JPH05263238A - Load locking type vacuum treating device - Google Patents

Abstract

(57) [Summary] [Object] To reduce the rotation angle of a substrate holder in a load-lock type vacuum processing apparatus having a substrate transfer function, and to enable the substrate to be transferred and processed always downward. [Structure] An ion source 6 is attached below the processing chamber 2 on the side of the load lock chamber 4 to irradiate the ion beam 10 above the horizontal. Reduce the angle change of. [Effect] The time required for attaching and detaching the substrate is shortened, the tact time can be shortened, and a clean process can be always performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a load lock type vacuum processing apparatus, and more particularly to a load lock type vacuum processing apparatus having a load lock mechanism in a milling apparatus or an ion beam sputtering apparatus, which is excellent in productivity and cleanliness. .

[0002]

2. Description of the Related Art A conventional milling machine is Hitachi Review No. 68.
Vol. 6, No. 6 (1986-6), pp. 49-52.
As described in "Development of large-diameter ion beam milling apparatus", in a vacuum container equipped with a load lock chamber, the ion source is arranged so that the irradiation direction of the extracted ion beam is horizontal.

[0003]

In the conventional apparatus, when the load lock chamber for attaching and detaching the substrate is attached to the vacuum processing chamber through the gate valve, the load lock chamber must be attached to the opposite side of the ion source. Therefore, after mounting the substrate on the substrate holder, the substrate holder must be rotated so that the ion beam has an angle suitable for processing. Since it is necessary to rotate the substrate holder at a large angle for each substrate, it takes a long time to process the substrates continuously,
It was extremely uneconomical.

Further, since the substrate holder is usually mounted and detached with the substrate mounting surface facing upward, there is a problem that dust adheres to the processing surface of the substrate during the transfer process.

An object of the present invention is to solve the above-mentioned problems. The rotation angle of the substrate holder is reduced between when the substrate holder is mounted on the substrate and when the ion beam is irradiated, and the substrate processing surface is always directed downward. It is an object of the present invention to provide a load-lock type vacuum processing device that can be transported and processed in this state.

[0006]

In order to achieve the above object, the present invention comprises a vacuum container having at least an ion source and a substrate holder, and a load lock mechanism for attaching and detaching the substrate to the substrate holder substantially horizontally. In the load-lock type vacuum processing apparatus, the ion source is provided below a substrate attachment / detachment operation region for the substrate holder by the load-lock mechanism, and an irradiation direction of an ion beam emitted from the ion source to the substrate surface is set. It is characterized by being directed obliquely upward from the horizontal.

Further, the ion source is either in a direction of a substrate attachment / detachment operation region with respect to the substrate holder by the load lock mechanism or in a direction opposite to the substrate attachment / detachment operation region, and the substrate holder. Is provided obliquely below, and the irradiation direction of the ion beam irradiated from the ion source to the substrate surface is obliquely upward from horizontal.

[0008]

According to the above structure, the ion source irradiates the ion beam from obliquely below the substrate holder. Therefore, after the substrate is mounted on the substrate holder substantially horizontally, the substrate holder is set at a predetermined position for irradiating the substrate with the ion beam. It is possible to reduce the rotation angle for rotating to the position. Further, the processing surface of the substrate can always be installed so as to face downward, and it is possible to always perform clean processing.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of the present invention, which is a milling device with a load lock mechanism. The processing chamber 2 is evacuated by an exhaust device (not shown). The substrate 5 is mounted on the transfer holder 8 shown in FIG. 2 in the load lock chamber 4, and is mounted on the substrate holder 1 in the processing chamber 2 by the transfer mechanism 7.

FIG. 2 is a view showing a state in which the substrate 5 is attached to the substrate attaching ring 9 of the substrate holder 1. When the substrate 5 is attached or detached, the substrate attaching ring 9 is operated as indicated by an arrow B in the drawing to process the substrate 5. At this time, it operates as indicated by arrow A to bring the substrate 5 into close contact with the substrate holder 1.

This will be described with reference to FIGS. 3 and 4. The substrate 5 is inserted between the substrate holder 1 and the substrate mounting ring 9 by the transfer holder 8 with the processing surface facing downward, and the substrate mounting ring 9 moves in the direction of arrow A to transfer the substrate 5 to the substrate holder 1. Make them adhere closely. Since the board mounting ring is partially cut away, the carrier holder 8 does not obstruct the attachment / detachment of the board.

