JPH05345368A - Seamless semiconductive belt - Google Patents
Seamless semiconductive beltInfo
- Publication number
- JPH05345368A JPH05345368A JP4195810A JP19581092A JPH05345368A JP H05345368 A JPH05345368 A JP H05345368A JP 4195810 A JP4195810 A JP 4195810A JP 19581092 A JP19581092 A JP 19581092A JP H05345368 A JPH05345368 A JP H05345368A
- Authority
- JP
- Japan
- Prior art keywords
- belt
- ethylene
- electric resistance
- resistance value
- seamless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001577 copolymer Polymers 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000011231 conductive filler Substances 0.000 abstract description 9
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract 3
- 239000005977 Ethylene Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- 239000002994 raw material Substances 0.000 description 8
- 238000001125 extrusion Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000004513 sizing Methods 0.000 description 6
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000009396 hybridization Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NDKGUMMLYBINOC-UHFFFAOYSA-N 1,2-dichloro-1-fluoroethane Chemical compound FC(Cl)CCl NDKGUMMLYBINOC-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920001780 ECTFE Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910000878 H alloy Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- WAIPAZQMEIHHTJ-UHFFFAOYSA-N [Cr].[Co] Chemical compound [Cr].[Co] WAIPAZQMEIHHTJ-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、均一な電気抵抗値を有
するシームレス状半導電性ベルトに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a seamless semiconductive belt having a uniform electric resistance value.
【０００２】[0002]
【従来の技術】従来より、シームレス状半導電性ベルト
は、存在するがこれらは電気抵抗値がばらついたり、導
電性フィラーを混合することにより機械的特性が低下す
る等の問題があった。2. Description of the Related Art Conventionally, seamless semiconductive belts exist, but they have problems such as variations in electric resistance value and deterioration of mechanical properties due to mixing of conductive fillers.
【０００３】[0003]
【発明が解決しようとする課題】シームレス状半導雷性
ベルトの製法において、シームレス状ベルトの押出成型
法では、慨して電気抵抗値がばらつき、寸法精度の良好
なものが得られにくいという欠点があり、遠心成型法で
は混合材粒子間の比重差により表面と内面との電気抵抗
値差が生じる傾向にあった。本発明者らは以上のような
問題点を解決すべく、電気抵抗値が１定範囲にあり小さ
く、かつ機械的強度に優れたシームレス状半導電性ベル
トを提供することを可能にした。DISCLOSURE OF INVENTION Problems to be Solved by the Invention In the method for producing a seamless semi-lightning conductive belt, the seamless belt extrusion molding method has a drawback in that the electric resistance value fluctuates, and it is difficult to obtain a product having good dimensional accuracy. However, the centrifugal molding method tends to cause a difference in electric resistance between the surface and the inner surface due to the difference in specific gravity between the particles of the mixed material. In order to solve the above problems, the present inventors have made it possible to provide a seamless semiconductive belt having an electric resistance value within a fixed range and a small mechanical strength.
【０００４】[0004]
【課題を解決するための手段】本発明の特徴とするとこ
ろはエチレン−４フッ化エチレン共重合体（ＥＴＦＥ）
及び／又はエチレン−３フッ化塩化エチレン（ＥＣＴＦ
Ｅ）を主成分として、導電性フィラーを混合して得られ
る材料をチューブ状に押出成膜し、次いで軸方向と直角
方向に所定長さに切断して得られるベルトであって、ベ
ルト各部の体積電気抵抗値が１０５〜１０１７Ωｃｍ好
ましくは、１０８〜１０１４Ωｃｍの範囲にあると共に
前記各部における体積電気抵抗値の最大値が最小値の１
〜１００倍にあることを特徴とするものである。The feature of the present invention lies in that ethylene-tetrafluoroethylene copolymer (ETFE)
And / or ethylene-3-fluorochloroethylene (ECTF
A belt obtained by extruding a material obtained by mixing a conductive filler containing E) as a main component into a tubular shape, and then cutting the material into a predetermined length in a direction perpendicular to the axial direction. The volume electric resistance value is 10 5 to 10 17 Ωcm, preferably in the range of 10 8 to 10 14 Ωcm, and the maximum value of the volume electric resistance value in each of the above parts is 1 as the minimum value.
