JPH05311479A - Formation of resin coating film - Google Patents

Abstract

(57) [Abstract] [Purpose] When forming an independent pattern such as a pattern or letters on the surface of a transfer target, pick up ultraviolet ray or electron beam curable resin from the intaglio with a silicon pad for transfer printing. The curable resin is transferred to the transferred body with high accuracy and reliability. [Structure] In a state where an uncured ultraviolet ray or electron beam curable resin 8 is brought into contact with the pad surface of the transfer printing silicon pad 5, the curable resin 8 is exposed to ultraviolet rays or electrons from the contact surface side of the silicon pad 5. Irradiate a ray to semi-cure. Next, the curable resin 8 is transferred to the surface of the transfer target with the silicon pad 5. After the transfer, the curable resin 8 is completely cured by irradiation with ultraviolet rays or electron beams.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the formation of an independent pattern body such as a pattern or a character with a resin coating film on the surface of a transferred material, using a transfer silicon pad for the surface of the transferred material. The present invention relates to a method for transferring a coating film with high accuracy, easily and surely.

[0002]

2. Description of the Related Art For example, FIG. 6 shows a conventional process for producing a dome-shaped mesh outer blade for an electric razor by an electroforming method. First, as shown in FIG. The ultraviolet curable resin 8 is uniformly applied to the surface of the base material 1. Then, as shown in FIG. 6 (b), a shadow mask 16 is placed on the curable resin 8 and subjected to baking and development processes to form an electric insulating film 4 of the curable resin 8 (FIG. 6 (c)). reference). The electroformed base material 1 on which the electric insulating film 4 is formed is drawn by a press to form a predetermined dome-shaped electroformed base die 2 as shown in FIG. 6 (d). Then, Fig. 6
As shown in (e), a primary electrodeposition layer 9 having a substantially arcuate cross section is formed on the surface of the electroforming mold 2 which is not covered with the electrical insulating film 4, and a release layer is formed on the surface of the primary electrodeposition layer 9. After forming, the secondary electrodeposition is performed to form the secondary electrodeposition layer 11 which becomes the mesh outer blade (see FIG. 6 (f)). Finally, the secondary electrodeposition layer 11 is peeled off to have a hair introducing hole 13 as shown in FIG. 2 and a continuous rib 14 having an inverted dish-shaped cross section surrounding the hair introducing hole 13 and having a counter sink 15 formed on the lower surface. The dome-shaped mesh-shaped outer blade 12 was obtained.

[0003]

The problem here is that after forming the electrical insulating film 4 on the flat plate-shaped electroformed base material 1, the base material 1 is drawn to form the dome-shaped electroformed base material 2. It is a point to do. That is, in this drawing process, the electrically insulating film 4 cannot be fully extended at a portion such as the shoulder portion A of the electroformed mother die 2 where the elongation is remarkable, so that the electrically insulating film 4 is peeled off, flaws, pinholes, etc. at the corresponding portions. Is generated, which adversely affects the formation of the electrodeposition layer, and product defects continue. From this point of view, it is an object of the present invention to eliminate defects such as peeling, scratches, and pinholes of the electrical insulating film during the manufacturing process of the dome-shaped mesh outer blade and the like.

[0004]

According to the method for forming a resin coating film of the present invention, an uncured ultraviolet ray or electron beam curable resin 8 is brought into contact with the pad surface of a transfer printing silicon pad 5. A step of semi-curing the curable resin 8 by irradiating it with ultraviolet rays or an electron beam from the contact surface side of the silicon pad 5, and a step of transferring the curable resin 8 to the surface of the transfer target by the silicon pad 5. The subsequent step is to irradiate ultraviolet rays or electron beams to completely cure the curable resin 8.

[0005]

According to the method of the present invention as described above,
Since the electroformed mother die 2 is formed into a dome shape, and the electrically insulating film 4 made of ultraviolet ray or electron beam curable resin is formed on the convex surface of the mother die 2, the electrically insulating film 4 is formed on the flat base material 1. Unlike the conventional method of forming and then drawing into a dome shape,
It is possible to completely prevent the electric insulating film 4 from being peeled off and causing scratches and pinholes. Further, since the transfer printing silicon pad 5 is used in forming the electric insulating film 4, the electric insulating film 4 can be easily and surely transferred and formed on the surface of the electroformed mold 2 even if the surface is convex. Have.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. First, a flat plate-shaped base material 1 shown in FIG. 1A is prepared, and this is drawn as shown in FIG. 1B to form a predetermined dome-shaped base mold 2. Figure 1
As shown in (c), an electric insulating film 4 made of an ultraviolet curable resin is formed on a portion (pattern) corresponding to the hair introduction hole 13 of the mesh-shaped outer blade 12 on the convex surface of the electroformed mold 2.

