JPH05339787A - Continuous electroplating method - Google Patents

Abstract

PURPOSE:To obtain the uniform distribution of plating amount and an alloy composition by alternately arranging conductor rolls and back-up rolls at the upper and lower surface sides of a steel plate to be plated, thereby correcting the camber in the transverse direction of the steel plate. CONSTITUTION:The steel plate 3 is electroplated with anodes 4 by alternately arranging conductor rolls 1a to 1k and back-up rolls 2a to 2k at the upper and lower surface sides of the steel plate 3. Cambers in the steel plate 3 are made to be slightly upward and slightly downward successively from an entrance side cell and influence by cambers is cancelled as the whole of the cell strings.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuous electroplating method using a horizontal electroplating cell array, and more particularly to a method of using a current-carrying roll and a backup roll.

[0002]

2. Description of the Related Art In horizontal electroplating, when a steel sheet is plated using a horizontal type cell, as shown in FIG.
Is sandwiched between a conductor roll 1 and a backup roll 2 whose surface is made of rubber, resin, or the like.
The steel plate 3 is brought into contact with and moved to perform electroplating. At this time, the conductor roll 1 is arranged on the upper surface side of the steel plate 3 for the convenience of roll replacement.

However, since the backup roll 2 attaches importance to the liquid draining function and the water draining function, it emphasizes the elastic characteristics of rubber or resin system, and conventionally, the rubber hardness (JIS K-7215) is up to 40 ° at most. Therefore, the steel plate 3 sinks into the backup roll 2 due to the reduction of the conductor roll 1, and the steel plate 3 is warped in the width direction (hereinafter, referred to as C warpage) 5. In the figure, 4 is an anode.

FIG. 4 is a diagram showing the mechanism of C warpage. Due to the reduction of the conductor roll 1, L-warp is generated in the steel plate 3, and tension in the cell is applied to this. As a result, the steel plate 3 is stretched, a compressive stress is generated on the lower surface of the steel plate 3, and a tensile stress is generated on the upper surface thereof, and the steel plate 3 warps in the direction of releasing the stress and C-warp occurs. Due to the C warpage of the steel sheet, there was a problem that the coating amount in the width direction and the alloy ratio distribution were not uniform.

FIG. 5 shows the distribution of the amount of plating adhered due to C warpage,
An example of alloy ratio distribution is shown. Conventionally, as a method for solving this problem, there is a method of increasing the hardness of the backup roll to prevent the steel sheet from sinking, a method of providing a tension leveler on the plating cell entry side and giving a warp in the opposite direction on the cell entry side. Was used.

[0006]

However, in the above method, there is a problem that a spark occurs when a welding point having a different plate thickness passes, and it is difficult to put it into practical use. With the other method, the effect is limited to a few cells on the ingress side, and it is 10 to 20 as in today.
The effect cannot be expected when the plating cells on the table are arranged side by side.

An object of the present invention is to provide a continuous electroplating method using a horizontal electroplating cell which solves the above problems.

[0008]

The present invention relates to a horizontal electroplating cell in which a strip steel sheet to be plated is sandwiched between a conductor roll and a backup roll and passed through, and the conductor roll and the backup roll are provided on the upper and lower surfaces of the steel sheet to be plated. The continuous electroplating method is characterized in that the warp in the width direction of the steel sheet to be plated, which is alternately arranged on the side and is caused by the sandwiching of the conductor roll and the backup roll, is corrected by sandwiching the subsequent conductor roll and the backup roll.

[0009]

According to the present invention, the conductor rolls are alternately arranged on the upper surface side of the steel sheet from the entry side cell and on the lower surface side of the next cell, and the rolling force of each conductor roll is appropriately adjusted, whereby the steel sheet is The C-curve also has a slight upward warp and a slight downward warp in order from the entry side cell, and the effect of the warp of the adjacent cells is canceled out for the entire plating cell row, and a uniform coating amount and alloy ratio are applied in the width direction. Can be given.

That is, since the curl in the same direction is not overlapped, the amount of C warpage is slight and remains substantially harmless. In addition, in the case of such an arrangement, there is a problem that the conductor roll, which is frequently exchanged, is on the lower surface side of the steel sheet, but this problem can be solved by horizontally pulling out the roll.

A plating apparatus having a structure similar to that of the present invention is disclosed in Japanese Patent Application Laid-Open No. 4-74896, but the above patent merely mentions that the difference in gloss between the front and the back is eliminated. However, the C warpage correction of the present application has not been reached yet.

[0012]

An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a layout diagram showing an example of a plating cell array used in the present invention. In this example, the number of cells is 10, but
The present invention is not limited to this, and may be any number as long as the number of cells is two or more.

In FIG. 1, 1a to 1k are conductor rolls, 2a to 2k are backup rolls, and conductor rolls 1a to 1k and backup rolls 2a to 2k.
Are alternately arranged on the upper and lower surfaces of the steel plate 3. No. 4 is the anode. By properly adjusting the rolling force of each conductor roll in this arrangement, the direction of C-warp in the cell alternates slightly upward and downward,
Although the adhesion amount distribution and the alloy ratio distribution slightly occur in each cell, they are canceled out by the adjacent cells and can be made uniform as a whole plating layer.

Next, FIG. 2 shows an example of measurement of the deposition amount distribution in the width direction and the alloy ratio distribution in the case of plating according to the present invention. In the case of the present invention, it can be seen that the distribution in the width direction of the adhesion amount and the alloy ratio is remarkably uniform as compared with the conventional example shown in FIG.

[0015]

As described above, according to the present invention, a uniform coating amount distribution and alloy composition distribution in the width direction can be obtained.

[Brief description of drawings]

FIG. 1 is a layout view showing an example of an apparatus used in the present invention.

FIG. 2 is a graph showing an example of a plating adhesion amount and an alloy ratio in the width direction according to the present invention.

FIG. 3 is an explanatory diagram showing C warpage in a conventional horizontal electroplating cell.

FIG. 4 is an explanatory diagram of a mechanism of occurrence of C warpage.

FIG. 5 is a graph showing an example of a conventional coating amount and alloy ratio in the width direction.

[Explanation of symbols]

 1 Conductor roll 2 Backup roll 3 Steel plate 4 Anode 5 C Warpage

Claims (1)

[Claims] 1. A horizontal type electroplating cell in which a strip steel sheet to be plated is sandwiched between a conductor roll and a backup roll to pass through, and conductor rolls and backup rolls are alternately arranged on the upper and lower surfaces of the steel sheet to be plated. A continuous electroplating method characterized in that the warp in the width direction of the steel sheet to be plated caused by the sandwiching of the backup roll and the backup roll is corrected by sandwiching the subsequent conductor roll and the backup roll.