JPH05326091A - Ic socket and multilayer printed board provided with heat radiating mechanism - Google Patents

Abstract

(57) [Abstract] [Purpose] An IC socket having a mechanism capable of radiating heat generated in an LSI to a multilayer printed circuit board, and a multilayer printed circuit board that efficiently absorbs heat from this IC socket and dissipates it in the air. It is intended to provide. [Structure] In the IC socket 9, as a heat conductor 11 in a central portion of the IC socket body 10, elastic plates 16a and 16b having a high heat conductivity such as silicone rubber are thinly formed on both sides of a metal plate 15 having a high heat conductivity such as copper. It is stacked in the. The heat conductor 11 is formed to be thicker than the thickness of the IC socket body 10, and the lower surface of the heat conductor 11 forms a convex portion slightly protruding from the IC socket body 10 to heat the concave portion of the printed circuit board. The lower end of the conductor 11 is configured to be fitted and fixed. The upper surface of the heat conductor 11 is I
It is slightly projected from the surface of the C socket body 10,
The elastic body 16a on the upper surface side of the metal plate 15 is configured to support the LSI.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC (integrated circuit) socket used in various electronic devices such as a computer, and a printed circuit board used in connection with the socket.

[0002]

2. Description of the Related Art Conventionally, LSIs with high operating frequencies used in personal computer systems, etc.
Generally, a large amount of heat is generated during operation, and it is a problem to keep the temperature of the LSI within the guaranteed operating temperature range. A conventional heat dissipation means for an LSI will be described below with reference to the drawings.

FIG. 7 shows a conventional LSI heat radiation means, and FIG. 8 is a sectional view thereof. In the figure, L with a high operating frequency
SI1 is mounted on the printed circuit board 3 by soldering the signal pin 5, and the heat generated in the LSI is applied to the signal pin 5.
However, since the insulating layer 6 of the printed board 3 has a low thermal conductivity at this time, the printed board 3 alone cannot provide a sufficient heat dissipation effect. On the other hand, an electric signal transmitting conductor foil 4 formed of a material having a high thermal conductivity is attached to the printed circuit board 3, and the electric signal transmitting conductor foil 4 can also dissipate a part of heat. However, since the electric signal transmission conductor foil 4 has a narrow width and is joined to the LSI 1 by the signal pin 5, the heat transmission from the LSI 1 is poor and it cannot sufficiently function as a heat dissipation material. there were.

Therefore, the heat sink 2 is formed on the surface of the LSI 1.
To attach the heat generated by the LSI 1 to the heat sink 2
And the heat is dissipated into the air by the heat sink 2, and the temperature of the LSI 1 is suppressed within the guaranteed operation range.

[0005]

However, due to the internal mechanical structure of the personal computer, it may not be possible to provide a heat sink having a sufficient heat dissipation mechanism. That is, as shown in FIG. 9, when the option board 7 is mounted inside the personal computer, it is often the case that the space between the option board 7 and the LSI 1 cannot be set wide, and a heat sink having a high heat dissipation effect is provided in the LSI 1. It was difficult to secure enough space to attach it to the top surface.

Therefore, there is a problem that it becomes very difficult to maintain the operation guarantee temperature of the LSI when the heat sink cannot be attached. The present invention is to solve the above problems, and an IC socket having a mechanism capable of radiating heat generated in an LSI to a multilayer printed circuit board, and a multilayer that efficiently absorbs heat from the IC socket and radiates the heat into the air. It is intended to provide a printed circuit board.

[0007]

In order to achieve the above object, the invention according to claim 1 radiates heat to a multilayer printed circuit board by using a heat conductor composed of an elastic body having a high heat conductivity and a metal in an IC socket. It is equipped with a possible mechanism. Claim 2
In the invention, the inner layer solid conductor foil is exposed at the contact portion of the multilayer printed circuit board with the heat conductor of the IC socket.

