JPH05305625A - Multi-cavity injection molding equipment of optical disc substrate - Google Patents
Multi-cavity injection molding equipment of optical disc substrateInfo
- Publication number
- JPH05305625A JPH05305625A JP2417125A JP41712590A JPH05305625A JP H05305625 A JPH05305625 A JP H05305625A JP 2417125 A JP2417125 A JP 2417125A JP 41712590 A JP41712590 A JP 41712590A JP H05305625 A JPH05305625 A JP H05305625A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- injection molding
- cavity
- cavities
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/20—Injection nozzles
- B29C45/22—Multiple nozzle systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C2045/2651—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs using a plurality of mould cavities
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
- Y10S425/81—Sound record
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、凹凸ピットによる記録
情報を有するコンパクトディスク、光学的特性、光磁気
相互作用等を利用して記録情報の読み出しがなされる光
磁気ディスク等の光学ディスク基板の複数個取り射出成
型装置に係わる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical disk substrate such as a compact disk having recorded information by concave and convex pits, a magneto-optical disk for reading recorded information utilizing optical characteristics, magneto-optical interaction and the like. It is related to injection molding equipment that takes multiple pieces.
【0002】[0002]
【従来の技術】通常透明樹脂より成る凹凸ピットを有す
る、或いは凹凸ピットによらない平滑面を有する場合に
おいても、その光学ディスク基板は、図2に示すように
その中心に、光学ディスクドライブ装置の回転駆動部に
装着するに供する中心孔1が穿設されて成るが、その周
囲の基板面は、複屈折率等の光学的特性が均一、一様で
あることが要求される。このため、この光学ディスク基
板の成型に当っては、その成型金型のキャビティ内への
樹脂の射出による注入開口は、光学ディスク基板の中
心、即ち、ディスク基板の中心孔を穿設する部分に設け
ることが余儀なくされる。つまり、この光学ディスク基
板の成型金型は、1つの成型キャビティに1つづつ樹脂
注入のスプルーを設ける必要がある。2. Description of the Related Art An optical disk substrate having an uneven pit which is usually made of a transparent resin or a smooth surface which does not depend on the uneven pit has its optical disk substrate at the center thereof as shown in FIG. The center hole 1 used for mounting on the rotation drive unit is formed by drilling, and the substrate surface around the center hole 1 is required to have uniform and uniform optical characteristics such as birefringence. Therefore, in molding this optical disk substrate, the injection opening by injection of resin into the cavity of the molding die is at the center of the optical disk substrate, that is, at the portion where the central hole of the disk substrate is formed. It is forced to be provided. That is, in the molding die for this optical disk substrate, it is necessary to provide a resin injection sprue for each molding cavity.
【0003】通常この光学ディスク基板の成型は、光学
ディスク基板を一枚づつ樹脂成型する射出成型装置が用
いられている。しかしながら、このように光学ディスク
基板を一枚づつ成型することは量産性が低いという問題
がある。Usually, an injection molding apparatus for molding the optical disk substrates one by one is used for molding the optical disk substrates. However, molding the optical disk substrates one by one in this manner has a problem of low mass productivity.
【0004】そこで、この光学ディスク基板の成型を、
2枚取り以上複数枚同時に成型できる射出成型装置の製
作、使用が試みられている。Therefore, molding of this optical disk substrate
Attempts have been made to manufacture and use an injection molding machine capable of simultaneously molding two or more sheets.
【0005】現在のその作製が試みられているものは、
一般に光ディスク基板を成型する複数のキャビティを有
する金型と、これに対し樹脂を溶かして送り込む射出成
型機とより構成され、その金型側に溶融した樹脂の湯道
を各キャビティに対応して設けるとか、各キャビティに
対して設けられたスプルーに連結する同様の複数の湯道
を設けるとかの方法が採られている。The ones currently being attempted to be produced are
In general, it is composed of a mold having a plurality of cavities for molding an optical disk substrate, and an injection molding machine for melting and feeding resin into the mold, and a molten resin runner is provided on the mold side corresponding to each cavity. Alternatively, a plurality of similar runners connected to sprues provided for the respective cavities are provided.
