JPH05279825A - Copper alloy bar scarcely causing wear to stamping die - Google Patents
Copper alloy bar scarcely causing wear to stamping dieInfo
- Publication number
- JPH05279825A JPH05279825A JP10360692A JP10360692A JPH05279825A JP H05279825 A JPH05279825 A JP H05279825A JP 10360692 A JP10360692 A JP 10360692A JP 10360692 A JP10360692 A JP 10360692A JP H05279825 A JPH05279825 A JP H05279825A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- crystal grains
- alloy strip
- strip
- wear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】
【目的】 加工用金型を摩耗させることの少ない銅合金
条材を提供する。
【構成】 Ｎｉ：１〜４％，Ｓｉ：０．１〜１％，Ｚ
ｎ：０．１〜２％を含有し、さらに必要に応じてＳｎ：
０．１〜３％を含有し、残りがＣｕおよび不可避不純物
からなる組成を有する銅合金条材において、この条材の
表面組織の結晶粒は延伸形状を有し、この延伸形状結晶
粒の平均短径をａ、平均長径をｂとすると、
ａ：５〜３５μｍ、
ｂ：７〜２００μｍ、
１．４≦ｂ／ａ≦６．７
なる寸法を有するスタンピング金型を摩耗することの少
ない銅合金条材。(57) [Abstract] [Purpose] To provide a copper alloy strip that is less likely to wear a working die. [Structure] Ni: 1 to 4%, Si: 0.1 to 1%, Z
n: 0.1 to 2%, and optionally Sn:
In a copper alloy strip containing 0.1 to 3% and the balance of Cu and inevitable impurities, the crystal grains of the surface texture of the strip have a stretched shape, and the average of the stretched crystal grains is A copper alloy that is less likely to wear a stamping die having dimensions of a: 5 to 35 μm, b: 7 to 200 μm, 1.4 ≦ b / a ≦ 6.7, where a minor axis is a and an average major axis is b. Strip material.
Description
【０００１】[0001]
【産業上の利用分野】この発明は、加工用金型を摩耗さ
せることの少ない銅合金条材に間するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper alloy strip that is less likely to wear a working die.
【０００２】[0002]
【従来の技術】一般に、電気および電子部品を製造する
場合、銅合金条材にプレス打抜き、エンボシング、コイ
ニングなどの加工（以下、これらの加工をスタンピング
と総称する）が施されることは知られている。2. Description of the Related Art Generally, it is known that copper alloy strips are subjected to processing such as press punching, embossing and coining (hereinafter, these processings are collectively referred to as stamping) when manufacturing electrical and electronic parts. ing.
【０００３】上記電気および電子部品を製造するための
銅合金条材は、高導電および高強度を兼ね備えた銅合金
条材が用いられ、かかる銅合金条材としてＣｕ−Ｎｉ−
Ｓｉ系合金（例えば、コルソン系合金）条材などが用い
られている。As the copper alloy strip for producing the above electric and electronic parts, a copper alloy strip having both high conductivity and high strength is used. As such copper alloy strip, Cu--Ni--
A Si-based alloy (for example, Corson-based alloy) strip or the like is used.
【０００４】上記銅合金条材を製造する方法としては、
上記銅合金の鋳塊を熱間圧延して得られた熱間圧延銅合
金厚板表面のスケールを除去し、ついで冷間圧延と焼鈍
を繰り返し、最終冷間圧延を行なって最終合金条材を得
る方法、または、上記スケール除去した熱間圧延銅合金
厚板を冷間圧延と焼鈍を繰り返し、ついで加熱後水冷焼
入れする溶体化処理、最終冷間圧延および時効処理を施
して最終合金材を得る方法が知られている。As a method for producing the above copper alloy strip,
The scale of the hot-rolled copper alloy plate surface obtained by hot-rolling the ingot of the copper alloy is removed, and then cold rolling and annealing are repeated, and the final cold rolling is performed to obtain the final alloy strip. Method of obtaining, or the above-described scale-removed hot-rolled copper alloy thick plate is repeatedly cold-rolled and annealed, then heated after water-quenching solution treatment, final cold rolling and aging treatment to obtain the final alloy material The method is known.
【０００５】かかる従来法で得られた銅合金条材の表面
結晶粒は、結晶粒径が５μｍ未満の微細結晶粒を圧延し
て得られた延伸形状結晶粒、または結晶粒径が４０μｍ
を越える粗大結晶粒を圧延して得られた延伸形状結晶粒
を有している。The surface crystal grains of the copper alloy strip obtained by the conventional method are stretched crystal grains obtained by rolling fine crystal grains having a crystal grain size of less than 5 μm, or a crystal grain size of 40 μm.
It has a stretched crystal grain obtained by rolling a coarse crystal grain that exceeds.
【０００６】[0006]
【発明が解決しようとする課題】上記従来の５μｍ未満
の微細結晶粒を圧延して得られた延伸形状結晶粒を有す
る銅合金条材をスタンピングすると、スタンピング金型
が激しく摩耗し、金型摩耗は加工製品の形状に悪影響を
及ぼすところからスタンピング金型は摩耗する前に頻繁
に研摩しなければならず、結局高価な金型を短期間で交
換することになり、このことは電気および電子部品のコ
ストを押上げる原因となる。When stamping a copper alloy strip having drawn crystal grains obtained by rolling the above-mentioned conventional fine crystal grains of less than 5 μm, the stamping die suffers severe wear and die wear. Since it adversely affects the shape of the processed product, the stamping mold must be frequently ground before it is worn, which eventually results in the replacement of expensive molds in a short period of time. Cause to increase the cost of.
