JPH05304358A - Bonding head - Google Patents

Abstract

(57) [Abstract] [Purpose] Regarding a bonding head having a suction nozzle for adsorbing an electronic component, thermal stress is not applied to a printed circuit board at the time of bonding or removing the electronic component, and further, oxidation of solder is prevented. The purpose is to A heating head which is provided with a suction nozzle for sucking air and is heated to a predetermined temperature, and a duct which covers the periphery of the heating head and supplies an inert gas heated to a predetermined temperature. The electronic component is held at the tip of the heating head by adsorbing the electronic component by the suction nozzle, and when the electronic component is bonded to or removed from a predetermined printed circuit board, the tip is provided. Is brought into contact with the electronic component, the opening of the duct is brought into contact with the surface of the printed circuit board, and the electronic component is heated by the inert gas and the heating head.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding head having a suction nozzle for sucking electronic parts.

Electronic components mounted on a printed circuit board are mounted by soldering the terminals of the electronic component to pads formed on the printed circuit board. A bonding head is used for such soldering.When bonding electronic components to a printed circuit board, the electronic components are held by the bonding head, positioned at a predetermined position on the printed circuit board, and the bonding head is heated. The solder is melted by the solder and the terminal of the electronic component is fixed to the pad of the printed circuit board by the solder. The solder is melted, an electronic component is adsorbed by a bonding head, and peeled off from a printed board.

Therefore, there is a demand for a bonding head which can easily perform both bonding and removal of electronic components.

[0004]

2. Description of the Related Art Conventionally, a conventional structure has been formed as shown in FIG. As shown in FIG. 4, a heating head 1 having a suction nozzle 2 is provided via a holding member 11 by a lifting mechanism 10 so as to be able to move up and down in the arrow Z direction.
The front end portion 1A is formed so as to move up and down on the surface 6A of the printed circuit board 6 placed on the XY table 12 which is transferred in the X and Y directions.

A heater 13 is provided on the XY table 12 to heat the printed circuit board 6 placed thereon to a predetermined temperature T2 to preheat the entire printed circuit board 6. Further, the heating head 1 is provided with an electrode 1B,
The suction nozzle 2 has a tube so that the tip 1A is heated to a predetermined temperature T1 by supplying the pulse power POW to the tube.
14 is piped so that the air 3 is sucked as indicated by arrow F, and the electronic component 7 is sucked by the tip 1A.

Therefore, when the electronic component 7 is mounted on the printed circuit board 6, first, the electronic component 7 is adsorbed to the tip portion 1A of the heating head 1 by suction of the air 3, and the electronic component 7 is transferred by moving the XY table 12. 7 is positioned at a predetermined place to be mounted, then the terminal 7A of the electronic component 7 is brought into contact with the pad 6B of the printed circuit board 6 by the lowering of the elevating mechanism 10, and the temperature T1 is heated by supplying the pulse power POW. , Melt the preliminary solder applied to the pad 6B,
Finally, stop heating head 1 by stopping the suction of air 3.
The bonding was performed by raising the temperature.

When the electronic component 7 already mounted on the printed circuit board 6 is removed, the XY table 12 is moved to position the heating head 1 at a predetermined position on the electronic component 7 to be removed, and then , The tip 1A of the heating head 1 is brought into contact with the electronic component 7 by lowering the elevating mechanism 10, and then the pulse power POW is supplied to heat the temperature T1 to melt the solder adhered to the pad 6B. Finally, air 3 was sucked to adsorb electronic component 7 to tip 1A, and heating head 1 was raised to remove it.

Therefore, the printed circuit board 6 on which the XY table 12 is mounted is always preheated by the heater 13 so that the solder is melted instantaneously during bonding or removal.

[0009]

[Problems to be Solved by the Invention] However, such XY
Printed circuit board by heater 13 provided on table 12
By preheating by heating 6
The entire printed circuit board 6 is heated to a high temperature.

Therefore, thermal stress is applied to the printed circuit board 6, which causes a problem such as disconnection of the pattern wiring. Further, there is a problem that the solder is easily oxidized and an oxide film is generated, resulting in defective soldering.

Therefore, it is an object of the present invention to prevent thermal oxidation from being applied to a printed circuit board during bonding or removal of electronic parts, and also to prevent solder oxidation.

