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JPH05258903A - Electronic parts - Google Patents

Electronic parts

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Publication number
JPH05258903A
JPH05258903A JP4054940A JP5494092A JPH05258903A JP H05258903 A JPH05258903 A JP H05258903A JP 4054940 A JP4054940 A JP 4054940A JP 5494092 A JP5494092 A JP 5494092A JP H05258903 A JPH05258903 A JP H05258903A
Authority
JP
Japan
Prior art keywords
light
electronic component
diffusing
protective film
reflecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4054940A
Other languages
Japanese (ja)
Inventor
Junzo Seta
順三 瀬田
Hirokado Toba
広門 鳥羽
Akio Yasuda
彰夫 安田
Takumi Sekito
卓美 脊戸
Yoko Koseki
洋子 小関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP4054940A priority Critical patent/JPH05258903A/en
Publication of JPH05258903A publication Critical patent/JPH05258903A/en
Pending legal-status Critical Current

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  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

(57)【要約】 【目的】 外観検査用の光を拡散反射させ、受光素子に
対する反射出力を増やし、外観検査を安定した状態で確
実に行うことができるようにした電子部品を提供する。 【構成】 光透過性の保護膜6の内面にケイ素粉末等の
光を拡散反射する成分を配して光拡散反射部5を形成す
る。レーザ光を照射した際、光拡散反射部5によりレー
ザ光を拡散反射させ、多くの反射光を受光素子に入射さ
せる。
(57) [Summary] [Object] To provide an electronic component capable of performing a visual inspection in a stable state by diffusing and reflecting the light for visual inspection, increasing the reflection output to the light receiving element. A component for diffusing and reflecting light such as silicon powder is arranged on the inner surface of a light-transmitting protective film 6 to form a light diffusing / reflecting portion 5. When the laser light is irradiated, the laser light is diffusely reflected by the light diffusing / reflecting portion 5, and a large amount of the reflected light is made incident on the light receiving element.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、プリント基板に実装す
るのに適する電子部品に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component suitable for mounting on a printed circuit board.

【0002】[0002]

【従来の技術】プリント基板に電子部品を実装した後、
電子部品の実装の有無、ずれ、横立ち等の外観検査を行
う必要がある。
2. Description of the Related Art After mounting electronic parts on a printed circuit board,
It is necessary to carry out visual inspections such as mounting / dismounting of electronic parts, misalignment, and horizontal standing.

【0003】以下、従来の電子部品の構造およびこの電
子部品の実装状態の外観検査原理について図面を参照し
ながら説明する。
The structure of a conventional electronic component and the principle of appearance inspection of the mounted state of the electronic component will be described below with reference to the drawings.

【0004】図7は従来の電子部品を示す一部切欠斜視
図である。図7に示す電子部品51は微小抵抗素子であ
り、セラミックから成る基体52の表面に膜状の抵抗体
53が設けられ、基体52の両端部に抵抗体53の端部
と接続するように電極54が設けられている。抵抗体5
3の表面は保護膜55で覆われ、保護膜55の表面に種
別を表示するための記号56が捺印されている。
FIG. 7 is a partially cutaway perspective view showing a conventional electronic component. An electronic component 51 shown in FIG. 7 is a minute resistance element, in which a film-shaped resistor 53 is provided on the surface of a base 52 made of ceramic, and electrodes are formed on both ends of the base 52 so as to be connected to the ends of the resistor 53. 54 is provided. Resistor 5
The surface of No. 3 is covered with a protective film 55, and a symbol 56 for indicating the type is imprinted on the surface of the protective film 55.