【０００７】一方、上記従来の４０μｍを越える粗大結
晶粒を圧延して得られた延伸形状結晶粒を有する銅合金
条材は、電気および電子部品の曲げ加工において、曲げ
部分に肌荒れが現われるという問題点があった。On the other hand, the conventional copper alloy strip having stretched crystal grains obtained by rolling coarse crystal grains exceeding 40 μm has a problem that rough surface appears at the bent portion during bending of electric and electronic parts. There was a point.
【０００８】[0008]
【課題を解決するための手段】そこで、本発明者等は、
スタンピングしても金型の摩耗が少なくかつスタンピン
グ加工製品の強度および硬さが電気および電子部品とし
て十分使用に耐えることのできる銅合金条材を開発すべ
く研究を行った結果、（１） 重量％で、Ｎｉ：１〜４
％，Ｓｉ：０．１〜１％，Ｚｎ：０．１〜２％を含有
し、さらに必要に応じてＳｎ：０．１〜３％を含有し、
残りがＣｕおよび不可避不純物からなる組成を有する銅
合金鋳塊を熱間圧延し、ついで冷間圧延と焼鈍を繰り返
し、最終冷間圧延前の焼鈍において平均結晶粒度を５〜
３５μｍに調整し、最終冷間圧延の圧延率を３０〜８５
％にて圧延して得られた銅合金条材は、スタンピング金
型を摩耗させることが極めて少なくなり、またその圧延
表面組織の結晶粒は平均短径が５〜３５μｍ、平均長径
が７〜２００μｍの範囲内にありかつ平均長径／平均短
径の値が１．４〜６．７の範囲内にある延伸形状を有し
ている、（２） 上記成分組成を有する銅合金鋳塊を熱
間圧延し、ついで冷間圧延と焼鈍を繰り返したのち、温
度：８００〜１０００℃に加熱して水冷焼入れする溶体
化処理を施し、平均粒度を５〜３５μｍの微細な結晶粒
となるように粒度調整し、かかる粒度調整された溶体化
処理材を圧延率：３０〜８５％の最終冷間圧延してその
結晶粒を平均短径が５〜３５μｍ、平均長径が７〜２０
０μｍ、平均長径／平均短径：１．４〜６．７の範囲内
にあるような延伸形状とし、さらに時効処理を施し、こ
のようにして得られた銅合金条材もスタンピング金型を
摩耗させることは極めて少ない、という知見を得たので
ある。Therefore, the present inventors have
As a result of research to develop a copper alloy strip that has little wear of the die even when stamping and the strength and hardness of the stamped product can be sufficiently used as electric and electronic parts, (1) Weight %, Ni: 1 to 4
%, Si: 0.1 to 1%, Zn: 0.1 to 2%, and optionally Sn: 0.1 to 3%,
A copper alloy ingot having a composition in which the balance is Cu and inevitable impurities is hot-rolled, and then cold rolling and annealing are repeated, and an average grain size of 5 to 5 is obtained in the annealing before the final cold rolling.
Adjusted to 35 μm, the rolling ratio of the final cold rolling is 30 to 85
%, The copper alloy strip obtained by rolling at 10% significantly reduces the abrasion of the stamping die, and the crystal grains of the rolled surface texture have an average minor axis of 5 to 35 μm and an average major axis of 7 to 200 μm. Having a stretched shape in which the value of average major axis / average minor axis is within the range of 1.4 to 6.7, and (2) the copper alloy ingot having the above-described composition is hot-worked. After rolling, and then repeating cold rolling and annealing, a solution treatment is performed by heating at a temperature of 800 to 1000 ° C. and quenching with water, and the grain size is adjusted so that the average grain size becomes fine crystal grains of 5 to 35 μm. Then, the solution treated material having the adjusted grain size is subjected to final cold rolling at a rolling ratio of 30 to 85% to obtain crystal grains having an average minor axis of 5 to 35 μm and an average major axis of 7 to 20.
0 μm, average major axis / average minor axis: Stretched shape within the range of 1.4 to 6.7, further subjected to aging treatment, and the copper alloy strip thus obtained also wears the stamping die. We have found that there is very little to do.
【０００９】この発明は、かかる知見にもとづいてなさ
れたものであって、重量％で、Ｎｉ：１〜４％，Ｓｉ：
０．１〜１％，Ｚｎ：０．１〜２％を含有し、さらに必
要に応じてＳｎ：０．１〜３％を含有し、残りがＣｕお
よび不可避不純物からなる組成を有する銅合金条材にお
いて、この条材の表面組織の結晶粒は延伸形状を有し、
この延伸形状結晶粒の平均短径をａ、平均長径をｂとす
ると、 ａ：５〜３５μｍ、 ｂ：７〜２００μｍ、 １．４≦ｂ／ａ≦６．７ なる寸法を有するスタンピング金型を摩耗することの少
ない銅合金条材に特徴を有するものである。The present invention has been made on the basis of the above-mentioned findings, and in weight%, Ni: 1 to 4%, Si:
Copper alloy strip containing 0.1 to 1%, Zn: 0.1 to 2%, and optionally Sn: 0.1 to 3%, with the balance being Cu and inevitable impurities. In the material, the crystal grains of the surface texture of this strip have an elongated shape,
Assuming that the average minor axis of the stretched crystal grains is a and the average major axis is b, a: 5 to 35 μm, b: 7 to 200 μm, and a stamping die having dimensions of 1.4 ≦ b / a ≦ 6.7 It is characterized by a copper alloy strip that is less likely to wear.
