JPH05338110A - Solder paste printing - Google Patents
Solder paste printingInfo
- Publication number
- JPH05338110A JPH05338110A JP14946392A JP14946392A JPH05338110A JP H05338110 A JPH05338110 A JP H05338110A JP 14946392 A JP14946392 A JP 14946392A JP 14946392 A JP14946392 A JP 14946392A JP H05338110 A JPH05338110 A JP H05338110A
- Authority
- JP
- Japan
- Prior art keywords
- solder paste
- printed
- printing
- metal mask
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 abstract description 26
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント基板上に実装
される電子部品をはんだ付けするためのはんだペースト
をプリント基板に印刷するはんだペースト印刷方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder paste printing method for printing a solder paste for soldering electronic components mounted on a printed board onto the printed board.
【０００２】[0002]
【従来の技術】プリント基板上に電子部品を実装する際
に、予めプリント基板上にはんだペーストが印刷され
る。2. Description of the Related Art When an electronic component is mounted on a printed board, a solder paste is printed on the printed board in advance.
【０００３】このはんだペーストの印刷方法としては、
従来、例えば図３に示すように、プリント基板１０１上
に所定の開口部１０２ａ，１０２ｂを形成したメタルマ
スク１０２を配置し、メタルマスク１０２上のはんだペ
ースト１０３をスキージ１０４により、メタルマスク１
０２の開口部１０２ａ，１０２ｂを通してプリント基板
１０１上に印刷していた。As a method of printing this solder paste,
Conventionally, for example, as shown in FIG. 3, a metal mask 102 in which predetermined openings 102a and 102b are formed is arranged on a printed circuit board 101, and a solder paste 103 on the metal mask 102 is squeegeeed by a squeegee 104.
Printed on the printed circuit board 101 through the openings 102a and 102b of No. 02.
【０００４】そして、上記した従来のはんだペースト印
刷装置では、実装される大小さまざまな電子部品に対応
するために、メタルマスク１０２の開口部１０２ａ，１
０２ｂの大きさを変えてはんだ量を制御していた。ま
た、印刷の厚さを制御するために、メタルマスク１０２
の表面にハーフエッチング１０２ｃと呼ばれる段付き加
工を施し、印刷厚さの調整を行っていた。In the above-mentioned conventional solder paste printing apparatus, the openings 102a, 1a of the metal mask 102 are provided in order to cope with various electronic components to be mounted.
The amount of solder was controlled by changing the size of 02b. Also, in order to control the printing thickness, the metal mask 102
The printing thickness was adjusted by performing a stepped process called half etching 102c on the surface of the.
【０００５】[0005]
【発明が解決しようとする課題】ところで、上記した従
来のはんだペースト印刷装置では、メタルマスク１０２
の開口部１０２ａ，１０２ｂの大きさを変えるだけで
は、はんだペーストの量を制御するのには限界があり、
特に、例えば０．５ｍｍピッチパターンのような微細パ
ターンの場合、メタルマスク１０２が厚いと印刷が難し
かった。By the way, in the above-mentioned conventional solder paste printing apparatus, the metal mask 102 is used.
There is a limit in controlling the amount of solder paste only by changing the sizes of the openings 102a and 102b of
In particular, in the case of a fine pattern such as a 0.5 mm pitch pattern, printing was difficult when the metal mask 102 was thick.
【０００６】また、厚さの厚いメタルマスクを用いて薄
く印刷したい場合には、図３に示したように開口部１０
２ｂ上にハーフエッチング１０２ｃと呼ばれる段付き加
工を施して、必要な部分だけを薄くする方法もあるが、
この方法ではメタルマスク１０２の表面に凹凸が発生し
易く、印刷性がよくなかった。When it is desired to print thinly using a thick metal mask, as shown in FIG.
There is also a method of applying a step processing called half etching 102c on 2b to thin only a necessary portion,
In this method, unevenness is likely to occur on the surface of the metal mask 102, and the printability is poor.
【０００７】本発明は上記した課題を解決する目的でな
され、プリント基板上に実装される大小さのざまな電子
部品に応じて適切なはんだペーストを印刷することがで
きるはんだペースト印刷方法を提供しようとするもので
ある。The present invention has been made for the purpose of solving the above problems, and provides a solder paste printing method capable of printing an appropriate solder paste according to various large and small electronic components mounted on a printed circuit board. Is to
【０００８】[0008]
【課題を解決するための手段】前記した課題を解決する
ために本発明は、プリント基板上にパターンに応じた開
口部を形成したマスクを配置し、前記開口部を通しては
んだペーストを前記基板上に印刷するはんだペースト印
刷方法において、前記プリント基板に実装される電子部
品に応じてはんだペースト印刷行程を少なくとも２回以
上に分け、最初の印刷工程時には厚さの薄いマスクを使
用し、次の印刷工程時には先に前記基板上に印刷された
はんだペーストとの干渉を避ける逃げ溝を有する前記印
刷工程で使用したマスクよりも厚さの厚いマスクを使用
することを特徴としている。In order to solve the above-mentioned problems, the present invention arranges a mask having an opening corresponding to a pattern on a printed board, and solder paste is applied onto the board through the opening. In the solder paste printing method for printing, the solder paste printing process is divided into at least two or more times according to the electronic components mounted on the printed circuit board, a thin mask is used in the first printing process, and the next printing process is performed. It is sometimes characterized in that a mask having a thickness larger than that of the mask used in the printing step, which has an escape groove for avoiding interference with the solder paste previously printed on the substrate, is used.
【０００９】[0009]
【作用】本発明によれば、プリント基板に実装される電
子部品に応じてはんだペースト印刷工程を少なくとも２
回以上に分けて、最初の印刷工程時には厚さの薄いマス
クを使用し、次の印刷工程時には先に印刷したはんだペ
ーストとの干渉を避ける逃げ溝を形成した厚さの厚いマ
スクを使用することにより、基板上に微細パターンのは
んだペーストと大きなパターンのはんだペーストとを良
好に印刷することができる。According to the present invention, at least two solder paste printing steps are performed depending on the electronic components mounted on the printed circuit board.
Use a thin mask in the first printing process, divided into two or more times.In the next printing process, use a thick mask with a relief groove to avoid interference with the solder paste printed earlier. As a result, the fine-pattern solder paste and the large-pattern solder paste can be satisfactorily printed on the substrate.
【００１０】[0010]
【実施例】以下、本発明を図示の一実施例に基づいて詳
細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to an embodiment shown in the drawings.
【００１１】図１は、本発明の一実施例に係るはんだペ
ースト印刷方法を示す説明図である。本実施例では、２
段階（第１，第２）のはんだペースト印刷工程１０，２
０を有しており（図２参照）、第１の印刷工程１０で
は、プリント基板１上に厚さの薄いメタルマスク２が配
置されている（図１(a) ）。FIG. 1 is an explanatory view showing a solder paste printing method according to an embodiment of the present invention. In this embodiment, 2
Step (first and second) solder paste printing step 10, 2
0 (see FIG. 2), and in the first printing step 10, the thin metal mask 2 is arranged on the printed circuit board 1 (FIG. 1 (a)).
【００１２】第１の印刷工程１０で使用されるメタルマ
スク２は、プリント基板１に実装される電子部品の微細
パターンに対応して薄く形成されている。そして、スキ
ージ３によりはんだペースト４を、メタルマスク２に形
成した開口部２ａを通してプリント基板１に印刷する。
そして、メタルマスク２を取外すことにより、はんだペ
ースト５が印刷されたプリント基板１が得られる（図１
(b) ）。The metal mask 2 used in the first printing step 10 is thinly formed corresponding to the fine pattern of the electronic component mounted on the printed board 1. Then, the squeegee 3 prints the solder paste 4 on the printed board 1 through the opening 2 a formed in the metal mask 2.
Then, the metal mask 2 is removed to obtain the printed board 1 on which the solder paste 5 is printed (see FIG. 1).
(b)).
【００１３】次に、第１の印刷工程１０によりはんだペ
ーストが印刷されたプリント基板１を第２の印刷工程２
０に搬送する。Next, the printed board 1 on which the solder paste is printed in the first printing step 10 is attached to the second printing step 2.
Transport to 0.
【００１４】第２の印刷工程２０では、プリント基板１
に実装される電子部品の大きなパターンに対応して厚さ
の厚いメタルマスク６が使用される（図１(c) ）。この
メタルマスク６のプリント基板１と接する面には、前記
第１の印刷工程１０で得られたプリント基板１上のはん
だペースト５と干渉するのを防ぐために逃げ溝７が形成
されている。In the second printing step 20, the printed circuit board 1
A metal mask 6 having a large thickness is used in correspondence with a large pattern of the electronic component mounted on the board (FIG. 1 (c)). An escape groove 7 is formed on the surface of the metal mask 6 that contacts the printed circuit board 1 in order to prevent the metal mask 6 from interfering with the solder paste 5 on the printed circuit board 1 obtained in the first printing step 10.
【００１５】そして、メタルマスク６に形成した逃げ溝
７を、プリント基板１上に印刷されているはんだペース
ト５の位置に合わせて配置し、スキージ３によりはんだ
ペースト４を、メタルマスク６に形成した開口部６ａを
通してプリント基板１に印刷する。そして、メタルマス
ク６を取外すことにより、はんだペースト５（はんだペ
ースト５は予め第１の印刷工程１０で形成されてい
る）、８が印刷されたプリント基板１が得られる（図１
(d) ）。Then, the relief groove 7 formed in the metal mask 6 is arranged in accordance with the position of the solder paste 5 printed on the printed board 1, and the solder paste 4 is formed on the metal mask 6 by the squeegee 3. Printing is performed on the printed circuit board 1 through the opening 6a. Then, by removing the metal mask 6, the printed circuit board 1 on which the solder paste 5 (the solder paste 5 is formed in advance in the first printing step 10) and 8 is obtained (FIG. 1).
(d)).
【００１６】尚、上記した第１，２の印刷工程１０，２
０におけるはんだペーストの印刷は、公知のはんだペー
スト印刷装置によって行われる。The above-mentioned first and second printing steps 10 and 2
Printing of the solder paste at 0 is performed by a known solder paste printing apparatus.
