JPH05267367A - Resin sealed semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To prevent quality deterioration of a tablet and enhance resin sealing quality of semiconductor elements in terms of a resin sealed semiconductor manufacturing device which seals the semiconductor elements with thermosetting resin. CONSTITUTION:An automatic air conditioning device 6, which holds the peripheral parts of a storage section of a tablet 5 comprising a part feeder 2 and a loader section at a specified temperature and a specified humidity, is installed within an MPS 1 so as to keep the tablet 5 in the MPS 1 in an ambient atmosphere at specified temperature and humidity.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed semiconductor manufacturing apparatus, and more particularly to a resin-sealed semiconductor manufacturing apparatus for sealing a semiconductor element with a thermosetting resin.

A semiconductor element such as an IC or a transistor is generally connected to a lead frame by wire bonding or the like, and it is necessary to protect the semiconductor element and the connecting portion from external stress, dust, dust, moisture and the like.

For this reason, means for sealing a semiconductor element with a resin is used. As a resin used for such an application, the curing time is short, and the heat resistance and the humidity resistance are excellent. Resin is widely used.

[0004]

2. Description of the Related Art FIG. 2 shows a resin-sealed semiconductor manufacturing apparatus (MPS; Mold) which is generally used in a semiconductor resin-sealing process.
(A) in the block diagram of the Press System)
Shows a plan view thereof, and FIG. 7B shows a front view thereof.

The MPS 11 is covered with an outer plate 9 and has various constituent parts inside. In the figure, reference numeral 2 denotes a parts feeder, which has an opening in the upper part, from which a pellet-shaped thermosetting resin material (tablet) 5 used for resin sealing of a semiconductor is supplied. The tablet 5 is vibrated in the parts feeder 2 and is aligned with the groove provided inside the parts feeder 2 to be sequentially sent to the loader unit 3.

The loader unit 3 stores a predetermined amount of tablets 5,
It is supplied to the molding die 4 at the timing of resin sealing. The molding die 4 is constantly heated, and when the tablet 5 is supplied to the molding die 4, the tablet 5 is softened by the heat. When the tablet 5 is pressed after sufficiently softening and becoming liquid, the liquid thermosetting resin flows into the periphery of the semiconductor element previously set in the molding die 4. Then, when heating is continued for a predetermined time, the liquid thermosetting resin is cured by heat, and the semiconductor element is sealed with the thermosetting resin.

As described above, since the properties of the tablet 5 change when heat is applied to the tablet 5, heat shield plates 7 and 8 are provided so that heat is not applied while the tablet 5 is stored in the parts feeder 2 and the loader unit 3. The heat generated by the molding die 4 is prevented from being directly radiated.

[0008]

However, the conventional MP described above is used.
In S11, since the periphery of the device is covered with the outer plate 9, the heat generated by the molding die 4 stays inside the device, circulates around the heat shield plates 7 and 8, and the temperature around the parts feeder 2 and the loader unit 3 is increased. And the humidity rises. Therefore tablet 5
Is heated while being stored in the parts feeder 2 and the loader unit 3, absorbs moisture in the surroundings, and its quality changes.

Since the curing reaction of the thermosetting resin is an irreversible reaction, when the quality of the tablet 5 is changed by heating, sufficient fluidity of the resin is obtained when the tablet 5 is heated in the mold 4 to be liquid. I can't get it. When the amount of moisture absorbed by the tablet 5 is large, when the tablet 5 is heated in the molding die 4,
The absorbed moisture is gasified to cause defective resin sealing such as voids and pinholes inside the resin after sealing.

In particular, when the production plan is set up to stop the MPS 11 for a long time or on a holiday, the quality of the tablets 5 stored in the parts feeder 2 and the loader unit 3 is deteriorated as compared with the case of continuous production. As a result, the resin sealing failure occurs frequently.

In recent years, semiconductor devices have become thinner and thinner, and the object of resin encapsulation has been reduced in size, and the lead frame has been miniaturized. For this reason, in the tablet 5 with deteriorated quality, a sufficient resin flow cannot be ensured, which may cause defective filling of the resin or deformation of the inner leads, resulting in a decrease in yield or a decrease in reliability of the semiconductor element. There is.