【００１０】この発明において、「延伸形状結晶粒」と
は最終冷間圧延により引き伸ばされているが完全に縞状
組織とならず、引き伸ばされた結晶粒の輪部が判別する
ことができる結晶粒をいう。In the present invention, the "stretched crystal grains" are crystal grains that have been stretched by the final cold rolling but do not have a completely striped structure, and the ring portion of the stretched crystal grains can be distinguished. Say.
【００１１】また、この発明の銅合金条材を製造する際
の焼鈍は４５０〜６００℃，１〜５時間保持することに
より行なわれ、溶体化処理は８００〜１０００℃に加熱
したのち水焼入れすることにより行なわれ、時効処理は
３５０〜５００℃，１〜５時間保持することにより行わ
れる。なお、４５０〜６００℃，１〜５時間保持の焼鈍
は６５０〜９５０℃の短時間保持の条連続焼鈍に代える
こともできる。Annealing at the time of producing the copper alloy strip of the present invention is carried out by holding at 450 to 600 ° C. for 1 to 5 hours, and the solution treatment is heated to 800 to 1000 ° C. and then water quenched. The aging treatment is performed by holding at 350 to 500 ° C. for 1 to 5 hours. The annealing at 450 to 600 ° C for 1 to 5 hours can be replaced with the continuous strip annealing at 650 to 950 ° C for a short time.
【００１２】つぎに、この発明の限定理由を説明する。Next, the reasons for limitation of the present invention will be described.
【００１３】（ａ） Ｎｉ ＮｉにはＳｉとともにニッケル珪化物（Ｎｉ2 Ｓｉな
ど）を作り、強度を向上させる作用があるが、１％未満
ではさしたる効果はなく、４％を越えて含有させると導
電率低下が著しくなるとの理由によりその含有量を１〜
４％と定めた。(A) Ni Ni has the effect of forming nickel silicide (Ni 2 Si etc.) together with Si to improve the strength, but if it is less than 1%, there is no significant effect, and if it exceeds 4%, it is contained. The content of 1-
It was set at 4%.
【００１４】（ｂ） Ｓｉ Ｓｉは溶解時に脱酸の作用、またＮｉとともにニッケル
珪化物を作り強度向上の作用があるが、０．１％未満で
は、さしたる効果がなく、１％を越えて含有させると熱
間加工性が劣るようになるとの理由によりその含有量を
０．１〜１％と定めた。(B) Si Si has the function of deoxidizing during melting and the function of improving the strength by forming nickel silicide together with Ni, but if it is less than 0.1%, it does not have a measurable effect, and if it exceeds 1%, it is contained. The content is set to 0.1 to 1% because the hot workability becomes poor.
【００１５】（ｃ） Ｚｎ Ｚｎには溶解時の脱酸、脱ガスの作用、はんだ耐熱剥離
性、耐マイグレーション性を改善する作用があるが、
０．１％未満では、さしたる効果がなく、２％を越えて
含有させても、その効果が飽和傾向になるとの理由か
ら、その含有量を０．１〜２％と定めた。(C) Zn Zn has an effect of deoxidizing and degassing upon melting, and an effect of improving solder heat-resistant peeling resistance and migration resistance.
If the content is less than 0.1%, there is no significant effect, and even if the content is more than 2%, the effect tends to be saturated, so the content was set to 0.1 to 2%.
【００１６】（ｄ） Ｓｎ Ｓｎは強度を向上させる作用があるが、０．１％未満で
はさしたる効果がなく、３％を越えて含有させると導電
率の低下が著しくなるとの理由によりその含有量を０．
１〜３％と定めた。(D) Sn Sn has an action of improving the strength, but if it is less than 0.1%, it does not have a dull effect, and if it is contained in excess of 3%, the conductivity is remarkably lowered, so that its content is increased. 0.
It was set to 1-3%.
【００１７】（ｅ） 結晶粒度 この発明の銅合金条材の圧延表面の結晶粒は延伸形状を
有し、その延伸形状結晶粒の平均短径ａが５μｍ未満で
はスタンピング金型摩耗を少なくするに十分な効果が得
られず、一方、延伸形状結晶粒の平均短径ａが３５μｍ
を越えると部品の曲げ加工の際に肌荒れが目立つように
なり、スタンピング金型摩耗をこれ以上少なくすること
ができない。また延伸形状結晶粒の平均長径ｂが７μｍ
未満では圧延加工硬化による強度向上が期待できないの
で好ましくなく、一方、延伸形状結晶粒の平均長径ｂが
２００μｍを越えると圧延組織が強くなり、耐金型摩耗
性を害するようになるので好ましくない。(E) Grain size Crystal grains on the rolled surface of the copper alloy strip according to the present invention have a stretched shape, and if the average minor axis a of the stretched crystal grains is less than 5 μm, wear of the stamping die is reduced. Sufficient effect cannot be obtained, while the average minor axis a of the drawn crystal grains is 35 μm.
If it exceeds, the surface roughness becomes conspicuous during the bending of the parts, and the wear of the stamping die cannot be reduced any further. The average major axis b of the drawn crystal grains is 7 μm.
When it is less than the above range, strength improvement due to rolling work hardening cannot be expected, and on the other hand, when the average major axis b of the drawn crystal grains exceeds 200 μm, the rolling structure becomes strong and the abrasion resistance of the die is impaired, which is not preferable.
