JPH05275552A - Package for encapsulating electronic component - Google Patents

Abstract

(57) [Abstract] [Purpose] Solder as an encapsulating material is prevented from protruding as a spherical projection outside the package for storing electronic parts, and the projection made of the solder is an external electric circuit board. An object of the present invention is to provide an electronic component storage package that can effectively prevent the wiring conductors of the external electric circuit board from being dropped and short-circuited. [Structure] A rectangular insulating substrate 1 having a frame-shaped metal layer 8 adhered to the upper surface outer peripheral portion, and a rectangular lid 2 having a frame-shaped metal layer 9 applied to the lower surface outer peripheral portion. , Insulating base 1 and lid 2
Is a package for storing electronic parts, in which the electronic layers are hermetically housed inside by bonding the respective metal layers 8 and 9 via a sealing material 10 made of solder. A notch A is formed in at least one corner of the body 2, and a metal layer 11 communicating with the metal layers 8 and 9 attached to the insulating substrate 1 or the lid 2 is formed on the surface of the notch A. ..

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improved electronic component storage package for storing electronic components such as semiconductor elements and crystal oscillators.

[0002]

2. Description of the Related Art Conventionally, an electronic component housing package for housing an electronic component, for example, a piezoelectric vibrator for obtaining a predetermined vibration frequency, is generally made of an electrically insulating material such as alumina ceramics as shown in FIG. A rectangular insulating substrate 21 having a metallized wiring layer 22 made of a refractory metal powder such as tungsten, molybdenum, or manganese, which is drawn from the top surface to the bottom surface, and a portion of the metallized wiring layer 22 is electrically conductive with an adhesive. And a holding metal fitting 23 for holding the piezoelectric vibrator 25 and connecting an electrode of the piezoelectric vibrator 25 to an external electric circuit board, and a bowl-shaped lid 24 also made of an electrically insulating material. The piezoelectric vibrator 25 is adhered and held on the holding metal fitting 23 through a conductive adhesive such as polyimide, and each electrode of the piezoelectric vibrator 25 is held by the holding metal fitting 2. Then, the lid 24 is joined to the upper surface of the insulating base 21 by the sealing material 26 made of solder, and the piezoelectric vibrator 25 is placed inside the container made up of the insulating base 21 and the lid 24. Is hermetically sealed to form a piezoelectric vibration element as a final product.

In the package for storing electronic parts, frame-shaped metallized metal layers 27 and 28 made of high melting point powder of tungsten, molybdenum or the like are preliminarily formed on the outer periphery of the upper surface of the insulating substrate 21 and the outer periphery of the lower surface of the lid 24. , The metallized metal layers 27 and 28 are adhered to each other with the sealing material 26 made of solder, so that the lid 24 is covered with the insulating base 2.
1 will be joined.

Further, in order to improve the workability of the lid 24 to the insulating substrate 21, the metallized metal layer 28 previously attached to the lid 24 is joined with solder as the sealing material 26. The metallized metal layer 2 of the insulating base 21
7, the lid 24 is placed with the solder sandwiched therebetween, and then the lid 24 is pressed against the insulating base 21 side with a constant pressure and a temperature of about 300 to 350 ° C. is applied to the solder. Then, the solder is heated and melted.

[0005]

However, in this conventional package for housing electronic components, the insulating base 21 and the lid 24 are poor in wettability of the alumina ceramics constituting the insulating base 21 and the lid 24 with respect to the solder. When the piezoelectric vibrator 25 is hermetically sealed inside the container made of, the solder as the sealing material 26 is heated and melted while pressing the lid body 24 toward the insulating base 21 side. )
Is pushed to the corners of the insulating base body 21 and the lid 24 by the pressing force of the lid 24, and a part thereof protrudes to the outside to form a spherical protrusion 29 as shown in FIG.
This has the drawback that when the piezoelectric vibrating element is mounted on an external electric circuit board, it drops onto the external electric circuit board, short-circuiting the wiring conductors of the external electric circuit board.

[0006]

SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned drawbacks, and it is an object of the present invention that solder as a sealing material protrudes as a spherical projection outside the insulating substrate and the lid. Another object of the present invention is to provide a package for storing electronic components, which can prevent the protrusion from dropping on the external electric circuit board and short-circuiting the wiring conductor of the external electric circuit board.

