JPH05286291A - Ic card module structure - Google Patents

Abstract

PURPOSE:To simplify an IC card module in structure and produce it in an easy manner. CONSTITUTION:Device holes 2 are provided in a circuit substrate 1 correspondingly to IC card input and output terminal parts. Contact patterns 3 are formed on the circuit substrate 1 on the same side that an IC chip 4 is mounted on. The IC chip 4 and the contact pattern 3 are connected to each other through a conductive member 5. The circuit substrate 1 and the IC chip 4 are integrally sealed with a resin so that the connection part is covered with the resin. The required contact patterns 3 can be exposed through the device holes 2. In this manner, the IC card module is simplified in structure, reduced in thickness, and lowered in production cost.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module structure of an IC card having a contact pattern on one surface of a circuit board on which an IC chip is mounted.

[0002]

2. Description of the Related Art In recent years, various kinds of cards such as cash cards, credit cards, various members' cards, and medical examination tickets for hospitals have been distributed, and are becoming indispensable to our daily lives. Currently, magnetic cards are the mainstream of these cards, but the magnetic cards have a limit in expanding functions because of their small storage capacity, and also have a limit in terms of security and reliability. As a multi-function card that breaks the limit of this magnetic card, has a large storage capacity, and has a high security function, C
It is well known that an IC card equipped with a PU, a memory chip, etc. has appeared.

Therefore, a module structure of a conventional general IC card will be described. FIG. 3 is a cross-sectional view of a main part showing the structure of the IC card. FIG. 4 is a sectional view showing the structure of the IC module of FIG.

In FIGS. 3 and 4, the card substrate 30 is shown.
In the recess formed in the
The C chip 31 is bonded to the circuit board 32 by the bonding wire 33, and the IC chip 31 is made of resin to seal the sealing portion 3.
The IC module 35 that forms part 4 is housed and fixed, and both sides of the card substrate 32 are overseat 36.
And a wiring pattern 37 having a predetermined shape is formed on both surfaces of the circuit board 32, and the wiring pattern 37 is formed through the through hole 38.
A plurality of input / output terminals 39 provided on the surface of the C card make contact with the connection terminals of the external processing device.

Therefore, in the above-described IC card module structure, forming wiring patterns on both surfaces of the circuit board and making electrical connection through the through holes leads to an increase in manufacturing cost and further increases reliability. It causes a decrease. In addition, the wire loop height due to wire bonding is required, the module becomes thicker, and at the same time, a sealing die is required, which further increases the manufacturing cost of the module, resulting in an unreliable and inexpensive module. There were various problems such as not being able to obtain it.

Therefore, as conventional techniques for improving these problems, Japanese Patent Publication No. Sho 61-30315 and Japanese Patent Publication No. 1-5.
Japanese Patent No. 8657 and Japanese Patent Publication No. 63-54219 disclose specific examples in which a wiring pattern is formed on one surface of a circuit board.

First, the outline of the prior art disclosed in Japanese Patent Publication No. 61-30315 will be described with reference to FIG. 5, in which a wiring pattern 42 is formed on one side of the circuit board 40 on which the IC chip 41 is mounted. A hole 45 is provided in the card substrate 44 in a region where the terminal region 43 of the wiring pattern 42 is located. This hole 45 penetrates the card board 44,
The hole 45 is designed so that an external electrode (not shown) of the card can be electrically contacted with the terminal area 43 on the IC module 46. The IC module 46 is made of resin 47.
There is a description that is fixed to the card substrate 44 by.

Next, the outline of the prior art disclosed in Japanese Patent Publication No. 1-58657 will be described with reference to FIG.
IC chip 52 arranged in window 51 of film 50
Are bonded to the ends of the contact leads 53 formed in a separate process by another suitable device, and a conductive layer 55 is formed in the contact region 54 at one end of the contact leads 53. After that, it is sealed with resin 56 using a molding die, but the conductive layer 55 is formed slightly higher than the molding surface, and when incorporated in the identification card body, this layer 55 is a coating of the identification card body. If the layer 55 is located on the same plane as and the layer 55 is made of a conductive material, the direct contact method can be used. When the layer 55 is made of a non-conductive material, it is described that the needle may penetrate the contact region 54 through the layer.

Further, the outline of the prior art disclosed in Japanese Patent Publication No. 63-54219 will be described with reference to FIG. 7. A window 61 is provided in a film 60, and an IC module 62 is provided.
There is a description that the terminal 63 is connected to the external lead portion 66 of the contact surface 65 through the window 61 of the film 60 with the thin gold wire 64.

[0010]

However, each of these conventional techniques has the following problems, and the conventional technique disclosed in Japanese Patent Publication No. 61-30315 described above is shown in FIG. As described above, since the external connection terminal is located at the bottom of the hole penetrating the thickness of the card substrate, the connection terminal of the external processing device also has to penetrate through the thickness of the card substrate to be in contact, and the structure of the contact portion of the device is also There was a problem such as becoming special.

In the prior art disclosed in Japanese Patent Publication No. 1-58657 mentioned above, as shown in FIG.
The IC chip must be accurately aligned before molding, and the IC chip cannot be fixed unless the whole is molded, and the external connection terminals must be formed slightly higher than the molding surface. There is also a problem that accuracy is required, the cost of the IC chip alignment device and the molding die are high, the manufacturing cost is high, and the thickness of the single unit is large because of the entire molding.