It is characterized by being up to 100 times.
【０００５】本発明におけるエチレン−４フッ化エチレ
ン共重合体（ＥＴＦＥ）及び／又はエチレン−３フッ化
塩化エチレン（ＥＣＴＦＥ）は、特に制限ないが、例え
ばその種類としては押出グレードのものを用いればよ
い。その形状も特に制限なく、粒状ペレット、粉体状の
もの等を適宜に使用できる。シームレス状半導電性ベル
トは、エチレン−４フッ化エチレン共重合体及び／又は
エチレン−３フッ化塩化エチレン共重合体を主成分とす
るが、導電性や機械的物性を低下させない範囲であれ
ば、他の樹脂例えばアクリル系樹脂やボリメチルメタク
リレート等を添加したものでもよく、このことに特に制
限をうけるものでない。The ethylene-4 fluoroethylene copolymer (ETFE) and / or ethylene-3 fluoroethylene chloride (ECTFE) in the present invention is not particularly limited, but for example, if an extrusion grade is used, Good. The shape is also not particularly limited, and granular pellets, powdery ones and the like can be appropriately used. The seamless semi-conductive belt has an ethylene-4 fluoroethylene copolymer and / or an ethylene-3 fluorochloroethylene copolymer as a main component, as long as the conductivity and the mechanical properties are not deteriorated. Other resins such as acrylic resins and polymethylmethacrylate may be added, and there is no particular limitation to this.
【０００６】エチレン−４フッ化エチレン共重合体及び
／又はエチレン−３フッ化塩化エチレン共重合体に導電
性を付与するために配合される導電性フィラーとして
は、導電性・半導電性の微粉末なら特に制限ないが、ケ
ッチェンブラック（コンダクティブファーネス系カーボ
ンブラック）、アセチレンブラック等のカーボンブラッ
ク、酸化第２スズ、酸化インジュウム、チタン酸カリウ
ム、チタン酸ブラック、チタン酸ウィスカー等の導電性
・半導電性の微粉末であればよい。かかる導電性フィラ
ーの混合量も特に制限なく電気抵抗値に応じて、適宜選
定すればよく、通常では樹脂の重量に対し５〜２０重量
％配合すればよい。また、体積電気抵抗値を安定化させ
るために導電性カーボンと金属酸化物を組み合わせて使
用すればよい場合もあるが、このことも特に制限はな
い。As the conductive filler to be added to the ethylene-4 fluoroethylene copolymer and / or the ethylene-3 fluorochloroethylene copolymer for imparting conductivity, a conductive or semi-conductive fine particle is used. The powder is not particularly limited, but carbon black such as Ketjen black (conductive furnace type carbon black) and acetylene black, stannic oxide, indium oxide, potassium titanate, black titanate, whisker titanate, etc. Any conductive fine powder may be used. The amount of the conductive filler mixed is not particularly limited and may be appropriately selected according to the electric resistance value, and usually 5 to 20% by weight with respect to the weight of the resin. In some cases, conductive carbon and a metal oxide may be used in combination to stabilize the volume electric resistance value, but this is not particularly limited.
【０００７】本発明は、エチレン−４フッ化エチレン共
重台体及び／又はエチレン−３フッ化塩化エチレン共重
合体及び導電性フィラー成分以外に、用途に応じて適当
な成分を配合すればよい。例えばワックス、シリコンオ
イル、ステアリン酸カルシュウム、低分子量のエチレン
−４フッ化エチレン共重合体、エチレン−３フッ化塩化
エチレン共重合体ならびにオリゴマー等の滑剤を配合で
きる。滑剤は通常使用原料の全重量に対し、１０重量％
以下、好ましくは０．５％〜１．５重量％程度配合すれ
ばよいが、かかる配合量については、特に制限はない。In the present invention, in addition to the ethylene-4fluoroethylene copolymer base and / or the ethylene-3fluoroethylene chloride copolymer and the conductive filler component, appropriate components may be blended depending on the application. . For example, a lubricant such as wax, silicone oil, calcium stearate, a low molecular weight ethylene-4 fluoroethylene copolymer, an ethylene-3 fluoroethylene chloride copolymer and an oligomer can be blended. Lubricant is usually 10% by weight based on the total weight of the raw materials used.