【0005】図8は電子部品51をプリント基板57に
実装した状態を外観検査装置により検査する原理説明図
である。図8に示すように、電子部品51を実装したプ
リント基板57を紙面に対して垂直方向に走行させ、こ
の間、レーザ光源(図示省略)からレーザ光58をプリ
ント基板57および電子部品51に照射させる。プリン
ト基板57からの反射光を集光レンズ59を介して受光
素子60に入射させる。プリント基板57上の電子部品
51の保護膜55からの反射光も集光レンズ59を介し
て受光素子60に入射させる。プリント基板57と電子
部品51とは反射箇所の高さが異なるので、それら反射
光の受光素子60に対する入射位置61a、61bが異
なり、それらの位置61a、61bの差dxを受光素子
60が電気的に演算し、電子部品51の高さ寸法を読み
取る。このような原理により電子部品51の有無、ず
れ、横立ち等の外観検査を行うことができる。
FIG. 8 is an explanatory view of the principle of inspecting the state in which the electronic component 51 is mounted on the printed board 57 by the appearance inspection device. As shown in FIG. 8, the printed circuit board 57 on which the electronic component 51 is mounted is run in the direction perpendicular to the paper surface, and during this time, the laser light 58 is emitted from the laser light source (not shown) to the printed circuit board 57 and the electronic component 51. . The reflected light from the printed board 57 is made incident on the light receiving element 60 via the condenser lens 59. The reflected light from the protective film 55 of the electronic component 51 on the printed board 57 is also made incident on the light receiving element 60 via the condenser lens 59. Since the printed circuit board 57 and the electronic component 51 are different in the height of the reflection portion, the incident positions 61a and 61b of the reflected light with respect to the light receiving element 60 are different, and the light receiving element 60 electrically detects the difference dx between the positions 61a and 61b. And the height dimension of the electronic component 51 is read. Based on such a principle, it is possible to perform an appearance inspection such as presence / absence of the electronic component 51, misalignment, and horizontal standing.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、上記の
ような従来の電子部品51では、レーザ光58を照射し
た際、レーザ光58が保護膜55の表面部でほとんど拡
散反射をしないで正反射するため、レーザ光58の受光
素子60に対する反射出力が落ちたり、ハレーションを
起こしたりし、外観検査を安定した状態で確実に行うこ
とができないという問題があった。
However, in the conventional electronic component 51 as described above, when the laser light 58 is irradiated, the laser light 58 is specularly reflected on the surface portion of the protective film 55 with almost no diffuse reflection. As a result, the reflected output of the laser light 58 to the light receiving element 60 is reduced or halation occurs, and there is a problem that the appearance inspection cannot be reliably performed in a stable state.

【0007】本発明は、このような従来の問題を解決す
るものであり、外観検査用の光を拡散反射させ、受光素
子に対する反射出力を増やし、外観検査を安定した状態
で確実に行うことができるようにした電子部品を提供す
ることを目的とするものである。
The present invention solves such a conventional problem, and diffuses and reflects the light for appearance inspection, increases the reflection output to the light receiving element, and can reliably perform appearance inspection in a stable state. The object is to provide an electronic component that can be manufactured.

【0008】[0008]

【課題を解決するための手段】本発明は、上記目的を達
成するために、外観検査用の光を拡散反射することがで
きる光拡散反射部を備えたものである。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention comprises a light diffusing / reflecting portion capable of diffusing and reflecting light for visual inspection.

【0009】そして、上記光拡散反射部として、光透過
性の保護膜の裏面に光を拡散反射する成分を配して形成
し、または保護膜の表面に光を拡散反射する成分を配し
て形成し、または光透過性の保護膜の内部に光を拡散反
射する成分を配して形成し、または保護膜の表面を荒ら
して形成し、またはセラミックの露出面により形成する
ことができる。
As the light diffusing / reflecting portion, a component for diffusing and reflecting light is formed on the back surface of the light transmitting protective film, or a component for diffusing and reflecting light is arranged on the surface of the protective film. It can be formed by forming a component that diffuses and reflects light inside a light-transmitting protective film, or by roughening the surface of the protective film, or by an exposed surface of a ceramic.

