JPH05318992A - Woodgrained embossing plate, its manufacture, and woodgrained decorative sheet - Google Patents
Woodgrained embossing plate, its manufacture, and woodgrained decorative sheetInfo
- Publication number
- JPH05318992A JPH05318992A JP14876592A JP14876592A JPH05318992A JP H05318992 A JPH05318992 A JP H05318992A JP 14876592 A JP14876592 A JP 14876592A JP 14876592 A JP14876592 A JP 14876592A JP H05318992 A JPH05318992 A JP H05318992A
- Authority
- JP
- Japan
- Prior art keywords
- wood grain
- plate
- woodgrained
- embossing plate
- line group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004049 embossing Methods 0.000 title claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 64
- 239000002023 wood Substances 0.000 claims description 52
- 238000005530 etching Methods 0.000 claims description 12
- 238000010147 laser engraving Methods 0.000 claims description 9
- 238000010894 electron beam technology Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002657 fibrous material Substances 0.000 abstract description 4
- 230000000994 depressogenic effect Effects 0.000 abstract 4
- 238000000034 method Methods 0.000 description 16
- 239000010410 layer Substances 0.000 description 7
- 239000000835 fiber Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- -1 acryl Chemical group 0.000 description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- 241000218645 Cedrus Species 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
- B44C1/228—Removing surface-material, e.g. by engraving, by etching by laser radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
- B44C1/227—Removing surface-material, e.g. by engraving, by etching by etching
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Printing Methods (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は木目調エンボス版、該木
目調エンボス版の製造方法、及び該木目調エンボス版を
用いて製造した製品である化粧シート等のような木目調
化粧材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a woodgrain embossing plate, a method for producing the woodgrain embossing plate, and a woodgrain decorative material such as a decorative sheet which is a product manufactured using the woodgrain embossing plate.
【0002】[0002]
【従来の技術】建材や家具等の表面に貼着して天然の木
のような質感を与えるために、基材表面に天然の木の表
面の凹凸を形成したり木目の模様を印刷形成したシート
が木目調化粧シートとして広く用いられている。従来こ
の木目凹凸を有する木目調化粧シートの製造方法とし
て、木目化粧シートの表面凹凸に対応した凹凸を形成し
たエンボス版を用い、該エンボス版の凹凸形状を基材表
面に賦形して得る方法が知られている。2. Description of the Related Art In order to give a natural wood-like texture by sticking to the surface of building materials, furniture, etc., the surface of the base material is provided with irregularities on the surface of natural wood or a pattern of wood grain is formed by printing. The sheet is widely used as a woodgrain decorative sheet. Conventionally, as a method for producing a woodgrain decorative sheet having this wood grain unevenness, a method using an embossed plate formed with unevenness corresponding to the surface unevenness of the wood grain decorative sheet, and obtaining the uneven shape of the embossed plate on the surface of the base material It has been known.
【0003】この化粧材の意匠を天然の木目の調子によ
り近づけるため、例えばエンボス版の表面に天然の木目
の導管や年輪模様等の微細な凹凸形状を再現するのに、
天然木目を撮影した写真フィルム等を原版として用い、
エンボス版の版材の表面にレジスト層を形成した後該版
材にエッチングを施して凹凸模様を形成する方法が用い
られている。In order to bring the design of this decorative material closer to the tone of natural wood grain, for example, in order to reproduce fine irregularities such as natural wood grain conduits and annual ring patterns on the surface of the embossed plate,
Using photographic film, etc. that took natural wood grain as the original plate,
A method is used in which a resist layer is formed on the surface of a plate material of an embossed plate and then the plate material is etched to form an uneven pattern.