Below, it is preferable to add about 0.5% to 1.5% by weight, but the amount to be added is not particularly limited.
【０００８】本発明にかかるシームレス状半導電性ベル
トはクリープ特性や耐久性を向上させるために、無機フ
ィラーや有機フィラーを混入すると好ましい場合が多い
が、特に制限なく、混入できるフィラーとして、タル
ク、チタン酸ウィスカー、マイカ等フィルムの表面精度
を考慮して粒径１〜２μのものを使用することが好まし
い。 有機フィラーとしては、特に制限はないが、液晶
ポリマー、アラミド繊維等が例示できる。フィラーの添
加量としては、特に制限なく、一般的に２０重量％以下
好ましくは、５〜２０重量％程度混入することが多い
が、必ずしもフィラーを添加する必要はなく、添加しな
くてよい。In order to improve creep characteristics and durability, it is often preferable to mix an inorganic filler or an organic filler in the seamless semiconductive belt according to the present invention, but there is no particular limitation, and as a filler that can be mixed, talc, In consideration of the surface accuracy of the film such as whisker titanate and mica, it is preferable to use one having a particle size of 1 to 2 μ. The organic filler is not particularly limited, but liquid crystal polymer, aramid fiber and the like can be exemplified. The amount of the filler added is not particularly limited and is generally 20% by weight or less, preferably about 5 to 20% by weight, but it is not always necessary to add the filler, and it is not necessary to add it.
【０００９】本発明によるシームレス状半導電性ベルト
は、以下のようにして製造できるがあくまで、一例であ
って、斯かる製法に制限を受けるものではない。使用す
る押出機は特に制限はないが、例えばミキシングする２
軸押出機等を例示でき、フッ素系樹脂の成型に使用する
ため耐蝕性に優れたハステロイＣやＨアロイ型の押出機
を用いることが好ましい場合が多い。The seamless semiconductive belt according to the present invention can be manufactured as follows, but it is merely an example, and the manufacturing method is not limited. The extruder used is not particularly limited, but for example, mixing 2
A shaft extruder or the like can be exemplified, and it is often preferable to use a Hastelloy C or H alloy type extruder having excellent corrosion resistance because it is used for molding a fluororesin.
【００１０】まず、前記各原料をブレンドする。ブレン
ドする方法として特に制限なく、例えば、ミキシングブ
レンド法をあげることができる。ミキシングブレンド法
に特に制限ないが、導電性カーボンを分散させることを
考慮すると、例えば２軸スクリューを有する押出機が好
ましい。更に分散性を向上させる場合には、前記樹脂
（粉末がより好ましい）と金属酸化物や導電性カーボン
等の粉体を物理的機械的に混合し前記樹脂と導電性粉体
を複合化するハイブリタイゼーションシステム等の方法
でミキシングすることも例示ができるが、このことに特
に制限はない。こうしてミキシングブレンドされた原料
は、通常ベレット状に押出されるが、ブレンドされた原
料をそのまま用いると、成膜時に発泡する恐れがあるの
で必要ならば、水分率が０．０５％以下に除湿乾燥する
ことが好ましい。次いで、ブレンドされ、必要ならベレ
ット化された原料をチューブ状フィルムに成膜する。本
発明に云うフィルムにはシート状の厚手のものも含まれ
る。First, the respective raw materials are blended. The blending method is not particularly limited, and for example, a mixing blending method can be used. The mixing blend method is not particularly limited, but in consideration of dispersing conductive carbon, an extruder having, for example, a twin screw is preferable. In order to further improve the dispersibility, a hybrid is prepared by physically and mechanically mixing the resin (powder is more preferable) and a powder of metal oxide, conductive carbon or the like to form a composite of the resin and the conductive powder. Mixing by a method such as a titration system can be illustrated, but there is no particular limitation to this. The raw material thus mixed and blended is usually extruded into a pellet shape. However, if the blended raw material is used as it is, foaming may occur during film formation. Therefore, if necessary, the moisture content is dehumidified and dried to 0.05% or less. Preferably. Then, the blended and, if necessary, pelletized raw materials are formed into a tubular film. The film referred to in the present invention also includes a sheet-like thick film.