【００１８】さらに、上記延伸形状結晶粒の平均長径／
平均短径（ｂ／ａ）の値が６．７を越えると金属組織が
完全な圧延加工組織となり、スタンピング金型の摩耗を
増加させるので好ましくなく、一方、上記ｂ／ａの値が
１．４より小さいと十分な強度が得られないので好まし
くない。Further, the average major axis of the stretched crystal grains /
If the value of the average minor axis (b / a) exceeds 6.7, the metal structure becomes a completely rolled structure and wear of the stamping die is increased, which is not preferable, while the value of b / a is 1. If it is less than 4, sufficient strength cannot be obtained, which is not preferable.
【００１９】なお、この発明伸銅合金条材の合金組成に
結晶粒度の成長を制御するためＭｇ，Ｚｒ，Ｔｉ，Ｃｒ
の１種ないし２種以上を０．００１〜０．１％含有して
もよい。さらにＢ，Ｓｂ，Ｃａ，Ａｓ，Ｍｎ，Ｈｆ，Ａ
ｌ，Ｂｅ，Ｍｏ，Ｔｅ，Ｐｂ，Ｃｏ，Ｆｅ，Ｎｂ，Ｐな
どは１種ないしは２種以上０．０５％まで含有してもこ
の発明の主旨を損なわない。Ｓ，Ｏ2 はそれぞれ２０pp
m 以下に抑えるのが望ましい。In order to control the grain size growth in the alloy composition of the copper alloy strip of the present invention, Mg, Zr, Ti, Cr are used.
0.001 to 0.1% may be contained. Furthermore, B, Sb, Ca, As, Mn, Hf, A
The content of 1, 1, Be, Mo, Te, Pb, Co, Fe, Nb, P, etc. may be contained in one or two or more up to 0.05% without impairing the purpose of the present invention. S and O 2 are 20pp each
It is desirable to keep it below m.
【００２０】一方、最終合金条材を得た後、テンション
レベラーによる平坦度改善、またテンションアニーラー
やバッチ式焼鈍炉による応力歪除去またそれら処理の組
み合せによる品質、特性の改善を行なってもこの発明の
主旨を損なうものではない。On the other hand, after the final alloy strip is obtained, even if the flatness is improved by the tension leveler, the stress strain is removed by the tension annealer or the batch type annealing furnace, and the quality and the characteristics are improved by the combination of these treatments. It does not impair the gist of the invention.
【００２１】[0021]
実施例１ 表１に示される成分組成のＣｕ合金を用意し、これらＣ
ｕ合金をコアレスタイプの誘導溶解炉を用いて溶解し、
次に半連続鋳造法により厚さ：１８０mm、幅：４５０m
m、長さ：３０００mmの鋳塊を得た。引続いて上記鋳塊
を加熱炉に装入し、９００℃に加熱したのち熱間圧延を
行ない、圧延終了後４５０℃で直ちに水冷し、厚さ：１
１mmの熱間圧延板を得た。この熱間圧延板表面のスケー
ル除去のために片面０．５mmの面削を両面にわたって行
ない、厚さ：１０mmの面削板を得た。Example 1 A Cu alloy having the composition shown in Table 1 was prepared.
u alloy is melted using a coreless type induction melting furnace,
Next, by semi-continuous casting method, thickness: 180 mm, width: 450 m
An ingot having m and length of 3000 mm was obtained. Subsequently, the above ingot was charged into a heating furnace, heated to 900 ° C., and then hot-rolled, and after completion of rolling, immediately water-cooled at 450 ° C. and thickness: 1
A 1 mm hot rolled plate was obtained. In order to remove the scale on the surface of the hot-rolled sheet, a surface-cut sheet having a thickness of 10 mm was obtained by performing surface-cutting on one side of 0.5 mm.
【００２２】上記面削板を冷間圧延後５００℃に加熱の
中間焼鈍と冷間圧延を繰り返し行い、ついで最終冷間圧
延直前の最終焼鈍を表１に示される条件で行ったのち表
面の結晶粒径を測定し、その結果を表１に示した。After the cold rolling of the above faced plate, the intermediate annealing of heating to 500 ° C. and the cold rolling are repeated, and then the final annealing just before the final cold rolling is performed under the conditions shown in Table 1, and then the surface crystal is formed. The particle size was measured and the results are shown in Table 1.
【００２３】上記表１に示される条件で最終焼鈍したの
ち、さらに表１に示される圧延率で最終冷間圧延を行な
い、厚さ０．２５mmの本発明条材１〜１０、比較条材１
〜５および従来条材１〜２を製造した。After the final annealing under the conditions shown in Table 1 above, the final cold rolling was further performed at the rolling rate shown in Table 1 to obtain 0.25 mm thick strips 1 to 10 of the present invention and comparative strip 1.
.About.5 and conventional strips 1 and 2 were produced.
【００２４】[0024]
【表１】 [Table 1]
【００２５】このようにして得られた本発明条材１〜１
０、比較条材１〜５および従来条材１〜２の表面組織の
延伸形状結晶粒の平均短径ａ、平均長径ｂおよびｂ／ａ
の値を測定し、これらの測定結果を表２に示すととも
に、上記本発明条材１〜１０、比較条材１〜５および従
来条材１〜２をそれぞれＷ−Ｃｏ系超硬合金金型を用い
て、縦：１．０mm、横：２．０mmの長方形に毎分６００
ストロークのスピードで打抜き、ストローク数が１００
万回に達した時の上記金型の摩耗量を測定し、それらの
測定結果を表２に示した。The strips 1 to 1 of the present invention thus obtained
0, the average minor axis a, the average major axis b and b / a of the stretched crystal grains of the surface texture of the comparative strips 1 to 5 and the conventional strips 1 and 2
Value was measured, and these measurement results are shown in Table 2. In addition to the above-mentioned strips 1 to 10 of the present invention, comparative strips 1 to 5 and conventional strips 1 to 2, W-Co type cemented carbide molds were used. Using, to form a rectangle with a length of 1.0 mm and a width of 2.0 mm, 600 minutes per minute
Punching at stroke speed, 100 strokes
The amount of wear of the mold when the number of cycles reached 10,000 was measured, and the measurement results are shown in Table 2.
