11, in the wiring patterns 3 and 4 having a very small pitch as described above, even if the angle θ is slightly deviated (for example, 0.08 ° or more), the adjacent wiring patterns 3 and 4 can be formed. It interferes with 4.

Therefore, an object of the present invention is to make it possible to automate the parallel positioning of the wiring pattern of the electronic component, and to accurately perform the parallel positioning to reduce the defective welding.

[0007]

The technical means of the present invention for solving the above problems are as follows.

Two electronic components having wiring patterns arranged in a comb-tooth shape are aligned so that the corresponding wiring patterns overlap each other, and then the wiring patterns of the aligned electronic components are welded to each other. In electronic device bonding equipment

A first support base for supporting one electronic component, a second support base provided near the first support base for supporting the other electronic component, and first and second support bases. And a camera device for imaging a reference line parallel to a wiring pattern provided on one of the electronic components, and a rotation unit that rotates at least one of the components around an axis orthogonal to the support surface of the electronic component. An angle calculation unit that calculates an angle formed by the reference line imaged by and a standard line in which the patterns of both electronic components are parallel to each other, and a rotation control unit that drives the rotation unit based on the angle calculated by the angle calculation unit. It is equipped with.

[0010]

According to the electronic component bonding apparatus having the above structure, one electronic component is supported on the first support base.
With the other electronic component supported by the second support, the camera device captures an image of the reference line parallel to the wiring pattern provided on one of the electronic components. In this state, the angle calculator calculates the angle between the reference line imaged by the camera device and the standard line in which the patterns of both electronic components are parallel to each other. Then, the rotation control unit rotates the rotation unit based on the angle calculated by the angle calculation unit, whereby the wiring patterns of the electronic components are positioned in parallel with each other. After that, the wiring patterns of the aligned electronic components are welded to each other.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component bonding apparatus according to an embodiment of the present invention will be described below with reference to the accompanying drawings. As shown in FIG. 10, the electronic component bonding apparatus according to the embodiment is an apparatus for welding the head 1 and the film carrier 2 as the electronic components used in the thermal transfer printer, as described above. Head 1 and film carrier 2
Respectively have wiring patterns 3 and 4 arranged in a comb-like shape. For example, 144 wiring patterns 3 and 4 are provided on one side of each component, and their pitch is 0.1 m.
It has become m. Further, the film carrier 2 has a common pattern 5 connected to the wiring patterns 3 and 4 and parallel to the wiring patterns 3 and 4. The edge of the common pattern 5 is used as a reference line K described later.

As shown in FIG. 1, the basic structure of the bonding apparatus for electronic parts according to the embodiment is a supporting device 10 for supporting the head 1 and the film carrier 2, and a supporting device 10.
A moving device 17 for moving the supporting device 10, a camera device 20 provided with the moving start end of the supporting device 10 on the arm, a microscope device 50 provided in the middle of moving the supporting device 10, a welding device 52 provided with the moving end of the supporting device 10 on the arm. And a control device 60 for controlling each device.

As shown in FIG. 1, the supporting device 10 is erected on a base 13 and has a wiring pattern 3 of the head 1 along a predetermined direction (horizontal direction in the drawing, along a standard line H described later). And the first support base 11 for supporting the wiring pattern 3 so as to project from the rear side.
And a second support 12 which is provided in the vicinity of and supports the film carrier 2 such that the wiring pattern 4 thereof projects from the front side. Between the first support 11 and the second support 12, a pattern portion of each electronic component faces and a gap through which an electrode of a welding device to be described later is inserted is provided.

The second support base 12 is attached to a rotating portion 14 that rotates about an axis orthogonal to the support surface of the electronic component. The rotary unit 14 includes a rotary table 14a for supporting the second support 12 and the rotary table 14a.
A motor 14b for rotating a is provided.