To form the electric insulating film 4, a transfer printing silicon pad 5 is used. At this time, as shown in FIG. 3, an intaglio plate 6 made of a quenching material such as SKD (alloy tool steel) is used.
A concave portion 7 matching the pattern is formed by etching or the like, and the concave portion 7 is filled with an ultraviolet curable resin 8. The silicon pad 5 is pressed onto the intaglio plate 6 as shown in FIG. The resin 8 is placed on the silicon pad 5 (see FIG. 5).

After that, the ultraviolet curable resin 8 is transferred to the convex surface of the electroforming mold 2 to form the electric insulating film 4. At this time, simply pressing the silicon pad 5 against the ultraviolet curable resin 8 on the intaglio 6 may not sufficiently fill the silicon pad 5 with the ultraviolet curable resin 8.

Therefore, as shown in FIG. 4, the silicon pad 5 is used.
Prepares a light source 10 having a relatively low ultraviolet intensity and having a light transmitting property. The resin 8 is picked up on the silicon pad 5 by irradiating it to semi-cure the vicinity of the contact surface of the ultraviolet curable resin 8 with the silicon pad 5. The surface of the ultraviolet curable resin 8 placed on the silicon pad 5 is a semi-cured layer as described above, but the lower layer portion is in an uncured state. Therefore, in combination with the excellent transfer of the silicon pad 5, the ultraviolet curable resin 8 is reliably transferred to the surface of the electroforming mold 2 even when the surface thereof is in a semi-cured state.

In this case, in particular, since the silicon pad 5 is semi-cured while being pressed, deformation of the shape due to pressing is suppressed, and the surface precision of the silicon pad 5 appears on the surface of the ultraviolet curable resin 8 during transfer. Therefore, the surface accuracy of the primary / secondary electrodeposition layer surface described later can be improved. Moreover, since transfer curing is performed after the shrinkage at the time of curing is reduced by the above semi-curing, peeling from the transferred object due to curing contraction, stress cracking, or the transferred object is thin compared to the case of complete curing at once. In this case, shrinkage and deformation can be suppressed.

After that, the electric insulating film 4 is cured by irradiation with ultraviolet rays (a light source having an intensity higher than that of the light source 10) as in the conventional method. Next, the electroformed mother die 2 having this insulating film 4 is transferred to the electrodeposition layer, and the primary electrodeposition of a metal such as copper is carried out, and the mother die 2 is covered with the insulating film 4 as shown in FIG. 1 (d). The primary electrodeposition layer 9 having a substantially arcuate cross section, for example, which protrudes beyond the thickness of the insulating film 4 on the surface not covered with the insulating film 4.
After the formation, a dipping layer (not shown) is formed on the surface of the primary electrodeposition layer 9 by immersing it in an aqueous solution of sodium dichromate or potassium dichromate.

Further, secondary electrodeposition is carried out using nickel or an alloy of nickel and cobalt, and as shown in FIG. 1 (e), on the surface of the peeling layer of the primary electrodeposition layer 9, hair introduction holes 13 of the mesh-like outer blade 12 are formed. The secondary electrodeposition layer 11 to be the continuous ribs 14 between the layers 13 is formed. After this electrodeposition, the electroformed mold 2 is pulled up from the electrodeposition tank, and the secondary electrodeposition layer 11 is peeled off from the primary electrodeposition layer 9. As shown in FIG. Continuous rib 1 between the formed hair introducing holes 13
A dome-shaped mesh outer cutter 12 having 4 and 4 is obtained.

The ultraviolet curable resin 8 of the electric insulating film 4 is preferably unsaturated polyester resin or thiol olefin resin. In addition to the ultraviolet curable resin, an electron beam curable resin may be used.

[Brief description of drawings]

FIG. 1 is a sectional view sequentially showing a manufacturing process of a dome-shaped mesh outer blade.

FIG. 2 is a cross-sectional view of a general dome-shaped mesh outer blade in an electric shaver.

FIG. 3 is a sectional view of an intaglio plate.

FIG. 4 is a cross-sectional view in which a transfer printing silicon pad is pressed against an ultraviolet curable resin.

FIG. 5 is a cross-sectional view showing a state where an ultraviolet curable resin is picked up by a transfer printing silicon pad.