【0004】[0004]
【発明が解決しようとする課題】しかしながら上記従来
の方法でエンボス版を製造した場合、エッチング工程で
サイドエッチが発生するために、凹部の形状を所望の形
状に正確に形成するのが困難であり、細線部の微妙な表
現が出来ないという問題があった。また、そのような問
題を解消するために、エッチングを2段階に分けて行う
所謂2段階エッチングによる方法もあるが、エッチング
では深さ方向の形状を任意に制御できないため、木目の
繊維質をシャープに表現することは困難であった。従っ
て従来の木目調エンボス版は、木目の繊維質等がシャー
プに表現されたものがなく、また木目調化粧材において
も繊維質等の細線が十分表現されたものはなかった。However, when the embossing plate is manufactured by the above-mentioned conventional method, it is difficult to accurately form the concave shape into a desired shape because side etching occurs in the etching process. , There was a problem that it was not possible to delicately express the fine line part. In order to solve such a problem, there is a so-called two-step etching method in which the etching is divided into two steps. However, since the shape in the depth direction cannot be arbitrarily controlled by etching, the fiber quality of the wood grain is sharp. It was difficult to express. Therefore, in the conventional woodgrain embossed plate, there is no one in which the fiber quality of the wood grain is sharply expressed, and there is no one in which the fine line of the fiber quality is sufficiently expressed even in the woodgrain tone decorative material.
【0005】本発明は上記従来技術の欠点を解消するた
めになされたものであり、木目の繊維質をシャープに表
現した木目調エンボス版と該木目調エンボス版を容易に
得るための製造方法、及び、繊維質等の細部がシャープ
に表現された木目調化粧材を提供することを目的とす
る。The present invention has been made to solve the above-mentioned drawbacks of the prior art, and a wood grain embossing plate in which the fiber quality of wood grain is sharply expressed and a manufacturing method for easily obtaining the wood grain embossing plate, Another object of the present invention is to provide a woodgrain decorative material in which details such as fiber quality are sharply expressed.
【0006】[0006]
【課題を解決するための手段】本発明木目調エンボス版
は、凹部の巾が1〜50μm、凹部の間隔が1〜50μ
m、凹部の深さ0.5〜30μmの平行線群状溝を版材
表面に機械彫刻、レーザー彫刻、又は電子ビーム彫刻に
より全面又は部分的に設けた後、該版材の表面に天然木
目の持つ表面凹凸に対応する凹部を木目の流れ方向が上
記平行線群状溝の線方向となるように形成してなること
を特徴とする。In the woodgrain embossing plate of the present invention, the width of the recesses is 1 to 50 μm and the interval between the recesses is 1 to 50 μm.
m, and the parallel line group grooves having a depth of the recess of 0.5 to 30 μm are formed entirely or partially on the surface of the plate material by mechanical engraving, laser engraving, or electron beam engraving, and then natural wood grain is formed on the surface of the plate material. It is characterized in that the concave portions corresponding to the surface irregularities of are formed so that the flow direction of the wood grain is the line direction of the parallel line group grooves.
【0007】本発明木目調エンボス版の製造方法は、凹
部の巾が1〜50μm、凹部の間隔が1〜50μm、凹
部の深さ0.5〜30μmの平行線群状溝を版材表面に
機械彫刻、レーザー彫刻、又は電子ビーム彫刻により全
面又は部分的に設けた後、該版材の表面に天然木目の持
つ表面凹凸に対応する凹部をエッチングにより形成する
ことを特徴とする。In the method for producing a woodgrain embossing plate of the present invention, parallel line group grooves having a recess width of 1 to 50 μm, a recess interval of 1 to 50 μm and a recess depth of 0.5 to 30 μm are formed on the surface of the plate material. It is characterized in that after being provided entirely or partially by mechanical engraving, laser engraving, or electron beam engraving, recesses corresponding to the surface irregularities of the natural wood grain are formed on the surface of the plate material by etching.
【0008】本発明木目調化粧材は凹部の巾が1〜50
μm、凹部の間隔が1〜50μm、凹部の深さ0.5〜
30μmの平行線群状溝を版材表面に機械彫刻、レーザ
ー彫刻、又は電子ビーム彫刻により全面又は部分的に設
けた後、天然木目の持つ表面凹凸に対応する凹部を木目
の流れ方向が上記平行線群状溝の線方向となるように形
成してなるエンボス板を用い、該エンボス版の表面凹凸
形状に対応する凹凸を化粧材基材の表面に賦形してなる
ことを特徴とする。The wood grain decorative material of the present invention has a concave width of 1 to 50.