【0006】ところが、この種の射出成型装置において
は、例えば数時間その使用が行われない場合加熱溶融さ
れた樹脂が分解されているおそれがあることから樹脂を
取り出すいわゆる樹脂のパージが必要となるが、上述し
た構造を採る場合、この樹脂パージが困難であるなど取
扱上の問題を生じる。However, in this type of injection molding apparatus, when the resin is not used for several hours, the resin melted by heating may be decomposed, so that so-called resin purging for taking out the resin is necessary. However, when the above-mentioned structure is adopted, handling problems such as difficulty in this resin purging occur.
【0007】また、他に試みられているものとして、樹
脂を送り込む射出成型機側に、金型側のスプルーに対応
してそれぞれ溶融樹脂を加圧送給する樹脂送給部、即ち
スクリュー機構を設けるものがある。[0007] As another attempt, a resin feeding section for feeding molten resin under pressure, that is, a screw mechanism, is provided on the injection molding machine side for feeding resin in correspondence with the sprue on the die side. There is something.
【0008】しかしながら、この場合は、複数のスクリ
ュー機構を設けるという特別の射出成型機の設計・製作
を必要とすることからコスト高を招来するなどの不都合
がある。However, in this case, there is a disadvantage that the cost is increased because it is necessary to design and manufacture a special injection molding machine in which a plurality of screw mechanisms are provided.
【0009】[0009]
【発明が解決しようとする課題】本発明は簡単な構成を
採り、また樹脂のパージ等の取扱い保全を簡便に行うこ
とができる、複数の光学ディスク基板を同時に成型する
ことができ量産性の向上をはかることができるようにし
た光学ディスク基板の複数個取り射出成型装置を提供す
る。SUMMARY OF THE INVENTION The present invention has a simple structure, can easily perform handling and maintenance such as resin purging, and can mold a plurality of optical disk substrates at the same time, thus improving mass productivity. (EN) Provided is an injection molding apparatus for taking a plurality of optical disk substrates, which is capable of being processed.
【0010】[0010]
【課題を解決するための手段】本発明は、図1にその一
例の断面図を示すように、複数個の光学ディスク基板を
同時に成型する複数個のキャビティ11が形成される金
型12と、この金型12に、溶融樹脂を送り込む樹脂送
給機構部19を有する射出成型機13とを設けて成る。As shown in FIG. 1 which is a sectional view of the present invention, a mold 12 having a plurality of cavities 11 for simultaneously molding a plurality of optical disk substrates is formed. The mold 12 is provided with an injection molding machine 13 having a resin feeding mechanism portion 19 for feeding the molten resin.
【0011】金型12には、上記各キャビティ11の中
心に開口するスプルー14を有するスプルーブッシュ1
3を設ける。The mold 12 has a sprue bush 1 having a sprue 14 opening at the center of each cavity 11.
3 is provided.
【0012】射出成型機13には樹脂送給機構部19に
対しキャビティ11の数に対応する複数のノズル17を
設け、これらノズル17に対し樹脂送給機構部19から
溶融樹脂をそれぞれ加圧供給する。The injection molding machine 13 is provided with a plurality of nozzles 17 corresponding to the number of cavities 11 with respect to the resin feeding mechanism section 19, and the molten resin is pressurized and fed from the resin feeding mechanism section 19 to these nozzles 17, respectively. To do.