【００１１】成膜方法は、特に制限ないが、環状ダイス
から押出成膜する方法が好ましい。環状ダイスから押出
成膜する際、一定径・一定膜厚の寸法精度を得るために
はインサイドもしくはアウトサイド冷却等のサイシング
法により、規制することが好ましい。こうしたサイジン
グ部の冷却温度は、特に重要であり、冷却水の温度・サ
イジング部の材質により、電気抵抗値が変化するので注
意を要する場合が多い。本発明における、サイジング筒
状体に循環する冷却水の温度は特に制限はないが、通常
では０〜９０℃、好ましくは２０〜６０℃を例示でき
る。また、水圧、水量を一定にすることが望ましい場合
が多い。また、冷却水の温度の変動は電気抵抗値に変動
を与えるので、例えば±２〜３℃にコントロールするこ
とが好ましい場合が多い。The film formation method is not particularly limited, but a method of extrusion film formation from an annular die is preferable. In extrusion film formation from an annular die, in order to obtain dimensional accuracy with a constant diameter and a constant film thickness, it is preferable to regulate by a sizing method such as inside or outside cooling. The cooling temperature of such a sizing portion is particularly important, and the electric resistance value changes depending on the temperature of the cooling water and the material of the sizing portion, so that caution is often required. The temperature of the cooling water circulated in the sizing tubular body in the present invention is not particularly limited, but it is usually 0 to 90 ° C, preferably 20 to 60 ° C. Further, it is often desirable to keep the water pressure and the water amount constant. Further, since the fluctuation of the temperature of the cooling water causes the fluctuation of the electric resistance value, it is often preferable to control the temperature to ± 2 to 3 ° C, for example.
【００１２】押出されたチューブ状フィルムは、特に制
限はないが折目がつかない状態で引き取ることが好まし
い。例えば、１対の軟質キャタピラー式コンベアーを用
いて折目が残らない程度に、軽く押さえつけながら引き
取ることが好ましい。There is no particular limitation on the extruded tubular film, but it is preferable that the extruded tubular film is taken out in a crease-free state. For example, it is preferable to use a pair of soft caterpillar-type conveyors while gently pressing while pulling them so that no folds remain.
【００１３】得られるフィルムの体積電気抵抗値は、主
としてブレンドする導電性フィラーの量によって決定さ
れるが、フィルム各部の体積電気抵抗値は成膜条件によ
って変動する。従って、体積電気抵抗値の抵抗変動の巾
を、一定範囲以内にするために、ブレンドされた原料の
流動性粘度や、押出機内での圧力その他の要因を所定の
範囲に定めることがより望ましい。The volume electric resistance value of the obtained film is mainly determined by the amount of the conductive filler to be blended, but the volume electric resistance value of each part of the film varies depending on the film forming conditions. Therefore, it is more desirable to set the fluidity viscosity of the blended raw materials, the pressure in the extruder and other factors within a predetermined range in order to keep the width of the resistance fluctuation of the volume electric resistance value within a certain range.
