JPH0525238Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] The invention enables efficient die bonding or wire bonding to extremely large substrates such as HICs with bonding positions scattered over a wide range. This is related to a bonding device that can be used.

[Conventional technology]

A specific example of conventional wire bonding equipment is shown in Part 3.
As shown in the figure. 1 is the bonding head, which is placed on the XY table 2, which is a highly accurate XY moving device.
A bonding tool 3 is provided so as to be movable up and down by a Z moving device 4 which is a vertical moving device. Reference numeral 5 denotes a holding frame for a substrate 6 to be bonded, which is placed on a θ table 7 rotatable around an axis 9 perpendicular to the substrate 6. 10 is an imaging device for detecting the bonding position.

[Problem that the invention attempts to solve]

Therefore, when performing extensive bonding,
This was done by widening the movement range of the XY table 2, and by making the bonding arm 8, which has the bonding tool 3 at its tip, extendable and retractable.

However, if the movement range of the XY table 2 is widened, a decrease in movement speed cannot be avoided,
When the bonding arm 8 was extended, bonding performance was sometimes adversely affected.

Furthermore, die bonding, in which a semiconductor device is bonded to a substrate, has the same problems as wire bonding when moving over a wide range and making fine adjustments to the position.

The present invention attempts to solve the above-mentioned conventional problems, and aims to provide a bonding device that can improve the accuracy and speed of movement without adversely affecting bonding performance. be.

[Means for solving problems]

In order to solve the above-mentioned problems, the present invention includes a holding frame that holds a substrate, a bonding tool that performs bonding, and a bonding position detection device, and the holding frame and bonding tool are arranged in a plane parallel to the substrate. movement relative to,
In a bonding apparatus that bonds a substrate and a semiconductor device or a semiconductor device fixed on a substrate and a lead by relative movement in a direction perpendicular to the substrate and relative rotation around an axis perpendicular to the substrate, the holding As a device for relatively moving the frame and the bonding tool in a plane parallel to the substrate, a mechanism for moving the frame by a small distance and a mechanism for moving the bonding tool by a large distance are provided as separate mechanisms, and the mechanism for moving the frame and the bonding tool by a large distance is provided separately. An XY moving mechanism is formed as a mechanism for moving the bonding tool, and the XY moving mechanism is provided on the bonding head having the bonding tool or the holding frame, and as a mechanism for moving the large distance, the bonding tool is moved directly or through the XY moving mechanism. An arm for supporting a head is provided rotatably about an axis perpendicular to the substrate, and the arm is provided with an axial bonding head having a variable distance parallel to the substrate between the axis and the supported bonding head. It is an object of the present invention to provide a bonding apparatus characterized in that a distance variable device is provided to form an arm mechanism, and the bonding head is supported by the arm of the arm mechanism.

[Effect]

In the present invention, as a device for relatively moving the holding frame and the bonding tool in a plane parallel to the substrate, a mechanism for moving a small distance and a mechanism for moving a large distance are provided as separate mechanisms. For example, when performing wire bonding on a very large board such as an HIC with bonding positions scattered over a wide range, the holding frame and bonding tool board required for wire bonding between individual semiconductor devices and lead groups. Relative movement of a small distance in a parallel plane is performed by a mechanism that moves a small distance, and movement of a large distance to a semiconductor device portion to which wire bonding is performed is performed by a mechanism that moves a large distance. Therefore, since a mechanism for moving over large distances can be selected with emphasis placed on speed rather than accuracy, the speed of moving over large distances can be greatly improved.

And as a mechanism for moving small distances
Since it uses an XY movement mechanism, it can move with high precision and perform accurate bonding. In addition, as a mechanism for moving large distances, direct or
An arm supporting the bonding head via an XY movement mechanism is provided rotatably around an axis perpendicular to the substrate, and the arm is provided with a distance parallel to the substrate between the axis and the supported bonding head. An arm mechanism is formed by providing a device for varying the distance between shaft bonding heads, and the bonding head is supported by the arm of the arm mechanism, so that a large distance can be achieved with a simple structure using a small number of small and lightweight components. Moreover, it allows for rapid movement.

Therefore, wire bonding of a substrate on which semiconductor devices are scattered over a wide area can be performed accurately and quickly.