【0013】一方、金型12側の、スプルーブッシュ1
5の配置側とは反対側から各キャビティ11内に各キャ
ビィ11の中心軸に沿ってスプルーブッシュ15を各キ
ャビティ11から押圧後退させながら貫通して、各キャ
ビティ11内で成型された光学ディスク基板に中心孔を
穿設するポンチ16を設ける。On the other hand, the sprue bush 1 on the die 12 side
The optical disc substrate molded in each cavity 11 by penetrating through the sprue bush 15 along the central axis of each cavity 11 from the side opposite to the arrangement side of 5 along with the central axis of each cavity 11 while pressing and retracting from each cavity 11. A punch 16 having a central hole is provided in the.
【0014】そして、射出成型機側にスプルーブッシュ
15の、ポンチ16による押圧後退を微小移動に制限し
て保持するロケートリング20の配置孔を有する固定プ
ラテン21を設ける。On the injection molding machine side, a fixed platen 21 having an arrangement hole for a locate ring 20 for holding the sprue bush 15 by pressing and retracting the punch 16 by restricting it to a minute movement is provided.
【0015】[0015]
【作用】上述したように本発明構成では、複数のキャビ
ティ11を有する金型12によって、複数の光学ディス
ク基板を射出成型するので量産性にすぐれている。As described above, in the structure of the present invention, a plurality of optical disk substrates are injection-molded by the mold 12 having the plurality of cavities 11, so that mass productivity is excellent.
【0016】また、本発明構成では、樹脂供給を行う射
出成型機13側に、金型12の各キャビティ11に対応
するノズル17を設けた構成、即ち複数の湯道18を設
けた構成を採るので、金型12側に設ける場合に比し、
構造・構成が簡潔化され、コストの低下、樹脂パージ等
の取扱いも簡単となる。Further, in the structure of the present invention, a nozzle 17 corresponding to each cavity 11 of the mold 12 is provided on the injection molding machine 13 side for supplying the resin, that is, a plurality of runners 18 are provided. Therefore, compared with the case where it is provided on the mold 12 side,
The structure and configuration are simplified, cost is reduced, and handling such as resin purging is easy.
【0017】そして、射出成型機13側においても、複
数のノズル17への樹脂送給機構19は1コのみで、そ
の送り出し端即ち湯道18を複数に分割してノズル17
へと導けば良いので、コスト高を抑制することができ
る。Also on the injection molding machine 13 side, there is only one resin feeding mechanism 19 for the plurality of nozzles 17, and the delivery end, that is, the runner 18 is divided into a plurality of nozzles 17.
Since it is sufficient to lead to, it is possible to suppress the cost increase.
【0018】[0018]
【実施例】図1を参照して更に本発明の一例を説明す
る。図1の例は光ディスク基板2個取りの縦型構成とし
た場合である。DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of the present invention will be further described with reference to FIG. The example of FIG. 1 shows a case where a vertical structure is adopted in which two optical disk substrates are taken.
【0019】金型12は、それぞれプレート31と32
とに設けられた透孔にそれぞれホールドリング41と4
2とによってホールドされた2個の円盤状キャビティ1
1を構成する固定側金型51と可動金型52が保持され
て成る。23は金型の分離面いわゆるパーティング面で
ある。The mold 12 includes plates 31 and 32, respectively.
Hold holes 41 and 4 are provided in through holes provided in and, respectively.
Two disk-shaped cavities 1 held by 2 and
The fixed-side mold 51 and the movable mold 52 that compose 1 are held. Reference numeral 23 is a separation surface of the mold, a so-called parting surface.
【0020】また、金型12の固定側には、各キャビテ
ィ11の中心軸上にスプルー14が中心に設けられたス
プルーブッシュ15が貫通配置され、スプルー14の開
口端が各キャビティ11に連通するようになされる。ス
プルーブッシュ15のキャビティ11とは反対側、図1
において上端に(以下上下の表現は、説明の便宜上図1
をもとにした表示である)外周部に突出するフランジ1
5Fが設けられ、金型12の固定側に設けられた凹部2
4の底面との衝合によってスプルーブッシュ15の下端
がキャビティ11の上面と同一面となるようにする。On the fixed side of the die 12, a sprue bush 15 having a sprue 14 centered on the central axis of each cavity 11 is disposed so as to penetrate therethrough, and the open end of the sprue 14 communicates with each cavity 11. Is done like this. The opposite side of the sprue bush 15 from the cavity 11, FIG.