【0010】[0010]

【作用】したがって、本発明によれば、光拡散反射部を
有するので、外観検査用の光を照射した際、上記光拡散
反射部により拡散反射させ、多くの反射光を受光素子に
入射させることができる。
Therefore, according to the present invention, since the light diffusing / reflecting portion is provided, when the light for visual inspection is irradiated, it is diffused and reflected by the light diffusing / reflecting portion and a large amount of reflected light is made incident on the light receiving element. You can

【0011】[0011]

【実施例】【Example】

(実施例1)以下、本発明の第1の実施例について図面
を参照しながら説明する。
(Embodiment 1) Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

【0012】図1は本発明の第1の実施例における電子
部品を示す断面図である。図1に示す電子部品1は微小
抵抗素子であり、セラミックから成る基体2の表面に膜
状の抵抗体3が設けられ、基体2の両端部に抵抗体3の
端部と接続するように電極4が設けられている。抵抗体
3の表面にはケイ素粉末等の光を拡散反射する成分から
成る光拡散反射部5が設けられ、光拡散反射部5および
電極4の表面が保護膜6で覆われている。すなわち、保
護膜6の裏面に光を拡散反射する成分が配されて光拡散
反射部5が形成されている。したがって、保護膜6は光
透過性の材料により形成されている。
FIG. 1 is a sectional view showing an electronic component according to the first embodiment of the present invention. The electronic component 1 shown in FIG. 1 is a minute resistance element, in which a film-shaped resistor 3 is provided on the surface of a base body 2 made of ceramic, and electrodes are formed on both ends of the base body 2 so as to be connected to the ends of the resistor 3. 4 are provided. The surface of the resistor 3 is provided with a light diffusing and reflecting portion 5 made of a component such as silicon powder that diffuses and reflects light, and the surfaces of the light diffusing and reflecting portion 5 and the electrode 4 are covered with a protective film 6. That is, the light diffuse reflection portion 5 is formed by arranging a component that diffuses and reflects light on the back surface of the protective film 6. Therefore, the protective film 6 is formed of a light transmissive material.

【0013】以上のように構成された電子部品1の実装
状態の外観検査動作について図2に示す原理説明図を参
照しながら説明する。
The appearance inspection operation of the mounted state of the electronic component 1 configured as described above will be described with reference to the principle explanatory diagram shown in FIG.

【0014】電子部品1を実装したプリント基板7を紙
面に対して垂直方向に走行させ、この間レーザ光源(図
示省略)からレーザ光8をプリント基板7および電子部
品1に照射させる。このとき、電子部品1においては、
レーザ光8は保護膜6を透過し、光拡散反射部5により
拡散反射され、多くの反射光が集光レンズ9を介して受
光素子10に入射する。したがって、上記従来例と同様
にして電子部品1の高さ寸法を読み取り、電子部品1の
有無、ずれ、横立ち等の外観検査を行うことができる。
The printed circuit board 7 on which the electronic component 1 is mounted is run in a direction perpendicular to the paper surface, and during this time, a laser light source (not shown) irradiates the printed circuit board 7 and the electronic component 1 with laser light 8. At this time, in the electronic component 1,
The laser light 8 passes through the protective film 6, is diffused and reflected by the light diffusing and reflecting portion 5, and a large amount of reflected light is incident on the light receiving element 10 via the condenser lens 9. Therefore, the height dimension of the electronic component 1 can be read in the same manner as the above-mentioned conventional example, and the appearance inspection of the electronic component 1 such as presence / absence, displacement, and standing can be performed.

【0015】(実施例2)以下、本発明の第2の実施例
について図面を参照しながら説明する。
(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings.

【0016】図3は本発明の第2の実施例における電子
部品を示す断面図である。本実施例においては、図3に
示すように、保護膜6の表面にケイ素粉末等の光を拡散
反射する成分を配して光拡散反射部5が形成されたもの
である。したがって、本実施例における保護膜6は光透
過性である必要はない。その他の構成については上記第
1の実施例と同様であるので、同一部分には同一符号を
付してその説明を省略する。
FIG. 3 is a sectional view showing an electronic component according to the second embodiment of the present invention. In the present embodiment, as shown in FIG. 3, the light diffusion reflection portion 5 is formed on the surface of the protective film 6 by disposing a component such as silicon powder that diffuses and reflects light. Therefore, the protective film 6 in this embodiment does not need to be light transmissive. The other parts of the configuration are the same as those of the first embodiment, and therefore, the same parts are designated by the same reference numerals and the description thereof is omitted.

