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JPH05337396A - Metal powder removing device - Google Patents

Metal powder removing device

Info

Publication number
JPH05337396A
JPH05337396A JP4143085A JP14308592A JPH05337396A JP H05337396 A JPH05337396 A JP H05337396A JP 4143085 A JP4143085 A JP 4143085A JP 14308592 A JP14308592 A JP 14308592A JP H05337396 A JPH05337396 A JP H05337396A
Authority
JP
Japan
Prior art keywords
insulating varnish
metal powder
trap
magnetic
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4143085A
Other languages
Japanese (ja)
Inventor
Kazuyoshi Tsunoda
和好 角田
Tsutomu Higuchi
勤 樋口
Kazuo Sugiyama
和雄 杉山
Takeshi Arai
剛 新井
Hiroshi Takahashi
啓 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP4143085A priority Critical patent/JPH05337396A/en
Publication of JPH05337396A publication Critical patent/JPH05337396A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To obtain a metal powder removing device sucking and removing the magnetic metal powder mixed with insulating varnish in a highly efficient manner. CONSTITUTION:A trap main body 11 is incorporated on the way of piping 10 and the insulating varnish flowing through the trap main body 11 is stirred while the passage thereof is changed by weir plates 14 and the metal powder mixed with the insulating varnish is attracted by the magnetic bodies 12 arranged to the under surface of the trap main body 11.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、絶縁ワニス中に混入さ
れている磁性金属粉を高効率で吸引除去することが可能
な金属粉除去装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal powder removing device capable of sucking and removing magnetic metal powder mixed in an insulating varnish with high efficiency.

【0002】[0002]

【従来の技術】銅張り積層板や多層プリント配線板用な
どの基材となるプリプレグは、絶縁ワニスをガラスクロ
スなどに含浸し乾燥させて製造されている。このプリプ
レグは、銅張り積層板や多層プリント配線板などの絶縁
用基材として用いられるため、絶縁ワニスの中に絶縁破
壊の原因となるような金属粉が混入しないようにしなけ
ればならない。
2. Description of the Related Art A prepreg, which is a base material for a copper-clad laminated board or a multilayer printed wiring board, is manufactured by impregnating an insulating varnish into a glass cloth and drying it. Since this prepreg is used as an insulating base material such as a copper-clad laminate or a multilayer printed wiring board, it is necessary to prevent metal powder that may cause dielectric breakdown from entering the insulating varnish.

【0003】しかしながら、絶縁ワニスはギアーポンプ
などの圧送ポンプを用いて配管中を圧送されるため、圧
送ポンプやバルブ類からの摩耗粉あるいは絶縁ワニス構
成素材に含まれている金属粉などが混入している。した
がって、絶縁ワニスを圧送する配管中に、絶縁破壊の原
因となるような金属粉を除去する装置を設ける必要があ
る。
However, since the insulating varnish is pressure-fed through the pipe by using a pressure pump such as a gear pump, abrasion powder from the pressure pump or valves or metal powder contained in the constituent material of the insulating varnish is mixed. There is. Therefore, it is necessary to provide a device for removing metal powder that causes dielectric breakdown in the pipe for pumping the insulating varnish.

【0004】次に、従来用いられている金属粉除去装置
を説明する。図3に示すものは、配管1の途中に筒状の
金属粉除去用トラップ本体2を横設して組込む構成のも
ので、このトラップ本体2は、その上面側にOリング3
を介して磁性体4が取付けられている。そして、トラッ
プ本体2の上面側からは邪魔板5が垂下されている。
Next, a conventional metal powder removing device will be described. The structure shown in FIG. 3 has a configuration in which a tubular metal powder removing trap body 2 is installed sideways in the middle of the pipe 1, and the trap body 2 has an O-ring 3 on its upper surface side.
The magnetic body 4 is attached via. A baffle plate 5 is hung from the upper surface side of the trap body 2.

【0005】また、図4に示すものは、配管1の途中に
筒状の金属粉除去用トラップ本体6を立設して組込む構
成のもので、円筒状のトラップ本体6中には、図5にも
示されているように、金属粉吸着用の磁性体であるマグ
ネット棒7,…が所定の間隔を隔てて上下方向に配置さ
れている。
FIG. 4 shows a structure in which a tubular metal powder removing trap body 6 is installed upright in the middle of the pipe 1, and the cylindrical trap body 6 has a structure shown in FIG. As also shown in FIG. 1, magnet rods 7, which are magnetic bodies for adsorbing the metal powder, are arranged in the vertical direction with a predetermined space therebetween.