μm, the interval between the recesses is 1 to 50 μm, the depth of the recesses is 0.5 to
After forming parallel line group grooves of 30 μm on the surface of the plate material by mechanical engraving, laser engraving, or electron beam engraving, the concave portions corresponding to the surface irregularities of the natural grain are parallel to the flow direction of the grain. It is characterized in that an embossing plate formed so as to be in the line direction of the line group groove is used, and unevenness corresponding to the surface unevenness of the embossing plate is formed on the surface of the decorative material base material.
【0009】[0009]
【実施例】以下、図面に基き本発明を詳細に説明する。
図面は本発明の実施例を示し図1は本発明エンボス版の
製造方法の1例を示す説明図である。The present invention will be described in detail below with reference to the drawings.
The drawings show examples of the present invention, and FIG. 1 is an explanatory view showing an example of a method for producing an embossing plate of the present invention.
【0010】本発明エンボス版1は図1に示すように、
版材2の表面に凹部の巾Wが1〜50μm、凹部の間隔
Kが1〜50μm、凹部の深さDが0.5〜30μmの
平行線群状溝3〔同図(a)〕と、同図(c)に示すよ
うに上記平行線群状溝3の上から天然木目板の表面凹凸
に対応した凹部4が形成されているものである。The embossing plate 1 of the present invention is as shown in FIG.
On the surface of the plate material 2, parallel line group grooves 3 having a width W of the recesses of 1 to 50 μm, an interval K of the recesses of 1 to 50 μm and a depth D of the recesses of 0.5 to 30 μm [FIG. As shown in FIG. 3C, the recesses 4 corresponding to the surface irregularities of the natural wood grain board are formed on the parallel line group grooves 3.
【0011】本発明エンボス版1を製造するには、まず
平行線群状溝3を機械彫刻、電子ビーム彫刻、又はレー
ザー彫刻により形成する。機械彫刻の場合はバイトによ
る彫刻により行うことができ、バイトの材質はダイヤモ
ンド(金剛石)、特殊鋼等公知のものから選び、バイト
先端の形状は任意に選ぶことができる。バイトの断面形
状は、半円、半楕円、二等辺三角形等の形状が意匠的に
は好ましい。また機械彫刻は円筒の版材の場合には旋盤
による彫刻により行うことも可能である。また、レーザ
ー彫刻の場合は、集光されたレーザー光の発生する熱エ
ネルギーにより、版材2の所望の部分を蒸発させて行
う。レーザー光源としては、炭酸ガスレーザー、YAG
レーザー、ルビーレーザー等の高出力レーザーの中から
用途に応じ、適当な出力、種類を選ぶ。平行線群状溝を
彫刻するには、版材2を固定して集光されたレーザービ
ームを走査するか、又は、固定された集光レーザービー
ムに対して、版材2の方を移動させると(円筒版材の場
合は例えば軸の廻りに回転させつつ、軸方向に送る)、
〔図2(ア)〕の如き溝が彫刻される。To manufacture the embossing plate 1 of the present invention, first, the parallel line group grooves 3 are formed by mechanical engraving, electron beam engraving, or laser engraving. In the case of mechanical engraving, engraving with a cutting tool can be performed, and the material of the cutting tool can be selected from known materials such as diamond (gold stone) and special steel, and the shape of the tip of the cutting tool can be arbitrarily selected. The cross-sectional shape of the cutting tool is preferably a semicircle, a semi-ellipse, an isosceles triangle, or the like in terms of design. Further, in the case of a cylindrical plate material, mechanical engraving can be performed by engraving with a lathe. Further, in the case of laser engraving, a desired portion of the plate material 2 is evaporated by the thermal energy generated by the focused laser light. As the laser light source, carbon dioxide laser, YAG
Select an appropriate output and type from high-power lasers such as lasers and ruby lasers according to the application. To engrave the parallel line group grooves, the plate material 2 is fixed and the focused laser beam is scanned, or the plate material 2 is moved with respect to the fixed focused laser beam. And (in the case of a cylindrical plate material, for example, while rotating around the shaft, feed in the axial direction),
A groove as shown in FIG. 2A is engraved.