The present invention has been made in view of the above points, and an object of the present invention is to provide an MPS that prevents deterioration of the quality of tablets and improves the quality of resin sealing of semiconductor elements.

[0013]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, according to the present invention, a resin material used for resin encapsulation of a semiconductor is heated and softened, and then a semiconductor element is previously arranged inside. In a resin-sealed semiconductor manufacturing apparatus in which a semiconductor element is resin-sealed by pouring it into a mold and curing the resin, a storage unit for storing the resin material is provided with an air-conditioning mechanism for maintaining a predetermined temperature and humidity. ..

[0014]

According to the above construction, since the storage section is kept at a predetermined temperature and humidity, the resin material stored in the storage section is also kept at a predetermined temperature and humidity. Therefore, good resin quality is maintained regardless of the time of storage in the apparatus.

[0015]

1 is a block diagram of an embodiment of an MPS according to the present invention. FIG. 1A is a plan view thereof and FIG. 1B is a front view thereof. In the figure, the same parts as those in FIG. 2 are designated by the same reference numerals, and the description thereof will be omitted.

Reference numeral 6 in the figure denotes an automatic air conditioner corresponding to the air conditioning mechanism, which is arranged in a space partitioned by the outer plate 9 and the heat shield plates 7 and 8 in the MPS 1 and corresponds to the storage section. Only when the temperature and humidity around the feeder 2 and the loader unit 3 rise and fall from a predetermined set range, dehumidification and blowing are automatically performed.

Since the tablet 5 is usually formed by molding thermosetting resin powder into a pellet shape, a powder resin that easily floats is present on the outer periphery thereof. Therefore, if air is blown directly to the tablet 5 with a fan or the like, the powdered resin will be MPS.
1 is scattered inside and adheres to various sensors such as photoelectric switches, causing malfunction of the MPS 1.

For this reason, the automatic air conditioner 6 in the apparatus of this embodiment controls the temperature and humidity by blowing air around the blower ports of the parts feeder 2 and the loader section 3 instead of directing them.

In the apparatus of this embodiment, for example, the setting range of the automatic air conditioner 6 is such that the temperature around the parts feeder 2 and the loader section 3 is 20 to 30 [° C] and the humidity is 40 ± 10 [%.
Rh], the tablets 5 stored in the parts feeder 2 and the loader unit 3 are not affected by the heat generated by the molding die 4, and the semiconductor elements are mounted by the conventional MPS without the automatic air conditioner 6. Compared to the case of resin encapsulation, the resin encapsulation defects such as voids and pinholes are 1/10.
Reduced to

As described above, according to the apparatus of this embodiment, the MPS
The quality of the tablet 5 stored in the MPS 1 can be stored in the MPS 1 in the environment where the quality is not deteriorated because the tablet 5 stored in the MPS 1 can be stored in an environment where the quality is not deteriorated. Deterioration can be prevented and defective resin sealing can be reduced. Further, even during normal production, the tablet 5 under a substantially constant condition is always used, so that the resin sealing process is stable.

[0021]

As described above, according to the present invention, since the thermosetting resin stored in the resin-encapsulated semiconductor manufacturing apparatus is kept at a predetermined temperature and humidity, the resin flowability is always good. In addition, stable resin sealing quality can be secured, and defects such as voids and pinholes do not occur even when the thermosetting resin is stored in the resin sealing semiconductor manufacturing apparatus for a long time.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of a resin-sealed semiconductor manufacturing apparatus according to the present invention.

FIG. 2 is a configuration diagram of a conventional resin-sealed semiconductor manufacturing apparatus.

[Explanation of symbols]

 1 Resin-sealed semiconductor manufacturing equipment (MPS) 2 Parts feeder 3 Loader part 4 Mold 5 Tablet 6 Automatic air conditioner

Claims (1)

[Claims] 1. A resin material used for resin sealing of a semiconductor,
After heating and softening, by pouring into a mold in which the semiconductor element is arranged in advance and curing,
A resin-sealed semiconductor manufacturing apparatus for resin-sealing a semiconductor element, comprising an air-conditioning mechanism for maintaining a storage unit for storing the resin material at a predetermined temperature and humidity.