JPH05245844A - Resin-encapsulation mold with venting function - Google Patents
Resin-encapsulation mold with venting functionInfo
- Publication number
- JPH05245844A JPH05245844A JP5023292A JP5023292A JPH05245844A JP H05245844 A JPH05245844 A JP H05245844A JP 5023292 A JP5023292 A JP 5023292A JP 5023292 A JP5023292 A JP 5023292A JP H05245844 A JPH05245844 A JP H05245844A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- exhaust
- vent
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は排気機能付樹脂封止用金
型に関し、特に熱硬化性樹脂を使用してトランファーモ
ールドによって樹脂封止を行う際の樹脂封止用金型に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealing die having an exhaust function, and more particularly to a resin-sealing die for resin-sealing by transfer molding using a thermosetting resin.
【0002】[0002]
【従来の技術】従来の樹脂封止用金型は、図2(a)の
上金の下面図,図2(b)の下金の上面図,図2(c)
の縦断面図に示すように樹脂を投入するポット1,カル
2,樹脂の流路となるランナー3,製品を形成するキャ
ビティ4,ランナー3とキャビティ4を結ぶゲート5,
金型内の空気の抜け路となるエアベント6を有してい
る。又、金型自体は上型7と下型8に分けられる。2. Description of the Related Art A conventional resin molding die is shown in FIG. 2 (a), which is a bottom view of the upper die, FIG. 2 (b) is a top view of the lower die, and FIG.
As shown in the vertical cross-sectional view of FIG. 1, a pot for charging resin 1, a cull 2, a runner serving as a resin flow path 3, a cavity 4 for forming a product 4, a gate 5 connecting the runner 3 and the cavity 4,
It has an air vent 6 which serves as a passage for the air in the mold. The mold itself is divided into an upper mold 7 and a lower mold 8.
【0003】次に金型の動作について説明する。上型
7,下型8を型締した後、樹脂をポット1より投入し、
プランジャーヘッド9を降下させる事により、樹脂はカ
ル2からランナー3,ゲート5を流動し各キャビティ4
内に充填させる。この時、ランナー3かキャビティ4内
の空気は、樹脂が充填されるにつれそれぞれのエアベン
ト6から金型外へと自然に排気される。Next, the operation of the mold will be described. After the upper mold 7 and the lower mold 8 are clamped, the resin is poured from the pot 1,
When the plunger head 9 is lowered, the resin flows from the cull 2 to the runner 3 and the gate 5, and each cavity 4
Fill inside. At this time, the air inside the runner 3 or the cavity 4 is naturally exhausted from the respective air vents 6 to the outside of the mold as the resin is filled.
【0004】[0004]
【発明が解決しようとする課題】この従来の樹脂封止用
金型では、ランナーやキャビティ内の空気は注入される
樹脂によって自然に排気されるが、ランナーやゲートで
樹脂が巻き込んだ空気はエアベントから排気されにく
く、ボイドとしてキャビティ内に残ってしまうという問
題点があった。又、残ったボイドを圧縮する為に射出圧
力を高くすると、それに伴う薄ばりの発生を少なくする
為の高い型締圧力が必要となり、金型強度や加圧能力の
関係で樹脂封止装置の小型化,軽量化の妨げになるとい
う問題点もあった。In this conventional mold for resin encapsulation, the air in the runner and the cavity is naturally exhausted by the injected resin, but the air entrained by the resin in the runner and the gate is air vented. There is a problem in that it is difficult to exhaust from the inside and remains in the cavity as a void. In addition, if the injection pressure is increased to compress the remaining voids, a high mold clamping pressure is required to reduce the occurrence of thin flashes that accompany the injection pressure. There was also a problem that it hindered size and weight reduction.
【0005】[0005]
【課題を解決するための手段】本発明の樹脂封止用金型
は、各キャビティからのエアベントを金型内で一括接続
し、この接続したエアベントに排気口を設け、金型外の
排気ポンプ等で強制排気,通気ができる様な機能を有し
ている。According to the resin sealing mold of the present invention, the air vents from the respective cavities are collectively connected in the mold, and the connected air vents are provided with exhaust ports to provide an exhaust pump outside the mold. It has the function of forced exhaust and ventilation.
【0006】[0006]
【実施例】次に本発明について図面を参照して説明す
る。The present invention will be described below with reference to the drawings.
【0007】図1は本発明の一実施例の樹脂封止用金型
を示す図で、同図(a)は上型の下面図、同図(b)は
下型の上面図、同図(c)は金型の縦断面図である。1A and 1B are views showing a resin-sealing mold according to an embodiment of the present invention. FIG. 1A is a bottom view of the upper mold, FIG. 1B is a top view of the lower mold, and FIG. (C) is a vertical cross-sectional view of the mold.
【0008】ポット1,カル2,ランナー3,キャビテ
ィ4,ゲート5,上型7,下型8,プランジャーヘッド
9という構成は従来金型と同様であるが、エアベント6
は従来金型の様に個々に金型外まで伸びておらず、それ
ぞれ金型内部でつながっており、型締めをした際は密封
される。そして、このエアベント6の一端には排気口1
0が設けられ、金型内の排気ダクト11を通して金型外
の排気ポンプ12に接続される。型締め後、ポット1内
に樹脂が投入され、プランジャーヘッド9が降下して射
出が開始されると同時に排気ポンプ12が稼働し、ラン
ナー3やキャビティ4内の空気は排気口10,排気ダク
ト11より途々に排気される。そして、射出終了と同時
に排気も終了し、キャビティ内に残ったボイドは射出後
のプランジャーヘッドの保持圧力で圧縮される。The structure of the pot 1, cull 2, runner 3, cavity 4, gate 5, upper die 7, lower die 8 and plunger head 9 is the same as that of the conventional die, but the air vent 6 is used.