【0012】版材2は平板状又は円筒形状(シリンダー
状)のいずれでもよく、その材質は鉄、銅等の金属が用
いられる。また、中空鉄芯等の表面に銅メッキを施した
もの等も用いられる。The plate material 2 may have either a flat plate shape or a cylindrical shape (cylindrical shape), and the material thereof is a metal such as iron or copper. Further, a hollow iron core or the like whose surface is plated with copper may also be used.
【0013】図2は平行線群状溝の例を模式的に示す説
明図であり、平行線群状溝3は円筒状の版材を用いた場
合に、例えば同図(ア)に示すように例えばスパイラル
状の連続直線としてもよく、また、同図(イ)に示すよ
うに1円周につき1本の線となるように非連続の線群で
もいずれでもよい。FIG. 2 is an explanatory view schematically showing an example of parallel line group grooves, and the parallel line group grooves 3 when a cylindrical plate material is used, for example, as shown in FIG. For example, a spiral continuous straight line may be used, or a discontinuous line group may be formed so that one line is formed on one circumference as shown in FIG.
【0014】次いで、上記の平行線群状溝を形成した上
から木目板の表面凹凸に対応する凹凸部4を形成する。
尚、該版面上の凹部4は、最終製品である化粧材の凹凸
部と同形状で且つ逆凹凸とする。平行線群状溝3は図2
(ウ)に示すように、版面上において天然木目の凹凸に
対応した凸部4(即ち化粧材上では凹部に対応)の木目
の流れ方向Xに対して、該平行線群状溝3の線方向が、
同じ方向になるように形成する。本発明では、化粧材の
凸部に対応する版面上の凹部のみを光腐食方等で加工す
る。化粧材の凹部に対応する版面上の凸部は平行線群状
溝3を形成した状態である。Next, an uneven portion 4 corresponding to the uneven surface of the wood grain board is formed from above the parallel line group grooves.
The concave portions 4 on the plate surface have the same shape as the concave and convex portions of the final product, that is, the decorative material, and have reverse concave and convex portions. The parallel line group groove 3 is shown in FIG.
As shown in (c), the lines of the parallel-line group groove 3 with respect to the flow direction X of the convex portion 4 (that is, the concave portion on the decorative material) corresponding to the irregularities of the natural wood grain on the plate surface. Direction
Form so that they are in the same direction. In the present invention, only the concave portion on the plate surface corresponding to the convex portion of the decorative material is processed by the photo-corrosion method or the like. The convex portion on the plate surface corresponding to the concave portion of the decorative material is in a state where the parallel line group grooves 3 are formed.
【0015】この版面上の凸部4として例えば次のよう
なものがある。導管溝、浮造り加工により年輪のう
ち固い秋部材を凸部として残し、柔らかい春材部を研磨
して凹部とした浮造り木目板の表面凹凸の春材部、そ
の他。The convex portions 4 on the plate surface include, for example, the following. Conduit groove, spring material with uneven surface of floating wood grain board, which leaves hard autumn parts of annual rings as convex parts by polishing process, and soft spring parts are made into concave parts.
【0016】また上記天然木目の凸部に対応すべき版面
上の凹部4を形成する方法としては次のような手段が挙
げられる。 1)版面上の凹凸の凹部形状部分のみを写真原版として
抽出し(印写工学処理、手作業による修正、デジタル画
像処理等の公知の写真製版方法による)、版材表面に公
知の光腐食法で凹部を設ける方法 2)シリコン樹脂等により天然木目板の表面凹凸形状を
型取りし、該型を基に電鋳法でミルを作り、該ミルを用
いて平行線群溝を表面に形成した版材表面にミル加工で
凹部を形成する公知の電鋳ミル法 3)その他As a method of forming the concave portion 4 on the plate surface which should correspond to the convex portion of the natural wood grain, the following means can be mentioned. 1) Extracting only the concave-concave-shaped portion on the plate surface as a photographic original plate (by a known photoengraving method such as printing engineering processing, manual correction, digital image processing), and a known photocorrosion method on the surface of the plate material. 2) A concave part is formed on the surface of the natural wood grain board with a silicone resin or the like, a mill is formed by electroforming based on the mold, and parallel line group grooves are formed on the surface using the mill. A well-known electroforming mill method for forming recesses on the surface of a plate material by milling 3) Others
【0017】図1には上記1)の光腐食法の例を示し
た。これは同図(b)に示すように、レジスト層5を形
成し、エッチングにより点線部分6を除去してレジスト
層5を剥離して木目調エンボス版1が得られる〔同図
(c)〕。このように平行線群状溝3の形成された版材
の表面に木目板の表面凹凸が形成された木目調エンボス
版はそのままの状態で用いることができるが、さらに表
面に保護層としてクロムメッキ等を施してメッキ層を形
成してもよい。FIG. 1 shows an example of the photocorrosion method of 1) above. As shown in FIG. 4B, a resist layer 5 is formed, the dotted line portion 6 is removed by etching, and the resist layer 5 is peeled off to obtain a woodgrain embossing plate 1 [FIG. .. The wood grain embossing plate in which the surface unevenness of the wood grain board is formed on the surface of the plate material in which the parallel line group grooves 3 are formed can be used as it is, and the surface is further plated with chrome as a protective layer. Etc. may be applied to form the plating layer.