Further, in the prior art disclosed in the above-mentioned Japanese Patent Publication No. 63-54219, as shown in FIG. 7, a contact pattern is formed on the upper surface with a film interposed, and an IC module is mounted on the lower surface. It is connected with a wire through a hole provided in the film and is molded by covering the wire.The thickness of the module becomes thicker due to the loop height of the wire, a molding die is required, and the manufacturing cost increases. was there.

The present invention has been made in view of the above conventional problems, and an object thereof is a simple structure, high reliability,
The present invention provides an IC card module that is inexpensive to manufacture.

[0014]

In order to achieve the above object, the module structure of the IC card according to the present invention has a device hole at a position corresponding to an IC card input / output terminal portion of a circuit board, A contact pattern is formed on the IC chip mounting side of the substrate, the IC chip and the contact pattern are connected by a conductive member, the connected portion is covered, and the circuit board and the IC chip are integrally sealed with resin. The contact pattern and the connection terminal of the external processing device can be brought into contact with each other through a device hole provided in the circuit board.

[0015]

Therefore, in the module structure of the IC card obtained by the present invention, a contact pattern is formed on one surface of the circuit board on the side where the IC chip is mounted, and the contact pattern is seen through the device hole provided in the circuit board. Therefore, it is possible to make sufficient contact between the contact pattern on the circuit board and the connection terminal of the external processing device through the device hole.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing a module structure of an IC card of the present invention, and FIG. 2 is a cross-sectional view showing a state where the IC card module of FIG. 1 is housed in a card substrate.

First, in FIG. 1, the circuit board 1 is made of glass epoxy resin, for example, FR-4, and has a thin plate thickness of, for example, about 0.1 mm.
Position corresponding to card input / output terminal section, that is, IC compliant with ISO
The device holes 2 are arranged at the eight terminal positions defined by the card. After forming a copper foil pattern on one surface of the circuit board 1, by etching into a predetermined shape,
The contact pattern 3 is formed on the circuit board 1. Next, for example, a pump 5 made of a conductive material is provided on the IC chip 4 side, the IC chip 4 is attached to a predetermined position of the contact pattern 3, and then the resin injector 6 is provided from the side of the IC chip 4 and the contact pattern 3. When a thermoplastic resin 7 is injected by using a so-called side potting method, the resin 7 enters between the IC chip 4 and the circuit board 1 due to a capillary phenomenon, and the circuit board 1 and the IC chip 4 are reliably sealed. Then, the IC card module 8 is completed.

Next, referring to FIG. 2, the IC completed as described above.
In order to store and fix the card module 8 in the card substrate 9, a recess 10 for housing the IC card module 8 is provided in the card substrate 9, and heat is applied at the stepped portion 11 of the contact pattern 3 of the IC card module 8. Although they are firmly fixed by the pressure-bonding sheet 12, the mutual thicknesses of the members are set in advance so that the upper surface of the card board 9 and the surface of the circuit board 1 of the module 8 of the stored IC card are flush with each other. Good.

Therefore, the feature of this embodiment is that
As described above, the thickness of the circuit board is thin, the circuit board has a single-sided pattern, and the desired contact pattern can be seen through the device hole provided in the circuit board, so that it can be easily contacted with the connection terminal of the external processing device. it can.
Also, since resin sealing is performed by side potting, I
The C card module is thin, and further, the molding die is not necessary, so that the manufacturing cost of the highly reliable IC card module can be reduced. When the adhesion between the thermocompression bonding sheet 12 and the contact pattern 3 of the module 8 is weak, a large outer peripheral area of the circuit board 1 is used.
The circuit board 1 having good adhesion to the thermocompression bonding sheet 12 and the card board 9 may be positively brought into close contact with each other.

[0020]

As described above, according to the present invention,
In the IC card module, a contact pattern formed on one side of the thin circuit board on the side where the IC chip is mounted and a device hole provided at a predetermined position of the circuit board are passed to enable easy contact with a connection terminal of an external processing device. It is possible to provide an inexpensive IC card module that has a simple structure, is thin, and is excellent in reliability and productivity.

[Brief description of drawings]

FIG. 1 is a sectional view showing a module structure of an IC card according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a state where the IC card module of FIG. 1 is housed in a card substrate.

FIG. 3 is a cross-sectional view of essential parts showing the structure of a conventional IC card having a double-sided pattern.

FIG. 4 is a cross-sectional view showing the structure of the IC module shown in FIG.

FIG. 5 is a cross-sectional view of an essential part showing the structure of a conventional IC card having a single-sided pattern.

FIG. 6 is a cross-sectional view of an essential part showing a module structure of a conventional IC card having a single-sided pattern.

FIG. 7 is a sectional view of an essential part showing a conventional IC card module structure having a single-sided pattern.

[Explanation of symbols]

 1 Circuit Board 2 Device Hole 3 Contact Pattern 4 IC Chip 5 Bump 7 Resin 8 IC Card Module 9 Card Board 12 Thermocompression Sheet

Claims (1)

[Claims] 1. In a module structure of an IC card having a contact pattern on one surface of a circuit board on which an IC chip is mounted, a device hole is provided at a position corresponding to an IC card input / output terminal portion of the circuit board, IC
The contact pattern is formed on the chip mounting side, and the IC
The chip and the contact pattern are connected by a conductive member, the connected portion is covered, the circuit board and the IC chip are integrally sealed with resin, and the contact pattern is passed through a device hole provided in the circuit board. A module structure of an IC card, which enables contact between the connection terminal of the external processing device and the connection terminal.