[0012]

FIG. 1 is a diagram for explaining the principle of the present invention. As shown in FIG. 1, a heating head provided with a suction nozzle 2 for sucking air 3 and heated to a predetermined temperature T1. 1 and the surrounding of the heating head 1
Duct 4 to which inert gas 5 heated to T2 is supplied
The electronic component 7 is held by the tip 1A of the heating head 1 by sucking the electronic component 7 by the suction nozzle 2, and the electronic component 7 is attached to a predetermined printed circuit board.
When bonding or removing to 6, the tip
1A is brought into contact with the electronic component 7, the opening 4A of the duct 4 is brought into contact with the surface 6A of the printed circuit board 6, and the inert gas 5 and the heating head 1 are applied to the electronic component 7. The heating temperature T1 of the heating head 1 is set so that the heating head 1 heats the preheating by spraying the inert gas 5 and the heating head 1 melts the solder. The heating temperature T2 is higher than the heating temperature T2.

The above-mentioned problems can be solved by such a configuration.

[0014]

[Function] That is, the duct 4 covering the heating head 1 is provided, and the duct 4 is provided with an inert gas heated to a predetermined temperature T2.
When supplying 5 to melt the solder during bonding or removal, the opening 4A of the duct 4 is brought into close contact with the surface of the printed circuit board 6 to preheat by supplying the inert gas 5, and then the heating head. The solder is melted at the heating temperature T1 of 1.

Therefore, the printed circuit board 6 as in the conventional case is used.
Can be preheated without heating the whole of the board, eliminating the effect of thermal stress on the printed circuit board 6 and
It is possible to prevent generation of an oxide film on the melted solder, ensure reliable soldering, and improve reliability.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to FIGS. FIG. 2 is an explanatory view of an embodiment according to the present invention,
(a) is a configuration diagram, (b) is a side cross-sectional view of a main part, FIG. 3 is an operation explanatory diagram of the present invention, (a1) to (a4) are operation explanatory diagrams of a bondig, (b)
1) to (b4) are operation explanatory views of the remove. Throughout the drawings, the same reference numerals denote the same objects.

As shown in FIG. 2 (a), the attachment 17 is formed so as to move up and down in the arrow Z direction by the cylinder 9A locked to the head arm 16 which is a fixing member and the slide bearing 8A. The attachment 17 has a suction nozzle 2 for sucking air 3, and is formed so as to hold a heating head 1 for heating by supply of a pulse power source POW and a duct 4, respectively.

Further, the attachment 17 includes a motor 15 for further raising and lowering the heating head 1, a slide bearing 8C, a cylinder 9B for raising and lowering a duct 4 provided so as to cover the heating head 1, and a slide bearing 8B. The duct 4 is provided with an opening 4A and a supply port 4B which are formed so that the tip portion 1A of the heating head 1 projects or retracts from the opening 4A by driving either the motor 15 or the cylinder 9B. The inert gas 5 such as nitrogen gas heated to a predetermined temperature is supplied from the supply port 4B.

Therefore, when performing bonding, first, as shown in (a1) of FIG. 3, the tip portion 1A of the heating head 1 is first.
The electronic component 7 is sucked onto the printed circuit board 6
By positioning the heating head 1 at the predetermined position of arrow Z1.
3) and lower the duct 4 as shown in (a2) of Fig. 3.
Is further lowered as indicated by arrow Z11 and the opening of the duct 4 is brought into contact with the surface 6A of the printed circuit board 6 to supply the inert gas 5 heated to the predetermined temperature T2 into the duct 4.

Next, as shown in (a3) of FIG. 3, the tip portion 1A
By lowering the heating head 1 so that the terminal 7A of the electronic component 7 adsorbed on the surface 6 is brought into contact with the surface 6A of the printed circuit board 6, and supplying the pulse power POW to the heating head 1, the temperature T1 of the heating head 1 is lowered. And the temperature T2 of the inert gas 5 are both heated to melt the solder.

Finally, the pulse power supply supplied to the heating head 1 is cut off, the inert gas 5 supplied to the duct 4 is stopped, and as shown in (a4) of FIG.
By raising the heating head 1 and the duct 4 as described above, the electronic component 7 is fixed to the printed circuit board 6, and the electronic component 7 is bonded.

