JPH0526339B2 - - Google Patents
Info
- Publication number
- JPH0526339B2 JPH0526339B2 JP58019981A JP1998183A JPH0526339B2 JP H0526339 B2 JPH0526339 B2 JP H0526339B2 JP 58019981 A JP58019981 A JP 58019981A JP 1998183 A JP1998183 A JP 1998183A JP H0526339 B2 JPH0526339 B2 JP H0526339B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- supporter
- resin
- lead
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0426—Feeding with belts or tapes for components being oppositely extending terminal leads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子部品をより効率良く実装する電子
部品に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to electronic components that can be mounted more efficiently.
従来例の構成とその問題点
現在、業界で用いられている電子部品は、電子
部品１個ずつが独立した形態で出来上つているた
め、自動組立てをしようとする場合、電子部品の
外形形状より取付けの位置出しをして、配線基板
に実装するか、又は一個ずつバラバラになつたも
のをテープに取りつけ直して位置出しをし易くし
て実装している。Conventional configurations and their problems Currently, electronic components used in the industry are manufactured in an independent form, so when trying to assemble them automatically, it is difficult to The mounting position is determined and mounted on the wiring board, or the parts are separated one by one and reattached to tape to facilitate positioning.
発明の目的
本発明は、電子機器の多くに用いられている印
刷配線基板に電子部品を実装するに当り、より高
精度により早く自動的に実装（挿入や装着）する
事を目的としている。Purpose of the Invention The present invention aims at automatically mounting (inserting and mounting) electronic components with higher accuracy and faster when mounting electronic components on printed wiring boards used in many electronic devices.
発明の構成
本発明の電子部品は、複数個の電子部品単体が
サポータリードによつてコム材に接続された電子
部品であつて、前記電子部品単体は樹脂によりモ
ールド形成し、切断ならびに曲げ加工が施された
引出し用リードを設けると共に、前記サポータリ
ードに対して連結され、かつ、前記電子部品単体
と一体の樹脂により薄肉に形成されたサポータ部
形成用樹脂を設けたものである。Structure of the Invention The electronic component of the present invention is an electronic component in which a plurality of individual electronic components are connected to a comb material by supporter leads, and the individual electronic components are molded with resin and can be cut and bent. In addition to providing a lead-out lead, a resin for forming a supporter part is connected to the supporter lead and is formed of a thin resin integral with the electronic component alone.
実施例の説明
第１図に示すコム材１は金属より出来上つてい
る。電子部品単体３はサポータリード５によりコ
ム材１にホールドサポートされている。この様な
形で電子部品単体３をコム材１に数多く一体化し
て形成する。この電子部品単体３が例えば半導体
集積回路ICの様な場合、シリコン基板をダイボ
ンデイングしたり、ワイヤボンデイングするにあ
たり、高い精度を維持することが重要であり、図
示するようにコム材１上にガイド穴２を設けてこ
の目的を達成している。ところで完成した電子部
品をアツセンブリメーカへ供給するに際してはサ
ポータリード５を切断除去してIC単体とし、こ
れを供給する為に実装等に際して再び寸法精度を
出す手段を用いなくてはならなくなる。DESCRIPTION OF THE EMBODIMENTS The comb material 1 shown in FIG. 1 is made of metal. The electronic component 3 is held and supported by the comb material 1 by supporter leads 5. In this manner, a large number of individual electronic components 3 are formed integrally with the comb material 1. When the electronic component 3 is, for example, a semiconductor integrated circuit IC, it is important to maintain high precision when performing die bonding or wire bonding on a silicon substrate. Hole 2 is provided to achieve this purpose. By the way, when supplying the completed electronic component to an assembly manufacturer, the supporter leads 5 must be cut and removed to form a single IC, and in order to supply this, it is necessary to use a means to ensure dimensional accuracy again during mounting, etc.
そこで第１図で正面図を、第２図で側面図を示
す構造のままで機器のアツセンブリメーカへの輸
送を行なう方がより産業界において有効的な手段
となる。更に本発明の第１図で示す６の部分は電
子部品単体３を樹脂によりモールドした場合に溢
れ出したサポータ部形成樹脂であり、このサポー
タ部形成用樹脂６はサポータリード５と連結され
る。もちろん前記の様な金属コムでも良いのであ
るが、金属の場合は金型等を用いて切断せねばな
らないが、樹脂の場合は容易に折る事も可能であ
る。樹脂材料が近年耐湿特性を向上させるために
シリカ材を入れるため、切断しようとすると刃の
摩擦もはげしくなるので、折る方が容易な場合が
多い。 Therefore, it is more effective in industry to transport the equipment to an assembly manufacturer with the structure shown in FIG. 1 as a front view and in FIG. 2 as a side view. Further, a portion 6 shown in FIG. 1 of the present invention is supporter portion forming resin that overflows when the electronic component unit 3 is molded with resin, and this supporter portion forming resin 6 is connected to the supporter lead 5. Of course, a metal comb as described above may also be used, but if it is made of metal, it must be cut using a mold or the like, but if it is made of resin, it can be easily folded. In recent years, resin materials have been filled with silica to improve their moisture resistance, so when you try to cut them, the friction of the blade increases, so it is often easier to break them.