Unlike the conventional mold, does not extend to the outside of the mold individually, but is connected inside the mold, and is sealed when the mold is clamped. The exhaust port 1 is provided at one end of the air vent 6.
0 is provided and is connected to an exhaust pump 12 outside the mold through an exhaust duct 11 inside the mold. After the mold is clamped, the resin is put into the pot 1, the plunger head 9 is lowered, and the injection is started. It is exhausted from 11 onwards. Then, at the same time as the injection is completed, the exhaust is also completed, and the void left in the cavity is compressed by the holding pressure of the plunger head after the injection.
【0009】[0009]
【発明の効果】以上説明したように本発明は、エアベン
トから強制排気を行う機能を付加させる事により、金型
内を流動する樹脂が空気を巻込んでも巻込む空気自体が
低気圧である為、低い射出圧力でボイドを充分に圧縮で
きるという効果がある。その結果、高型締圧力が不要と
なるので樹脂封止装置の小型化,軽量化が可能となる。As described above, according to the present invention, by adding the function of forcibly exhausting from the air vent, even if the resin flowing in the mold entrains air, the entrained air itself is a low pressure. There is an effect that the void can be sufficiently compressed with a low injection pressure. As a result, a high mold clamping pressure is not required, so that the resin sealing device can be made smaller and lighter.
【図1】本発明の一実施例を示す図で、同図(a)は上
型の下面図,同図(b)は下型の上面図,同図(c)は
金型の縦断面図である。1A and 1B are views showing an embodiment of the present invention, in which FIG. 1A is a bottom view of an upper mold, FIG. 1B is a top view of a lower mold, and FIG. 1C is a vertical cross section of a mold. It is a figure.
【図2】従来の樹脂封止用金型を示す図で、同図(a)
は上型の下面図,同図(b)は下型の上面図,同図
(c)は金型の縦断面図である。FIG. 2 is a view showing a conventional resin-sealing mold, and FIG.
Is a bottom view of the upper die, FIG. 2B is a top view of the lower die, and FIG. 1C is a vertical sectional view of the die.
1 ポット 2 カル 3 ランナー 4 キャビティ 5 ゲート 6 エアベント 7 上型 8 下型 9 プランジャーヘッド 10 排気口 11 排気ダクト 12 排気ポンプ 1 Pot 2 Cull 3 Runner 4 Cavity 5 Gate 6 Air Vent 7 Upper Mold 8 Lower Mold 9 Plunger Head 10 Exhaust Port 11 Exhaust Duct 12 Exhaust Pump
Claims (1)
で一括接続し、この接続したエアベントの一端に排気口
を設けて排気ポンプに接続することを特徴とする排気機
能付樹脂封止用金型。1. A mold for resin-sealing with an exhaust function, wherein air vents from respective cavities are collectively connected in a mold, and an exhaust port is provided at one end of the connected air vent to connect to an exhaust pump. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5023292A JPH05245844A (en) | 1992-03-09 | 1992-03-09 | Resin-encapsulation mold with venting function |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5023292A JPH05245844A (en) | 1992-03-09 | 1992-03-09 | Resin-encapsulation mold with venting function |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05245844A true JPH05245844A (en) | 1993-09-24 |
Family
ID=12853275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5023292A Withdrawn JPH05245844A (en) | 1992-03-09 | 1992-03-09 | Resin-encapsulation mold with venting function |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05245844A (en) |
-
1992
- 1992-03-09 JP JP5023292A patent/JPH05245844A/en not_active Withdrawn
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0336741A (en) | Resin sealing device for resin sealed type semiconductor device | |
JP2003243435A (en) | Method for manufacturing semiconductor integrated circuit device | |
JPS6048261B2 (en) | Mold making method | |
JPS6240851B2 (en) | ||
JPS6138770A (en) | Vent combined part pressure equipment of pressure casting | |
JPH05245844A (en) | Resin-encapsulation mold with venting function | |
JP2000263603A (en) | Resin molding machine and method for releasing molding from mold | |
JPH03202333A (en) | Injection molding device | |
JPS60132716A (en) | Method and apparatus for molding resin | |
JPH0647754A (en) | Simple mold for cast molding | |
IE841173L (en) | Electronic device method using a leadframe with an integral¹mold vent means | |
JP2903977B2 (en) | Gas curing mold molding equipment | |
JP2001105111A (en) | Vacuum die casting apparatus | |
JPH0574827A (en) | Manufacturing apparatus for semiconductor device | |
JPS63193814A (en) | Mold for transfer molding | |
JP3170973B2 (en) | Molding method of gas curing mold | |
CN211464753U (en) | Green sand casting molding structure | |
JPH07205185A (en) | Mold for transfer molding | |
JPH0788901A (en) | Resin sealing mold | |
JPS6311722Y2 (en) | ||
JPH11150138A (en) | Method for sealing semiconductor device | |
JPH09276989A (en) | Method for filling core sand | |
JPS6364331A (en) | Semiconductor resin sealing apparatus | |
JPH08281376A (en) | Method for filling molding sand | |
JPS6027443A (en) | Gas curing type molding method making combination use of suction means |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990518 |