JPH05251852A - Printed-circuit board and its manufacture - Google Patents
Printed-circuit board and its manufactureInfo
- Publication number
- JPH05251852A JPH05251852A JP4973192A JP4973192A JPH05251852A JP H05251852 A JPH05251852 A JP H05251852A JP 4973192 A JP4973192 A JP 4973192A JP 4973192 A JP4973192 A JP 4973192A JP H05251852 A JPH05251852 A JP H05251852A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- plating
- electrolytic plating
- etching
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000009713 electroplating Methods 0.000 claims abstract description 27
- 238000005530 etching Methods 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 24
- 229910021645 metal ion Inorganic materials 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 210000001015 abdomen Anatomy 0.000 description 2
- -1 alkyl imidazole Chemical compound 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Landscapes
- Coils Or Transformers For Communication (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、配線基板、特に高密度
および高断面の配線回路を有する配線基板およびその製
造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board, and more particularly to a wiring board having a high-density and high-section wiring circuit and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】小型薄型モータ等に使用されるコイルに
は、高密度で且つ高断面の回路パターンが要求される。
このような配線パターンを形成するには、サブトラクテ
ィブ法、すなわち基板上の回路以外の導体膜（銅など）
をエッチングにより除去する方法が検討されてきた。し
かし、低抵抗値を得るために、導体膜を厚くすると導体
膜の中腹部が幅方向に削られるサイドエッチ効果により
配線間のギャップが大きくなり高密度回路を形成できな
くなる。また導体膜を薄くすれば高断面を得ることがで
きないために抵抗値を低くできないという欠点がある。
そこで、高密度および高断面の配線回路を形成する方法
として、特開昭５７−９１５９０号に示される製造方法
が提案されている。この方法は、アルミなどの金属薄板
上に電解メッキなどによって銅などの導電体を成長さ
せ、ついで得られた導電体を絶縁性基板に金属薄板を上
にして貼り付けたのち、金属薄板をエッチング除去す
る。この方法は電解メッキによって配線パターンを形成
しているために導体膜の太りを充分に期待でき、また配
線パターンはレジストを使用することによって行うため
に高密度の配線パターンを実現することが可能である。2. Description of the Related Art A coil used in a small and thin motor or the like is required to have a high-density and high-section circuit pattern.
To form such a wiring pattern, a subtractive method is used, that is, a conductor film (such as copper) other than the circuit on the substrate.
A method of removing the by etching has been studied. However, if the conductor film is made thick in order to obtain a low resistance value, the gap between the wirings becomes large due to the side etching effect of cutting the middle part of the conductor film in the width direction, making it impossible to form a high-density circuit. Further, if the conductor film is made thin, a high cross section cannot be obtained, so that the resistance value cannot be lowered.
Therefore, as a method for forming a wiring circuit having a high density and a high cross section, a manufacturing method disclosed in Japanese Patent Laid-Open No. 57-91590 has been proposed. In this method, a conductor such as copper is grown on a thin metal plate such as aluminum by electrolytic plating, and then the obtained conductor is attached to an insulating substrate with the thin metal plate facing up, and then the thin metal plate is etched. Remove. In this method, since the wiring pattern is formed by electrolytic plating, the conductor film can be expected to be thick enough, and since the wiring pattern is formed by using a resist, a high-density wiring pattern can be realized. is there.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記の
特開昭５７−９１５９０号に示される製造方法ではアル
ミなどの金属薄板が必要であり、しかも最終工程として
この金属薄板をエッチング除去しなければならなくさら
に絶縁性基板も必要であることから工程が極めて煩雑と
なる。However, the manufacturing method disclosed in Japanese Patent Laid-Open No. 57-91590 requires a metal thin plate such as aluminum, and the metal thin plate must be removed by etching as a final step. In addition, since an insulating substrate is also required, the process becomes extremely complicated.
【０００４】本発明の目的は、高密度，高断面の配線回
路を得ることができるとともに、従来のサブトラクティ
ブ法を使用することによって非常に低コスト化できる配
線基板およびその製造方法を提供することにある。It is an object of the present invention to provide a wiring board which can obtain a wiring circuit having a high density and a high cross section and can be made extremely low in cost by using a conventional subtractive method, and a manufacturing method thereof. It is in.