【0018】図3は本発明エンボス版を用いて製造した
化粧材の1例を示す要部断面図である。本発明木目調化
粧材10は前述の木目調エンボス版を用いて、図3に示
すように化粧材基材11の表面に上記エンボス版の表面
形状を賦形して、木目板の凹凸模様13が形成されてい
るものである。FIG. 3 is a cross-sectional view of an essential part showing an example of a decorative material manufactured using the embossing plate of the present invention. The wood grain decorative material 10 of the present invention uses the above-mentioned wood grain embossing plate to shape the surface shape of the embossing plate on the surface of the decorative material substrate 11 as shown in FIG. Are formed.
【0019】化粧材基材の表面にエンボス版の表面凹凸
形状に対応する凹凸形状を形成する手段としては、公知
のエンボス加工が用いられる。これは化粧材基材11の
表面に熱や圧力によりエンボス版の凹凸形状を賦形する
方法であり、平板プレス、ロールエンボス機等のプレス
エンボス機を用いる。ロールエンボス法は、円筒状のエ
ンボス版の凹凸を熱圧で賦形する。材料の加熱加圧条件
は基材の熱圧的挙動により異なるが、通常の熱可塑性樹
脂の場合、軟化点又は熱変形温度と融点又は熔融温度と
の間の適当な温度に加熱し、エンボス版を押圧して賦形
し、冷却して形状を固定する。加熱方式としては赤外線
照射、温風吹付、加熱ローラからの熱伝導、誘電加熱等
公知の方法を用いる。Well-known embossing is used as a means for forming an uneven shape corresponding to the surface uneven shape of the embossing plate on the surface of the decorative material substrate. This is a method of forming an uneven shape of an embossing plate on the surface of the decorative material base material 11 by heat or pressure, and a press embossing machine such as a flat plate press or a roll embossing machine is used. In the roll embossing method, the unevenness of a cylindrical embossing plate is shaped by heat and pressure. The heating and pressurizing conditions of the material differ depending on the thermocompressive behavior of the substrate, but in the case of ordinary thermoplastic resins, the embossing plate is heated to an appropriate temperature between the softening point or heat distortion temperature and the melting point or melting temperature. Press to shape and then cool to fix the shape. As a heating method, known methods such as infrared irradiation, warm air blowing, heat conduction from a heating roller, and dielectric heating are used.
【0020】また本発明木目調化粧材は、図3に示すよ
うに印刷模様14を設けたり、他の基材12等に化粧材
基材を貼り合せて形成してもよい。The wood grain decorative material of the present invention may be formed by providing a printed pattern 14 as shown in FIG. 3 or by bonding a decorative material base material to another base material 12 or the like.
【0021】上記化粧材基材としては、ボリ塩化ビニ
ル、アクリル、ポリプロピレン、ABS、ポリスチレン
等の熱可塑性樹脂や熱硬化性樹脂含浸紙等がある。Examples of the base material for the decorative material include thermoplastic resin such as polyvinyl chloride, acryl, polypropylene, ABS, polystyrene, and thermosetting resin-impregnated paper.