【００２６】[0026]
【表２】 [Table 2]
【００２７】実施例２ 表３に示す成分組成のＣｕ合金を実施例１と同様の溶解
・鋳造して鋳塊を作製し、この鋳塊を実施例１と同様に
して加熱し、熱間圧延し、面削を行なうことにより厚
さ：１０mmの面削板を得た。Example 2 A Cu alloy having the composition shown in Table 3 was melted and cast in the same manner as in Example 1 to prepare an ingot, which was heated in the same manner as in Example 1 and hot-rolled. Then, a chamfered plate having a thickness of 10 mm was obtained by performing chamfering.
【００２８】上記面削板を冷間圧延後５００℃に加熱の
中間焼鈍と冷間圧延を繰り返し、最終冷間圧延前の銅合
金条材に、連続的に表３に示される条件で加熱保持した
のち水焼入れする溶体化処理を施した。After the cold rolling of the above faced plate, the intermediate annealing and the cold rolling of heating at 500 ° C. are repeated, and the copper alloy strip before the final cold rolling is continuously heated and held under the conditions shown in Table 3. After that, a solution treatment of water quenching was performed.
【００２９】その後、表３に示される圧延率で最終冷間
圧延を行ない、厚さ：０．２５mmの銅合金条材を作製
し、引き続いて４７０℃、９０分保持の時効処理を行な
い、本発明条材１１〜２０、比較条材６〜１０および従
来条材３〜４を得た。Thereafter, final cold rolling was carried out at the rolling ratios shown in Table 3 to produce a copper alloy strip having a thickness of 0.25 mm, which was subsequently subjected to an aging treatment at 470 ° C. for 90 minutes, followed by Invention strips 11 to 20, comparative strips 6 to 10 and conventional strips 3 to 4 were obtained.
【００３０】[0030]
【表３】 [Table 3]
【００３１】このようにして得られた本発明条材１１〜
２０、比較条材６〜１０および従来条材３〜４のそれぞ
れの表面組織の延伸形状結晶粒の平均短径ａ、平均長径
ｂおよびｂ／ａの値を測定し、これらの測定結果を表４
に示すとともに、上記本発明条材１１〜２０、比較条材
６〜１０および従来条材３〜４を実施例１と同様の方法
で打抜き、金型の摩耗量を測定し、これら測定結果を表
４に示した。The strips 11 to 11 of the present invention thus obtained
20, the values of the average minor axis a, the average major axis b and b / a of the drawn crystal grains of the surface texture of each of the comparative strips 6 to 10 and the conventional strips 3 to 4 were measured, and the measurement results are shown in the table. Four
In addition to the above, the present invention strips 11 to 20, the comparative strips 6 to 10 and the conventional strips 3 to 4 were punched by the same method as in Example 1 to measure the wear amount of the mold, and the measurement results are shown. The results are shown in Table 4.
【００３２】[0032]
【表４】 [Table 4]
【００３３】[0033]
【発明の効果】表１〜表４に示される結果から、本発明
条材１〜２０は、従来条材１〜４に比較し、スタンピン
グに際して金型を摩耗させることが極めて少ないことが
わかる。また、この発明の範囲から外れた比較条材（表
２および表４における＊印はこの発明から外れた値を示
す）１〜１０は、金型の摩耗量が多いものあるいは金型
摩耗量が少なくても備考に示した電気または電子部品と
して好ましくない性質を示すことがわかる。From the results shown in Tables 1 to 4, it can be seen that the strips 1 to 20 of the present invention are much less likely to wear the die during stamping as compared with the conventional strips 1 to 4. Further, comparative strips (* in Tables 2 and 4 indicate values outside the scope of the invention) 1 to 10 outside the scope of the present invention have a large amount of wear of the mold or the amount of wear of the mold. It can be seen that at least the properties unfavorable for the electric or electronic parts shown in the remarks are exhibited.