【０００５】[0005]
【課題を解決するための手段】本発明に係る配線基板
は、基板上に形成され、中腹部から上部を中心に側部全
体がけずられた山型または略Ｉ型の断面形状の配線の周
囲に幅方向よりも厚み方向に厚い電解メッキ層を被着し
てなることを特徴とする。A wiring board according to the present invention is formed on a board and surrounds a wiring having a mountain-shaped or substantially I-shaped cross-sectional shape in which the entire side portion is offset from the middle portion to the upper portion. And an electrolytic plating layer thicker in the thickness direction than in the width direction.
【０００６】また、前記配線はうず巻状であることを特
徴とする。Further, the wiring is spirally wound.
【０００７】本発明に係る配線基板の製造方法は、基板
上の導体層をエッチングすることにより所望の配線パタ
ーンを形成するとき、オーバーエッチングにより配線断
面の中腹部から上部を十分に削り、ついで電解メッキに
より配線の周囲に電解メッキ層を成長させることを特徴
とする。In the method of manufacturing a wiring board according to the present invention, when a desired wiring pattern is formed by etching the conductor layer on the board, the upper part of the middle section of the wiring cross section is sufficiently removed by overetching, and then electrolysis is performed. It is characterized in that an electrolytic plating layer is grown around the wiring by plating.
【０００８】[0008]
【作用】エッチング液によって銅箔などの導体層をエッ
チングする場合、導体膜の厚さが厚い状態でエッチング
を進めオーバエッチを行うと、サイドエッチによって導
体層の断面中腹部から上部を中心に側部全体が内側に削
られていき、山型または略Ｉ型の断面形状となる。本発
明では、この山型または略Ｉ型の断面形状を核として周
囲に電解メッキ層を成長させたものであり、しかもその
電解メッキ層は幅方向よりも厚み方向に厚くなるように
制御されたものである。このような構成であると、電解
メッキを使用するために配線は高断面となり、また電解
メッキ時には幅方向にもメッキ層が成長するために線幅
の間隔は小さくなる。[Function] When a conductor layer such as a copper foil is etched by an etching solution, if the conductor film is thick and etching is carried out and overetching is performed, side etching causes side portions centering on the upper part of the conductor layer to the upper side. The entire part is carved inward to form a mountain-shaped or substantially I-shaped cross-sectional shape. In the present invention, an electrolytic plating layer is grown around the core of this mountain-shaped or substantially I-shaped cross-sectional shape, and the electrolytic plating layer is controlled to be thicker in the thickness direction than in the width direction. It is a thing. With such a configuration, the wiring has a high cross section due to the use of electrolytic plating, and at the time of electrolytic plating, the plating layer grows in the width direction as well, so that the interval between the line widths becomes small.
【０００９】本発明では、基板上の導体層をエッチング
するときに、従来のサブトラクティブ法の制御目標であ
った適性エッチングに逆行してオーバーエッチングを行
い、配線断面の中腹部から上部を中心に側部全体が充分
に削られるようにする。図１（Ａ）は適性エッチングを
示し、同図（Ｂ）は本発明に係るオーバーエッチングを
示している。図２は本発明の配線基板の断面図を示す。
なお、図において１はエッチングレジスト膜、２は導体
層（銅等）からなる配線、３は電解メッキ層をそれぞれ
示している。オーバーエッチングを行ったのち、レジス
ト膜１を取り除いて、配線断面の中腹部から上部が充分
に削られた銅箔２を電極として電解メッキにより銅箔２
の周囲に電解メッキ層３を成長させる。本発明の製造方
法では、このときの電解メッキ層３の成長速度に異方性
が生じることを利用する。すなわち、電解メッキの工程
では、メッキ液の金属イオン濃度が、配線２，２間では
低く、それ以外の所で高いと考えられる。この理由は、
配線２，２間ではメッキ液の流れが同配線が障害物とな
るために相対的に悪いと考えられるからである。このた
めにメッキ層３は厚み方向により早く成長していく。し
たがって、隣接する配線２，２間の距離が短くても、厚
み方向により厚いメッキ層を得ることが出来るから高断
面の配線を形成することができる。また、電解メッキ工
程においては配線２が電極となるが、左右両サイドが削
られた配線２は所謂薄膜ではないために充分低い抵抗値
にある。従って基板全体のメッキ層の成長は均一なもの
となる。According to the present invention, when the conductor layer on the substrate is etched, overetching is performed by reversing the proper etching which was the control target of the conventional subtractive method, and centering from the middle part to the upper part of the wiring cross section. Make sure the entire side is well carved. FIG. 1A shows proper etching, and FIG. 1B shows overetching according to the present invention. FIG. 2 shows a sectional view of the wiring board of the present invention.
