JPH05329759A - Wafer material edge face polishing device - Google Patents

Abstract

PURPOSE:To perform an excellent polishing work through oscillation of a pressure receiving pad in a manner to follow the shape of the edge face of a wafer material by providing an oscillating mechanism to oscillate the pressure receiving pad. CONSTITUTION:In the case of a work to polish the peripheral edge face of a wafer W, a polishing tape T guided in a flat state by a tape guide 31 by means of a tape transfer mechanism 4 is continuously transferred in a direction extending at right angles with the direction of the tangential line of the wafer material. The tape transfer mechanism 4 is oscillated in the direction of the tangential line of the wafer material by an oscillating mechanism and the wafer material is supported and rotated around the axis of a rotating mechanism by means of a rotating mechanism 1. Under this state, the tape transfer mechanism is moved forward by a moving mechanism and the polishing tape is brought into pressure contact with the peripheral edge face of the wafer material. A pressure receiving pad 42 capable of being oscillated by an oscillating mechanism 43 is oscillated following the shape of the peripheral edge face of the wafer material W. This constitution performs an excellent work to polish the peripheral edge face of the wafer material W.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer material edge surface polishing apparatus used for polishing edge surfaces of semiconductor wafers made of, for example, silicon.

[0002]

2. Description of the Related Art Conventionally, a beveling device is known as a device for processing the edge surface of a semiconductor wafer of this type.

As shown in FIG. 9, this wafer material W is a thin plate made of silicon or the like, and has an edge face F composed of a circumferential edge face F ₁ and a straight edge face F ₂ (orientation flat). Have

In the conventional structure described above, a rotary grindstone having a concave peripheral surface adapted to the edge face F of the wafer material W is used, and the rotary grindstone is pressed against the edge face F of the wafer material W for polishing. Is configured to do.

[0005]

However, in the case of the conventional structure using the rotary grindstone, the dressing process of the grindstone is indispensable, and since the polishing operation is performed only by the rotating operation of the grindstone, the state of the satisfactory polishing surface may not be obtained. In addition, there is a disadvantage that chipping easily occurs.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to solve such problems, and a rotation mechanism for supporting and rotating a wafer material around its axis, and a polishing tape in a tangential direction of the wafer material. A tape transfer mechanism for continuously transferring in a direction orthogonal to each other, a moving mechanism for moving the tape transfer mechanism forward and backward, a shaking mechanism for rocking the tape transfer mechanism in a tangential direction of a wafer material, and a flat polishing tape. A tape guide portion that can be guided to the inner surface, a pressure receiving pad that receives a pressure contact force between the polishing tape and the edge surface of the wafer material, a swing mechanism that enables swinging of the pressure receiving pad, and a tape transfer mechanism. A wafer material edge polishing apparatus comprising a feed mechanism for feeding the wafer material in a tangential direction.

[0007]

In the case of polishing the peripheral edge surface of the wafer material, the polishing tape guided by the tape guide portion in a flat shape by the tape transfer mechanism is continuously transferred in the direction orthogonal to the tangential direction of the wafer material, and When the tape transfer mechanism is oscillated in the tangential direction of the wafer material by the oscillating mechanism, and the wafer is supported and rotated around its axis by the rotating mechanism, and the tape transfer mechanism is moved forward by the moving mechanism in this state, the polishing tape is removed. The pressure-sensitive pad, which is pressed against the circumferential edge surface of the wafer material and can be swung by the swing mechanism, receives the pressure contact force between the polishing tape and the edge surface of the wafer material, and the circumferential edge surface of the wafer material. Is pressed and polished by the combined action of the rotation of the wafer material, the transfer of the polishing tape, and the shaking action of the polishing tape.

Further, in the case of polishing the linear edge surface of the wafer material, the polishing tape guided flat by the tape guide portion by the tape transfer mechanism is continuously transferred in the direction orthogonal to the tangential direction of the wafer material, and The tape transfer mechanism is oscillated by the oscillating mechanism in the tangential direction of the wafer material, and the rotation of the wafer material is stopped so that the linear edge surface and the tape surface of the polishing tape face each other. When the transfer mechanism is moved forward by the moving mechanism and the tape transfer mechanism is moved in the tangential direction of the wafer material by the feeding mechanism, the polishing tape is pressed against the linear edge surface of the wafer material, and the swing mechanism swings the head. The movable pressure receiving pad receives the pressure contact force between the polishing tape and the edge surface of the wafer material, and the linear edge surface of the wafer material transfers the polishing tape and the polishing tape. It will be pressed against the polishing by the action of the three composite Yurafu action and feeding action of the polishing tape flop.

[0009]

1 to 8 show an embodiment of the present invention, in which 1 is a rotating mechanism, and a suction pad 3 having a negative pressure suction action at the end of a rotary shaft 2 rotated by a motor or the like not shown. The suction pad 3 sucks the plate surface of the wafer material W, and the rotating shaft 2 supports and rotates the wafer material around its axis W ₁ .

