JPH05335534A - Optical semiconductor device - Google Patents

Abstract

PURPOSE:To unneed adhering resin by providing a gap between an element and a light transparent material by holding the light transparent material using holding members provided in its periphery. CONSTITUTION:A solid-state imaging element 1 is fixed to a flexible printed board 8 having a reinforcing plate 10 with adhesives 4. The element 1 is connected with a bonding pad 9 of a flexible printed board 8 by a bonding wire 6. A light transparent material 2 is fixed to a holding member 7 to cause a gap 3. Thereafter, a gap between the light transparent material 2 and the holding member 7 is filled with potting resin. A gap can be provided between the element and the light transparent material, and as a result, resin for adhering the element to the light transparent material can be unneeded.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor using a solid-state image pickup device and an optical semiconductor device such as an EPROM which makes light incident on the device surface.

[0002]

2. Description of the Related Art Conventional optical semiconductor devices generally have a structure in which an element is fixed in a recess of a package made of ceramic or the like, and a glass substrate is bonded onto the element by means of potting resin.

In order to further reduce the size of the optical semiconductor device, as shown in FIG.
Is also fixed by an adhesive agent 4, the glass substrate 2 is further adhered to the surface of the element 1 by using an adhesive resin 12, and the peripheral portion of the glass substrate is sealed by a potting resin 5 (Japanese Patent Laid-Open No. 61-61). 123288).

[0004]

However, in the above-mentioned conventional example, since the glass substrate is adhered to the surface of the element, there are the following problems. (1) An optical defect occurs when delicate dust or bubbles contained in the adhesive resin or potting resin are present on the element in the light incident region. (2) If the adhesive resin or potting resin is not completely transparent, the light transmittance will decrease. Further, if there is discoloration or the like due to aging, the element sensitivity also changes due to the change in transmittance. (3) If the adhesiveness with the glass substrate is not improved, peeling or the like will occur, and reliability and optical characteristics will deteriorate. (4) Adhesive parts other than the glass adhesive part must be sealed in a separate process.

As described above, the production yield of an optical semiconductor device is reduced, the cost is increased due to complicated processes, the deterioration of optical characteristics, the deterioration of reliability, and the resin used for adhesion is extremely limited. There was a problem.

In order to overcome the above conventional problems, it is an object of the present invention to provide a device in which it is not necessary to bond an element and a light transmitting material.

[0007]

According to the present invention, in an optical semiconductor device for sealing an optical semiconductor element with potting resin, a holding member is provided on at least two sides around the optical semiconductor element. A transparent material is held on the optical semiconductor element by forming a gap between the optical semiconductor element and the optical transparent material, and a potting resin is applied to the peripheral portion of the optical transparent material so that the potting resin does not enter the gap. It is characterized by sealing by.

[0008]

According to the present invention, the light transmitting material is held by the holding member provided in the periphery, so that a gap can be provided between the element and the light transmitting material, and as a result, the element and the light transmitting material are bonded to each other. The above-mentioned problems such as optical defects and deterioration of characteristics are solved without the need for a resin. Also, by sealing the peripheral portion with potting resin, the element surface can be sealed at the same time.

With the above structure, the potting resin does not need to be light transmissive, and the range of resin selection is widened.

[0010]

The present invention will be described in more detail with reference to the following examples, but it goes without saying that the present invention is not limited to these examples.

(Embodiment 1) FIG. 1 is a schematic sectional view showing an embodiment of the present invention, and FIG. 2 is a schematic plan view thereof.

An element 1 such as a solid-state image sensor is fixed to a flexible printed board 8 having a reinforcing plate 10 with an adhesive 4. The element 1 and the bonding pad 9 of the flexible printed board 8 are connected by the bonding wire 6. By fixing the light transmitting material 2 such as glass to the holding member 7, a gap 3 is formed and the space between the light transmitting material 2 and the holding member 7 is filled with the potting resin 5.

In the above description, the element is a solid-state image pickup element, but it may be an optical semiconductor element such as an EPROM that allows light to enter the element surface.

As the light transmitting material, in addition to glass, an optical mold or the like which transmits light may be used, and a function of an anti-reflection film such as an infrared light cut filter may be provided.

A printed circuit board (PCB) or the like may be used instead of the flexible printed board.

The potting resin may be black, semi-transparent, or the like because it does not exist on the element in the light incident region only in the peripheral portion.

Generally, as the potting resin, the gap 3
Since it is preferable that the fluidity is small so that the light-transmissive material does not easily enter, the holding member for holding the light transmitting material may be partial (only two opposing sides), and the other sides may not be provided.

(Embodiment 2) Another embodiment of the present invention is shown in FIG. In this embodiment, the light transmitting material 2 has a convex shape on the surface of the element 1. As a material used for the package 11, ceramic, resin, or the like can be used.

(Embodiment 3) FIG. 4 shows another embodiment of the present invention. In this embodiment, by providing the block 13 at the end of the light transmitting material 2, it is possible to prevent the sealing resin 5 from flowing into the gap 3. As a result, the resin 5 having good fluidity can be used, and the range of resin selection is widened. The block 13 is preferably made of resin and may be provided not only on the light transmitting material side but also on the element 1 side.

[0020]

According to the present invention, since no adhesive resin is required on the element, the yield is improved without optical defects or deterioration of characteristics.
Since the manufacturing process can be simplified, the cost can be reduced. That is, it is possible to provide a high-performance and highly reliable optical semiconductor device at a low cost.

Further, if the chip-on-board (COB) as shown in FIG. 1 is used, not only is it suitable for downsizing, but also an expensive package is not required, so that it can be used for the current small-quantity high-mix production. It is valid.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing a semiconductor device of Example 1.

2 is a schematic plan view showing a semiconductor device of Example 1. FIG.

FIG. 3 is a schematic cross-sectional view showing a semiconductor device of Example 2.

FIG. 4 is a schematic cross-sectional view showing a semiconductor device of Example 3.

FIG. 5 is a schematic sectional view showing a conventional semiconductor device.

[Explanation of symbols]

 1 element, 2 light transmitting material, 3 gap, 4 adhesive, 5 potting resin, 6 bonding wire, 7 holding member, 8 flexible printed board, 9 bonding pad, 10 reinforcing plate, 11 package, 12 adhesive resin, 13 blocks.

Claims (3)

[Claims] 1. An optical semiconductor device for encapsulating an optical semiconductor element with potting resin, wherein a holding member is provided on at least two sides of the periphery of the optical semiconductor element, and the holding member causes a light transmitting material to the optical semiconductor element. A gap is formed between the light transmissive materials to be held on the optical semiconductor element, and a peripheral portion of the light transmissive material is sealed with the potting resin so that the potting resin does not enter the space. Optical semiconductor device. 2. The optical semiconductor device according to claim 1, wherein the light transmitting material has a convex shape toward the optical semiconductor element. 3. A block is provided on an end portion of the surface of the light transmitting material on the optical semiconductor element side or on the optical semiconductor element facing the end portion to prevent the potting resin from entering the gap. The optical semiconductor device according to claim 1 or 2.