[0007]

According to the present invention, there is provided a rectangular insulating substrate having a frame-shaped metal layer deposited on the outer peripheral surface of an upper surface, and a rectangular insulating substrate having a frame-shaped metal layer deposited on the outer peripheral surface of a lower surface. A package for storing electronic parts, which comprises an insulating base and a metal layer of each of the insulating base and a cover, which are bonded to each other through a sealing material made of solder to hermetically house electronic parts inside. And forming a notch in at least one corner of the insulating base or the lid and forming a metal layer on the surface of the notch communicating with the metal layer adhered to the insulating base or the lid. It is characterized by that.

[0008]

According to the electronic component storing package of the present invention,
Since a notch is formed in at least one corner of the rectangular insulating base and the lid, and a metal layer communicating with the frame-shaped metal layer provided on the insulating base or the lid is formed on the surface of the notch. When the lid is joined to the insulating base, even if the solder as the sealing material protrudes from the corners of the insulating base and the lid, the protruding solder is a notch formed in the corner of the insulating base or the lid. Will not flow out and adhere onto the metal layer, and will not project as spherical projections.

[0009]

The present invention will now be described in detail with reference to the accompanying drawings.

FIGS. 1 and 2 show an embodiment in which the package for housing electronic parts of the present invention is applied to a package for housing a piezoelectric vibrator, wherein 1 is an insulating substrate and 2 is a lid. The insulating base 1 and the lid 2 form a container 4 for housing the piezoelectric vibrator 3.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or a silicon carbide aggregate, for example, an aluminum oxide sintered body. In the case, alumina, silica, calcia, magnesia, and other raw material powders are mixed with a suitable binder and organic solvent to form a slurry, and this is made into a slurry by using the well-known doctor blade method, calendar roll method, etc. A sheet (ceramic green sheet) is obtained, and thereafter, a suitable punching process is performed on the sheet, and a plurality of sheets are laminated and fired at a high temperature (about 1600 ° C.).

A metallized wiring layer 6 extending from the upper surface to the lower surface through the through holes 5 is adhered to the insulating base 1, and the piezoelectric vibrator is provided on the upper surface of the insulating base 1 of the metallized wiring layer 6. A holding member 7 for holding 3 is attached via a conductive adhesive, and the lower surface portion of the insulating substrate 1 is connected to an external electric circuit board via a conductive adhesive such as solder.

The metallized wiring layer 6 is made of a refractory metal powder such as tungsten, molybdenum or manganese, and a metal paste obtained by adding and mixing an appropriate binder and an organic solvent to the refractory metal powder such as tungsten is insulated. The ceramic green sheet to be the substrate 1 is printed and applied in advance by using a thick film technique such as a well-known screen printing method so as to lead out from the upper face of the insulating substrate 1 to the lower face through the through hole 5. Formed.

The metallized wiring layer 6 is formed by depositing a metal such as nickel or gold, which has good conductivity and corrosion resistance, on the surface of the metallized wiring layer 6 by plating to a thickness of 1.0 to 20.0 μm. It is possible to effectively prevent the wiring layer 6 from being oxidized and corroded. Therefore, the surface of the metallized wiring layer 6 is coated with nickel, gold or the like in an amount of 1.0 to 20.0 in order to prevent the metallized wiring layer 6 from being oxidized and corroded.
It is preferable that a layer having a thickness of μm is deposited.

A holding member 7 is attached to the metallized wiring layer 6 on the upper surface of the insulating substrate 1 through a conductive adhesive such as conductive polyimide, and the upper portion of the holding member 7 is also electrically conductive. The piezoelectric vibrator 3 is adhesively held so that its electrode is electrically connected to the holding member 7 via a conductive adhesive such as polyimide.

The holding member 7 has a function of holding the piezoelectric vibrator 3 and electrically connecting the electrodes of the piezoelectric vibrator 3 to the metallized wiring layer 6, for example, nickel silver (Cu-Zn-).
Ni alloy) and Kovar (Fe-Ni-Co alloy), 42
It is made of metal having elasticity such as alloy (Fe-Ni alloy).

The holding member 7 is manufactured into a predetermined shape by adopting a conventionally known metal working method such as punching and bending on a plate material such as nickel silver.