【0017】(実施例3)以下、本発明の第3の実施例
について図面を参照しながら説明する。
(Embodiment 3) A third embodiment of the present invention will be described below with reference to the drawings.

【0018】図4は本発明の第3の実施例における電子
部品を示す断面図である。本実施例においては、図4に
示すように、光透過性の材料から成る保護膜6の内部に
ケイ素粉末等の光を拡散反射する成分を配して光拡散反
射部5が形成されたものであり、その他の構成について
は上記第1の実施例と同様であるので、同一部分には同
一符号を付してその説明を省略する。
FIG. 4 is a sectional view showing an electronic component according to the third embodiment of the present invention. In this embodiment, as shown in FIG. 4, a light diffusion reflection part 5 is formed by arranging a component such as silicon powder that diffuses and reflects light inside a protective film 6 made of a light transmissive material. Since the other configurations are similar to those of the first embodiment, the same parts are designated by the same reference numerals and the description thereof will be omitted.

【0019】(実施例4)以下、本発明の第4の実施例
について図面を参照しながら説明する。
(Embodiment 4) A fourth embodiment of the present invention will be described below with reference to the drawings.

【0020】図5は本発明の第4の実施例における電子
部品を示す断面図である。本実施例においては、図5に
示すように、保護膜6の表面を荒らした状態にして光拡
散反射部5が形成されたものである。したがって、本実
施例における保護膜6は光反射性の材料により形成され
ている。その他の構成については上記第1の実施例と同
様であるので、同一部分には同一符号を付してその説明
を省略する。
FIG. 5 is a sectional view showing an electronic component according to the fourth embodiment of the present invention. In the present embodiment, as shown in FIG. 5, the light diffusion reflection portion 5 is formed with the surface of the protective film 6 roughened. Therefore, the protective film 6 in this embodiment is made of a light-reflecting material. The rest of the configuration is the same as that of the first embodiment described above, so the same reference numerals are given to the same parts and the description thereof is omitted.

【0021】(実施例5)以下、本発明の第5の実施例
について図面を参照しながら説明する。
(Fifth Embodiment) A fifth embodiment of the present invention will be described below with reference to the drawings.

【0022】図6は本発明の第5の実施例における電子
部品を示す断面図である。本実施例においては、図6に
示すように、セラミックから成る基体2の露出面を光拡
散反射部5として用いるようにしたものである。セラミ
ックは光を拡散反射しやすいので、そのまま光拡散反射
部5として用いることができる。その他の構成について
は上記第1の実施例と同様であるので、同一部分には同
一符号を付してその説明を省略する。
FIG. 6 is a sectional view showing an electronic component according to the fifth embodiment of the present invention. In the present embodiment, as shown in FIG. 6, the exposed surface of the base body 2 made of ceramic is used as the light diffusing and reflecting portion 5. Since ceramic easily diffuses and reflects light, it can be used as it is as the light diffusing and reflecting portion 5. The other parts of the configuration are the same as those of the first embodiment, and therefore, the same parts are designated by the same reference numerals and the description thereof is omitted.

【0023】[0023]

【発明の効果】以上説明したように本発明によれば、光
拡散反射部を有するので、外観検査用の光を照射した
際、上記光拡散反射部により拡散反射させ、多くの反射
光を受光素子に入射させることができる。したがって、
外観検査を安定した状態で確実に行うことができる。
As described above, according to the present invention, since the light diffusing / reflecting portion is provided, when the light for visual inspection is irradiated, it is diffused and reflected by the light diffusing / reflecting portion to receive a large amount of reflected light. It can be incident on the device. Therefore,
Appearance inspection can be reliably performed in a stable state.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施例における電子部品の断面
FIG. 1 is a sectional view of an electronic component according to a first embodiment of the present invention.

【図2】同電子部品の実装状態の外観検査原理説明図FIG. 2 is an explanatory diagram of the appearance inspection principle of the mounted state of the electronic component.