In the figure, 1 is an etching resist film, 2 is a wiring made of a conductor layer (copper or the like), and 3 is an electrolytic plating layer. After performing over-etching, the resist film 1 is removed, and the copper foil 2 having a sufficiently cut upper part from the middle part of the wiring cross section is used as an electrode for electrolytic plating.
The electrolytic plating layer 3 is grown around the. The manufacturing method of the present invention utilizes that the growth rate of the electrolytic plating layer 3 at this time is anisotropic. That is, in the process of electrolytic plating, it is considered that the metal ion concentration of the plating solution is low between the wirings 2 and 2 and high elsewhere. The reason for this is
This is because it is considered that the flow of the plating solution between the wirings 2 and 2 is relatively bad because the wiring becomes an obstacle. Therefore, the plated layer 3 grows faster in the thickness direction. Therefore, even if the distance between the adjacent wirings 2 and 2 is short, it is possible to obtain a plating layer that is thicker in the thickness direction, and thus it is possible to form a wiring having a high cross section. Further, in the electroplating process, the wiring 2 serves as an electrode, but the wiring 2 whose left and right sides are shaved has a sufficiently low resistance value because it is not a so-called thin film. Therefore, the growth of the plated layer on the entire substrate becomes uniform.
【００１０】[0010]
【実施例】図３は本発明に係る配線基板製造方法の実施
例の前半の工程を示し、図４は同製造方法の後半の工程
を示している。EXAMPLE FIG. 3 shows the first half of the steps of an embodiment of the wiring board manufacturing method according to the present invention, and FIG. 4 shows the second half of the steps of the same manufacturing method.
【００１１】素材には両面銅張積層板を使用する。この
素材は、フェノールまたはエポキシ樹脂１０の表面およ
び裏面に銅箔１１を接着したものである。板厚は、例え
ば０．４５ｔのものが使用され、この場合の銅箔１１の
厚さは３５〜７０μｍのものが使用される。次に、スル
ーホール部を形成する箇所に穴明けを行う。続いてスル
ーホール部および表面裏面全体に厚さが略１０μｍの電
解メッキ１２を行う。A double-sided copper clad laminate is used as the material. This material is obtained by adhering a copper foil 11 to the front and back surfaces of a phenol or epoxy resin 10. The plate thickness is, for example, 0.45 t, and the thickness of the copper foil 11 in this case is 35 to 70 μm. Next, a hole is formed at the place where the through hole portion is formed. Subsequently, electrolytic plating 12 having a thickness of approximately 10 μm is performed on the through hole portion and the entire front surface and back surface.
【００１２】図４に示す後半の工程では、厚さ２０μｍ
の感光性レジスト１３をエッチングレジストとして、前
記電解メッキ１２上に付ける。その後、露光および現像
を行って所望のレジストパターンを得る。そして、エッ
チング液に浸しオーバーエッチングを行い、図２に示す
ように配線２の側部全体が中腹部から上部を中心に十分
にけずられるようにする。なお、中腹部よりも上方部の
けずりが大きいと、完全な山型となり、より好ましい形
状となる。但し、いずれの場合も高さ上方向のけずりは
ないから、配線２の高さは元のままである。さらにその
後、感光性レジスト１３の剥離を行う。そして、配線パ
ターンを電極としてメッキ液に浸して電解メッキを行
い、図に示すような形状にメッキ層を成長させ、さらに
その後ハンダレジスト１５をつける。In the latter half process shown in FIG. 4, the thickness is 20 μm.
The photosensitive resist 13 is used as an etching resist on the electrolytic plating 12. Then, exposure and development are performed to obtain a desired resist pattern. Then, it is dipped in an etching solution to perform over-etching so that the entire side portion of the wiring 2 is sufficiently displaced from the middle abdomen to the upper portion as shown in FIG. In addition, when the displacement in the upper portion is larger than that in the middle abdomen, the mountain shape becomes a complete mountain shape, which is a more preferable shape. However, in any case, since there is no upward shift in height, the height of the wiring 2 remains unchanged. After that, the photosensitive resist 13 is peeled off. Then, the wiring pattern is used as an electrode and immersed in a plating solution for electrolytic plating to grow a plating layer in a shape as shown in the figure, and then a solder resist 15 is applied.