【００１７】このように、プリント基板１上にはんだペ
ーストを印刷する際に、最初に厚さの薄いメタルマスク
２を使用して微細パターンを印刷し、その後に厚さの厚
いメタルマスク６で大きなパターンを印刷することによ
り、微細パターンのはんだペーストと大きなパターンの
はんだペーストとを良好に印刷することができる。As described above, when the solder paste is printed on the printed board 1, the thin metal mask 2 is first used to print a fine pattern, and then the thick metal mask 6 is used to make a large pattern. By printing the pattern, the fine-pattern solder paste and the large-pattern solder paste can be favorably printed.
【００１８】また、前記した実施例では２段階のはんだ
ペースト印刷工程の場合であったが、印刷するパターン
に応じて３段階以上のはんだペースト印刷工程にしても
よい。この場合も、最初は厚さの薄いメタルマスクを使
用して順次厚さの厚いメタルマスクを使用する。In the above-described embodiment, the solder paste printing process has two steps, but the solder paste printing process may have three or more steps depending on the pattern to be printed. Also in this case, a metal mask having a small thickness is used first, and then a metal mask having a large thickness is sequentially used.
【００１９】[0019]
【発明の効果】以上、実施例に基づいて具体的に説明し
たように本発明によれば、はんだペースト印刷工程を少
なくとも２回以上に分けて、最初の印刷工程時には厚さ
の薄いマスクを使用し、次の印刷工程時には先に印刷し
たはんだペーストとの干渉を避ける逃げ溝を形成した厚
さの厚いマスクを使用することにより、プリント基板に
実装される電子部品に応じて適量のはんだペーストを供
給することができるので、微細パターンのはんだペース
トと大きなパターンのはんだペーストとを良好に印刷す
ることができる。As described above in detail with reference to the embodiments, according to the present invention, the solder paste printing process is divided into at least two times, and a thin mask is used in the first printing process. However, in the next printing process, by using a thick mask with a relief groove that avoids interference with the previously printed solder paste, an appropriate amount of solder paste can be provided according to the electronic components mounted on the printed circuit board. Since it can be supplied, the solder paste having a fine pattern and the solder paste having a large pattern can be favorably printed.
【図１】本発明の一実施例に係るはんだペースト印刷方
法を示す説明図である。FIG. 1 is an explanatory diagram showing a solder paste printing method according to an embodiment of the present invention.
【図２】図１に示したはんだペースト印刷工程を示す説
明図である。FIG. 2 is an explanatory diagram showing a solder paste printing step shown in FIG.
【図３】従来のはんだペースト印刷方法を示す説明図で
ある。FIG. 3 is an explanatory diagram showing a conventional solder paste printing method.
１ プリント基板 ２ 薄いメタルマスク ３ スキージ ４，５，８ はんだペースト ６ 厚いメタルマスク ７ 逃げ溝 １０ 第１の印刷工程 ２０ 第２の印刷工程 1 Printed Circuit Board 2 Thin Metal Mask 3 Squeegee 4, 5, 8 Solder Paste 6 Thick Metal Mask 7 Escape Groove 10 First Printing Process 20 Second Printing Process
Claims (1)
部を形成したマスクを配置し、前記開口部を通してはん
だペーストを前記基板上に印刷するはんだペースト印刷
方法において、前記プリント基板に実装される電子部品
に応じてはんだペースト印刷行程を少なくとも２回以上
に分け、最初の印刷工程時には厚さの薄いマスクを使用
し、次の印刷工程時には先に前記基板上に印刷されたは
んだペーストとの干渉を避ける逃げ溝を有する前記印刷
工程で使用したマスクよりも厚さの厚いマスクを使用す
ることを特徴とするはんだペースト印刷方法。1. A solder paste printing method in which a mask having an opening corresponding to a pattern is arranged on a printed board, and a solder paste is printed on the board through the opening, an electronic device mounted on the printed board. The solder paste printing process is divided into at least two times according to the parts, and a thin mask is used in the first printing process, and the interference with the solder paste previously printed on the board is prevented in the next printing process. A solder paste printing method comprising using a mask having a clearance groove to be avoided and having a thickness thicker than that used in the printing step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14946392A JPH05338110A (en) | 1992-06-09 | 1992-06-09 | Solder paste printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14946392A JPH05338110A (en) | 1992-06-09 | 1992-06-09 | Solder paste printing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05338110A true JPH05338110A (en) | 1993-12-21 |
Family
ID=15475684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14946392A Pending JPH05338110A (en) | 1992-06-09 | 1992-06-09 | Solder paste printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05338110A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020198358A (en) * | 2019-05-31 | 2020-12-10 | 株式会社村田製作所 | Manufacturing method of electronic component and conductive paste coating device |
-
1992
- 1992-06-09 JP JP14946392A patent/JPH05338110A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020198358A (en) * | 2019-05-31 | 2020-12-10 | 株式会社村田製作所 | Manufacturing method of electronic component and conductive paste coating device |
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