FIG. 6 is a sectional view sequentially showing a manufacturing process of a conventional dome-shaped mesh outer blade.

[Explanation of symbols]

 1 Electroformed base material 2 Electroformed base material 4 Electrical insulating film 5 Silicon pad for transfer printing 8 UV or electron beam curable resin 9 Primary electrodeposition layer 11 Secondary electrodeposition layer 12 Reticulated outer blade 13 Hair introduction hole 14 Continuous rib

[Procedure amendment]

[Submission date] August 27, 1991

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Full text

[Correction method] Change

[Correction content]

[Document name] Statement

Title: Pad transfer method

[Claims]

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a silicon pad (silicon
The present invention relates to a method of transferring a desired pattern or an independent pattern body such as a character onto a surface of a transfer target using a tampon made of rubber .

[0002]

2. Description of the Related Art This type of pad transfer is, for example, a transfer source.
Form a recess that matches the desired pattern or pattern on the plate,
Resin (resin type ink) is applied to the plate surface, and then the surface
Wipe the resin, leaving the resin only in the recess,
Transfer to a pad and transfer print it onto the surface of the transfer target.
(Unknown literature).

[0003]

However, in order to transfer the resin in the recess of the transfer original plate to the silicon pad, the silicon pad is merely pressed against the resin. Therefore, the resin may not be sufficiently transferred to the silicon pad, and the pattern or the pattern body is likely to lose its shape due to troubles such as a small amount of ink, a lack of ink, and defective printing.
An object of the present invention, near-point to allow the resin on the transfer master can be accurately and easily transferred and Rukoto with silicon pads
It

[0004]

Pad transfer according to the present invention
Methods, in a state pressed against the divorced pad 5 the uncured state on the transfer original 6 ultraviolet ray hardening resin 8, the semi-cured with ultraviolet radiation a contact surface side of the silicon pad 5 of the curable resin 8 and allowed to Ru preparative transferred curable resin 8 in the silicon pad 5 step is, the curable resin 8 on the silicon pad 5 by irradiating a step of transcription of a transfer surface, after transcription ultraviolet ray The step is to completely cure the curable resin 8.

[0005]

According to the pad transfer method of the present invention, the
UV curing of the uncured state on the transfer master 6
Of the curable resin by irradiating with ultraviolet rays while being pressed against the curable resin 8.
8 is semi-cured on the contact surface side with the silicon pad 5.
Then, the curable resin 8 is transferred from the transfer original plate 6 to the silicon pad 5
Can be transferred accurately and easily without losing its shape.
It Also, the curability when transferred to the silicon pad 5.
Since the lower layer side of Resin 8 is in an uncured state, it still has an appropriate viscosity.
It retains its property and is sure against the surface of the transferred material.
Can be transferred to. Furthermore, due to the above semi-curing
Since the transfer curing is performed after the shrinkage during curing is reduced,
Compared to the case where it is completely cured,
Delamination from the object or stress cracking, or the transferred object is thin
This is advantageous because it can suppress shrinkage and deformation in some cases.

[0006]

EXAMPLES The present invention is applied to the outer dome-shaped mesh of an electric shaver.
An example in which the method is applied to a blade electroforming method will be described. First, a plate-shaped electroformed preform 1 shown in FIG. 1 (a), which was drawn as shown in FIG. 1 (b) to form an electroforming mother die 2 having a predetermined dome-shaped. Then, as shown in FIG. 1 (c), an electric insulating film 4 made of an ultraviolet curable resin is formed on the convex surface of the electroformed mold 2 at a portion (pattern) corresponding to the hair introduction hole 13 of the mesh outer blade 12. To do.

This electric insulating film 4 is the pad transfer method of the present invention.
Form by method. In other words, leave a recess 7 that matches the pattern by etching or the like to transfer the original version 6 by hardening material such as SKD (alloy tool steel) as shown in FIG. 3, the usual suitable for printing in the recess 7 filling the <br/> ultraviolet curable resin 8, which is adjusted to a viscosity, Nikki transferred to the silicon pad 5 an ultraviolet curing resin 8 silicon pad 5 pressed onto the transfer original plate 6 as shown in FIG. 4 (FIG. 5).

After that, the ultraviolet curable resin 8 is transferred to the convex surface of the electroforming mold 2 to form the electric insulating film 4. In this case, it may ultraviolet curing resin 8 in the silicon pad 5 only presses simply silicon pad 5 on the ultraviolet curing resin 8 on the transfer original version 6 does not ride sufficiently.

Therefore, as shown in FIG. 4, the silicon pad 5 is used.
Has a light source 10 with a relatively weak UV intensity
Prepare a material that has properties and transfer this silicon pad 5
When pressed against the UV-curable resin 8 of the original version of the 6, light source 10 is irradiated with ultraviolet light to semi-cure the contact surface near the silicon pad 5 of the ultraviolet curing resin 8 from the resin 8
Are transferred to the silicon pad 5. Move to silicon pad 5
The surface of the removed ultraviolet curable resin 8 is a semi-cured layer as described above, but the lower layer side is in an uncured state. Therefore, in combination with the excellent transferability of the silicon pad 5, the ultraviolet curable resin 8 is reliably transferred to the surface of the electroformed mold 2 that is the transferred object even if the surface thereof is in a semi-cured state.

[0010] In this case, since the semi-curing in a state of pressing the silicon pad 5, to suppress loss of shape by the pressing, the surface of the ultraviolet curable resin 8 during transfer to the surface accuracy itself of the silicon pad 5 appears Therefore, the surface accuracy of the primary / secondary electrodeposition layer surface described later can be improved. Moreover, since transfer curing is performed after the shrinkage at the time of curing is reduced by the above-mentioned semi-curing, peeling from the electroformed mother die 2 which is the transferred object due to curing shrinkage, stress cracking, or shrinkage when the transfer member is thin, can suppression deformation.

[0011] Thereafter, a curing treatment an electrical insulating film 4 by ultraviolet irradiation (larger becomes the light source than the ultraviolet intensity of the light source 10). Then , the electroforming mother die 2 having the insulating film 4 is transferred to the electrodeposition layer and the metal such as copper is subjected to the primary electrodeposition according to the conventional means of electroforming, and the mother die is formed as shown in FIG. 1 (d). On the surface not covered with the insulating film 4 of No. 2, a primary electrodeposition layer 9 having a substantially arcuate cross section is formed so as to protrude beyond the thickness of the insulating film 4, and then sodium dichromate or heavy dichromate is formed. It is dipped in an aqueous solution of potassium chromate or the like to form a release layer (not shown) on the surface of the primary electrodeposition layer 9.

Further, secondary electrodeposition is carried out using nickel or an alloy of nickel and cobalt, and as shown in FIG. 1 (e), on the surface of the peeling layer of the primary electrodeposition layer 9, hair introduction holes 13 of the mesh-like outer blade 12 are formed. The secondary electrodeposition layer 11 to be the continuous ribs 14 between the layers 13 is formed. After this electrodeposition, the electroformed mold 2 is pulled up from the electrodeposition tank, and the secondary electrodeposition layer 11 is peeled off from the primary electrodeposition layer 9. As shown in FIG. Continuous rib 1 between the formed hair introducing holes 13
A dome-shaped mesh outer cutter 12 having 4 and 4 is obtained.

As the ultraviolet curable resin 8 of the electric insulating film 4, a curable resin generally used for printing is used.
Unsaturated polyester resin or thiol olefin resin can be used . In addition, as the transfer master 6
In addition to the one in which the concave portion 7 is formed,
Things can be used as well, drawn directly on this surface
Is transferred to the surface of a can or a pot that cannot be drawn directly.
It is also effective.

[Brief description of drawings]

FIG. 1 is a sectional view sequentially showing a manufacturing process of a dome-shaped mesh outer blade.

FIG. 2 is a cross-sectional view of a general dome-shaped mesh outer blade in an electric shaver.

FIG. 3 is a cross-sectional view of a transfer original version.

[4] The divorced pad is a cross-sectional view of a state pressed against the UV-curable resin.

5 is a cross-sectional view of a state where an ultraviolet curable resin was picked up divorced pad.

[EXPLANATION OF SYMBOLS] 2 electroforming mother die (transfer member) 5 divorced pad 6 transfer precursor 8 ultraviolet ray hardening resin

[Procedure Amendment 2]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 6

[Correction method] Delete

Claims (1)

[Claims] 1. An ultraviolet ray or an electron beam curable resin 8 in an uncured state is brought into contact with the pad surface of the transfer printing silicon pad 5, and the curable resin 8 is irradiated from the contact surface side of the silicon pad 5 with ultraviolet rays. Alternatively, a step of irradiating with an electron beam to semi-cure, a step of transferring the curable resin 8 to the surface of the transfer target with the silicon pad 5, and a step of irradiating ultraviolet rays or an electron beam after the transfer to completely cure the curable resin 8 A method for forming a resin coating film, which comprises a step of curing.