コム材１にサポートされている電子部品単体３
からは引出し用リード４が複数本出ているけれど
も実装する印刷配線基板の実装方法に合わせて端
子の曲げ加工が施されている。第２図にその状態
が図示されている。この場合は印刷配線基板の導
体箔に直接密着させて接続するタイプであるが、
第３図は印刷配線基板の孔に挿入し、この印刷配
線基板面に施された導体箔と接続するタイプであ
る。 Single electronic component 3 supported by comb material 1
Although a plurality of lead-out leads 4 are protruding from the terminal, the terminals are bent in accordance with the mounting method of the printed wiring board to be mounted. The situation is illustrated in FIG. In this case, it is a type that is connected directly to the conductor foil of the printed wiring board.
FIG. 3 shows a type that is inserted into a hole in a printed wiring board and connected to a conductive foil applied to the surface of the printed wiring board.
発明の効果
以上、詳述したように本発明によれば、電子部
品単体をサポータリードと連結したのが、員数管
理が容易となり、輸送形態が簡略化出来る。Effects of the Invention As described in detail above, according to the present invention, connecting individual electronic components to supporter leads facilitates number management and simplifies transportation mode.
また、自動実装する場合のガイドとしてコム材
がその役目を果すのでテープ台紙等も不要とな
る。 Furthermore, since the comb material serves as a guide during automatic mounting, tape mounts and the like are not required.
また、サポートリードに対して連結され、か
つ、電子部品単体と一体の樹脂により薄肉に形成
されたサポータ部形成用樹脂を設けたので、電子
部品単体をコム材から切り離すのが容易になる利
点を有する。 In addition, we have provided a thin supporter part forming resin that is connected to the support lead and is integral with the electronic component, which has the advantage of making it easier to separate the electronic component from the comb material. have
第１図は本発明の電子部品の外観を示す全体
図、第２図、第３図は第１図のＡ，A′に沿つて
切断して示した断面図である。
１……コム材、２……ガイド穴、３……電子部
品単体、４……電子部品の引出しリード、５……
サポータリード、６……サポータ部形成用樹脂。
FIG. 1 is an overall view showing the external appearance of the electronic component of the present invention, and FIGS. 2 and 3 are sectional views taken along lines A and A' in FIG. 1. 1...Com material, 2...Guide hole, 3...Electronic component unit, 4...Electronic component drawer lead, 5...
Supporter lead, 6...Resin for forming the supporter part.
Claims (1)
つてコム材に接続された電子部品であつて、前記
電子部品単体は樹脂によりモールド形成し、切断
ならびに曲げ加工が施された引出し用リードを設
けると共に、前記サポータリードに対して連結さ
れ、かつ、前記電子部品単体と一体の樹脂により
薄肉に形成されたサポータ部形成用樹脂を設けた
ことを特徴とする電子部品。1. An electronic component in which a plurality of individual electronic components are connected to a com material by supporter leads, and the individual electronic components are molded with resin and provided with extraction leads that are cut and bent. 2. An electronic component, characterized in that a resin for forming a supporter portion is connected to the supporter lead and is formed of a thin resin integrally with the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1998183A JPS59145549A (en) | 1983-02-09 | 1983-02-09 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1998183A JPS59145549A (en) | 1983-02-09 | 1983-02-09 | Electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59145549A JPS59145549A (en) | 1984-08-21 |
| JPH0526339B2 true JPH0526339B2 (en) | 1993-04-15 |
Family
ID=12014353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1998183A Granted JPS59145549A (en) | 1983-02-09 | 1983-02-09 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59145549A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH065759A (en) * | 1992-06-23 | 1994-01-14 | Sharp Corp | Fabrication of semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55103753A (en) * | 1979-02-05 | 1980-08-08 | Hitachi Ltd | Electronic component |
-
1983
- 1983-02-09 JP JP1998183A patent/JPS59145549A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55103753A (en) * | 1979-02-05 | 1980-08-08 | Hitachi Ltd | Electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59145549A (en) | 1984-08-21 |
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