【００３４】上述のように、この発明の銅合金条材をス
タンピングして電気および電子部品を製造すると、金型
の交換回数を減らすことができるため、コストを大幅に
削減することができ、産業上すぐれた効果をもたらすも
のである。As described above, when the copper alloy strip of the present invention is stamped to produce electric and electronic parts, the number of times of die replacement can be reduced, so that the cost can be greatly reduced and the industrial It has excellent effects.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成４年５月１１日[Submission date] May 11, 1992
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３４[Correction target item name] 0034
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３４】また、この発明の銅合金条材を使用してリ
ードフレームを試作する場合、エッチングにより銅合金
条材から複数単位のリードフレームが連なったリードフ
レーム帯を作製し、この複数単位のリードフレームが連
なったリードフレーム帯を切断して１単位づつのリード
フレームを作製することも行なわれるが、この発明の銅
合金条材はかかる切断に際して使用する切刃を摩耗させ
ることの極めて少ない効果もある。上述のように、この
発明の銅合金条材をスタンピングまたは切断して電気お
よび電子部品を製造すると金型または切刃の交換回数を
減らすことができるため、コストを大幅に削減すること
ができ、産業上すぐれた効果をもたらすものである。When a lead frame is trial-produced using the copper alloy strip of the present invention, a lead frame band in which a plurality of units of lead frames are connected from the copper alloy strip is produced by etching, and the lead of this plurality of units is manufactured. It is also possible to cut a lead frame band in which frames are connected to each other to produce a lead frame for each unit, but the copper alloy strip of the present invention also has an effect of extremely reducing abrasion of a cutting edge used for such cutting. is there. As described above, stamping or cutting the copper alloy strip of the present invention to manufacture electric and electronic components can reduce the number of times of exchanging the mold or the cutting blade, and thus can significantly reduce the cost. It has excellent industrial effects.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 桑原 萬平 福島県会津若松市扇町128−７ 三菱伸銅 株式会社若松製作所内 (72)発明者 千葉 俊一 福島県会津若松市扇町128−７ 三菱伸銅 株式会社若松製作所内 (72)発明者 榊原 直男 福島県会津若松市扇町128−７ 三菱伸銅 株式会社若松製作所内 (72)発明者 熊谷 淳一 福島県会津若松市扇町128−７ 三菱伸銅 株式会社若松製作所内 (72)発明者 小田嶋 美智代 福島県会津若松市扇町128−７ 三菱伸銅 株式会社若松製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Manpei Kuwahara 128-7 Ogimachi, Aizuwakamatsu City, Fukushima Prefecture Mitsubishi Shindoh Co., Ltd. Wakamatsu Plant (72) Inventor Shunichi Chiba 128-7 Ogimachi, Aizuwakamatsu City, Fukushima Prefecture Mitsubishi Shindoh Wakamatsu Manufacturing Co., Ltd. (72) Inventor Nao Sakakibara 128-7 Ogimachi, Aizuwakamatsu, Fukushima Prefecture Mitsubishi Shindoh Co., Ltd. Wakamatsu Manufacturing Co., Ltd. (72) Inoue Kumagai 128-7 Ogimachi, Aizuwakamatsu, Fukushima Mitsubishi Shindoh Co., Ltd. Company Wakamatsu Works (72) Inventor Michiyo Odajima 128-7 Ogimachi, Aizuwakamatsu City, Fukushima Prefecture Wakamatsu Works, Mitsubishi Shindoh Co., Ltd.
Claims (2)
１〜１％，Ｚｎ：０．１〜２％を含有し、残りがＣｕお
よび不可避不純物からなる組成を有する銅合金条材にお
いて、 この条材の表面組織の結晶粒は引き伸ばされた形状（以
下、この形状を延伸形状という）を有し、この延伸形状
結晶粒の平均短径をａ、平均長径をｂとすると、 ａ：５〜３５μｍ、 ｂ：７〜２００μｍ、 １．４≦ｂ／ａ≦６．７ なる寸法を有することを特徴とするスタンピング金型を
摩耗することの少ない銅合金条材。1. By weight%, Ni: 1 to 4%, Si: 0.
In a copper alloy strip containing 1 to 1%, Zn: 0.1 to 2%, and the balance being Cu and inevitable impurities, the crystal grains of the surface texture of the strip have a stretched shape (hereinafter , And the average minor axis of the stretched crystal grains is a and the average major axis is b, a: 5 to 35 μm, b: 7 to 200 μm, 1.4 ≦ b / a A copper alloy strip that is less likely to wear a stamping die, having a dimension of ≦ 6.7.
１〜１％，Ｚｎ：０．１〜２％，Ｓｎ：０．１〜３％を
含有し、残りがＣｕおよび不可避不純物からなる組成を
有する銅合金条材において、 この条材の表面組織の結晶粒は延伸形状を有し、この延
伸形状結晶粒の平均短径をａ、平均長径をｂとすると、 ａ：５〜３５μｍ、 ｂ：７〜２００μｍ、 １．４≦ｂ／ａ≦６．７ なる寸法を有することを特徴とするスタンピング金型を
摩耗することの少ない銅合金条材。2. Ni: 1 to 4%, Si: 0.
In a copper alloy strip containing 1 to 1%, Zn: 0.1 to 2%, Sn: 0.1 to 3%, and the balance of Cu and unavoidable impurities, the surface texture of this strip is The crystal grains have a stretched shape, and when the average minor axis of the stretched crystal grains is a and the average major axis is b, a: 5 to 35 μm, b: 7 to 200 μm, 1.4 ≦ b / a ≦ 6. 7. A copper alloy strip with less wear of a stamping die, which has a dimension of 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10360692A JP3334157B2 (en) | 1992-03-30 | 1992-03-30 | Copper alloy strip with less wear on stamping mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10360692A JP3334157B2 (en) | 1992-03-30 | 1992-03-30 | Copper alloy strip with less wear on stamping mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05279825A true JPH05279825A (en) | 1993-10-26 |
| JP3334157B2 JP3334157B2 (en) | 2002-10-15 |
Family
ID=14358436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10360692A Expired - Lifetime JP3334157B2 (en) | 1992-03-30 | 1992-03-30 | Copper alloy strip with less wear on stamping mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3334157B2 (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002020825A (en) * | 2000-05-20 | 2002-01-23 | Stolberger Metallwerke Gmbh & Co Kg | Electroconductive metallic band and connector |
| JP2002025334A (en) * | 2000-05-20 | 2002-01-25 | Stolberger Metallwerke Gmbh & Co Kg | Conductive metal band and connector made of the same |
| JP2002180165A (en) * | 2000-12-18 | 2002-06-26 | Dowa Mining Co Ltd | Copper base alloy excellent in press punching property and method for producing the same |