【0022】上記含浸紙の熱硬化性樹脂としてはメラミ
ン樹脂、ジアリルフタレート樹脂、グアナミン樹脂、ポ
リエステル樹脂、フェノール樹脂等が使用される。加工
方法は例えばジアリルフタレート樹脂含浸紙を使用する
場合には、板状基材の上に熱硬化性樹脂含浸紙を順次積
み重ね、140〜150℃、15kg/cm2 、及び10分
程度の条件で加熱圧締して製造する。As the thermosetting resin for the impregnated paper, melamine resin, diallyl phthalate resin, guanamine resin, polyester resin, phenol resin and the like are used. The processing method is, for example, when diallyl phthalate resin-impregnated paper is used, the thermosetting resin-impregnated paper is sequentially stacked on the plate-shaped substrate, and the conditions are 140 to 150 ° C., 15 kg / cm 2 , and about 10 minutes. It is manufactured by heating and pressing.
【0023】次に本発明の具体的実施例を挙げ、本発明
を更に詳細に説明する。 〔実施例1〕まず、円筒鉄芯の表面に厚さ3m/m の銅メ
ッキ層が施された円周620m/m のシリンダーロールの
表面に、スパイラル状の並行線群状溝を機械彫刻で60
μm間隔に設けた。尚、平行線群状溝は図1に示すよう
な断面半円状で、D=20μm、W=40μm、K=2
0μmであった。次いで、上記のスパイラル状の並行線
群状溝が形成されたシリンダーロールの表面全面にネガ
型感光性レジスト層を塗布形成した後、浮造杉木目板模
様のエッチングチ用柄写真原版(年輪模様の秋材部が遮
光部)を露光焼き付けし現像し、秋材部以外を全て、レ
ジスト被覆した後、塩化第2鉄により100μmの深さ
まで腐食させエッチング処理を行いレジスト層を除去
し、さらに表面に保護層として6μm厚みにクロムメッ
キを施し木目調エンボス版を得た。Next, the present invention will be described in more detail with reference to specific examples of the present invention. [Example 1] First, a spiral parallel line-shaped groove was machine-engraved on the surface of a cylinder roll having a circumference of 620 m / m in which a copper plating layer having a thickness of 3 m / m was applied to the surface of a cylindrical iron core. 60
It was provided at intervals of μm. The parallel-line group groove has a semicircular cross section as shown in FIG. 1, and D = 20 μm, W = 40 μm, K = 2.
It was 0 μm. Next, after coating and forming a negative photosensitive resist layer on the entire surface of the cylinder roll in which the spiral parallel line group grooves are formed, a pattern photo master plate for etching of a floating cedar wood grain pattern (annual ring pattern The autumn material part is exposed to light and developed, and all the parts except the autumn material part are coated with resist, and then etched with ferric chloride to a depth of 100 μm for etching to remove the resist layer and further to the surface. As a protective layer, chromium plating was applied to a thickness of 6 μm to obtain a wood grain embossing plate.
【0024】〔実施例2〕表面に木目柄をグラビア印刷
にて設けた厚み0.1m/m の着色塩化ビニルシート(理
研ビニル工業:W−500)に、透明塩化ビニルシート
(理研ビニル工業:W−500)を積層し実施例1の木
目調エンボス版を用いてダブリングエンボスを行い、表
面に木目凹凸を形成した後、凹部へワイピング加工を行
い木目調化粧シートを得た。得られた木目調化粧シート
は、木目の繊維質等の細線部までもがシャープに表現さ
れたリアルな木目の凹凸が表現されたものであった。[Example 2] A colored vinyl chloride sheet (Riken Vinyl Industry: W-500) having a thickness of 0.1 m / m and having a wood grain pattern formed by gravure printing on a surface, and a transparent vinyl chloride sheet (Riken Vinyl Industry: W-500) was laminated and doubling embossing was performed using the wood grain embossing plate of Example 1 to form wood grain unevenness on the surface, and then wiping processing was performed on the recessed portion to obtain a wood grain decorative sheet. The obtained woodgrain decorative sheet had realistic wood grain unevenness in which even fine line parts such as fiber of wood grain were sharply expressed.