Further, the rotating part 14 moves the second support base 12 in one direction (a direction perpendicular to the paper surface in the drawing and a direction perpendicular to a standard line H described later) via the rotating part 14. It is supported by the Y-direction moving unit 15. The Y-direction moving unit 15 moves the second support base 12 in the other direction (the left-right direction in the drawing and the direction along a standard line H described later) via the Y-direction moving unit 15 and the rotating unit 14. It is supported by the X-direction moving unit 16. The X-direction moving unit 16 is the base 1 described above.
It is attached to 3.

The moving device 17 is, as shown in FIG. 1, a rail 18 for movably supporting the base 13 of the supporting device 10.
The above-mentioned base 13 is mounted on the rail 1 by a drive device (not shown).
8 is to move.

As shown in FIGS. 2 and 3, the camera device 20 enlarges the common pattern 5 of the film carrier 2 on the second support 12 and forms an image on the image forming surface 23, and an imaging lens 24. A first camera 21 having an imaging element 21a such as a CCD element on an imaging surface 23 on which one end side of the common pattern 5 of the film carrier 2 is imaged, and an imaging surface on which the other end side of the film carrier 2 is imaged 23 for example C
A second camera 22 having an image pickup element 22a such as a CD element
It has and.

The image pickup lens 24 is housed in a case body 25 and fixed to the tip of a base plate 26. The first camera 21 and the second camera 22 are fixed to the base plate 26 in parallel. On the front of the cameras 21 and 22,
A window member 27 is provided to allow only the images reaching the image pickup devices 21a and 22a of the cameras 21 and 22 to pass therethrough. The image pickup lens 24 and its optical path are covered with a cover 28. A transparent glass 29 attached to a cover 28 is provided on the front side of the image pickup lens 24, and a filter glass 30 is provided on the rear side of the image pickup lens 24. The filter glass 30 is interposed between the translucent members 31 and 32 having a through hole on the optical path and fixed to the base plate 26, and a ball elastic contact type pressing member 33 provided on one translucent member 31. Is pressed and supported by the other translucent member 32.

Further, as shown in FIG. 4, the camera device 20 is provided with a display section 35 for image-processing the image signal from the first camera 21 and the image signal from the second camera 22 and displaying it on the screen. ing. As shown in FIG. 6, the display unit 35 has a screen configuration of 512 × 512 pixels.
Further, the camera device 20 includes a switching circuit 36 for switching the image signal from the first camera 21 and the image signal from the second camera 22 and sending the image signal to the display unit 35 when there is a switching signal; A switching signal transmission circuit 40 that transmits a switching signal each time ½ (256 pixels) of scanning is scanned.

The switching signal transmission circuit 40 includes a switching signal transmission circuit 41 for adjusting the timing when a start signal is received and transmitting a switching signal to the switching circuit 36, and an oscillation circuit 42 for transmitting a pulse signal of a predetermined cycle. , A counter circuit 43 which counts the pulse signals transmitted by the oscillation circuit 42 and which transmits the start signal when the count value becomes half the number of horizontal pixels of the screen, and a counter circuit 43 when the screen is updated.
And an initialization circuit 44 for initializing.

The switching signal transmission circuit 41 includes a multivibrator 45 which outputs a predetermined time after the activation signal is output, and a transmission unit 46 which transmits the switching signal by the output of the multivibrator 45.

The initialization circuit 44 is a sync signal generation circuit 47 which sends out a horizontal sync signal and a vertical sync signal of the scanned image.
And an AND circuit 48 which sends out an initialization signal when a horizontal synchronizing signal and a vertical synchronizing signal are simultaneously present.

As shown in FIG. 1, the microscope apparatus 50 comprises a head 1 and a microscope section 51 for enlarging the pattern section of the film carrier 2 and a CCD camera (not shown) for picking up an image of the microscope section 51.

The welding device 52 comprises a stand 53 and a pair of electrodes 5 provided on the stand 53 so as to be close to and away from each other.
4, 55 and. The lower electrode 55 is inserted into the gap between the first support 11 and the second support 12, and holds the pattern portion of the head 1 and the film carrier 2 together with the upper electrode 54 to form a pattern. The parts are welded to each other.