[0008]

Therefore, in the IC socket of the present invention, the LSI
The heat generated in the socket is absorbed by the elastic body having a high thermal conductivity and the metal forming the socket, and can be quickly transmitted to the multilayer printed board side. Further, according to the multilayer printed circuit board of the present invention, in the contact portion of the IC socket with the heat conductor,
Since the inner layer solid conductor foil is exposed, the heat of the IC socket can be effectively absorbed by the inner layer solid conductor foil of the multilayer printed circuit board via the heat conductor, and can be efficiently dissipated into the air. is there.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An IC socket and a multilayer printed board according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an IC socket 9 of the present invention, which has a structure in which a heat conductor 11 is provided at the center of an IC socket body 10 formed in a rectangular frame shape. FIG. 2 shows a multilayer printed circuit board 12 of the present invention, which is configured as a multilayer printed circuit board 12 using a glass epoxy resin copper clad laminate in which a glass base epoxy resin and a copper foil are laminated.
The first insulating layer 13 in the portion of the socket 9 that contacts the heat conductor 11 is removed to form a recess in which the inner solid conductor foil 14 made of copper foil is exposed. The size of the recess is formed so that the heat conductor 11 of the IC socket 9 can be fitted therein.

As shown in FIG. 3, the IC socket 9 has an I
In the center of the C socket body 10, as a heat conductor 11, a metal plate 15 having a high heat conductivity such as copper is laminated on both surfaces with elastic bodies 16a and 16b having a high heat conductivity such as silicone rubber and having a thin thickness. The metal plate 1 through the elastic body 16b on the side
5 is installed in the recess of the printed circuit board 12.

The heat conductor 11 is formed to be thicker than the thickness of the IC socket body 10, and the lower surface of the heat conductor 11 constitutes a convex portion slightly protruding from the IC socket body 10 so that the printed circuit board 12 has a protrusion. The lower end of the heat conductor 11 is fitted and fixed in the recess. Further, the upper surface of the heat conductor 11 is slightly projected from the surface of the IC socket body 10, and the elastic body 1 on the upper surface side of the metal plate 15 is provided.
6a is configured to support the LSI. Also,
The IC socket body 10 is provided with a large number of pins 18, 18, 18 ... For joining with the multilayer printed board 12.

Further, as shown in FIG. 4, the multilayer printed circuit board 12 has an inner solid conductor foil 14 made of copper foil used as a ground layer by removing a part of the first insulating layer 13 located on the upper surface. An exposed recess is formed. Also,
The pin 1 of the IC socket body 10 is provided around the recess.
A large number of joining holes 19 and 19 into which 8 and 18 are inserted are formed at opposite positions.

Next, heat dissipation of the LSI when the LSI is mounted by the IC socket 9 and the multilayer printed board 12 will be described. 5 and 6 show the case where the LSI 17 is mounted on the multilayer printed circuit board 12 of the present invention by the IC socket 9. First, the heat conductor 1 of the IC socket 9 is mounted.
1 is fitted into the recess of the multilayer printed circuit board 12 and installed.

At this time, since the heat conductor 11 has the elastic body 16b having a high heat conductivity on the lower surface side, it is pressed against the inner layer solid conductor foil 14 exposed in the recess of the multilayer printed circuit board 12. Further, the LSI 17 is pressure-bonded and fixed onto the IC socket 9 via the elastic body 16a having a high thermal conductivity on the upper surface of the heat conductor 11, and this LIS 17 and the multilayer printed circuit board 1
The heat conductor 11 of the IC socket 9 is fixed by pressure contact with the inner solid conductor foil 14 of No. 2. Since the upper and lower surfaces of the heat conductor 11 are composed of the elastic bodies 16a and 16b having high heat conductivity, they are elastically adhered to the exposed surface of the inner layer solid conductor foil 14 of the multilayer printed board 12 and the lower surface of the LSI 17 by elastic deformation. Uniform and effective heat conduction is possible.

That is, the heat generated in the LSI 17 is conducted to the elastic body 16a having a high thermal conductivity, and then the metal plate 15
To the inner layer solid conductor foil 14 of the multilayer printed board 12 through the elastic body 16b having a high thermal conductivity. The heat conducted to the inner layer solid conductor foil 14 has a large area inside the multilayer printed circuit board 12, so that the inner layer solid conductor foil 14 has a sufficient heat capacity and an excellent thermal conductivity. Therefore, the heat from the elastic body 16b is quickly absorbed, the heat is conducted to the entire inner layer solid conductor foil 14, and the heat is radiated into the air.