【００１３】実験例 素材としては図３に示すものを使用し、また電解メッキ
１２および感光性レジスト１３の膜厚も１２，１３に示
すようにそれぞれ１０μｍ，２０μｍものを使用した。
なおエッチングレジストとして使用した感光性レジスト
１３には、印刷インクやＥＤ塗料やフォトレジストのよ
うな有機レジストの他、Ａｕ，Ｓｎ−ＰｄＳｎなどのメ
タルレジストあるいはアルキルイシダゾールなどを使用
することもも可能である。エッチング液としては、塩化
第２銅エッチング液を使用した。Experimental Example The materials shown in FIG. 3 were used, and the thicknesses of the electrolytic plating 12 and the photosensitive resist 13 were 10 μm and 20 μm as shown in 12 and 13, respectively.
As the photosensitive resist 13 used as the etching resist, printing resist, organic resist such as ED paint and photoresist, metal resist such as Au, Sn-PdSn, or alkyl imidazole may be used. Is. A cupric chloride etching solution was used as the etching solution.
【００１４】この他、アルカリエッチング液や塩化第２
鉄エッチング液を使用することも可能である。さらに、
連続コンベア方式によってエッチングを行った。エッチ
ング条件は以下のとおりである。In addition to the above, an alkaline etching solution and a second chloride
It is also possible to use an iron etching solution. further,
Etching was performed by a continuous conveyor system. The etching conditions are as follows.
【００１５】 塩酸濃度 １２０（１００〜１４０）ｇ／ｌ（リット
ル） ＯＲＰ ５７０（５５０−６００）ｍＶ 比 重 １．２４８（１．２４０〜１．２５０）ｇ／ｃ
ｍ3 （ａｔ２５℃） スプレー圧力 上１．８５（１．７５〜１．９５）ｋｇ
／ｃｍ2 下２．３５（２．２５〜２．４５）ｋｇ／ｃｍ2 コンベアスピード１．５ （１．４５〜１．９０）ｍ
／分 ２回流し 電解メッキを行うのに硫酸銅メッキを使用した。この
他、ピロリン酸銅メッキ，シアン化銅，ホウフッ化銅な
どを使用することも可能である。Hydrochloric acid concentration 120 (100 to 140) g / l (liter) ORP 570 (550-600) mV Specific gravity 1.248 (1.240 to 1.250) g / c
m 3 (at 25 ° C.) spray pressure 1.85 (1.75-1.95) kg
/ Cm 2 below 2.35 (2.25 to 2.45) kg / cm 2 conveyor speed 1.5 (1.45 to 1.90) m
Copper / sulfate plating was used to perform electrolytic plating. Besides, it is also possible to use copper pyrophosphate plating, copper cyanide, copper borofluoride and the like.
【００１６】条件は、 硫酸濃度 １８０（１７０〜２１０）ｇ／ｌ 塩酸イオン ５０（３０〜６０）ｍｇ／ｌ 銅濃度 ３０（２０〜５０）ｇ／ｌ 光沢剤 キューボートＭ（商品名）５（３〜８）
ｍｌ／ｌ 陰極電流密度 ６（５〜８）Ａ／ｄｍ2 メッキ時間 ８８分 以上の条件で図３，図４に示す工程を実施した結果、図
５に示すようにメッキ厚Ｈと片側メッキ幅ａ、すなわ
ち、（メッキ幅Ｗ−銅下地幅ａ）／２の比は、１．５以
上：１．０となった。従って、メッキ間隔ｂを最低３０
μｍと決めれば、ピッチ（ｐ）−Ｗ（メッキ幅）＝３０
μｍとなり、ピッチｐ（回路幅）が与えられたときにメ
ッキ幅Ｗをコントロールすることで、すなわち電解メッ
キの時間をコントロールすることで３０μｍの一定のメ
ッキ間隔ｂを得ることができる。また、この場合、メッ
キ厚Ｈは片側メッキ幅ａの少なくとも１．５倍以上とな
るために、高断面積の配線パターンにすることができ
る。The conditions are as follows: sulfuric acid concentration 180 (170 to 210) g / l hydrochloric acid ion 50 (30 to 60) mg / l copper concentration 30 (20 to 50) g / l brightener Cueboat M (trade name) 5 ( 3-8)
ml / l Cathode current density 6 (5-8) A / dm 2 Plating time 88 minutes As a result of carrying out the steps shown in FIGS. 3 and 4 under the above conditions, the plating thickness H and the plating width on one side as shown in FIG. The ratio of a, that is, (plating width W-copper base width a) / 2 was 1.5 or more: 1.0. Therefore, the plating interval b should be at least 30.