【００１４】こうしたために押出機においては、スクリ
ューの形状、押出量・温度制御等を精度よく行うことが
望ましい。この際、押出機の圧力をコントロールするた
めにギヤーポンプを用いることもある。さらにこの体積
電気抵抗値の変動は、一般的に押出方向（チューブの軸
方向）に対し、直角方向（チューブの円周方向）に大き
くなる傾向がみられるので、特に制限ないが押出機の環
状ダイスにおける温度コントロールを細部に行うことが
好ましい。例えばダイス内の樹脂温度を±１℃にさらに
好ましくは、±０．５℃でコントロールすることが好ま
しい。For this reason, in the extruder, it is desirable that the shape of the screw, the amount of extrusion, the temperature control, etc. be accurately controlled. At this time, a gear pump may be used to control the pressure of the extruder. Further, this variation in the volume electric resistance value tends to increase in a direction perpendicular to the extrusion direction (the axial direction of the tube) (circumferential direction of the tube). It is preferable to control the temperature in the die in detail. For example, it is preferable to control the resin temperature in the die to ± 1 ° C, more preferably ± 0.5 ° C.
【００１５】より高度な寸法精度が要求される場合に
は、例えば押出機に定寸ガイドで規制したり、延伸を行
う等により寸法精度を付与してもよい。延伸を行う場合
には、縦、横（チューブの軸方向及び円周方向）の延伸
倍率により、体積電気抵抗値の変動があるのであらかじ
め条件を一定に整えることが好ましい。延伸倍率は、例
えば縦、横１〜５％を例示でき、延伸温度は、６０〜１
８０℃好ましくは、１２０〜１５０℃を例示できる。延
伸倍率、温度は、適宜選定してよいが、低温低倍率の方
が抵抗のバラツキは小さいが、この限りでない。When higher dimensional accuracy is required, the dimensional accuracy may be imparted by, for example, regulating the extruder with a sizing guide or stretching. When the stretching is performed, the volume electric resistance value varies depending on the stretching ratio in the lengthwise direction and the transverse direction (the axial direction and the circumferential direction of the tube). The stretching ratio can be, for example, 1% to 5% in the lengthwise direction, and the stretching temperature is 60 to 1%.
80 ° C., preferably 120 to 150 ° C. The draw ratio and the temperature may be appropriately selected, but the variation in resistance is smaller at a low temperature and a lower ratio, but it is not limited to this.
【００１６】導電性フィラーの凝集により、フィルム表
面の平滑性等の表面精度が低下する場合は、押出機にお
けるブレーカーブレートの近辺にフィルターを用いるこ
ともある。かかるフィルターは、メッシュが１０〜２０
μのバスケットタイプやメッシュ５〜２０μのリーフタ
イプなどのフィルターを例示できるが、フィルターの種
類、メッシュは特に制限ない。When the surface precision such as the smoothness of the film surface is deteriorated due to the aggregation of the conductive filler, a filter may be used near the break curve rate in the extruder. Such a filter has a mesh of 10-20
Examples of the filter include a basket type of μ and a leaf type of 5 to 20 μ of mesh, but the type and mesh of the filter are not particularly limited.
【００１７】表面の離型性が求められる場合には、シリ
コンオイル、シリコン粉末、４フッ化エチレン系重合体
を配合することにより、表面精度の向上がはかられるこ
とがある。さらに必要なら、表面コートしたり、蒸着し
て使用することもさしつかえなく可能であるが、こうし
た場合、フッ素系樹脂を用いているため離型性があって
塗料の密着性が悪いので、表面をエッチング処理するこ
ともある。エッチング方法としては、ケミカルエッチン
グ、プラズマエッチング、コロナ処理等の方法が例示で
きる。When surface releasability is required, surface accuracy may be improved by blending silicon oil, silicon powder, and tetrafluoroethylene polymer. If necessary, it is possible to use surface coating or vapor deposition and use it, but in such a case, since the fluorine resin is used, there is releasability and the adhesion of the paint is poor, so the surface It may be etched. Examples of the etching method include chemical etching, plasma etching, corona treatment and the like.
【００１８】本発明の用途としては特に制限はないが、
複写機などの各種機能性ベルトとして有用で、一例とし
て転写ベルトやＯＰＣベルトとして使用したところ好適
であった。The use of the present invention is not particularly limited,
It was useful as various functional belts for copying machines, and was suitable as a transfer belt or an OPC belt as an example.
【００１９】以下、実施例に基ずいて本発明を説明す
る。The present invention will be described below based on examples.
