JPH05315653A - Matrix display board - Google Patents

Abstract

PURPOSE:To provide a matrix display board which improves reliability on connection and reduces the cost and besides is excellent in heat radiation property by using a matrix circuit board without a through hole. CONSTITUTION:This is a matrix display board where anode circuits 3 and 4 and cathode circuits 4 and 3 are formed in orthogonal directions and besides, with either or both of them cut at the crossing of both, at one side of the printed board 2 and the cut section is connected by the three-dimensional crossing using the metallic frame of a light emitting diode lamp.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a matrix display plate in which light emitting diode (hereinafter referred to as LED) lamps are arranged in a dot matrix form and characters, symbols, figures and the like are displayed on a display screen.

[0002]

2. Description of the Related Art Conventionally, as this type of display plate, as shown in FIG. 6, one in which a pin insertion type LED lamp is mounted on a through hole substrate is known. In this, the LED bare chip 8 is mounted on the metal frame 14-1 by using a metal paste, and the LED bare chip 8 and the metal frame 14-2 are mounted.
After connecting and with the metal wire 10, both terminals are entirely sealed with the light-transmissive resin 11 and molded into a lamp having a desired shape, and the metal frame 13 is pulled out from the resin and attached to the through-hole substrate 15. The pin-insertion type LED lamp 17 having the structure of the electrode is mounted on the through-hole substrate 15 in a matrix.

In this case, in order to prevent the anode side wiring and the cathode side wiring from intersecting with each other on the plane of the through hole substrate, the anode side wiring and the cathode side wiring are separately provided on both surfaces of the through hole substrate 15. The pin insertion type LED lamp 17 is connected to the through hole substrate 15 by forming a pattern and inserting the metal frame 14 into the pin insertion through hole 16.

However, as described above, in the conventional matrix display panel, a through hole substrate is required to arrange the LED lamps in a dot matrix shape. In the case of connection by through holes, especially when the number of mounted LED lamps is large, the connection reliability is reduced, the number of processes such as through hole processing and through hole plating is increased, and the cost is high. Therefore, one side cannot be used as a drive circuit or the like, and even if it is desired to efficiently dissipate the heat generated from the LED bare chip to the through-hole substrate (matrix circuit substrate), a metal substrate or a ceramic substrate with good heat dissipation is required. There was a problem that it was difficult to process through holes.

[0005]

SUMMARY OF THE INVENTION An object of the present invention is to meet the above-mentioned demand, and a matrix using a metal substrate or a ceramic substrate having good heat dissipation as a matrix circuit substrate without providing through holes or jumper circuits. To provide a display board.

[0006]

That is, according to the present invention, the anode circuit 3 (or 4) and the cathode circuit 4 (or 3) are arranged on one surface of the printed circuit board 2 in the orthogonal direction and at the intersection of the two. The matrix display panel is characterized in that one or both of them are cut into pieces, and the cut portions are connected by a three-dimensional intersection using a metal frame 9 of a light emitting diode lamp.

The present invention will be described below in detail with reference to the drawings showing an example of an embodiment.

FIGS. 1 and 2 are plan views in which a part of the display is omitted for explaining the matrix circuit board used in the present invention. FIG. 1 is a matrix circuit board for mounting a single color light emitting LED lamp, and FIG. 2 is a two color light emitting LED.
It is a matrix circuit board for mounting a lamp.

In FIGS. 1 and 2, an anode circuit 3 (or 4) and a cathode circuit 4 (or 3) are cut on one surface of a printed circuit board 2 in the orthogonal direction, and either or both of them are cut at an intersection of the two. It shows that both circuits are insulated by the insulator 5 so that both circuits are not short-circuited at the intersection. For convenience of explanation, FIG.
2 and FIG. 2 are described by omitting a part of the display.

On the matrix circuit board 1 for mounting a single color light emitting LED lamp, for example, the surface mounting single color light emitting LED lamp 7 or the electrode bending type single color light emitting LED lamp 12 having a structure as shown in FIG. 3 or 4 is provided. A continuous circuit is formed by connecting and mounting the cut parts using the metal frame 9. In this case,
Since the insulating material 5 is applied to the intersection, the circuit 4 and the metal frame 9 are not short-circuited. In this structure, the heat generated from the LED bare chip 8 propagates through the metal frame 9 and is radiated to the single-color LED lamp mounting matrix circuit board 1 in the shortest distance. A substrate or the like can be used.