If μm is determined, pitch (p) -W (plating width) = 30
When the pitch p (circuit width) is given, the plating width W is controlled, that is, by controlling the electrolytic plating time, a constant plating interval b of 30 μm can be obtained. Further, in this case, since the plating thickness H is at least 1.5 times the one-side plating width a, a wiring pattern having a high cross-sectional area can be obtained.
【００１７】[0017]
【発明の効果】本発明では、従来のサブトラクティブ法
に電解メッキ工程を追加するだけで高密度且つ高断面積
の配線パターンを形成でき、非常に低コストとなり、し
かも工数が少ないために製造時間を短く出来る。しか
も、電解メッキを行うときにはエッチング後の配線を電
極とするが、この配線は薄膜のような小断面ではなくメ
ッキを行うのに充分な断面を有することからメッキ成長
が基板全面に渡って均一なものとなる。また、メッキ時
間をコントロールすることにより任意の配線ピッチに対
応することも可能である。According to the present invention, a wiring pattern having a high density and a large cross-sectional area can be formed only by adding an electrolytic plating step to the conventional subtractive method, resulting in a very low cost and a small number of man-hours. Can be shortened. Moreover, when electrolytic plating is performed, the wiring after etching is used as an electrode. Since this wiring has a cross section sufficient for plating, not a small cross section like a thin film, the plating growth is uniform over the entire surface of the substrate. Will be things. It is also possible to cope with an arbitrary wiring pitch by controlling the plating time.
【図１】（Ａ），（Ｂ）従来の適性エッチング，本発明
に係るオーバーエッチングをそれぞれ示す図。FIGS. 1A and 1B are diagrams showing conventional aptitude etching and overetching according to the present invention, respectively.
【図２】本発明に係る配線基板の配線パターンの断面図
を示す図。FIG. 2 is a diagram showing a cross-sectional view of a wiring pattern of a wiring board according to the present invention.
【図３】本発明の実施例の製造方法の前半の工程を示す
図。FIG. 3 is a diagram showing a first half of a manufacturing method according to an embodiment of the present invention.
【図４】上記製造方法の後半の工程を示す図。FIG. 4 is a diagram showing a latter half of the manufacturing method.
【図５】メッキ部の大きさについて説明するための図。FIG. 5 is a diagram for explaining the size of a plated portion.
２−エッチング後の配線部 ３（１４）−電解メッキ部 2-Wiring part after etching 3 (14) -Electrolytic plating part
Claims (3)
に側部全体がけずられた山型または略Ｉ型の断面形状の
配線の周囲に幅方向よりも厚み方向に厚い電解メッキ層
を被着してなる配線基板。1. An electrolytic plating layer formed on a substrate, which is thicker in the thickness direction than in the width direction around a wiring having a mountain-shaped or substantially I-shaped cross-section which is offset from the middle part to the upper part and whose entire side part is offset. A wiring board formed by coating.
る、請求項１記載の配線基板。2. The wiring board according to claim 1, wherein the wiring has a spiral shape.
り所望の配線パターンを形成するとき、オーバーエッチ
ングにより配線断面の中腹部から上部を十分に削り、つ
いで電解メッキにより配線の周囲に電解メッキ層を成長
させることを特徴とする、配線基板の製造方法。3. When a desired wiring pattern is formed by etching a conductor layer on a substrate, the upper part from the middle part of the wiring cross section is sufficiently removed by over-etching, and then electrolytic plating layer is formed around the wiring by electrolytic plating. A method for manufacturing a wiring board, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4973192A JPH0719950B2 (en) | 1992-03-06 | 1992-03-06 | Wiring board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4973192A JPH0719950B2 (en) | 1992-03-06 | 1992-03-06 | Wiring board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05251852A true JPH05251852A (en) | 1993-09-28 |
| JPH0719950B2 JPH0719950B2 (en) | 1995-03-06 |
Family
ID=12839336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4973192A Expired - Fee Related JPH0719950B2 (en) | 1992-03-06 | 1992-03-06 | Wiring board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719950B2 (en) |
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| JP2014027251A (en) * | 2012-06-20 | 2014-02-06 | Alps Green Devices Co Ltd | Magnetic element and method for manufacturing the same |
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| CN113302331B (en) * | 2019-03-28 | 2023-08-11 | 住友化学株式会社 | Target grinding method, target manufacturing method, and circulating ingot manufacturing method |
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Also Published As
| Publication number | Publication date |
|---|---|
| JPH0719950B2 (en) | 1995-03-06 |
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