【００２０】[0020]
【００２１】実施例１ エチレン−４フッ化エチレン共重合体（ＥＴＦＥ）９４
重量％とケッチェンプラック６重量％とを窒素ガス雰囲
中でハイブリダイゼーションシステムによりブレンドし
た。得られたブレンド物は、引き続き窒素ガス中で２軸
スクリューを有する押出機に投入され、ベレット状原料
に造粒された。このペレット状原料はＬ／Ｄ＝２４の６
５ｍｍ押出機に投入され、ギヤーポンプを介し、環状ダ
イスに導かれて、チューブ状に溶融押出された。次い
で、外径６０ｍｍФのサイジングスリーブで内側から冷
却され引き取られて、厚み１６０μのフィルムに成膜せ
しめた。この際、環状ダイス内の温度を３００±０．５
℃にコントロールした。更に、押出機のスクリュー先端
とダイスとの間には２０メッシュのバスケット状ステン
レスフィルターを装看した。こうして得られたチューブ
状フィルムを、１４０℃温度下で縦方向及び円周方向に
各々３％延伸した。次いで延伸フィルムを３５０ｍｍ間
隔の長さに切断してベルトを得た。このベルトは内径１
６５ｍｍ、厚み１５０μの寸法精度も優れたものであっ
た。 このベルトの体積電気抵抗値は、１００ｖ電圧印
加時に１×１０１０〜１×１０１１Ωｃｍの範囲であ
り、電圧依存性は認められず、ベルト各部における体積
電気抵抗値の最大値は、最小値の１０倍であった。この
フィルムの物性値を表１に示す。Example 1 Ethylene-4Fluoroethylene Copolymer (ETFE) 94
% By weight and 6% by weight of Ketchen plaque were blended by a hybridization system in a nitrogen gas atmosphere. The obtained blended product was subsequently charged into an extruder having a twin screw in nitrogen gas, and granulated into a pellet-shaped raw material. This pelletized raw material is L / D = 6 of 6
It was put into a 5 mm extruder, guided to an annular die through a gear pump, and melt-extruded into a tube shape. Then, it was cooled from the inside with a sizing sleeve having an outer diameter of 60 mm and taken out to form a film having a thickness of 160 μ. At this time, the temperature inside the circular die is 300 ± 0.5.
The temperature was controlled at ° C. Furthermore, a 20-mesh basket-shaped stainless steel filter was installed between the screw tip of the extruder and the die. The tubular film thus obtained was stretched at a temperature of 140 ° C. in the longitudinal direction and the circumferential direction by 3% each. Then, the stretched film was cut into a length of 350 mm to obtain a belt. This belt has an inner diameter of 1
The dimensional accuracy of 65 mm and thickness 150 μ was also excellent. The volume electric resistance value of this belt is in the range of 1 × 10 10 to 1 × 10 11 Ωcm when a voltage of 100 v is applied, voltage dependency is not recognized, and the maximum value of the volume electric resistance value in each part of the belt is the minimum value. Was 10 times. The physical properties of this film are shown in Table 1.
【００２２】実施例２ ボリエチレン−４フッ化エチレン共重合体（ＥＴＦＥ）
８４重量％及びケッチニンブラック６重量％、さらに微
粒タルク（粒径２〜３μ）１０重量％をハイブリダイセ
ーションシステムにてブレンドして、実施例１と同様に
してシームレスベルトを得た。こうして得たフィルム
は、１００Ｖ電圧印加時の体積電気抵抗値が１×１０
１０〜１×１０１１Ωｃｍの範囲であり、電圧依存性も
認められず、ベルト各部における体積抵抗値の最大値は
最小値の１０倍であった。得られたフィルムの物性を表
１に示す。Example 2 Polyethylene-4 Fluoroethylene Copolymer (ETFE)
84% by weight, 6% by weight of Ketchinine black, and 10% by weight of fine talc (particle size: 2 to 3 μ) were blended in a hybridization system to obtain a seamless belt in the same manner as in Example 1. The film thus obtained has a volume electric resistance value of 1 × 10 when a voltage of 100 V is applied.