A frame-shaped metallized metal layer 8 is deposited on the outer peripheral portion of the upper surface of the insulating substrate 1, and a bowl-shaped lid 2 made of solder is formed on the metallized metal layer 8.
The piezoelectric vibrator 3 is hermetically sealed inside the container 4 composed of the insulating base 1 and the lid 2.

The metallized metal layer 8 deposited on the outer peripheral portion of the upper surface of the insulating substrate 1 is made of a refractory metal powder such as tungsten, molybdenum or manganese, and a suitable binder or organic solvent for the refractory metal powder such as tungsten. Is added and mixed to obtain a metal paste on the ceramic green sheet to be the insulating substrate 1 in advance by a thick film method such as a well-known screen printing method to form a frame on the outer periphery of the upper surface of the insulating substrate 1. Be applied.

The metallized metal layer 8 is plated with a metal having good wettability with respect to solder such as nickel or gold by plating so that the solder constituting the sealing material 10 is firmly bonded to the surface thereof. It is layered to a thickness of 20.0 μm.

The insulating base 1 is also formed with a notch A from the upper surface to the lower surface of the corner thereof, and the metallized metal layer 8 on the upper surface of the insulating base 1 is formed on the surface of the notch A.
A metallized metal layer 11 made of a high melting point metal powder such as tungsten or molybdenum is formed by deposition.

The notch A having the metallized metal layer 11 formed on the insulating base 1 is metalized when the lid 2 is joined to the metallized metal layer 8 of the insulating base 1 via the sealing material 10 made of solder. The sealing material 10 protruding from between the insulating substrate 1 and the lid body 2 is made to flow out and adhere to the metal layer 11 to effectively form a spherical projection made of the sealing material 10 on the outside of the container 4. This prevents the spherical projections made of the sealing material 10 from dropping on the external electric circuit board and short-circuiting the wiring conductors.

The cutouts A provided at the corners of the insulating base 1 are formed by punching a ceramic green sheet to be the insulating base 1 into a predetermined shape in advance from the upper surface to the lower surface of the corners of the insulating base 1. The metallized metal layer 1 formed and deposited on the surface of the cutout portion A.
1 is a high-melting-point metal powder of tungsten, molybdenum, or the like, to which a metal paste obtained by adding and mixing an appropriate binder and an organic solvent is preliminarily applied to a ceramic green sheet serving as the insulating substrate 1 by a thick film method such as a conventionally known screen printing method By printing and coating, it is adhered and formed on the surface of the notch A at the corner of the insulating substrate 1.

If the depth t of the cutout portion A is less than 0.1 mm, it becomes difficult to properly flow out and adhere the sealing material 10 protruding from the container 4 onto the metallized metal layer 10. It is preferable that the notch A has a depth t of 0.1 mm or more.

Further, the metallized metal layer 11 to be deposited on the surface of the notch A is plated with a metal having good wettability to solder such as nickel or gold to a thickness of 1.0 to 20.0 μm. When the sealing material 10 is layered, the sealing material 10 made of solder and flowing out and adhering to the metallized metal layer 11 can be further improved. Therefore, it is preferable that the surface of the metallized metal layer 10 be plated with a metal having good wettability with respect to solder such as nickel and gold to a thickness of 1.0 to 20.0 μm by plating.

On the other hand, a bowl-shaped lid 2 is bonded to the metallized metal layer 8 deposited on the outer peripheral portion of the upper surface of the insulating substrate 1, and the lid 2 is made of an aluminum oxide sintered body or a mullite sintered body. Made of an electrically insulating material such as a sintered body, an aluminum nitride sintered body or a silicon carbide sintered body. For example, when it is made of an aluminum oxide sintered body, it is suitable as a raw material powder of alumina, silica, calcia, magnesia, etc. It is manufactured by filling a mixture of a binder and an organic solvent in a press die having a predetermined shape and applying a constant pressure for molding, and then firing the molded product at a temperature of about 1600 ° C. It

Further, a frame-shaped metallized metal layer 9 is deposited on the outer peripheral portion of the lower surface of the lid body 2, and the frame-shaped metallized metal layer 9 is formed on the upper surface of the insulating substrate 1.
The insulating substrate 1 is bonded to the insulating substrate 1 via the sealing material 10.
The lid 2 is joined to the upper surface of the.