On the other hand, in order to mount the two-color LED lamp on the matrix circuit board 6 for mounting the two-color LED lamp, for example, a commercially available pin insertion type two-color LED lamp is obtained, and the metal frame 9 is bent. This can be carried out by processing into a shape shown in FIG. 5 to produce a surface-mounting processed product 13 of a pin insertion type two-color light emitting LED lamp, and using the bent portion as an electrode to connect the cut portions. In this case, the intersection is covered with the insulator 5 so that the circuit 4 and the metal frame 9 are not short-circuited.
Electrode bending type monochromatic light emission for surface mounting L as shown in FIG.
When the ED lamp 12 is used, the circuit 4 and the metal frame 9 can be mounted without being short-circuited without being covered with the insulator 5.

Examples of the printed circuit board 2 used in the present invention include a normal glass epoxy substrate, a paper phenolic substrate, a composite substrate and the like. Among them, a substrate based on aluminum generates heat generated from the LED bare chip 8. Is preferable because it can efficiently dissipate heat. Further, as the insulator 5, an epoxy resin, a phenol resin, a polyimide resin or the like which is usually used as a resist insulating material is used, and further, the light transmissive resin 11 is light transmissive and can be heated or exposed to ultraviolet rays or the like. There is no limitation as long as it cures, but an epoxy resin is preferable.

[0013]

EXAMPLES The present invention will be described in more detail with reference to Examples and Comparative Examples. Example 1 A commercially available pin insertion type two-color light emitting LED lamp (trade name "VRPY5315S" manufactured by Stanley Co., Ltd.) was obtained, and the three metal frames 9 and the metal frame 9-1 on which the LED bare chip 8 is mounted and the LED. After bending the metal frames 9-2 and 9-3 on which bare chips are not mounted to form electrodes, the legs of the metal frame 9-1 are cut to 3 mm and the legs of the metal frames 9-2 and 9-3 are cut to 6 mm. Fig. 5
A processed product 13 for surface mounting of the pin insertion type two-color LED lamp shown in FIG.

Next, as shown in FIG. 2, an anode circuit 3 is provided on one side of a commercially available printed circuit board 2 (trade name "HITT plate" manufactured by Denki Kagaku Kogyo KK) having a thickness of 1.5 mm and made of aluminum as a base material. The cathode circuit 4 and the cathode circuit 4 are formed by cutting the copper foil by cutting the anode circuit 3 in the orthogonal direction and at the intersections of the two, and the intersections are made thick by the insulator 5 (product name "CR10G" manufactured by Asahi Kaken Co., Ltd.). 20 μm coated, 6 mm pitch, 16 rows vertically, 16 rows horizontally
Two-color light-emitting LEDs for mounting surface-mounted processed products 14 of a total of 256 pin-insertion-type two-color light-emitting LED lamps
A matrix circuit board 6 for mounting a lamp was produced.

Then, a solder paste is applied by printing to a portion of the matrix circuit board 6 for mounting the two-color light emitting LED lamp, to which the metal frame 9 of the surface-mounting processed product 13 of the pin insertion type two-color light emitting LED lamp is connected. After that, the surface-mounted processed product 13 of the pin insertion type two-color light emitting LED lamp is heated to 300 ° C. while being conveyed by solder reflow, and the cut anode circuit is connected by the bent metal frame 9 to form a matrix display. A plate was made.

A voltage of 3 V is continuously applied to the obtained matrix display panel, and the temperature rise of the surface of the surface-mounting processed product 13 of the pin insertion type two-color LED lamp is changed by changing the current and the non-contact radiation type. It was measured by a thermometer. The result is shown by the curve A in FIG. From FIG. 7, LEDs with increasing current
The surface temperature of the lamp did not rise and good heat dissipation was shown.

Example 2 A set of metal frames 9-1 and 9-2 having a shape shown in FIG. 3 was prepared from a copper plate having a thickness of 0.5 mm, and the metal frames 9-1 and 9-2 were arranged at a constant pitch by die punching. After 2 μm
Ni plating and 0.5 μm silver plating were applied. Then, the LED bare chip 8 is mounted on the metal frame 9-1 by heating with silver paste (trade name “T-3007” manufactured by Sumitomo Metal Industries, Ltd.) at a temperature of 150 ° C. for 30 minutes, and the metal wire 10 made of gold having a diameter of 50 μm is mounted. It was wire-bonded and connected to the metal frame 9-2.

Next, the light transmissive resin 11 (trade name "Stycast 1253" manufactured by Grace Japan Co., Ltd.) is poured into a fluororesin mold having a semi-spherical tip, and then LE is used.
Insert the metal frame on which the D bare chip is mounted with the LED bare chip facing down, degas in vacuum, and then at a temperature of 120 ° C for 16
The resin was cured by heating for a period of time.