The range was 10 to 1 × 10 11 Ωcm, voltage dependency was not recognized, and the maximum value of the volume resistance value in each part of the belt was 10 times the minimum value. Table 1 shows the physical properties of the obtained film.
【００２３】[0023]
【表１】 [Table 1]
【００２４】[0024]
【発明の効果】本発明に係るシームレス状半導電性ベル
トは電気的特性、機械的特性、耐熱性にも優れているた
め、今後各分野への適用が期待できる。例えば、複写機
などの機能性ベルトとして使用でき、寸法変形なども発
生せず、その効果は顕著である。The seamless semiconductive belt according to the present invention is excellent in electrical characteristics, mechanical characteristics, and heat resistance, so that it can be expected to be applied to various fields in the future. For example, it can be used as a functional belt for a copying machine and the like, and its effect is remarkable without causing dimensional deformation.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２９Ｌ 29:00 4Ｆ Ｃ０８Ｌ 27:12 (72)発明者 中井 浩一 滋賀県守山市守川原町163番地 グンゼ株 式会社滋賀研究所内 (72)発明者 脇中 敏 愛知県江南市村久野町取附１番地 グンゼ 株式会社エンプラ事業センタ−内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Reference number within the agency FI Technical display location B29L 29:00 4F C08L 27:12 (72) Inventor Koichi Nakai 163 Morikawahara-cho, Moriyama City, Shiga Prefecture Gunze Incorporated Shiga Research Institute (72) Inventor Satoshi Wanaka Nakamura No. 1 in Murakuno-cho, Konan-shi, Aichi Gunze Engineering Plastics Business Center
Claims (1)
び／またはエチレン−３フッ化塩化エチレン共重合体よ
りなる材料をチューブ状に押出し、次いで軸方向と直角
方向に所定長さに切断して得られるベルトであり、ベル
ト各部の体積電気抵抗値が１０５〜１０１７Ωｃｍの範
囲にあるとともに、前記各部における体積電気抵抗値の
最大値が最小値の１〜１００倍の範囲にあることを特徴
とするシームレス状半導電性ベルト。1. A material comprising an ethylene-4-fluoroethylene copolymer and / or an ethylene-3fluoroethylene chloride chloride copolymer is extruded into a tube shape, and then cut into a predetermined length in the direction perpendicular to the axial direction. The obtained belt, wherein the volume electric resistance value of each part of the belt is in the range of 10 5 to 10 17 Ωcm, and the maximum value of the volume electric resistance value of each part is in the range of 1 to 100 times the minimum value. Characteristic seamless semi-conductive belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4195810A JPH0825232B2 (en) | 1992-06-12 | 1992-06-12 | Seamless semi-conductive belt |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4195810A JPH0825232B2 (en) | 1992-06-12 | 1992-06-12 | Seamless semi-conductive belt |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05345368A true JPH05345368A (en) | 1993-12-27 |
| JPH0825232B2 JPH0825232B2 (en) | 1996-03-13 |
Family
ID=16347366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4195810A Expired - Fee Related JPH0825232B2 (en) | 1992-06-12 | 1992-06-12 | Seamless semi-conductive belt |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0825232B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10237300A (en) * | 1997-02-25 | 1998-09-08 | Kanegafuchi Chem Ind Co Ltd | Resin composition |
| EP1014217A2 (en) | 1998-12-21 | 2000-06-28 | Nitto Denko Corporation | Semiconductive belt |
| US6303072B1 (en) | 1998-07-28 | 2001-10-16 | Canon Kabushiki Kaisha | Process of making an endless belt |
| US6470165B2 (en) | 2000-02-03 | 2002-10-22 | Canon Kabushiki Kaisha | Process for producing transfer member, transfer member, and image forming apparatus |
| US6592803B2 (en) | 1999-07-07 | 2003-07-15 | Canon Kabushiki Kaisha | Process for producing belt-shaped member from a die-extruded film having a film thickness, die gap relationship |
| US6852400B2 (en) | 1998-12-22 | 2005-02-08 | Canon Kabushiki Kaisha | Endless belt electrophotography, process for producing the endless belt, and image forming apparatus having the endless belt |
| US7201967B2 (en) | 2003-11-28 | 2007-04-10 | Canon Kabushiki Kaisha | Electrophotographic endless belt, process for producing electrophotographic endless belt, and electrophotographic apparatus |