As shown in FIGS. 1 and 5, the control device 60 forms an angle θ between the reference line K imaged by the camera device 20 and the standard line H at which the patterns of both electronic components are parallel to each other.
And an angle control unit 62 that drives the rotation unit 14 based on the angle calculated by the angle calculation unit 61.

As shown in FIG. 5, the angle calculation unit 61 pays attention to the change in the luminance in the image of the common pattern 5, and the pixel coordinates where the inclination of the standard line H is zero in the image pickup screen of the reference line K. In the system, the brightness reading unit 63 that reads the brightness of the pixel in the direction orthogonal to the standard line H, the brightness difference calculation unit 64 that calculates the brightness difference of the brightness of the adjacent pixels, and the brightness difference calculated by the brightness difference calculation unit 64 are A pixel coordinate reading unit 65 that reads the maximum pixel coordinate (pixel address), and a coordinate calculation unit 66 that corrects the pixel coordinates read by the pixel coordinate reading unit 65 by using the brightness difference and calculates the coordinates of the reference line K. And an angle calculator 67 that calculates the angle of the reference line K based on the coordinates calculated by the coordinate calculator 66. The brightness and the brightness difference are obtained at many points in the X-axis direction.

The coordinate calculator 66 calculates the coordinates by the following mathematical formula.

[0028]

[Equation 1]

In Expression 1, Gn is a pixel coordinate that maximizes the luminance difference (in the embodiment, the side with smaller coordinates is selected), Sm
Is the maximum value of the brightness difference, Sm + 1 is the brightness difference on the side having one coordinate larger than the maximum value of the brightness difference, Sm + 2 is the brightness difference on the side having two coordinates larger than the maximum value of the brightness difference, Sm -1 is the brightness difference on the side having one coordinate smaller than the maximum value of the brightness difference, and Sm-2 is the brightness difference on the side having one coordinate smaller than the maximum value of the brightness difference.

The angle calculation section 67 calculates the angle using the least squares method, based on the large number of coordinates (each Y coordinate at a large number of points in the X axis direction) calculated by the above calculation.

Furthermore, the control device 60 is the microscope device 5
The wiring pattern 3 of the head 1 and the wiring pattern 4 of the film carrier 2 based on the image data of the 0 CCD camera.
A phase shift (shift in the direction perpendicular to the standard line H) is calculated, and based on the calculation result, control is performed to move the Y-direction moving unit 15 by the phase shift. Further, the deviation in the direction parallel to the standard line H is also calculated, and X is calculated based on the calculation result.
Control is performed to move the direction moving unit 16 by the amount of the shift. Further, the control device 60 also controls the drive of the moving device 17 so that the base 13 is moved along the rail 18 and stopped at a predetermined position.

Therefore, the electronic component bonding apparatus according to this embodiment operates as follows. Base 13
Is moved along the rail 18 from the start end to the end by the moving device 17, and is stopped at a predetermined position during that time. First, at the start position, the head 1 is supported by the first support base 11. In this case, the wiring pattern 3 of the head 1 is positioned along the standard line H and so that the wiring pattern 3 projects rearward. The film carrier 2 is supported on the second support 12. In this case, the wiring pattern 4 of the film carrier 2 projects forward and overlaps the wiring pattern 3 of the head 1.

Next, the base 13 is moved by the moving device 17 and stopped at a predetermined position of the camera device 20. Then, at this position, an image is taken by the camera device 20.

The camera device 20 operates as follows. The common pattern 5 of the film carrier 2 is magnified by the imaging lens 24 and imaged on the imaging surface 23. Then, of the enlarged image, one end side of the common pattern 5 of the film carrier 2 is imaged by the first camera 21, and the other end side of the common pattern 5 of the film carrier 2 is imaged by the second camera 22.

Then, the switching signal is sent from the switching signal sending circuit 40 every time 1/2 of horizontal scanning (256 pixels) is scanned, and the image signal from the first camera 21 and the second camera 22 are sent. Image signal is switched every 256 pixels and the display unit 35 is sent to the frame. Therefore, as shown in FIGS. 6 and 7, the image pickup screens of the respective cameras are displayed half by half on one display unit 35. In addition, the switching signal transmission circuit 4
At 0, the counter circuit 43 is initialized every time the screen is updated, so that the switching signal without deviation is sent out, and therefore the image is output to the regular position of the display unit 35.

Therefore, as compared with the case where two ends of the reference line are picked up by one camera, the cameras can be fixed and the images picked up by each camera can be
Although they can be displayed two by two, they can be displayed on the same screen, which improves operability and screen processing efficiency.

In this state, the angle calculator 61 of the control device 60 functions as follows. First, in the image pickup screen of the reference line K shown in FIG. 7 and in the pixel coordinate system in which the inclination of the standard line H is zero, the luminance reading unit 63 causes X
The brightness of the pixel in the direction orthogonal to the standard line H at some points of the coordinates is read. The reading result is shown in FIG.
Next, the brightness difference calculation unit 64 calculates the brightness difference of the brightness of the adjacent pixels. The results are also shown in FIG. After that, the pixel coordinate reading unit 65 reads out the pixel coordinate that maximizes the brightness difference calculated by the brightness difference calculating unit 64.

Then, the coordinate calculation unit 66 corrects the pixel coordinates read by the pixel coordinate reading unit 65 using the above-mentioned brightness difference, and calculates the coordinates of the reference line K. Now, the case at the point X4 in the figure will be described. The pixel coordinate Gn at which the brightness difference is maximum is 115, and the calculation result is as follows.

[0039]

[Equation 2]

In this way, the corrected Y coordinate at some points of the X coordinate is obtained. In this case, since the coordinates are corrected in consideration of the weights of the upper and lower luminances, the accuracy is high. In addition, the calculation of the pixel coordinates from the read data inevitably causes a quantization error of plus or minus one pixel, but in the embodiment,
The quantization error can be set to 1 pixel or less (about ± 0.2 pixel), and accordingly, highly accurate coordinates can be obtained.

In this way, when the coordinates of the reference line K are corrected and obtained at many points in the X-axis direction, the angle calculator 67 calculates the angle of the reference line K based on the calculated coordinates.

In this case, as shown in FIG. 7, the camera device 20 images both ends of the reference line K, and obtains the angle of the reference line K from the coordinates of the reference line K at both ends. The angle is calculated with substantially the same accuracy as when the coordinates are obtained for the entire K, and the pixel density of the image by the camera device 20 is compared when the entire image is captured by one camera (for example, the range A in FIG. 7). And then big (eg about 8
), The accuracy of the coordinates calculated above is higher. According to the experiment, the pattern interval is 0.1 m.
In the case of m, it was possible to fall within the error range of about 0.03 °, and the condition of 0.08 ° or less was sufficiently satisfied.

Then, the rotation control unit 62 drives the rotation unit 14 by the angle calculated by the angle calculation unit 61. As a result, the wiring pattern 4 of the film carrier 2 becomes parallel to the wiring pattern 3 of the head 1. in this case,
Since the accuracy of the calculated angle is high, it is possible to prevent the wiring pattern 4 of the film carrier 2 from tilting and crossing another wiring pattern 3 of the head 1.

Next, the base 13 is moved to the microscope device 50 by the moving device 17. Here, the wiring pattern 3 of the head 1 and the film carrier 2 are based on the image data of the CCD camera of the microscope device 50.
Of the phase of the wiring pattern 4 of the head 1 and the wiring pattern 4 of the film carrier 2 are moved based on the calculation result. Are aligned in phase.

Further, the deviation in the standard line H direction is also calculated, and the X-direction moving section 16 is moved by the amount of the deviation based on the calculation result. As a result, the joint length between the wiring pattern 3 of the head 1 and the wiring pattern 4 of the film carrier 2 becomes a predetermined length.