In addition, when removing, first, as shown in FIG.
As shown in (b1) of Fig. 3, the tip portion 1A of the heating head 1 is positioned at a predetermined position of the electronic component 7 mounted on the printed circuit board 6, and the heating head 1 is lowered as indicated by the arrow Z1 to move it to the position shown in FIG.
As shown in (b2), the duct 4 is further lowered as indicated by the arrow Z11, and the opening of the duct 4 is brought into contact with the surface 6A of the printed circuit board 6 to heat the inside of the duct 4 to a predetermined temperature T2. Supply inert gas 5.

Next, as shown in FIG. 3 (b3), the heating head 1 is lowered, the heating head 1 is brought into contact with the electronic component 7, and the pulsed power supply POW is supplied to the heating head 1. The temperature T1 is heated by 1 and the solder is melted by heating both the temperature T1 of the heating head 1 and the temperature T2 of the inert gas 5.

By melting the solder, the electronic component 7 is attracted to the heating head 1 by the suction of the suction nozzle 2 as shown in FIG. 3 (b4), and the heating head 1 is raised as indicated by arrow Z2. The electronic component 7 is removed from the surface 6A of the printed board 6.

Finally, at the same time as the heating head 1 is raised, the duct 4 that was in close contact with the surface 6A of the printed circuit board 6 is raised, so that the pulse power POW supplied to the heating head 1 is cut off and the duct 4 is supplied. Inert gas used to be 5
Is stopped and the electronic component 7 is removed.

Therefore, the spraying of the inert gas 5 for preheating is performed by the electronic component 7 to be bonded or removed.
As compared with the preheating for heating the entire printed circuit board 6 described above, it is possible to prevent the thermal stress from being affected, and further, the melting of the solder is performed by the inert gas 5 Since it is performed in the atmosphere, the solder can be prevented from being oxidized.

As shown in FIG. 2 (b), the heating bed
When the thermocouple 18 is provided at the tip 1A of 1 and the temperature of the tip 1A is detected, the heating temperature of the heating bed 1 can be accurately controlled by the temperature detected by the thermocouple 18 when the solder is melted. Furthermore, if a gasket 19 made of a heat resistant rubber material is fixed to the opening 4A of the duct 4, the duct 4
When the duct 4 is lowered so that the opening 4A contacts the surface 6A of the printed circuit board 6, the surface 6A of the printed circuit board 6 and the duct
The opening 4A of 4 can be surely brought into close contact, and preheating by spraying the inert gas 5 can be ensured.

[0028]

As described above, according to the present invention,
A duct covering the periphery of the heating head 1 is provided, and by supplying an inert gas heated to a predetermined temperature to the duct, preheating is performed by spraying the inert gas.
It is possible to prevent the solder from being oxidized by heating the solder by heating 1 and to avoid the thermal stress on the printed circuit board as much as possible.

Therefore, as compared with the prior art, the effect of thermal stress on the printed circuit board during bonding and removal is eliminated, and further, the oxidation of the solder is prevented, so that the quality of soldering can be improved and the practical effect is great. ..

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of the present invention.

FIG. 2 is an explanatory diagram of an embodiment according to the present invention.

FIG. 3 is an operation explanatory diagram of the present invention.

FIG. 4 is a conventional explanatory diagram

[Explanation of symbols]

1 Heating Head 2 Suction Nozzle 3 Air 4 Duct 5 Inert Gas 6 Printed Circuit Board 7 Electronic Components 1A Tip 4A Gasket 6A Surface

Claims (2)

[Claims] 1. A heating head (1) provided with a suction nozzle (2) for sucking air (3) and heated to a predetermined temperature (T1).
And covering the heating head (1) with a predetermined temperature (T
Duct where the heated inert gas (5) is supplied to 2)
(4) and the electronic component (7) by the suction nozzle (2)
The electronic component (7) is held on the tip portion (1A) of the heating head (1) by adsorbing, and the electronic component (7) is bonded or removed to a predetermined printed circuit board (6). When this is done, the tip (1A) is brought into contact with the electronic component (7),
The opening (4A) of the duct (4) corresponds to the surface (6) of the printed circuit board (6).
A) is brought into contact with the electronic component (7) and the inert gas
A bonding head comprising: (5) and the heating head (1) for heating. 2. The heating head (1) according to claim 1, wherein preheating is performed by spraying the inert gas (5) and melting of the solder is performed by heating the heating head (1).
The heating temperature of (T1) is the heating temperature of the inert gas (5) (T2)
A bonding head characterized by being formed higher.