When the above-mentioned multilayer printed circuit board 12 is installed in a personal computer, the inner layer solid conductor foil 14 used as the ground layer of the multilayer printed circuit board 12 is connected to a metal chassis by a metal screw so as to form an inner layer solid. It goes without saying that the heat conducted to the conductor foil 14 can be transferred to the metal chassis for more effective heat dissipation.

As described above, the IC socket 9 of the present invention has L
By mounting the SI 17 in advance, the lower surface of the LSI 17 is brought into close contact with the metal plate 15 through the elastic body 16a having a high thermal conductivity, and the heat during the LSI operation is quickly conducted to the thermal conductor 11 of the IC socket 9. At the same time, the heat conductor 11 is brought into close contact with the multilayer printed board 12 by the elastic body 16b having a high thermal conductivity on the lower surface of the metal plate 15 so that heat can be quickly conducted and diffused to the multilayer printed board 12 side.

Further, on the multilayer printed circuit board 12, an inner layer solid conductor foil 14 which is brought into contact with the heat conductor 11 of the IC socket.
The heat from the heat conductor 11 is quickly transferred to the entire inner layer solid conductor foil 14, and the heat of the LSI 17 is transferred from the heat conductor 11 of the IC socket 9 to the inner layer solid conductor foil of the multilayer printed circuit board 12. The temperature of the LSI 17 is quickly transmitted by being transmitted up to 14, and the temperature of the LSI 17 can be maintained within the operation guarantee temperature range.

Further, the IC socket 9 is arranged between the multilayer printed circuit board 12 and the LSI 17, and since it can be formed with a small overall thickness, it can be arranged in a narrow space of a personal computer. Also does not get in the way of option boards.

[0020]

As described above, the IC socket of the present invention is
Since it has a mechanism capable of radiating heat with a heat conductor composed of an elastic body having a high thermal conductivity and a metal plate, the heat generated in the LSI can be quickly transferred to the printed circuit board side by closely adhering to the LSI. It can be dispersed on a printed circuit board.

Further, the multilayer printed circuit board of the present invention is a multilayer printed circuit board which is brought into contact with the heat conductor in the IC socket, and the inner layer solid conductor foil is exposed at the contact portion with the heat conductor. Therefore, the heat of the heat conductor of the IC socket can be absorbed and transmitted to the entire inner layer solid conductor foil inside the printed circuit board, and the heat can be quickly radiated into the air to maintain the LIS temperature within the operation guarantee temperature range. This has an effect of preventing malfunction due to heat generation of the LSI.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of an IC socket of the present invention,

FIG. 2 is a perspective view showing an embodiment of a multilayer printed circuit board according to the present invention,

FIG. 3 is a sectional view of the IC socket shown in FIG.

4 is a partially enlarged cross-sectional view of the multilayer printed circuit board shown in FIG.

FIG. 5: LS via an IC socket on a multilayer printed circuit board
A perspective view illustrating a state in which I is attached,

FIG. 6 is a partially enlarged cross-sectional view illustrating the mounted state shown in FIG.

FIG. 7 is a perspective view illustrating a configuration of a conventional LSI heat dissipation method;

8 is an enlarged cross-sectional view illustrating the configuration of the conventional heat dissipation method shown in FIG.

FIG. 9 is a side view illustrating a case where a conventional heat sink cannot be installed.

[Explanation of symbols]

 9 IC Socket 10 IC Socket Main Body 11 Thermal Conductor 12 Multilayer Printed Circuit Board 14 Inner Layer Solid Conductor Foil 15 Metal Plates 16a, 16b Elastic Body 17 LSI

Claims (2)

[Claims] 1. An IC socket having a mechanism capable of radiating heat with a heat conductor composed of an elastic body having a high heat conductivity and a metal plate. 2. A multi-layer printed circuit board which is brought into contact with a heat conductor in the IC socket according to claim 1, wherein an inner solid conductor foil is exposed at a contact portion with the heat conductor. Printed board.