【0025】[0025]
【発明の効果】以上説明したように本発明木目調エンボ
ス版は、細い平行線群状溝の凹部を機械彫刻、レーザー
彫刻、又は電子ビーム彫刻で形成した後、天然木目に対
応した凹部が木目の流れ方向が上記平行線群状溝の線方
向に設けた構成を採用したことにより、木目の繊維質等
が平行線群状溝で表現され、細い線部がシャープに表現
される。また本発明木目調エンボス版の製造方法によれ
ば、上記の細線部までシャープに表現されたエンボス版
を容易且つ確実に製造することができる。特に従来の2
段エッチング法等に比べ細線部がサイドエッチにより潰
れたりすることなく、微細な表現が可能である。本発明
木目調化粧材は、木目の繊維質等の細線部がシャープに
表現されリアルな木目の質感を持つものであり意匠的に
優れたものである。As described above, in the wood grain embossing plate of the present invention, the concave portions of the thin parallel line group grooves are formed by mechanical engraving, laser engraving, or electron beam engraving, and then the concave portions corresponding to the natural grain are formed. By adopting a configuration in which the flow direction of (3) is provided in the line direction of the parallel line group groove, the fiber material of the wood grain is expressed by the parallel line group groove, and the thin line portion is sharply expressed. Further, according to the method for manufacturing a woodgrain embossing plate of the present invention, it is possible to easily and reliably manufacture the embossing plate in which even the fine line portion is sharply expressed. Especially the conventional 2
Compared with the step etching method, the fine line portion can be expressed finely without being crushed by the side etching. INDUSTRIAL APPLICABILITY The wood grain decorative material of the present invention is excellent in design because the fine line portion such as the fiber material of the wood grain is sharply expressed and has a realistic texture of the wood grain.
【図1】本発明木目調エンボス版の製造方法の1例を示
す説明図である。FIG. 1 is an explanatory view showing an example of a method for producing a woodgrain embossing plate of the present invention.
【図2】平行線群状溝を模式的に示したエンボス版の態
様を示す説明図である。FIG. 2 is an explanatory diagram showing an aspect of an embossing plate that schematically shows parallel line group grooves.
【図3】本発明木目調化粧材の1例を示す要部断面図で
ある。FIG. 3 is a sectional view of an essential part showing an example of a wood grain decorative material of the present invention.
1:木目調エンボス版 2:版材 3:平行線群状溝 4:天然木目の凹凸に対応した凹部 10:木目調化粧材 11:化粧材基材 13:エンボス版の表面形状を賦形してなる木目の凹凸
模様1: Wood grain embossing plate 2: Plate material 3: Parallel line group grooves 4: Recesses corresponding to unevenness of natural wood grain 10: Wood grain decorative material 11: Decorative material base material 13: Embossed plate surface shape Uneven pattern of wood grain
Claims (3)
〜50μm、凹部の深さ0.5〜30μmの平行線群状
溝を版材表面に機械彫刻、レーザー彫刻、又は電子ビー
ム彫刻により全面又は部分的に設けた後、該版材の表面
に天然木目の持つ表面凹凸に対応する凹部を木目の流れ
方向が上記平行線群状溝の線方向となるように形成して
なることを特徴とする木目調エンボス板。1. The width of the recesses is 1 to 50 μm, and the interval between the recesses is 1.
After forming parallel line group grooves having a depth of ˜50 μm and a recess depth of 0.5 to 30 μm on the surface of the plate material by mechanical engraving, laser engraving, or electron beam engraving, the surface of the plate material is natural. A wood grain embossing plate, characterized in that recesses corresponding to the surface irregularities of the wood grain are formed such that the flow direction of the wood grain is the line direction of the parallel line group grooves.
〜50μm、凹部の深さ0.5〜30μmの平行線群状
溝を版材表面に機械彫刻、レーザー彫刻、又は電子ビー
ム彫刻により全面又は部分的に設けた後、該版材の表面
に天然木目の持つ表面凹凸に対応する凹部をエッチング
により形成することを特徴とする木目調エンボス版の製
造方法。2. The width of the recesses is 1 to 50 μm, and the interval between the recesses is 1.