After that, the base 13 is moved to the welding device 52 by the moving device 17. Here, the electrodes 54 and 55 of the welding device 52 weld the wiring pattern 3 of the head 1 and the wiring pattern 4 of the film carrier 2. In this case, as shown in FIG. 9, the wiring pattern 3 of the head 1 and the wiring pattern 4 of the film carrier 2 are inclined with respect to each other and do not intersect with each other, and the phase and the joint length are both predetermined. Therefore, the corresponding patterns are bonded to each other, and welding with different patterns is prevented, and as a result, the yield is improved.

Although the reference line K is set to the edge of the common pattern 5 in the above embodiment, the present invention is not limited to this, and it may be the wiring pattern 4 itself or a portion parallel to the wiring pattern 4. Anything will do.

[0048]

As described above, according to the bonding apparatus for electronic parts of the present invention, the angle formed by the reference line imaged by the camera device and the standard line in which the wiring patterns of both electronic parts are parallel to each other is calculated. Then, since the rotating portion is driven based on the calculated angle, the wiring pattern of the electronic component can be automatically positioned, and thus the work efficiency is significantly improved.

Further, if the coordinates of the reference line are corrected and obtained using the brightness difference, the accuracy of the coordinates becomes high, and the accuracy of the calculated angle of the reference line becomes high accordingly. Therefore, the misalignment of the aligned wiring patterns is almost eliminated, and it is possible to prevent the situation where the wiring patterns are inclined and intersect with another wiring pattern. As a result, defective welding can be prevented and the yield of finished products can be significantly improved. Especially the wiring pattern pitch is 0.1m
This is effective for electronic parts that are extremely small, such as m or less.

[Brief description of drawings]

FIG. 1 is a diagram showing a bonding apparatus for an electronic component according to an embodiment of the present invention.

FIG. 2 is a front sectional view showing a camera device according to an embodiment of the present invention.

FIG. 3 is a side sectional view showing a camera device according to an embodiment of the present invention.

FIG. 4 is a block diagram showing a camera device according to an embodiment of the present invention.

FIG. 5 is a block diagram showing an angle calculation unit of the control device according to the embodiment of the present invention.

FIG. 6 is a diagram schematically showing an operation of the camera device according to the embodiment of the present invention.

FIG. 7 is a diagram showing a pixel coordinate system imaged by the camera device according to the embodiment of the present invention.

FIG. 8 is a diagram showing reading and calculation data of the angle calculation unit according to the embodiment of the present invention.

FIG. 9 is a diagram showing a state in which wiring patterns of electronic components are normally overlapped with each other.

FIG. 10 is a diagram showing an example of an electronic component welded to the electronic component bonding apparatus according to the embodiment of the present invention.

FIG. 11 is a diagram showing a misaligned state of a wiring pattern of an electronic component.

[Explanation of symbols]

 1 Head 2 Film Carrier 3 Wiring Pattern 4 Wiring Pattern 5 Common Pattern K Reference Line H Standard Line 10 Supporting Device 11 First Supporting Base 12 Second Supporting Base 14 Rotating Unit 20 Camera Device 21 First Camera 22 Second Camera 35 Display unit 36 Switching circuit 50 Microscope device 52 Welding device 60 Control device 61 Angle detection unit 62 Rotation control unit 63 Luminance reading unit 64 Luminance difference calculation unit 65 Pixel coordinate reading unit 66 Coordinate calculation unit 67 Angle calculation unit 67

Claims (1)

[Claims] 1. Two electronic components having wiring patterns arranged in a comb-like shape are aligned so that the corresponding wiring patterns overlap each other, and then the wiring patterns of the aligned electronic components are aligned with each other. In an electronic component bonding apparatus for welding, a first support base for supporting one electronic component, a second support base provided in proximity to the first support base for supporting the other electronic component, An image of a rotating part that rotates at least one of the first and second support bases about an axis orthogonal to the support surface of the electronic component and a reference line parallel to the wiring pattern provided on one of the electronic components Based on the angle calculated by the angle calculation unit, and an angle calculation unit that calculates an angle formed by the camera device, a reference line captured by the camera device, and a standard line that makes the patterns of both electronic components parallel to each other. And a rotation control unit for driving the rotating unit.