-
1992
- 1992-06-12 JP JP4195810A patent/JPH0825232B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10237300A (en) * | 1997-02-25 | 1998-09-08 | Kanegafuchi Chem Ind Co Ltd | Resin composition |
| US6303072B1 (en) | 1998-07-28 | 2001-10-16 | Canon Kabushiki Kaisha | Process of making an endless belt |
| EP1014217A2 (en) | 1998-12-21 | 2000-06-28 | Nitto Denko Corporation | Semiconductive belt |
| US6281324B1 (en) * | 1998-12-21 | 2001-08-28 | Nitto Denko Corporation | Semiconductive belt |
| US6852400B2 (en) | 1998-12-22 | 2005-02-08 | Canon Kabushiki Kaisha | Endless belt electrophotography, process for producing the endless belt, and image forming apparatus having the endless belt |
| US6592803B2 (en) | 1999-07-07 | 2003-07-15 | Canon Kabushiki Kaisha | Process for producing belt-shaped member from a die-extruded film having a film thickness, die gap relationship |
| US6470165B2 (en) | 2000-02-03 | 2002-10-22 | Canon Kabushiki Kaisha | Process for producing transfer member, transfer member, and image forming apparatus |
| US7201967B2 (en) | 2003-11-28 | 2007-04-10 | Canon Kabushiki Kaisha | Electrophotographic endless belt, process for producing electrophotographic endless belt, and electrophotographic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0825232B2 (en) | 1996-03-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3461005B2 (en) | Seamless semiconductive belt and method of manufacturing the same | |
| JP2592000B2 (en) | Seamless semiconductive belt | |
| JP5771290B2 (en) | Conductive fully vulcanized thermoplastic elastomer and process for its production | |
| CN1877463A (en) | Semiconductive belt and method for manufacturing same and electrophotograph imaging device containing semiconductive belt | |
| JPH05345368A (en) | Seamless semiconductive belt | |
| KR101790707B1 (en) | Conductive master batch and method for manufacturing thereof and method for manufacturing conductive film using the same | |
| JP4070707B2 (en) | Fluororesin composition | |
| JP3017145B2 (en) | Resin composition | |
| JPH06254941A (en) | Seamless-type semi-conductive belt | |
| JP4751815B2 (en) | Charging roll, transfer roll, developing roll, charging belt, or static elimination belt in an electrophotographic image forming apparatus | |
| JP2005133002A (en) | Fluororesin composition | |
| JP2004207097A (en) | Conductive resin composition | |
| JPH07178795A (en) | Conductive seamless belt | |
| JP2657522B2 (en) | Manufacturing method of conductive roll sleeve | |
| JPH0785722A (en) | Uniform semiconductive composition | |
| US20070037918A1 (en) | Fluororesin compound | |
| JP2008138134A (en) | Semiconductive ultra-high-molecular-weight polyethylene composition, film composed thereof and its manufacturing method | |
| JP2004331725A (en) | Semiconductive fluororesin tubular film and its manufacturing method | |
| JPH08333474A (en) | Semiconductive resin composite | |
| WO1998023686A1 (en) | Semiconductive resin composition | |
| JPH0557815A (en) | Seamless conductive belt and its manufacture | |
| JP3252184B2 (en) | Seamless tubular belt | |
| JP3423833B2 (en) | Method of producing semiconductive polyethersulfone film and method of using the same | |
| JPH1080957A (en) | Seamless belt | |
| CN107739497B (en) | Reinforced super-static polyester composition and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080313 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090313 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090313 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100313 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110313 Year of fee payment: 15 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120313 Year of fee payment: 16 |
|
| LAPS | Cancellation because of no payment of annual fees |