In the upper end (in the following, upper and lower expressions are shown in FIG.
Flange 1 protruding to the outer periphery
5F is provided, and the concave portion 2 is provided on the fixed side of the mold 12.
The lower end of the sprue bush 15 is flush with the upper surface of the cavity 11 by abutting against the bottom surface of the cavity 4.
【0021】また、金型12に、各スプルーブッシュ1
5をその軸心方向に微小移動できるように、かつその抜
けを防止するように、スプルーブッシュ15のフランジ
15Fの上面と衝合するロケートリング20をねじどめ
等によってとりつける。Further, each sprue bush 1 is attached to the die 12.
A locating ring 20 that abuts the upper surface of the flange 15F of the sprue bush 15 is attached by screwing or the like so that 5 can be moved slightly in the axial direction and that it can be prevented from coming off.
【0022】一方、射出成型機13側の固定プラテン2
1に金型12の固定部が、例えば取付けねじ62によっ
て固定される。また、この固定プラテン21に穿設され
たロケートリング配置孔21H内には、固定プラテン用
入子71を介してそれぞれロケートリング20が収容さ
れる。On the other hand, the fixed platen 2 on the injection molding machine 13 side
The fixed portion of the mold 12 is fixed to the first mold 1 by, for example, a mounting screw 62. In addition, the locate ring 20 is housed in the locate ring placement hole 21H formed in the fixed platen 21 via the insert 71 for the fixed platen.
【0023】また、射出成型機13は、1組の樹脂送給
機構部19を有し、これにそれぞれスプルー14の上端
の開口に連通する各ノズル17が形成された2本の分岐
湯道18が設けられたY字型構成の樹脂送給路88が連
結される。そして、これらノズル17が金型12のスプ
ルーブッシュ15の上端に衝合し、このスプルーブッシ
ュ15を押下させて、スプルー14の開口をキャビティ
11の上面と同一面に一致させる。樹脂送給機構部19
は、スクリューより成り、図示しないが、この機構部1
9に樹脂ペレットが供給され、これが通電ヒータ等の加
熱手段90によって溶融され、且つスクリューの回転に
よって撹拌されると共に、スクリューの例えば油圧によ
る押下によって、溶融された状態の例えばポリカーボネ
ート、アクリル等の樹脂が、各ノズル17から射出さ
れ、スプルー14を通じて各キャビティ11内に供給さ
れるようにする。91及び92は樹脂送給路88、各湯
道18の外周に設けられた通電ヒータ等の樹脂の固化を
防止する加熱手段である。Further, the injection molding machine 13 has a pair of resin feeding mechanism portions 19, and two branch runners 18 in which each nozzle 17 communicating with the opening at the upper end of the sprue 14 is formed. The Y-shaped resin supply passage 88 provided with is connected. Then, these nozzles 17 collide with the upper end of the sprue bush 15 of the mold 12 and press down the sprue bush 15 so that the opening of the sprue 14 is flush with the upper surface of the cavity 11. Resin feeding mechanism section 19
Is a screw, and is not shown
9 is supplied with resin pellets, which are melted by a heating means 90 such as an electric heater and agitated by rotation of the screw, and when the screw is pressed by hydraulic pressure, for example, resin such as polycarbonate or acrylic resin in a melted state. Is injected from each nozzle 17 and supplied into each cavity 11 through the sprue 14. Reference numerals 91 and 92 denote heating means for preventing the resin from solidifying, such as an electric heater provided on the outer periphery of the resin feed passage 88 and each runner 18.
【0024】一方、金型12の可動金型52には、スプ
ルーブッシュ15と同軸上に、スプルーブッシュ15の
外径と同径のポンチ16が貫通するように設けられ、キ
ャビティ11内で樹脂成型がなされる状態では、その上
端がキャビティ11の下面と同一面を形成する位置にあ
る。On the other hand, the movable die 52 of the die 12 is provided with a punch 16 having the same diameter as the outer diameter of the sprue bush 15 coaxially with the sprue bush 15, and resin molding in the cavity 11. In the state where the above is performed, the upper end thereof is in the position where it forms the same surface as the lower surface of the cavity 11.
【0025】このようにして各キャビティ11に樹脂の
射出注入がなされ円盤状の光学ディスクが成型される。In this way, the resin is injected and injected into each cavity 11, and a disk-shaped optical disk is molded.
【0026】この成型後、射出成型機13のノズル17
及び樹脂送給機構19を有するいわば射出成型機本体が
上方に後退し、スプルーブッシュ15が上方に微小後退
できる状態て、各ポンチ16が押し上げられ、キャビテ
ィ11内で成型された光学ディスク基板に中心孔が穿設
される。このときスプルーブッシュ15は、ポンチ16
の先端で持ち上げられてそのフランジ15Fがロケート
リング20で規制される位置まで微小移動して後退する
ので、ポンチ16はその先端部が成型された光学ディス
ク基板の中心部においてその全厚さに亘って貫通できる
ことから、図2に示す中心孔1が良好に穿設される。After this molding, the nozzle 17 of the injection molding machine 13
And, so to speak, the injection molding machine main body having the resin feeding mechanism 19 is retracted upward, and the sprue bush 15 can be slightly retracted upward, so that each punch 16 is pushed up and the optical disc substrate molded in the cavity 11 is centered. A hole is drilled. At this time, the sprue bush 15 is replaced by the punch 16
Since the flange 15F is slightly moved to the position regulated by the locate ring 20 and is retracted by the tip of the punch 15, the punch 16 extends over its entire thickness in the center of the optical disk substrate whose tip is molded. The center hole 1 shown in FIG. 2 is satisfactorily formed because it can be penetrated.
【0027】図1は、例えば縦型の2個取り構成とした
場合であるが、横型構成とすることもできるし、3個取
り以上とすることもできるなど種々の変型変更を採り得
る。FIG. 1 shows a case where a vertical two-piece structure is used, for example, but a horizontal structure may be used, or three or more pieces may be formed, and various modifications may be made.
【0028】[0028]
【発明の効果】上述したように本発明におていは、光学
ディスク基板の成型を複数個取りとしたので量産性にす
ぐれている。As described above, according to the present invention, a plurality of optical disk substrates are molded, so that mass productivity is excellent.
【0029】また、複数のキャビティ11に対する樹脂
供給を行うノズル17を射出成型機13に設け、しかも
これらノズルを1組の樹脂送給機構部19から分岐して
設けるようにしたので、単数個取りとするか、複数個取
りとするかに応じてノズル部を交換するのみで達成でき
る。また、その樹脂パージも金型側ではないことから簡
単に行うことができる。Further, since the injection molding machine 13 is provided with the nozzles 17 for supplying the resin to the plurality of cavities 11, and these nozzles are provided so as to be branched from one set of the resin feeding mechanism section 19, a single piece is taken. This can be achieved simply by exchanging the nozzle portion depending on whether to use multiple nozzles or multiple nozzles. Further, the resin purging can be easily performed because it is not on the mold side.
【0030】同様にして、単数取りか複数個取りかに応
じて固定プラテン21は共通にしてそのロケートリング
配置孔内に配置する固定プラテン用入子21Hのみを交
換すれば良いので、上述したノズル部の構成と共に互換
性にすぐれ、廉価に構成できるなどの実用上重要且つ多
くの利点を有する。Similarly, the fixed platen 21 is commonly used according to whether to take a single piece or a plurality of pieces, and only the insert 21H for the fixed platen arranged in the locate ring arrangement hole needs to be replaced. It has practically important and many advantages such as excellent compatibility with the structure of the parts and low cost.