Reference numeral 4 is a tape transfer mechanism, 5 is a moving mechanism, 6 is a vibrating mechanism, and 7 is a feeding mechanism. In this case, the moving mechanism 5 is used.
Is a moving mechanism 5a for moving only the tape transfer mechanism 4 back and forth.
And a moving mechanism 5b for moving the entire unit including the tape transfer mechanism 4 back and forth. In this moving mechanism 5b, the machine base 8
A cylinder for forward and backward movement, in which a base 9 is fixed on the base 9, a front and rear moving base 11 is provided on the base 9 by a sliding portion 10 so as to be movable in the front and rear direction which is the left and right direction in FIG. Further, the feed mechanism 7 is provided with the feed mechanism 7 on the front-back movement base 11 by the sliding portion 13 so as to be movable in the left-right direction which is the left-right direction in FIG. A feeding cylinder 15 for moving is provided.

The swing mechanism 6 is provided with a swing portion 17 on the feed moving base 14 by a sliding portion 16 so as to be movable in the left and right directions which are the left and right directions in FIG. 18 is attached, the vibration motor 19 is attached to the bracket 18, the drive shaft 20 is borne by the bracket 18, the main shaft of the vibration motor 19 is connected to the upper end of the drive shaft 20, and the lower end of the drive shaft 20 is connected. Forming an eccentric shaft portion 20a,
The cam follower 21 is attached to the eccentric shaft portion 20a, and two guide plates 22 are attached on the shaking table 17 so as to face each other with the cam follower 21 sandwiched therebetween, and the driving shaft 20 is driven by driving the shaking motor 19. The cam follower 21 that is rotated and attached to the eccentric shaft portion 20a and the guide plate 22 are caused to oscillate by the sliding portion 16.

Of the moving mechanism 5, the tape transfer mechanism 4
The moving mechanism 5a that moves only the back and forth is used for the shaking table 17
The mounting plate 23 is installed upright on the
The slide base 25 is provided so as to be movable back and forth via the, and the mounting plate 23 is provided with an operating cylinder 26 for moving the slide base 25 back and forth.

Further, in this case, the tape transfer mechanism 4 coats or bonds the mounting plate 23 with abrasive particles having a predetermined particle size such as aluminum oxide, chromium oxide, silicon carbide and diamond on the base material such as polyester film, metal and cloth. Real reel 27 of polishing tape T
Also, the take-up reel 28 is attached to the shaft, the bearing tube portion 29 is provided on the slide base 25, the support tube 30 is provided in the bearing tube portion 29 in a non-rotating state, and the tape guide portion 31 is provided on the support tube 30. The polishing tape T that is arranged and pulled out from the actual winding reel 27 is wound around the winding reel 28 via the roller 32 between the roller 32, the tape guide portion 31, the roller 33, and the pair of sandwiching rollers 34a and 34b, The actual winding reel 27 is driven by the servo motor 36, the sandwiching roller 34a is driven by the servo motor 37, and the winding reel 28
Further, the rotation of the sandwiching roller 34a is driven by a belt transmission mechanism (not shown) to continuously transfer the polishing tape T in one direction while applying back tension.

Further, in the tape guide portion 31, the holding plate 38 is attached to the support cylinder 30, the arms 39 and 39 are attached to the upper and lower positions of the holding plate 38, and the support arms 40 and 40 are attached to and supported by the arms 39 and 39. The guide rollers 41, 41 are attached to the arms 40, 40 so that the polishing tape T can be guided flatly.

Reference numeral 42 is a pressure receiving pad, and 43 is a swing mechanism. In this case, a mounting shaft 44 is fitted and disposed on the center of the support cylinder 30 so as to be adjustable forward and backward by the rotation of a rotating plate 45. The support piece 46 is positionally fixed to the shaft 44 by a set screw 47, and the pressure receiving pad 42 is pivotally attached to the support piece 46 by a fulcrum shaft 48 so as to swing vertically and swingably, and is supported at a vertical position with the fulcrum shaft 48 as a boundary. Compression springs 49, 49 are respectively interposed between the piece 46 and the pressure receiving pad 42, and the pressure receiving pad 42 is provided with an elastic member 50 made of urethane rubber.

Since this embodiment has the above-mentioned structure, as shown in FIG. 7, when the circumferential edge surface F ₁ of the wafer material W is polished, it is guided flat by the tape guide portion 31 by the tape transfer mechanism 4. The polished polishing tape T is used as a wafer material W
Is continuously transferred in a direction perpendicular to the tangential direction of the wafer W, and the tape transfer mechanism 4 is oscillated in the tangential direction of the wafer material W by the oscillating mechanism 6, and the rotation mechanism 1 supports and rotates the wafer W around its axis W _1. Then, when the tape transfer mechanism 4 is moved forward by the moving mechanism 5a in the moving mechanism 5 in this state, the polishing tape T is moved to the circumferential edge surface F of the wafer material W.
_The pressure receiving pad 42 which is pressed against ₁ and can be swung by the swing mechanism 43 is an edge face F _{1 of the} polishing tape T and the wafer material W.
And a peripheral edge surface F _{1 of the} wafer material W under the pressure contact force with
Will be pressed and polished by three combined actions of the rotation action of the wafer material W, the transport action of the polishing tape T, and the shaking action of the polishing tape T. Therefore, a good polishing process can be obtained.

When the linear edge surface F ₂ of the wafer material W is polished, as shown in FIG. 8, the tape transfer mechanism 4 continues the polishing tape T in a direction orthogonal to the tangential direction of the wafer material W as described above. The tape transfer mechanism 4 is oscillated in the tangential direction of the wafer material W by the oscillating mechanism 6 to stop the rotation of the wafer material W to form a linear edge face F.
₂ and the tape surface of the polishing tape T face each other,
The state among the tape transport mechanism 4 of the moving mechanism 5, only the radial difference is advanced to the straight edge surfaces F ₂ and circumferential edge surfaces F ₁ by a moving mechanism 5b, and the moving mechanism 5a
When the tape transfer mechanism 4 is moved forward in the tangential direction of the wafer material W by the feeding mechanism 7, the polishing tape T moves linearly to the edge surface F _{2 of the} wafer material W.
The pressure receiving pad 42, which is pressed against and is swingable by the swing mechanism 43, receives the pressure contact force between the polishing tape T and the edge surface F ₂ of the wafer material W, and the linear edge surface F ₂ of the wafer material W is Since the polishing tape T is transferred, the shaking motion of the polishing tape T, and the feeding operation of the polishing tape T are combined, pressure contact polishing is performed. Therefore, excellent polishing processing can be obtained.

During this polishing process, the pressure receiving pad 42 can swing up and down about the fulcrum shaft 48 by the action of the two compression springs 49, 49 of the swing mechanism 43, so that the edge of the wafer material W can be swung. The end face F ₁ can be swung following the shape of the end face F ₁ , so that the polishing tape T can be brought into good pressure contact with the edge end face F _1, and good polishing processing can be obtained.

The present invention is not limited to the above-mentioned embodiment. For example, in the above-mentioned embodiment, a cylinder structure is adopted as the moving mechanism 5, but a combination structure of a ball screw mechanism and a servo motor may be adopted. In addition, although a suction pad is adopted as the rotating mechanism, a supporting and rotating structure is appropriately adopted, and the structure of the swinging mechanism 43 is appropriately changed and designed.

[0020]

As described above, according to the present invention, the polishing tape guided flat by the tape guide by the tape transfer mechanism is continuously transferred in the direction orthogonal to the tangential direction of the wafer material, and the tape transfer mechanism is vibrated. The mechanism oscillates in the tangential direction of the wafer material, the rotation mechanism supports and rotates the wafer about its axis in the case of circumferential edge polishing, and the rotation in the case of linear edge polishing. When the tape transfer mechanism is moved forward by the moving mechanism in this state, the polishing tape is brought into pressure contact with the edge surface of the wafer material, and the pressure-sensitive pad that can be oscillated by the swing mechanism moves between the polishing tape and the wafer material. Under the pressure contact force with the edge surface, the edge surface of the wafer material has three functions of the polishing tape transfer operation, the polishing tape swinging operation, the wafer material rotation operation, and the polishing tape feeding operation. Therefore, the pressure receiving pad swings and swings by the swinging mechanism during the polishing process, which allows it to swing following the shape of the edge surface of the wafer material. It is possible to obtain various polishing processes.

As described above, the intended purpose can be sufficiently achieved.

[Brief description of drawings]

FIG. 1 is an overall front view of an embodiment of the present invention.

FIG. 2 is a vertical sectional view of an embodiment of the present invention.

FIG. 3 is a partial perspective view of an embodiment of the present invention.

FIG. 4 is a partial cross-sectional view of an embodiment of the present invention.

FIG. 5 is a partial side sectional view of an embodiment of the present invention.

FIG. 6 is a partially enlarged side sectional view of the embodiment of the present invention.

FIG. 7 is a partial perspective view showing a state in which the circumferential edge surface of the embodiment of the present invention is polished.

FIG. 8 is a partial perspective view showing a state where the linear edge surface of the embodiment of the present invention is polished.

FIG. 9 is a perspective view of a wafer material.

[Explanation of symbols]

 W Wafer Material T Polishing Tape F Edge Edge Surface 1 Rotating Mechanism 4 Tape Transfer Mechanism 5 Moving Mechanism 6 Shaking Mechanism 7 Feeding Mechanism 31 Tape Guide Section 42 Pressure-Receiving Pad 43 Swinging Mechanism

Claims (1)

[Claims] 1. A rotation mechanism for supporting and rotating a wafer material around its axis, a tape transfer mechanism for continuously transferring a polishing tape in a direction orthogonal to a tangential direction of the wafer material, and a moving mechanism for moving the tape transfer mechanism forward and backward. A oscillating mechanism that oscillates the tape transfer mechanism in the tangential direction of the wafer material, a tape guide portion that can guide the polishing tape in a flat shape, and a pressure contact force between the polishing tape and the edge surface of the wafer material. A wafer material, comprising: a pressure receiving pad for receiving the pressure, a swinging mechanism capable of swinging the pressure receiving pad, and a feeding mechanism for feeding the tape transfer mechanism in a tangential direction of the wafer material. Edge polishing device.