The metallized metal layer 9 attached to the lid 2 is made of a metal such as silver-palladium, and is a metal paste obtained by adding and mixing glass frit, a binder, and an organic solvent to silver and palladium powders. Is applied to the outer peripheral surface of the lower surface of the lid body 2 by a thick film method such as a well-known screen printing method, and is baked at a temperature of about 1000 ° C. It

Further, a sealing material 10 made of solder is previously adhered and bonded to the surface of the metallized metal layer 9 in order to improve workability when the lid 2 is bonded to the insulating substrate 1. The encapsulant 10 consisting of a solder paste obtained by adding and mixing an appropriate binder and an organic solvent to solder powder is applied by printing on the metallized metal layer 9 by a conventionally known screen printing method and the temperature is set to about 350 ° C. It is adhered and bonded to the surface of the metallized metal layer 9 by heating and melting at.

Thus, according to the package for storing electronic parts of the present invention, the piezoelectric vibrator 3 is adhered and fixed to the holding member 7 attached to the insulating base 1 with a conductive adhesive and is attached to the upper surface of the insulating base 1. The metallized metal layer 8 and the lid 2
The metallized metal layer 9 adhered to the lower surface of the container is joined via the sealing material 10 made of solder which is adhered to the lid body 2 in advance, and the inside of the container 4 composed of the insulating substrate 1 and the lid body 2 is joined. Further, the piezoelectric vibrator 3 is hermetically sealed to form a piezoelectric vibrating element as a product.

The present invention is not limited to the above-described embodiment, but various modifications can be made without departing from the gist of the present invention. For example, in the above-described embodiment, the cutout portion A is Although the insulating base 1 is formed from the upper surface to the lower surface, the cutout portion A may be formed only in a part of the upper surface side of the insulating base 1, and the cutout portion A is formed in a corner portion of the lid body 2. May be done.

Further, although the above-described embodiment is the electronic component housing package which houses the piezoelectric vibrator, it may be an electronic component housing package which houses the integrated circuit element and the surface acoustic wave filter.

[0033]

According to the package for storing electronic parts of the present invention, since the notch portion A having the metallized metal layer 11 communicating with the metallized metal layer 8 is formed at the corner portion of the insulating substrate 1, the insulating substrate 1 is formed. Lid 2 on the metallized metal layer 8 of
When they are joined via the sealing material 10 made of solder, the sealing material 10 protruding from between the insulating substrate 1 and the lid 2 flows out and adheres to the metallized metal layer 11 of the cutout portion A, and the container 4
There is no spherical projection to the outside of the, and as a result, when mounting the piezoelectric vibration element on the external electric circuit board,
There is no possibility that the projection made of spherical solder will fall onto the external electric circuit board and short-circuit between the wiring conductors.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment in which the present invention is applied to a package for storing electronic parts that accommodates a piezoelectric vibrator.

FIG. 2 is a cross-sectional view of the electronic component storage package shown in FIG.

FIG. 3 is an exploded perspective view of a conventional electronic component storage package.

FIG. 4 is a perspective view of an electronic component using a conventional electronic component storage package.

[Explanation of symbols]

 1 ... Insulating substrate 2 ... Lid 3 ... Piezoelectric vibrator 4 ... Container 5 ... Metallized wiring layer 8, 9, 11 ... Metallized metal layer 10 ... Encapsulating material A ... Notch

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kiyoshige Miyawaki 22 Kyocera Corporation, 5-5 Higashinokitainouemachi, Yamashina-ku, Kyoto

Claims (1)

[Claims] 1. An insulating base comprising a rectangular insulating base body having a frame-shaped metal layer deposited on the outer peripheral surface of the upper surface, and a rectangular lid body having a frame-shaped metal layer deposited on the outer peripheral surface of the lower surface. A package for storing electronic parts, wherein an electronic part is hermetically housed inside by joining respective metal layers of a base body and a lid body with a sealing material made of solder, the insulating base body or the lid. Electronic component storage characterized in that a notch is formed in at least one corner of the body, and a metal layer communicating with the metal layer adhered to the insulating substrate or the lid is formed on the surface of the notch. For the package.