【図3】本発明の第2の実施例における電子部品の断面
FIG. 3 is a sectional view of an electronic component according to a second embodiment of the present invention.

【図4】本発明の第3の実施例における電子部品の断面
FIG. 4 is a sectional view of an electronic component according to a third embodiment of the present invention.

【図5】本発明の第4の実施例における電子部品の断面
FIG. 5 is a sectional view of an electronic component according to a fourth embodiment of the present invention.

【図6】本発明の第5の実施例における電子部品の断面
FIG. 6 is a sectional view of an electronic component according to a fifth embodiment of the present invention.

【図7】従来の電子部品の一部切欠斜視図FIG. 7 is a partially cutaway perspective view of a conventional electronic component.

【図8】同電子部品の実装状態の外観検査原理説明図FIG. 8 is an explanatory diagram of the appearance inspection principle of the mounted state of the electronic component.

【符号の説明】[Explanation of symbols]

1 電子部品 2 基体 3 抵抗体 4 電極 5 光拡散反射部 6 保護膜 1 Electronic Component 2 Base 3 Resistor 4 Electrode 5 Light Diffuse Reflecting Part 6 Protective Film

───────────────────────────────────────────────────── フロントページの続き (72)発明者 脊戸 卓美 神奈川県横浜市港北区綱島東四丁目3番1 号 松下通信工業株式会社内 (72)発明者 小関 洋子 神奈川県横浜市港北区綱島東四丁目3番1 号 松下通信工業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takumi Sudo Door 4-3-1, Tsunashima-higashi, Kohoku-ku, Yokohama-shi, Kanagawa Matsushita Communication Industrial Co., Ltd. 3-3-1 Matsushita Communication Industrial Co., Ltd.

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 外観検査用の光を拡散反射することがで
きる光拡散反射部を有する電子部品。
1. An electronic component having a light diffusion reflection portion capable of diffusely reflecting light for visual inspection.
【請求項2】 光拡散反射部が光透過性の保護膜の裏面
に光を拡散反射する成分を配して形成された請求項1記
載の電子部品。
2. The electronic component according to claim 1, wherein the light diffusing and reflecting portion is formed by arranging a component for diffusing and reflecting light on the back surface of the light transmitting protective film.
【請求項3】 光拡散反射部が保護膜の表面に光を拡散
反射する成分を配して形成された請求項1記載の電子部
品。
3. The electronic component according to claim 1, wherein the light diffusing and reflecting portion is formed by arranging a component for diffusing and reflecting light on the surface of the protective film.
【請求項4】 光拡散反射部が光透過性の保護膜の内部
に光を拡散反射する成分を配して形成された請求項1記
載の電子部品。
4. The electronic component according to claim 1, wherein the light diffusing / reflecting portion is formed by arranging a component that diffuses and reflects light inside a light-transmitting protective film.
【請求項5】 光拡散反射部が保護膜の表面を荒らして
形成された請求項1記載の電子部品。
5. The electronic component according to claim 1, wherein the light diffuse reflection portion is formed by roughening the surface of the protective film.
【請求項6】 光拡散反射部がセラミックの露出面であ
る請求項1記載の電子部品。
6. The electronic component according to claim 1, wherein the light diffuse reflection portion is an exposed surface of ceramic.
JP4054940A 1992-03-13 1992-03-13 Electronic parts Pending JPH05258903A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4054940A JPH05258903A (en) 1992-03-13 1992-03-13 Electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4054940A JPH05258903A (en) 1992-03-13 1992-03-13 Electronic parts

Publications (1)

Publication Number Publication Date
JPH05258903A true JPH05258903A (en) 1993-10-08

Family

ID=12984642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4054940A Pending JPH05258903A (en) 1992-03-13 1992-03-13 Electronic parts

Country Status (1)

Country Link
JP (1) JPH05258903A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4837646A (en) * 1982-01-13 1989-06-06 Hitachi, Ltd. Tape guide apparatus for helically wound tape

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4837646A (en) * 1982-01-13 1989-06-06 Hitachi, Ltd. Tape guide apparatus for helically wound tape

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