Thereafter, the metal frame was taken out from the fluororesin mold to obtain a surface-mounting LED lamp 7, which was mounted on the matrix circuit board 1 for mounting a single-color LED lamp shown in FIG. A display board was produced. With respect to the obtained matrix display plate, the temperature rise of the surface of the surface mounting LED lamp 7 was measured in the same manner as in Example 1. As a result, as shown by the curve B in FIG. 7, the surface temperature of the LED lamp 7 did not rise and the heat dissipation was good.

Comparative Example 1 A commercially available glass epoxy substrate having a thickness of 1.6 mm was used as the through hole substrate 15, and a glass epoxy substrate having a pitch of 6 mm and a length of 16 mm was used.
Anode wiring was formed on one surface of the through-hole substrate 15 and cathode wiring was formed on the other surface so that a total of 256 pin insertion type LED lamps 17 in rows and 16 rows could be mounted. Next, the pin insertion type LED lamp 17 (trade name "AY3403S" manufactured by Stanley Co., Ltd.) was mounted on the through hole substrate 15 using the pin insertion through hole 16 to manufacture a matrix display plate as shown in FIG.
When the temperature rise of the surface of the LED lamp 17 was measured in the same manner as in Example 1, it was higher than those in Examples 1 and 2 as shown by the curve C in FIG. 7.

[0021]

According to the present invention, since it is possible to use a matrix circuit board having no through holes, it is possible to improve the connection reliability and reduce the cost. Since a metal substrate made of aluminum or the like or a ceramic substrate made of alumina or the like, which has good properties, can be used, the heat dissipation characteristics are excellent.

[Brief description of drawings]

FIG. 1 is an example of a matrix circuit board for mounting a single-color LED lamp used in the present invention, and is a plan view with a part of the display omitted.

FIG. 2 is a plan view showing an example of a matrix circuit board for mounting a two-color light emitting LED lamp used in the present invention, in which a part of the display is omitted.

FIG. 3 is a schematic diagram of a surface-mount monochromatic light-emitting LE used in the present invention.
It is an example of a D lamp, (1) is a top view and (2) is a front view.

FIG. 4 is an example of an electrode folding type surface-mounting single-color LED lamp used in the present invention, where (1) is a plan view, (2) is a front view, and (3) is a side view.

FIG. 5 is a pin insertion type two-color light emitting LE used in the present invention.
It is an example of a surface mounted processed product of a D lamp, (1) is a plan view and (2) is a front view.

FIG. 6 is a front view of a conventional pin insertion type LED lamp mounted on a through hole substrate.

FIG. 7 is a diagram showing the relationship between the current and the temperature rise on the surface of the LED lamp.

[Explanation of symbols]

1 matrix circuit board for mounting monochromatic LED lamp 2 printed circuit board 3 anode circuit (or cathode circuit) 4 cathode circuit (or anode circuit) 5 insulator 6 matrix circuit board for mounting bicolor LED lamp 7 monochromatic LED for surface mounting Lamp 8 LED bare chip 9 Metal frame for LED lamp for surface mounting 9-1 Metal frame with LED bare chip 9-2 Metal frame without LED bare chip 9-3 Metal frame without LED bare chip 10 Metal wire 11 Light-transmissive resin 12 Electrode bending type monochromatic LED lamp for surface mounting Surface processed product of 13-pin insertion type bi-color LED lamp 14 Metal frame of 14-pin insertion type LED lamp 14-1 LED bare chip is mounted Metal frame 14-2 LED bare Metal frame 15 without through-hole mounted 15 through hole substrate 16 pin insertion through hole 17 pin insertion type LED lamp A A curve showing the result of Example 1 B Curve C showing the result of Example 2 The result of Comparative Example 1 Curve

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shinichiro Asai 3-5-1, Asahimachi, Machida, Tokyo Denka Kagaku Kogyo Co., Ltd.

Claims (2)

[Claims] 1. An anode circuit (3 or 4) and a cathode circuit (4 or 3) are formed on one surface of a printed circuit board (2) in a direction orthogonal to each other and one or both of them are cut off at an intersection of the two. The matrix display panel is characterized in that the cut portions are connected by a three-dimensional intersection using a metal frame (9) of a light emitting diode lamp. 2. The matrix display panel according to claim 1, wherein the printed circuit board (2) is made of an aluminum-based metal substrate.