| WO2003076672A1 (en) * | 2002-03-12 | 2003-09-18 | The Furukawa Electric Co., Ltd. | High-strength high-conductivity copper alloy wire rod of excellent resistance to stress relaxation characteristics |
| JP2006016629A (en) * | 2004-06-30 | 2006-01-19 | Nikko Metal Manufacturing Co Ltd | Cu-Ni-Si BASED COPPER ALLOY STRIP HAVING EXCELLENT BENDING WORKABILITY IN BAD WAY |
| JP2006219733A (en) * | 2005-02-14 | 2006-08-24 | Kobe Steel Ltd | Copper alloy sheet for electric-electronic component having reduced anisotropy |
| WO2007138956A1 (en) | 2006-05-26 | 2007-12-06 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy having high strength, high electric conductivity and excellent bending workability |
| WO2008032738A1 (en) * | 2006-09-12 | 2008-03-20 | The Furukawa Electric Co., Ltd. | Copper alloy plate material for electrical/electronic equipment and process for producing the same |
| WO2008038593A1 (en) * | 2006-09-25 | 2008-04-03 | Nippon Mining & Metals Co., Ltd. | Cu-Ni-Si ALLOY |
| JP2009068114A (en) * | 2008-10-30 | 2009-04-02 | Dowa Holdings Co Ltd | Copper alloy excellent in press-punching property and its production method |
| WO2009099198A1 (en) | 2008-02-08 | 2009-08-13 | The Furukawa Electric Co., Ltd. | Copper alloy material for electric and electronic components |
| JP4830048B1 (en) * | 2010-07-07 | 2011-12-07 | 三菱伸銅株式会社 | Cu-Ni-Si based copper alloy sheet excellent in deep drawing workability and method for producing the same |
| JP5030191B1 (en) * | 2011-05-25 | 2012-09-19 | 三菱伸銅株式会社 | Cu-Ni-Si based copper alloy sheet excellent in deep drawing workability and method for producing the same |
| WO2012160726A1 (en) * | 2011-05-25 | 2012-11-29 | 三菱伸銅株式会社 | Cu-ni-si copper alloy sheet with excellent deep drawability and process for producing same |
| JP5189708B1 (en) * | 2011-12-22 | 2013-04-24 | 三菱伸銅株式会社 | Cu-Ni-Si-based copper alloy sheet having good mold wear resistance and shearing workability and method for producing the same |
| JP2015034328A (en) * | 2013-08-09 | 2015-02-19 | 古河電気工業株式会社 | Copper alloy sheet material and production method thereof |
-
1992
- 1992-03-30 JP JP10360692A patent/JP3334157B2/en not_active Expired - Lifetime
Cited By (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002025334A (en) * | 2000-05-20 | 2002-01-25 | Stolberger Metallwerke Gmbh & Co Kg | Conductive metal band and connector made of the same |
| JP2002020825A (en) * | 2000-05-20 | 2002-01-23 | Stolberger Metallwerke Gmbh & Co Kg | Electroconductive metallic band and connector |
| JP2002180165A (en) * | 2000-12-18 | 2002-06-26 | Dowa Mining Co Ltd | Copper base alloy excellent in press punching property and method for producing the same |
| JP4729680B2 (en) * | 2000-12-18 | 2011-07-20 | Ｄｏｗａメタルテック株式会社 | Copper-based alloy with excellent press punchability |
| US7648601B2 (en) | 2002-03-12 | 2010-01-19 | Furukawa Electric Co., Ltd. | High-strength, high-conductivity copper alloy wire excellent in resistance to stress relaxation |
| WO2003076672A1 (en) * | 2002-03-12 | 2003-09-18 | The Furukawa Electric Co., Ltd. | High-strength high-conductivity copper alloy wire rod of excellent resistance to stress relaxation characteristics |
| KR100787269B1 (en) * | 2002-03-12 | 2007-12-21 | 후루카와 덴키 고교 가부시키가이샤 | Manufacturing method of high strength high conductivity copper alloy wire with excellent stress relaxation resistance |
| JP2006016629A (en) * | 2004-06-30 | 2006-01-19 | Nikko Metal Manufacturing Co Ltd | Cu-Ni-Si BASED COPPER ALLOY STRIP HAVING EXCELLENT BENDING WORKABILITY IN BAD WAY |
| JP4566020B2 (en) * | 2005-02-14 | 2010-10-20 | 株式会社神戸製鋼所 | Copper alloy sheet for electrical and electronic parts with low anisotropy |
| JP2006219733A (en) * | 2005-02-14 | 2006-08-24 | Kobe Steel Ltd | Copper alloy sheet for electric-electronic component having reduced anisotropy |
| EP2426225A2 (en) | 2006-05-26 | 2012-03-07 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy with high strength, high electrical conductivity, and excellent bendability |
| US8357248B2 (en) | 2006-05-26 | 2013-01-22 | Kobe Steel, Ltd. | Copper alloy having high strength, high electric conductivity and excellent bending workability |
| WO2007138956A1 (en) | 2006-05-26 | 2007-12-06 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy having high strength, high electric conductivity and excellent bending workability |
| US9177686B2 (en) | 2006-05-26 | 2015-11-03 | Kobe Steel, Ltd. | Copper alloy having high strength, high electric conductivity and excellent bending workability |
| US8268098B2 (en) | 2006-05-26 | 2012-09-18 | Kobe Steel, Ltd. | Copper alloy having high strength, high electric conductivity and excellent bending workability |
| WO2008032738A1 (en) * | 2006-09-12 | 2008-03-20 | The Furukawa Electric Co., Ltd. | Copper alloy plate material for electrical/electronic equipment and process for producing the same |
| US7947133B2 (en) | 2006-09-12 | 2011-05-24 | Furukawa Electric Co., Ltd. | Copper alloy strip material for electrical/electronic equipment and process for producing the same |
| JP2008095185A (en) * | 2006-09-12 | 2008-04-24 | Furukawa Electric Co Ltd:The | Copper alloy plate material for electrical/electronic equipment and process for producing the same |