【0006】[0006]

【発明が解決しようとする課題】ところで、絶縁ワニス
の粘度は0.1〜1,000Pa・sと高く、絶縁ワニ
ス中に混入されている直径0.01〜0.1mmの金属
粉が、磁力によって吸引されて20mm移動するには1
0〜20秒の時間を要する。そのため、高効率で金属粉
を吸着して絶縁ワニス中より金属粉を吸引除去するに
は、絶縁ワニスの流れを遅くするとともに、絶縁ワニス
の流れ層を薄くし、磁性体との接触時間を長く、また接
触面積を大とする必要がある。
By the way, the viscosity of the insulating varnish is as high as 0.1 to 1,000 Pa.s, and the metal powder having a diameter of 0.01 to 0.1 mm mixed in the insulating varnish has a magnetic force. To be sucked by and move 20 mm 1
It takes 0 to 20 seconds. Therefore, in order to adsorb the metal powder with high efficiency and remove the metal powder from the insulating varnish by suction, the flow of the insulating varnish is slowed down, the flow layer of the insulating varnish is thinned, and the contact time with the magnetic material is lengthened. Also, it is necessary to increase the contact area.

【0007】しかしながら、上記したような従来の金属
粉除去装置は、トラップ本体2,6内において、絶縁ワ
ニスと磁性体5,7との接する時間が短く、またその接
触面積が小さいという欠点がある。そのため、絶縁ワニ
ス中の金属粉除去率は30〜60%と低く、絶縁ワニス
を塗工したプリプレグに金属粉が混入してしまい、銅張
り積層板や多層プリント配線板における不良が多発する
という問題がある。
However, the above-described conventional metal powder removing device has the drawback that the contact time between the insulating varnish and the magnetic bodies 5, 7 in the trap bodies 2, 6 is short and the contact area is small. .. Therefore, the removal rate of the metal powder in the insulating varnish is as low as 30 to 60%, and the metal powder is mixed into the prepreg coated with the insulating varnish, which often causes defects in the copper-clad laminate and the multilayer printed wiring board. There is.

【0008】本発明は、このような事情に鑑みてなされ
たものであり、その目的とするところは、絶縁ワニス中
に混入されている金属粉を高効率でろ過することが可能
な金属粉除去装置を提供することを目的とする。
The present invention has been made in view of such circumstances, and an object of the present invention is to remove metal powder mixed in the insulating varnish with high efficiency. The purpose is to provide a device.

【0009】[0009]

【課題を解決するための手段】本発明は、このような目
的を達成するために、絶縁ワニスを圧送する配管の途中
に組込まれ、絶縁ワニスを流通させるトラップ本体と、
トラップ本体の下面側の全面にわたって配列され、絶縁
ワニス中に混入されている金属粉を吸引する磁性体と、
トラップ本体内において絶縁ワニスの流れ方向と垂直に
設置され、絶縁ワニスの流れ層の厚みを規制するととも
に、絶縁ワニスの流れ方向を変えながら撹拌するせき板
とを具備することを特徴とするものである。
In order to achieve such an object, the present invention provides a trap body which is incorporated in the middle of a pipe for pumping an insulating varnish and which circulates the insulating varnish.
A magnetic body that is arranged over the entire lower surface of the trap body and that attracts the metal powder mixed in the insulating varnish,
It is characterized in that it is installed perpendicularly to the flow direction of the insulating varnish in the trap body, regulates the thickness of the flow layer of the insulating varnish, and has a weir plate that stirs while changing the flowing direction of the insulating varnish. is there.

【0010】[0010]

【作用】絶縁ワニス中の最上部にある金属粉は、重力と
位置エネルギーの差も加わって磁性体上を流れる最低時
間内に磁性体側に移動させられ、また絶縁ワニスの流れ
方向と垂直に設置されたせき板によりその流れ方向が変
化するとともに、絶縁ワニスに加速度が働き撹拌が発生
し、効率よく金属粉は磁性体に補集される。
[Operation] The metal powder on the top of the insulating varnish is moved to the magnetic side within the minimum time of flowing on the magnetic body due to the difference in gravity and potential energy, and is installed perpendicular to the flow direction of the insulating varnish. The flow direction is changed by the dammed cuffs, and the insulating varnish is accelerated to cause agitation, so that the metal powder is efficiently collected in the magnetic body.