In addition, when performing die bonding with semiconductor devices scattered on a substrate, large distance movements are performed using a mechanism that moves large distances, and fine adjustments that require precision are performed using a mechanism that moves large distances.
If the XY movement mechanism is used, die bonding can be performed accurately and quickly.

〔Example〕

An embodiment in which the present invention is applied to a wire bonding device will be described with reference to the drawings.

In Figures 1 and 2, the bonding head 11
A Z moving device 36 is used to move the bonding tool 12 in a direction perpendicular to the substrate 24 to be bonded (hereinafter referred to as the Z direction), that is, in an up and down direction.
, and is attached to the lower surface of the XY moving mechanism 13.

The XY moving mechanism 13 is formed by a high-precision moving device in each of the X direction and the Y direction, which are parallel to the substrate 24 and perpendicular to each other, and moves the bonding head 11 in a plane parallel to the substrate 24. It is provided as a mechanism to move a small distance in case. Therefore, the XY moving mechanism 13 can arbitrarily move the bonding head 11 over a small distance in a plane parallel to the substrate 24 with high precision.
The XY moving mechanism 13 is provided with an imaging device 27 of a bonding position detection device.

The bonding position detection device is recognition unit 3.
1. It has a calculation unit and is connected to the control unit 32, and detects the bonding position with high precision using rectangular coordinates x and y, and controls the control unit 32 according to the detected value.
drives the XY moving mechanism 13.

The XY moving mechanism 13 is attached to the tip of a horizontal arm 14 parallel to the substrate 24 via a rotating device 29 so as to be rotatable around an axis 28 in the Z direction. The control section 32 drives the XY moving mechanism 13 so as to always maintain it in a constant direction even when the XY moving mechanism 13 is displaced.

The bonding head 11 is attached to the arm 14 of the arm mechanism 30 via the above-mentioned XY moving mechanism 13 and rotation device 29. The arm mechanism 30 is provided as a mechanism for moving the bonding head 11 over a large distance in a plane parallel to the substrate 24.

The arm 14 includes a first arm 15 and a second arm 16.
The first arm 15 is connected to the rotation device 19 so as to be relatively rotatable around an axis 18 in the Z direction. It is attached to the arm attachment member 21 via. The rotation device 17 adjusts the angle A formed by the first arm 15 and the second arm 16 so that the axis 20 of the arm 14 and the supported bonding head 11 are aligned with the substrate 2.
This is an axial bonding head distance variable device that varies the distance parallel to 4. Arm mounting member 21
is placed and fixed on a vertical movement device 22 that is movable in the Z direction, and the vertical movement device 22 is provided on an arm support base 23 so as to be vertically movable.

Therefore, the arm mechanism 30 moves the shaft 20 and the bonding head 11 to the The length R of a straight line parallel to the substrate 24 connecting the axis 28 of the rotating device 29 supported through the rotating device 19 is variable to an arbitrary value, and the angle C between the straight line and the reference line L passing through the axis 20 is set to the rotating device 19. By changing the rotation angle B, the bonding head 11 attached to the arm 14 can be arbitrarily moved over a large distance in a plane parallel to the substrate 24. Furthermore, the position, that is, the height, of the bonding head 11 in the Z direction can be made variable by the vertical movement mechanism 22.

The arm mechanism 30 is also driven by the control unit 32, and the control unit 32 controls the rough position of the bonding position, for example, an IC as a semiconductor device in FIG.
Chips 33, 34, 35, ... are preferably the second
The data are input using polar coordinates r and θ, with the axis 20 in the figure as the pole and the reference line L as the original line. Arm 14
The height is also input as appropriate during bonding and during driving.

IC chip 3 undergoing wire bonding
A substrate 2 having leads 3, 34, 35, . . .
The holding frame 25 that holds 4 has an axis 37 in the Z direction.
It is provided on a θ table 26 which is rotatable around the θ table.

However, IC chips 33, 34, 35,...
When performing wire bonding with each lead in this order, first, the arm mechanism 30 is driven so that the bonding tool 12 is positioned approximately above the IC chip 33. That is, when the position of the IC chip 33 is represented by polar coordinates r ₁ , θ ₁ , the arm 1 is moved so that the bonding tool 12 is located at that position.
4, that is, the length R of the straight line connecting the axes 20 and 28 in FIG. and drives the rotating devices 17 and 19. I C
When the bonding tool 12 is positioned above the chip 33, the arm 14 is lowered from the driving height to the bonding height.