【図1】本発明の光学ディスク基板の複数個取り射出成
型装置の一実施例の略線的断面図である。FIG. 1 is a schematic cross-sectional view of an embodiment of an injection molding apparatus for taking a plurality of optical disk substrates of the present invention.
【図2】光学ディスク基板の断面図である。FIG. 2 is a sectional view of an optical disk substrate.
11 キャビティ 12 金型 13 射出成型機 14 スプルー 15 スプルーブッシュ 17 ノズル 11 Cavity 12 Mold 13 Injection Molding Machine 14 Sprue 15 Sprue Bushing 17 Nozzle
───────────────────────────────────────────────────── フロントページの続き (72)発明者 平山 信之 静岡県志太郡大井川町相川1561−2 株式 会社シービーエス・ソニーグループ静岡工 場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Nobuyuki Hirayama 1561 Aikawa, Oigawa-cho, Shita-gun, Shizuoka CB Sony Corporation Shizuoka Factory
Claims (1)
する複数個のキャビティが構成される金型と、 この金型に、溶融樹脂を送り込む樹脂送給機構部を有す
る射出成型機とを有して成り、 上記金型には、上記各キャビティの中心に開口するスプ
ルーを有するスプルーブッシュが設けられ、 上記射出成型機には、上記樹脂送給機構部に対し上記キ
ャビティの数に対応する複数のノズルが設けられてこれ
らノズルに対し上記樹脂送給機構部から溶融樹脂がそれ
ぞれ加圧供給されるようになされ、 上記金型側の、上記スプルーブッシュの配置側とは反対
側から上記各キャビティ内に各キャビティの中心軸に沿
って上記スプルーブッシュを各キャビティから押圧後退
させながら貫通して、上記各キャビティ内で成型された
光学ディスク基板に中心孔を穿設するポンチが設けら
れ、 上記射出成型機側に上記スプルーブッシュの上記ポンチ
による押圧後退を微小移動に制限して保持するロケート
リングの配置孔を有するプラテンが設けられて成ること
を特徴とする光学ディスク基板の複数個取り射出成型装
置。1. A mold comprising a plurality of cavities for simultaneously molding a plurality of optical disk substrates, and an injection molding machine having a resin feeding mechanism for feeding a molten resin into the mold. The mold is provided with a sprue bush having a sprue opening at the center of each cavity, and the injection molding machine has a plurality of sprue bushes corresponding to the number of cavities with respect to the resin feeding mechanism. Nozzles are provided so that molten resin is pressurized and supplied to the nozzles from the resin feeding mechanism, respectively, and inside the cavities from the side of the mold side opposite to the side on which the sprue bush is arranged. The sprue bush is pushed through and retracted from each cavity along the center axis of each cavity, and is centered on the optical disk substrate molded in each cavity. And a platen having a locate ring arrangement hole for holding the sprue bush by pressing and retracting the sprue bush by restricting the movement to a small amount on the side of the injection molding machine. An injection molding machine that takes multiple optical disk substrates.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2-417125A JP3005299B2 (en) | 1990-12-28 | Injection molding machine for taking multiple optical disc substrates | |
AT0256591A AT402278B (en) | 1990-12-28 | 1991-12-27 | INJECTION MOLDING DEVICE FOR PRODUCING SUPPORT LAYERS FOR OPTICAL DISKS |
US07/816,393 US5238393A (en) | 1990-12-28 | 1991-12-27 | Multi-cavity injection molding apparatus for optical disk substrates |
EP92107456A EP0567682B1 (en) | 1990-12-28 | 1992-04-30 | Multi-cavity injection molding apparatus for optical disk substrates |
HK98106503A HK1007293A1 (en) | 1990-12-28 | 1998-06-24 | Multi-cavity injection molding apparatus for optical disk substrates |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2-417125A JP3005299B2 (en) | 1990-12-28 | Injection molding machine for taking multiple optical disc substrates | |
HK98106503A HK1007293A1 (en) | 1990-12-28 | 1998-06-24 | Multi-cavity injection molding apparatus for optical disk substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05305625A true JPH05305625A (en) | 1993-11-19 |
JP3005299B2 JP3005299B2 (en) | 2000-01-31 |
Family
ID=
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003039496A (en) * | 2001-07-27 | 2003-02-13 | Sony Corp | Injection molding device and injection molding method |
Citations (10)
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---|---|---|---|---|
JPS5411167A (en) * | 1977-06-27 | 1979-01-27 | Kooraa Aasaa | Plastic material pass separating apparatus |
JPS55139237A (en) * | 1979-04-17 | 1980-10-30 | Toyoda Gosei Co Ltd | Nozzle device of injection molding machine |
JPS58142833A (en) * | 1982-02-19 | 1983-08-25 | Kobe Steel Ltd | Control method for injection molding machine |
JPS6135223A (en) * | 1984-07-27 | 1986-02-19 | Eng Plast Kk | Mold for injection molding |
JPS6367123A (en) * | 1986-09-09 | 1988-03-25 | Sumitomo Heavy Ind Ltd | Injection molding equipment for molded item with punched hole |
JPS63151419A (en) * | 1986-12-15 | 1988-06-24 | Meiki Co Ltd | Mold for disk base |
JPS63270112A (en) * | 1987-04-30 | 1988-11-08 | Toshiba Corp | Mold |
JPH01159223A (en) * | 1987-12-17 | 1989-06-22 | Tdk Corp | Molding device for optical disk |
JPH01159220A (en) * | 1987-12-17 | 1989-06-22 | Tdk Corp | Molding device for optical disk |
JPH01200924A (en) * | 1987-12-24 | 1989-08-14 | Tdk Corp | Apparatus for molding optical disk |
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5411167A (en) * | 1977-06-27 | 1979-01-27 | Kooraa Aasaa | Plastic material pass separating apparatus |
JPS55139237A (en) * | 1979-04-17 | 1980-10-30 | Toyoda Gosei Co Ltd | Nozzle device of injection molding machine |
JPS58142833A (en) * | 1982-02-19 | 1983-08-25 | Kobe Steel Ltd | Control method for injection molding machine |
JPS6135223A (en) * | 1984-07-27 | 1986-02-19 | Eng Plast Kk | Mold for injection molding |
JPS6367123A (en) * | 1986-09-09 | 1988-03-25 | Sumitomo Heavy Ind Ltd | Injection molding equipment for molded item with punched hole |
JPS63151419A (en) * | 1986-12-15 | 1988-06-24 | Meiki Co Ltd | Mold for disk base |
JPS63270112A (en) * | 1987-04-30 | 1988-11-08 | Toshiba Corp | Mold |
JPH01159223A (en) * | 1987-12-17 | 1989-06-22 | Tdk Corp | Molding device for optical disk |
JPH01159220A (en) * | 1987-12-17 | 1989-06-22 | Tdk Corp | Molding device for optical disk |
JPH01200924A (en) * | 1987-12-24 | 1989-08-14 | Tdk Corp | Apparatus for molding optical disk |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003039496A (en) * | 2001-07-27 | 2003-02-13 | Sony Corp | Injection molding device and injection molding method |
Also Published As
Publication number | Publication date |
---|---|
US5238393A (en) | 1993-08-24 |
EP0567682A1 (en) | 1993-11-03 |
AT402278B (en) | 1997-03-25 |
ATA256591A (en) | 1996-08-15 |
HK1007293A1 (en) | 1999-04-09 |
EP0567682B1 (en) | 1996-12-27 |
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