According to the present embodiment, as shown in FIG. 1, the ion beam 10 performs the milling process by irradiating the substrate 5 at a predetermined angle. As is apparent from FIG. Is arranged at a predetermined position, the substrate holder 1 hardly needs to change the angle of the surface of the substrate 5. In the present embodiment, the irradiation direction of the ion beam can be set at an angle of 15 to 45 degrees with respect to the vertical direction, and the substrate holder has a substantially horizontally mounted substrate surface of + -45 degrees at most. It can be processed by rotating within the range.

FIG. 5 shows a conventional structure as a reference example. In the conventional structure, since the ion source 6 and the load lock chamber 4 are in a positional relationship of facing each other through the processing chamber 2, the ion beam 10 and the surface of the substrate 5 form a predetermined angle, so that the substrate holder 1 Needs to be changed in the direction of arrow C.
In a structure in which the substrate 5 is mounted with the surface of the substrate holder 1 on which the substrate 5 is mounted facing upward, this angle change is even greater.

In a single-wafer type apparatus in which a large number of substrates are simultaneously mounted in the load-lock chamber 4 and processing is continuously performed, the time required for this angle change greatly affects the tact time.

[0015]

According to the present invention, it is possible to reduce the required angle change of the substrate holder when the substrate is attached to and detached from the substrate holder, so that it is possible to shorten the tact time of processing and improve the throughput.

Further, since the processing surface of the substrate can be installed so as to always face downward, it is possible to prevent dust from adhering to the substrate and perform clean processing.

[Brief description of drawings]

FIG. 1 is a side view of a milling device with a load lock mechanism according to an embodiment of the present invention.

FIG. 2 is a front view of a substrate holder of this embodiment.

FIG. 3 is a side view for explaining the operation of the transport holder.

FIG. 4 is a front view for explaining the operation of the transport holder.

FIG. 5 is a side view of a milling device with a load lock mechanism as a reference example.

[Explanation of symbols]

 1 Substrate holder 2 Processing chamber 3 Gate valve 4 Load lock chamber 5 Substrate 6 Ion source 7 Transfer mechanism 8 Transfer holder 9 Substrate mounting ring 10 Ion beam

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hirosuke Yamaguchi 1-1-1 Kokubuncho, Hitachi City, Ibaraki Prefecture Hitachi Co., Ltd. Kokubun Plant

Claims (6)

[Claims] 1. A load-lock type vacuum processing apparatus comprising: a vacuum container having at least an ion source and a substrate holder; and a load-lock mechanism for attaching and detaching a substrate to the substrate holder substantially horizontally. A load lock, which is provided below a substrate attachment / detachment operation area to / from the substrate holder by a lock mechanism, and an irradiation direction of an ion beam irradiated from the ion source to the substrate surface is obliquely upward from a horizontal direction. Vacuum processing equipment. 2. A load-lock type vacuum processing apparatus comprising a vacuum container having at least an ion source and a substrate holder, and a load-lock mechanism for attaching and detaching a substrate to and from the substrate holder in a substantially horizontal manner. It is provided in any one of the direction of the substrate attachment / detachment operation area with respect to the substrate holder by the lock mechanism or the direction opposite to the substrate attachment / detachment operation area, and obliquely below the substrate holder. A load-lock type vacuum processing apparatus characterized in that an irradiation direction of an ion beam applied to a substrate surface is obliquely upward from a horizontal direction. 3. The substrate holder includes a ring-shaped attachment tool for attaching the substrate to the substrate holder, and the attachment tool is formed by cutting out at least a part of the ring shape. 1. The load lock type vacuum processing device according to 1. 4. The load lock type vacuum processing apparatus according to claim 1, wherein the load lock mechanism is mounted on the lower surface of the substrate holder with the processing surface of the substrate facing downward. 5. The load lock type vacuum processing apparatus according to claim 1, wherein the irradiation direction of the ion beam is at an angle of 15 to 45 degrees with respect to the vertical direction. 6. The load-lock type vacuum processing apparatus according to claim 1, wherein the substrate holder rotates a substrate surface mounted substantially horizontally within a range of plus / minus 45 degrees.