【0011】[0011]

【実施例】以下、本発明の実施例を図面に基づき詳細に
説明する。図1は、本発明に係る金属粉除去装置を流路
に沿って示した説明用断面図であり、金属粉除去用のト
ラップ本体11は、ギアーポンプのような圧送ポンプ
(図示略)が取付けられた配管10,10間に組込まれ
ている。このトラップ本体11は、図示しないが、絶縁
ワニスを重力と位置エネルギー差を活用しつつ流すもの
である。勿論、圧送の場合には、トラップ本体11の上
部に蓋を設け、内圧に耐えるようにする必要がある。
Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is an explanatory cross-sectional view showing a metal powder removing device according to the present invention along a flow path, and a trap body 11 for removing metal powder is attached with a pressure pump (not shown) such as a gear pump. It is incorporated between the pipes 10 and 10. Although not shown, the trap body 11 flows an insulating varnish while utilizing gravity and potential energy difference. Of course, in the case of pressure feeding, it is necessary to provide a lid on the upper part of the trap body 11 to withstand the internal pressure.

【0012】前述したように、絶縁ワニスの粘度は0.
1〜1,000Pa・sと高く、絶縁ワニス中の金属粉
(直径0.01〜0.1mm)は、磁石の吸引によって
20mm移動するのに10〜20秒かかる。そのため、
トラップ本体11は絶縁ワニスの流れを遅く、かつ絶縁
ワニスの流れ層を薄くする必要があり、実用上は絶縁ワ
ニスの流れを常に20mm以下、磁性体12(磁界)に
接触する時間を20秒以上確保し、多量に絶縁ワニスを
処理できるように設定する。
As described above, the viscosity of the insulating varnish is 0.
It is as high as 1 to 1,000 Pa · s, and it takes 10 to 20 seconds for the metal powder (diameter 0.01 to 0.1 mm) in the insulating varnish to move 20 mm due to the attraction of the magnet. for that reason,
The trap body 11 needs to slow the flow of the insulating varnish and thin the flow layer of the insulating varnish. In practice, the flow of the insulating varnish is always 20 mm or less, and the contact time with the magnetic body 12 (magnetic field) is 20 seconds or more. Secure and set so that a large amount of insulating varnish can be processed.

【0013】磁性体12の面積は、絶縁ワニスの粘度と
流速から決定するのであるが、トラップ本体11の下面
側に全面にわたって配列され、その配列は磁界が切れな
いよう連続的に配列する。なお、磁力は強い方がよいが
高価になるため、絶縁ワニスが流れる表面で0.01
T以上、好ましくは0.1 T以上にする必要がある。
また、磁性体12のカバー板(SUS板)13は、板厚
を極力薄くする必要がある。
The area of the magnetic body 12, which is determined from the viscosity and flow velocity of the insulating varnish, is arranged over the entire lower surface of the trap body 11, and the arrangement is continuous so that the magnetic field is not cut off. It should be noted that the stronger the magnetic force is, the more expensive it is.
It must be T or higher, preferably 0.1 T or higher.
Further, the cover plate (SUS plate) 13 of the magnetic body 12 needs to be as thin as possible.

【0014】さらに、トラップ本体11は絶縁ワニスを
流しながら撹拌できるようにするために、その内部に絶
縁ワニスの流れ方向に対して垂直にせき板14を設け、
絶縁ワニスの流れ方向を変える。また、トラップ本体1
1における側板15の隅部分は曲率を付けると金属粉を
除去する上で好適であり、その曲率は指先が密着する程
度でよい(図2参照)。せき板14の高さは、流速と流
量から算出される絶縁ワニスの流れ層の厚み以下に設定
する。このせき板14の高さを越えて絶縁ワニスが流れ
ると、磁性体12と接触する算出時間を守れなくなる。
そこで、常に絶縁ワニスの流れが算出値以下であるよ
う、また一目で判断できるよう、その高さを規定する。
なお、高さ監視上、せき板14の個数は2個以上必要で
ある。
Further, the trap body 11 is provided with a weir plate 14 perpendicularly to the flow direction of the insulating varnish so that the trap varnish 11 can be stirred while flowing the insulating varnish.
Change the flow direction of the insulating varnish. Also, the trap body 1
The corner portion of the side plate 15 of No. 1 is suitable for removing the metal powder when it is provided with a curvature, and the curvature may be such that the fingertip is in close contact (see FIG. 2). The height of the weir plate 14 is set to be equal to or less than the thickness of the flow layer of the insulating varnish calculated from the flow velocity and the flow rate. If the insulating varnish flows over the height of the weir 14, the calculated time for contact with the magnetic body 12 cannot be kept.
Therefore, the height of the insulating varnish is regulated so that the flow of the insulating varnish is always less than or equal to the calculated value and that the flow can be determined at a glance.
It should be noted that two or more cuffs 14 are required for height monitoring.

【0015】次に、具体例とともにその結果を以下に説
明する。巾300mm,長さ1500mmのトラップ本
体11を形成し、せき板14の高さ10mm、せき板1
4の設置を3ヵ所とし、かつ磁力0.15 Tの磁石を
配列した。そして、トラップ本体11内に粘度6Pa・
sの絶縁ワニスを流した。このとき、直径5μm以上の
金属粉の補集率は99.5%であった。
Next, the results will be described below together with specific examples. The trap body 11 having a width of 300 mm and a length of 1500 mm is formed, and the height of the weir 14 is 10 mm.
No. 4 was installed in three places, and magnets having a magnetic force of 0.15 T were arranged. Then, the viscosity of 6 Pa in the trap body 11
s of insulating varnish was poured. At this time, the collection rate of the metal powder having a diameter of 5 μm or more was 99.5%.

【0016】[0016]

【発明の効果】以上説明したように、本発明によれば、
粘度の高い絶縁ワニス中に混入されている金属粉を高効
率で吸引除去することができ、金属粉の混入していない
プリプレグを作製することができるので、銅張り積層板
や多層プリント配線板などにおける不良発生率を低下さ
せることができる。
As described above, according to the present invention,
Metal powder mixed in highly viscous insulating varnish can be removed by suction with high efficiency, and a prepreg containing no metal powder can be produced, so copper-clad laminates and multilayer printed wiring boards, etc. It is possible to reduce the defect occurrence rate.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る金属粉除去装置を流路に沿って示
した断面図なある。
FIG. 1 is a cross-sectional view showing a metal powder removing device according to the present invention along a flow path.

【図2】図1に示した装置の側面側を示した断面図であ
る。
FIG. 2 is a cross-sectional view showing a side surface side of the device shown in FIG.

【図3】従来の金属粉除去装置を示す断面図である。FIG. 3 is a cross-sectional view showing a conventional metal powder removing device.

【図4】従来の金属粉除去装置の他の例を示す断面図で
ある。
FIG. 4 is a cross-sectional view showing another example of a conventional metal powder removing device.

【図5】図4に示した装置の平面側を示す断面図であ
る。
5 is a cross-sectional view showing a plane side of the device shown in FIG.

【符号の説明】[Explanation of symbols]

10 配管 11 トラップ本体 12 磁性体 13 カバー体 14 せき板 10 Piping 11 Trap Main Body 12 Magnetic Material 13 Cover Body 14 Weir Board

フロントページの続き (72)発明者 新井 剛 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内 (72)発明者 高橋 啓 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内Front page continued (72) Inventor Tsuyoshi Arai 1500 Ogawa, Shimodate, Ibaraki Hitachi, Ltd. Shimodate factory (72) Inventor Kei Takahashi 1500, Ogawa, Shimodate, Ibaraki Hitachi Chemical Co., Ltd. Shimodate factory

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 絶縁ワニスを圧送する配管の途中に組込
まれ、絶縁ワニスを流通させるトラップ本体と、トラッ
プ本体の下面側の全面にわたって配列され、絶縁ワニス
中に混入されている磁性金属粉を吸引する磁性体と、ト
ラップ本体内において絶縁ワニスの流れ方向と垂直に設
置され、絶縁ワニスの流れ層の厚みを規制するととも
に、絶縁ワニスの流れ方向を変えながら撹拌するせき板
とを具備することを特徴とする金属粉除去装置。
1. A trap main body, which is incorporated in the middle of a pipe for pumping an insulating varnish, and which circulates the insulating varnish, and a magnetic metal powder mixed in the insulating varnish, which is arranged over the entire lower surface of the trap main body. And a dam that is installed perpendicular to the flow direction of the insulating varnish in the trap body, regulates the thickness of the flow layer of the insulating varnish, and stirs while changing the flowing direction of the insulating varnish. Characteristic metal powder removal device.
JP4143085A 1992-06-04 1992-06-04 Metal powder removing device Pending JPH05337396A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4143085A JPH05337396A (en) 1992-06-04 1992-06-04 Metal powder removing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4143085A JPH05337396A (en) 1992-06-04 1992-06-04 Metal powder removing device

Publications (1)

Publication Number Publication Date
JPH05337396A true JPH05337396A (en) 1993-12-21

Family

ID=15330566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4143085A Pending JPH05337396A (en) 1992-06-04 1992-06-04 Metal powder removing device

Country Status (1)

Country Link
JP (1) JPH05337396A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180571A (en) * 2007-02-14 2007-07-12 Hitachi Chem Co Ltd Insulating material with copper foil and multilayer wiring board using same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180571A (en) * 2007-02-14 2007-07-12 Hitachi Chem Co Ltd Insulating material with copper foil and multilayer wiring board using same
JP4555946B2 (en) * 2007-02-14 2010-10-06 日立化成工業株式会社 Insulating material with copper foil and multilayer printed wiring board using the same

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