After forming parallel line group grooves having a depth of ˜50 μm and a recess depth of 0.5 to 30 μm on the surface of the plate material by mechanical engraving, laser engraving, or electron beam engraving, the surface of the plate material is natural. A method for producing a woodgrain embossing plate, characterized in that a concave portion corresponding to the surface unevenness of the wood grain is formed by etching.
〜50μm、凹部の深さ0.5〜30μmの平行線群状
溝を版材表面に機械彫刻、レーザー彫刻、又は電子ビー
ム彫刻により全面又は部分的に設けた後、天然木目の持
つ表面凹凸に対応する凹部を木目の流れ方向が上記平行
線群状溝の線方向となるように形成してなるエンボス板
を用い、該エンボス版の表面凹凸形状に対応する凹凸を
化粧材基材の表面に賦形してなることを特徴とする木目
調化粧材。3. The width of the recesses is 1 to 50 μm, and the interval between the recesses is 1.
〜50μm, 0.5 ~ 30μm deep recessed parallel line group groove on the surface of the plate material by mechanical engraving, laser engraving, or electron beam engraving on the whole or part, then the surface irregularities of the natural wood grain Using an embossing plate formed by forming the corresponding recesses so that the flow direction of the wood grain is the line direction of the parallel line group-like groove, the unevenness corresponding to the surface unevenness of the embossing plate is formed on the surface of the decorative material substrate. A wood grain decorative material characterized by being shaped.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14876592A JPH05318992A (en) | 1992-05-15 | 1992-05-15 | Woodgrained embossing plate, its manufacture, and woodgrained decorative sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14876592A JPH05318992A (en) | 1992-05-15 | 1992-05-15 | Woodgrained embossing plate, its manufacture, and woodgrained decorative sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05318992A true JPH05318992A (en) | 1993-12-03 |
Family
ID=15460152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14876592A Pending JPH05318992A (en) | 1992-05-15 | 1992-05-15 | Woodgrained embossing plate, its manufacture, and woodgrained decorative sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05318992A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2343169A2 (en) * | 2005-02-23 | 2011-07-13 | Flooring Industries Ltd. | Method for manufacturing floor panels and equipment for processing board-shaped laminate materials |
US20120305179A1 (en) * | 2009-12-28 | 2012-12-06 | Fujikura Ltd. | Mold and manufacturing method therefor |
US20130230693A1 (en) * | 2010-12-07 | 2013-09-05 | Mitsubishi Gas Chemical Company, Inc. | Polyamide resin films and processes for manufacturing them |
US8846159B2 (en) | 2004-11-25 | 2014-09-30 | Samsung Electronics Co., Ltd. | Mold for fabricating barrier rib and method of fabricating two-layered barrier rib using same |
JP2019043086A (en) * | 2017-09-06 | 2019-03-22 | 大日本印刷株式会社 | Decorative sheet |
-
1992
- 1992-05-15 JP JP14876592A patent/JPH05318992A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8846159B2 (en) | 2004-11-25 | 2014-09-30 | Samsung Electronics Co., Ltd. | Mold for fabricating barrier rib and method of fabricating two-layered barrier rib using same |
EP2343169A2 (en) * | 2005-02-23 | 2011-07-13 | Flooring Industries Ltd. | Method for manufacturing floor panels and equipment for processing board-shaped laminate materials |
US20120305179A1 (en) * | 2009-12-28 | 2012-12-06 | Fujikura Ltd. | Mold and manufacturing method therefor |
US8894892B2 (en) | 2009-12-28 | 2014-11-25 | Fujikura Ltd. | Mold and manufacturing method therefor |
US20130230693A1 (en) * | 2010-12-07 | 2013-09-05 | Mitsubishi Gas Chemical Company, Inc. | Polyamide resin films and processes for manufacturing them |
US10100162B2 (en) * | 2010-12-07 | 2018-10-16 | Mitsubishi Gas Chemical Company, Inc. | Polyamide resin films and processes for manufacturing them |
JP2019043086A (en) * | 2017-09-06 | 2019-03-22 | 大日本印刷株式会社 | Decorative sheet |
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