| WO2008038593A1 (en) * | 2006-09-25 | 2008-04-03 | Nippon Mining & Metals Co., Ltd. | Cu-Ni-Si ALLOY |
| WO2009099198A1 (en) | 2008-02-08 | 2009-08-13 | The Furukawa Electric Co., Ltd. | Copper alloy material for electric and electronic components |
| JP2009068114A (en) * | 2008-10-30 | 2009-04-02 | Dowa Holdings Co Ltd | Copper alloy excellent in press-punching property and its production method |
| US9435016B2 (en) | 2010-07-07 | 2016-09-06 | Mitsubishi Shindoh Co., Ltd. | Cu-Ni-Si-based copper alloy plate having excellent deep drawing workability and method of manufacturing the same |
| WO2012004868A1 (en) * | 2010-07-07 | 2012-01-12 | 三菱伸銅株式会社 | Cu-ni-si copper alloy plate with excellent deep-draw characteristics and production method thereof |
| JP4830048B1 (en) * | 2010-07-07 | 2011-12-07 | 三菱伸銅株式会社 | Cu-Ni-Si based copper alloy sheet excellent in deep drawing workability and method for producing the same |
| JP5030191B1 (en) * | 2011-05-25 | 2012-09-19 | 三菱伸銅株式会社 | Cu-Ni-Si based copper alloy sheet excellent in deep drawing workability and method for producing the same |
| WO2012160684A1 (en) * | 2011-05-25 | 2012-11-29 | 三菱伸銅株式会社 | Cu-ni-si copper alloy sheet with excellent deep drawability and process for producing same |
| WO2012160726A1 (en) * | 2011-05-25 | 2012-11-29 | 三菱伸銅株式会社 | Cu-ni-si copper alloy sheet with excellent deep drawability and process for producing same |
| JP5189708B1 (en) * | 2011-12-22 | 2013-04-24 | 三菱伸銅株式会社 | Cu-Ni-Si-based copper alloy sheet having good mold wear resistance and shearing workability and method for producing the same |
| WO2013094061A1 (en) * | 2011-12-22 | 2013-06-27 | 三菱伸銅株式会社 | Cu-Ni-Si BASED COPPER ALLOY SHEET HAVING HIGH DIE ABRASION RESISTANCE AND GOOD SHEAR PROCESSABILITY AND METHOD FOR PRODUCING SAME |
| US10253405B2 (en) | 2011-12-22 | 2019-04-09 | Mitsubishi Shindoh Co., Ltd. | Cu—Ni—Si-based copper alloy sheet having excellent mold abrasion resistance and shear workability and method for manufacturing same |
| JP2015034328A (en) * | 2013-08-09 | 2015-02-19 | 古河電気工業株式会社 | Copper alloy sheet material and production method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3334157B2 (en) | 2002-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3334157B2 (en) | Copper alloy strip with less wear on stamping mold | |
| KR101331339B1 (en) | Cu-ni-si-co based copper ally for electronic materials and manufacturing method therefor | |
| EP0175183B1 (en) | Copper alloys having an improved combination of strength and conductivity | |
| KR101809377B1 (en) | Manufacturing method of Fe-Ni based alloy strip | |
| CN100562592C (en) | Copper alloy material excellent in press workability and manufacturing method thereof | |
| CN1327016C (en) | Copper base alloy with improved punchin and impacting performance and its preparing method | |
| KR102035399B1 (en) | Manufacturing method of pure copper plates, and pure copper plate | |
| EP2607508A1 (en) | Copper-cobalt-silicon alloy for electrode material | |
| CA1247505A (en) | Process for treating copper-nickel alloys for use in brazed assemblies | |
| JP2010229438A (en) | Copper alloy sheet and manufacturing method therefor | |
| JP5544316B2 (en) | Cu-Co-Si-based alloys, copper products, electronic parts, and connectors | |
| JP3353324B2 (en) | Copper alloy cold-rolled strip with low abrasion of stamping die and method of manufacturing the same | |
| JP3334172B2 (en) | Copper alloy strip with less wear on stamping mold | |
| JPH07242965A (en) | Copper alloy excellent in plating property and conductivity and thin plate or strip made of this copper alloy | |
| JPH10265873A (en) | Copper alloy for electrical/electronic parts and its production | |
| JP3763234B2 (en) | Method for producing high-strength, high-conductivity, high-heat-resistant copper-based alloy | |
| JPH05279824A (en) | Copper alloy bar scarcely causing wear to stamping die | |
| JP3911750B2 (en) | Manufacturing method of hot working dies | |
| JPH0633170A (en) | Copper alloy strip that does not easily wear stamping dies | |
| JPH05279823A (en) | Phosphor bronze strip material that does not easily wear stamping dies | |
| JPH0813066A (en) | Copper alloy or copper alloy sheet with excellent stamping properties | |
| JP2501636B2 (en) | Cu alloy material for the lead frame of semiconductor device, which has excellent effect of suppressing stamping die wear | |
| JPH108167A (en) | Copper alloy with excellent hot workability | |
| JP2018204115A (en) | Copper alloy having excellent heat resistance | |
| JPH0285330A (en) | Copper alloy having good press bendability and its manufacture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070802 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 6 Free format text: PAYMENT UNTIL: 20080802 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090802 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100802 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100802 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110802 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 9 Free format text: PAYMENT UNTIL: 20110802 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120802 Year of fee payment: 10 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120802 Year of fee payment: 10 |