Next, the IC chip 33 and the group of leads to be wire bonded are detected with high precision by a bonding position detection device, and the XY moving mechanism 13, Z moving device 36, and θ table 26 are driven to perform high precision wire bonding. I do.

When the wire bonding between the IC chip 33 and its lead group is completed, the arm 14 is raised to the operating height, and the arm mechanism 30 is moved so that the bonding tool 12 is positioned above the next IC chip 34.
is driven, and bonding is performed as described above.

It is also possible to input the positions of the IC chips 33, 34, .

In addition to the above-mentioned rotating device 17, the device for varying the distance between the shaft bonding heads provided on the arm 14 includes a sliding device for sliding the second arm 16 along the first arm 15, and a sliding device for sliding the second arm 16 along the first arm 15.
1 without dividing into the first arm 15 and the second arm 16
An XY moving mechanism 13 formed of a book arm and having a bonding head 11 on the arm, or a moving device for moving the bonding head 11 along the arm is used.

Further, although the XY moving mechanism 13 and the Z moving device 36 are provided on the bonding tool 12 side, and the θ table 26 is provided on the holding frame 25 side, it is necessary to configure the bonding tool 12 and the holding frame 25 so that they can move relative to each other. For example, the XY moving mechanism 13 may be provided on the holding frame 25 side, or the θ
A rotating device in place of the table 26 may be provided on the bonding tool 12 side.

The above was explained using wire bonding equipment,
Of course, the present invention can also be applied to a die bonding apparatus for bonding a semiconductor device to a substrate.

[Effect of idea]

In the present invention, as a device for relatively moving the holding frame and the bonding tool in a plane parallel to the substrate, a mechanism for moving a small distance and a mechanism for moving a large distance are provided as separate mechanisms. It is possible to improve the accuracy and speed of movement without adversely affecting bonding performance, and therefore enables efficient die bonding or wire bonding to ultra-large boards such as HIC where bonding positions are scattered over a wide range. It is possible to provide a bonding device that can carry out the following.

[Brief explanation of the drawing]

FIG. 1 is a front view of an embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a front view of a conventional example. DESCRIPTION OF SYMBOLS 1...Bonding head, 2...XY table, 3...Bonding tool, 4...Z moving device, 5...Holding frame, 6...Substrate, 7...θ
Table, 8... Bonding arm, 9...
Axis, 10... Imaging device, 11... Bonding head, 12... Bonding tool, 13...
XY movement mechanism, 14...arm, 15...first arm, 16...second arm, 17...rotation device,
18...Axis, 19...Rotating device, 20...Axis, 2
1... Arm mounting member, 22... Vertical movement device, 2
3... Arm support base, 24... Substrate, 25... Holding frame, 26... θ table, 27... Imaging device, 28... Axis, 29... Rotating device, 30...
Arm mechanism, 31... recognition unit, 32... control section, 33... IC chip, 34... IC chip,
35...IC chip, 36...Z moving device, 37
……shaft.

Claims (1)

[Claims for Utility Model Registration] A holding frame that holds a substrate, a bonding tool that performs bonding, and a bonding position detection device are provided, and the holding frame and the bonding tool are relatively moved in a plane parallel to the substrate, In a bonding apparatus for bonding a substrate and a semiconductor device or a semiconductor device fixed on a substrate and a lead by relative movement in a direction perpendicular to the substrate and relative rotation around an axis perpendicular to the substrate, the holding frame and As a device for relatively moving the bonding tool in a plane parallel to the substrate, a mechanism for moving a small distance and a mechanism for moving a large distance are provided as separate mechanisms, and a mechanism for moving the small distance. forming an XY moving mechanism, the XY moving mechanism is provided on the bonding head having the bonding tool or the holding frame, and as a mechanism for moving the large distance, the bonding head is moved directly or through the XY moving mechanism. A supporting arm is provided rotatably about an axis perpendicular to the substrate, and the arm includes:
An arm mechanism is formed by providing an inter-axis bonding head distance variable device for varying the distance parallel to the substrate between the axis and the supported bonding head, and the bonding head is supported by the arm of the arm mechanism. A bonding device characterized by: