[go: up one dir, main page]

JPH05242788A - Electrostatic relay - Google Patents

Electrostatic relay

Info

Publication number
JPH05242788A
JPH05242788A JP3810492A JP3810492A JPH05242788A JP H05242788 A JPH05242788 A JP H05242788A JP 3810492 A JP3810492 A JP 3810492A JP 3810492 A JP3810492 A JP 3810492A JP H05242788 A JPH05242788 A JP H05242788A
Authority
JP
Japan
Prior art keywords
fixed
movable plate
fixed base
side drive
movable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3810492A
Other languages
Japanese (ja)
Inventor
Atsushi Sakai
淳 阪井
Fumihiro Kasano
文宏 笠野
Hiromi Nishimura
広海 西村
Koichi Aizawa
浩一 相澤
Takayoshi Awai
崇善 粟井
Takuo Ishida
拓郎 石田
Keiji Kakinote
啓治 柿手
Hideki Kuzumi
秀樹 来住
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP3810492A priority Critical patent/JPH05242788A/en
Publication of JPH05242788A publication Critical patent/JPH05242788A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00Electrostatic relays; Electro-adhesion relays
    • H01H59/0009Electrostatic relays; Electro-adhesion relays making use of micromechanics

Landscapes

  • Micromachines (AREA)

Abstract

PURPOSE:To provide an electrostatic relay having fixed base bodies set on both sides of a movable plate, in which deformation caused by thermal expansion is hard to be generated, unbalance between the sizes of the upper and lower base bodies can be diminished, and moreover, connecting electrodes for leading to an outer circuit can be easily formed. CONSTITUTION:A pair of fixed base bodies 7, 8 and a movable plate 6 are formed of conductive base boards, and connecting electrodes 74, 84 for electrically connecting fixed side driving electrodes 70, 80 to an outer circuit, are set on the surfaces of the fixed base bodies 7, 8, opposite to the fixed side driving electrodes 70, 80. The connecting electrodes 74, 84 and fixed driving side electrodes 70, 80 are mutually conducted through fixed base bodies 7, 8 formed of the conductive base boards.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、静電力(クーロン
力)を利用して接点の接離を行う静電リレーに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrostatic relay that contacts and separates contacts by utilizing electrostatic force (Coulomb force).

【0002】[0002]

【従来の技術】図3に従来の静電リレーを示す。この静
電リレーは、固定基体161の表面左右に、対称構造の
固定接点171、171および固定側駆動電極172、
172を備え、この固定基体161の上に、スペーサ1
74を挟んで支持枠160が取り付けられ、この支持枠
160の中央の開口部分に、中心両側の支持部165で
支持枠160に連結されて左右に延びる可動板162、
162を備え、この可動板162、162自体が可動側
駆動電極となっている。可動板162の下面には可動接
点173、173が設けられている。固定側駆動電極1
72、172と可動板162、162すなわち可動側駆
動電極の間に静電力を作用させれば、可動板162、1
62の先端側が支持部165を基点に下方に屈曲旋回
し、固定接点171、171と可動接点173、173
が接触する。
2. Description of the Related Art FIG. 3 shows a conventional electrostatic relay. This electrostatic relay includes fixed contacts 171, 171 and a fixed-side drive electrode 172 having a symmetrical structure on the left and right surfaces of the fixed base 161.
172, and the spacer 1 on the fixed base 161.
A support frame 160 is attached with 74 in between, and a movable plate 162 that is connected to the support frame 160 at support portions 165 on both sides of the center and extends in the left-right direction at the central opening of the support frame 160,
162, and the movable plates 162, 162 themselves are movable side drive electrodes. Movable contacts 173 and 173 are provided on the lower surface of the movable plate 162. Fixed side drive electrode 1
If an electrostatic force is applied between the movable plates 162, 162 and the movable plates 162, 162, that is, the movable plates 162, 162.
The tip end side of 62 bends and swivels downward with the support portion 165 as a base point, and fixed contacts 171 and 171 and movable contacts 173 and 173.
Come into contact.

【0003】また、図4に示す静電リレーは、上記従来
例に比べて、駆動電圧印加時の静電力を増大させたもの
である。この静電リレーは、基本的な構造は前記従来例
と同じであるが、可動板162の支持枠160の上下
に、それぞれ固定基体161、167が設けられてお
り、固定基体161、167で可動板162を挟み、両
側の固定基体161、167に設けられた固定側駆動電
極172、172と、可動板160の間に電圧を印加し
て静電力を作用させて、可動板160を作動させる。そ
の結果、固定基体161、167の固定接点171、1
71の何れかに、可動板162の両面に形成された可動
接点173、173が接触することで、リレー動作を果
たす。固定基体161、167の固定側駆動電極17
2、172は、表面が絶縁膜175、175で覆われて
いる。固定側駆動電極172、172は、それぞれ、可
動板162の支持枠160との接合面に沿って延長さ
れ、支持枠160の表面もしくは固定基体161の表面
で露出しており、この露出部分が、外部回路と電気的に
接続する接続電極174、176となる。また、可動側
駆動電極である可動板162を外部回路と電気的に接続
するため、接続電極174よりも外側の支持枠160表
面には、可動側駆動電極用の接続電極175が形成され
ている。
The electrostatic relay shown in FIG. 4 has an electrostatic force increased when a drive voltage is applied, as compared with the conventional example. This electrostatic relay has the same basic structure as the above-mentioned conventional example, but fixed bases 161 and 167 are provided above and below the support frame 160 of the movable plate 162, respectively, and movable by the fixed bases 161 and 167. A voltage is applied between the fixed side drive electrodes 172 and 172 provided on the fixed bases 161 and 167 on both sides of the plate 162 and the movable plate 160 to apply an electrostatic force to operate the movable plate 160. As a result, the fixed contacts 171 and 1 of the fixed bases 161 and 167 are formed.
The movable contacts 173, 173 formed on both surfaces of the movable plate 162 come into contact with any one of 71 to perform a relay operation. Fixed-side drive electrode 17 of the fixed substrates 161 and 167
The surfaces of 2, 172 are covered with insulating films 175, 175. The fixed-side drive electrodes 172, 172 are extended along the joint surface of the movable plate 162 with the support frame 160, respectively, and are exposed on the surface of the support frame 160 or the surface of the fixed base 161. The connection electrodes 174 and 176 are electrically connected to an external circuit. Further, since the movable plate 162, which is the movable side drive electrode, is electrically connected to an external circuit, a connection electrode 175 for the movable side drive electrode is formed on the surface of the support frame 160 outside the connection electrode 174. ..

【0004】この静電リレーは、可動側駆動電極である
可動板162の両側に固定側駆動電極172、172が
配置されているため、可動板162に加わる静電力すな
わち駆動力が増大し、確実かつ迅速なリレー動作が行え
るという利点を備えている。
In this electrostatic relay, since the fixed-side drive electrodes 172 and 172 are arranged on both sides of the movable plate 162 which is the movable-side drive electrode, the electrostatic force applied to the movable plate 162, that is, the driving force is increased, so that the movable relay can be securely operated. Moreover, it has an advantage that a quick relay operation can be performed.

【0005】[0005]

【発明が解決しようとする課題】ところが、上記した従
来の、可動側駆動電極の両側に固定側駆動電極を配置し
た構造の静電リレーでは、使用時に、熱膨張でリレー全
体が歪み、動作に支障が出るという問題がある。これ
は、従来の静電リレーでは、可動側駆動電極となる可動
板162および支持枠160にはシリコンなどからなる
導電性のある基板を用いるのに対し、固定基体161、
167には絶縁性基板を用いており、可動板162と固
定基体161、167の熱膨張特性が異なっていた。そ
のため、静電リレーの使用時に、温度変化が生じると、
固定基体161、167と可動板6および支持枠60の
熱膨張率の違いで、リレー全体が歪んでしまうのであ
る。静電リレーは、その構造上、固定接点171、17
1と可動接点173、173の間にわずかな隙間を有し
ているだけなので、前記のような歪みは、静電リレーの
動作に大きな影響を与えることになる。
However, in the above-described conventional electrostatic relay having a structure in which fixed side drive electrodes are arranged on both sides of the movable side drive electrode, the entire relay is distorted by thermal expansion during use, resulting in operation failure. There is a problem that it causes trouble. This is because the conventional electrostatic relay uses a conductive substrate made of silicon or the like for the movable plate 162 that serves as the movable side drive electrode and the support frame 160, whereas the fixed base 161
An insulating substrate is used for 167, and the movable plate 162 and the fixed bases 161 and 167 have different thermal expansion characteristics. Therefore, if a temperature change occurs when using the electrostatic relay,
Due to the difference in the coefficient of thermal expansion between the fixed base bodies 161, 167 and the movable plate 6 and the support frame 60, the entire relay is distorted. Due to its structure, the electrostatic relay has fixed contacts 171, 17
Since there is only a slight gap between the No. 1 and the movable contacts 173, 173, the distortion as described above has a great influence on the operation of the electrostatic relay.

【0006】また、接続電極174〜176を設ける必
要のために、上下の固定基体161、167の形状にア
ンバランスが生じて静電力が減少したり、電極の接合構
造が複雑になって、連続通電などの信頼性が低下すると
いう問題もあった。これは、まず、下側の固定基体16
1の上面に接続電極176を設けるには、可動板162
の支持枠160を固定基体161よりも小さくして、固
定基体161の上面に露出面を設ける必要がある。つぎ
に、上側の固定基体167に接続電極174を設けるに
は、可動板162の支持枠160よりも固定基体167
を小さくして、支持枠160の表面に固定基体167の
接続電極174を配置する露出面を設けなければならな
い。しかも、支持枠160の表面には、可動側駆動電極
用の接続電極175も設けられる。その結果、上側の固
定基体167は、下側の固定基体161に比べて、大幅
に小さくなってしまうのである。静電リレーの動作特性
に関与する実質的な有効面積は、最も小さな上側の固定
基体167が基準になるから、必要な外形寸法に比べて
静電リレーの有効面積が小さくなり、静電リレーの小型
化あるいは高性能化を阻害する要因となっていた。
Further, since it is necessary to provide the connection electrodes 174 to 176, an imbalance occurs in the shapes of the upper and lower fixed bases 161 and 167, the electrostatic force is reduced, and the electrode bonding structure becomes complicated, resulting in a continuous structure. There is also a problem that reliability such as energization decreases. First, the lower fixed base 16
In order to provide the connection electrode 176 on the upper surface of No. 1, the movable plate 162
It is necessary to make the supporting frame 160 smaller than the fixed base 161 to provide an exposed surface on the upper surface of the fixed base 161. Next, in order to provide the connection electrode 174 on the upper fixed base 167, the fixed base 167 is provided rather than the support frame 160 of the movable plate 162.
Must be reduced to provide an exposed surface on the surface of the support frame 160 on which the connection electrode 174 of the fixed base 167 is arranged. Moreover, on the surface of the support frame 160, the connection electrode 175 for the movable side drive electrode is also provided. As a result, the upper fixed base 167 is significantly smaller than the lower fixed base 161. Since the smallest effective fixed base 167 is used as a reference for the substantial effective area related to the operating characteristics of the electrostatic relay, the effective area of the electrostatic relay becomes smaller than the required external dimensions, and It has been a factor that hinders miniaturization or higher performance.

【0007】また、接続電極174、176につながる
電路を、固定基体161、167と支持枠160との接
合面を介して外部まで延長形成する必要があるが、この
ような金属の接合部を伴う電路の形成は、技術的に難し
く、連続通電等の信頼性が低下するのである。そこで、
この発明の課題は、前記したように、可動板の両側に固
定基体が配置された構造の静電リレーにおいて、従来技
術の問題点を解消し、熱膨張による歪みが生じ難く、ま
た、上下の固定基体の大きさのアンバランスを少なくで
き、さらに、外部回路と接続するための接続電極の形成
が容易な構造の静電リレーを提供することにある。
Further, the electric path connected to the connection electrodes 174 and 176 needs to be extended to the outside through the joint surface between the fixed base bodies 161 and 167 and the support frame 160, but such a metal joint portion is involved. The formation of the electric path is technically difficult, and the reliability of continuous energization is reduced. Therefore,
As described above, an object of the present invention is to solve the problems of the prior art in an electrostatic relay having a structure in which fixed bases are arranged on both sides of a movable plate, and it is difficult for distortion due to thermal expansion to occur. An object of the present invention is to provide an electrostatic relay having a structure in which the imbalance of the size of the fixed substrate can be reduced, and further, a connection electrode for connecting to an external circuit can be easily formed.

【0008】[0008]

【課題を解決するための手段】上記課題を解決する、こ
の発明にかかる静電リレーは、固定接点および固定側駆
動電極を有する一対の固定基体が、両面に可動接点およ
び可動側駆動電極を有する可動板を両側から挟み、可動
側駆動電極とその外側の固定側駆動電極がそれぞれ対面
するように配置された静電リレーにおいて、一対の固定
基体および可動板が導電性基板からなり、固定側駆動電
極と外部回路との電気的接続を行う接続電極が、固定基
体の固定側駆動電極とは反対側の面に設けられ、導電性
基板からなる固定基体を介して、接続電極と固定側駆動
電極が導通されている。
In the electrostatic relay according to the present invention for solving the above problems, a pair of fixed bases having fixed contacts and fixed side drive electrodes have movable contacts and movable side drive electrodes on both sides. In an electrostatic relay in which the movable plate is sandwiched from both sides and the movable side drive electrode and the fixed side drive electrode on the outside face each other, a pair of fixed base and movable plate are made of a conductive substrate, and the fixed side drive The connection electrode for electrically connecting the electrode and the external circuit is provided on the surface of the fixed base opposite to the fixed drive electrode, and the connection electrode and the fixed drive electrode are provided via the fixed base made of a conductive substrate. Is conducted.

【0009】可動板および固定基体などの静電リレーの
基本的な構造は、可動板の両側に固定基体を配置する通
常の静電リレーと同様でよい。例えば、固定基体に設け
る固定接点や固定側駆動電極、および、可動板の可動接
点などの配置形状は、従来の静電リレーと同じように、
自由に設定することができる。可動側駆動電極となる可
動板あるいは固定側駆動電極の表面に、エレクトレット
を設けておくと、静電力を増大させることができる。特
に、両側の固定側駆動電極に、互いに極性の異なるエレ
クトレットを設けておくと、電圧印加時には、可動側駆
動電極に対して、片側のエレクトレットが吸引力を与
え、反対側のエレクトレットが反発力を与えることにな
り、上下のエレクトレットが同じ方向に力を作用する結
果、静電力の大幅な増大が図れ、好ましい。
The basic structure of the electrostatic relay such as the movable plate and the fixed substrate may be the same as that of a normal electrostatic relay in which the fixed substrate is arranged on both sides of the movable plate. For example, the fixed contact provided on the fixed substrate, the fixed-side drive electrode, and the movable contact of the movable plate have the same arrangement shape as the conventional electrostatic relay.
It can be set freely. Electrostatic force can be increased by providing an electret on the surface of the movable plate serving as the movable side drive electrode or the surface of the fixed side drive electrode. In particular, if the fixed-side drive electrodes on both sides are provided with electrets having different polarities, one electret gives a suction force to the movable-side drive electrode, and the electret on the opposite side gives a repulsive force to the movable-side drive electrode. As a result, the upper and lower electrets exert a force in the same direction, resulting in a large increase in electrostatic force, which is preferable.

【0010】この発明では、可動板と一対の固定基体の
何れをも、シリコン基板などからなる導電性基板で構成
する。したがって、固定基体に固定接点などの導電構造
を形成するには、導電性基板からなる固定基体の表面に
絶縁層を形成した後、その上に固定接点などを形成する
必要がある。その他、固定基体の上に、固定側駆動電極
を形成したり、可動板の支持枠と接合する際にも、絶縁
の必要な個所には絶縁層を形成するなどの絶縁処理を行
う。
In the present invention, both the movable plate and the pair of fixed bases are made of a conductive substrate such as a silicon substrate. Therefore, in order to form a conductive structure such as a fixed contact on the fixed base, it is necessary to form an insulating layer on the surface of the fixed base made of a conductive substrate and then form the fixed contact or the like on the insulating layer. In addition, when the fixed side drive electrode is formed on the fixed base or when the fixed side drive electrode is joined to the support frame of the movable plate, an insulating layer is formed at a portion where insulation is required.

【0011】固定側駆動電極に電圧を印加して静電力を
生じさせるには、固定側駆動電極を外部回路と電気的に
接続しておく接続電極が必要である。この接続電極を、
固定基体のうち、固定側駆動電極とは反対側の面に設け
ておく。すなわち、固定基体のうち、可動板もしくは可
動板の支持枠と接合される側の面ではなく、その反対側
の面に接続電極が設けられる。接続電極は、導電性基板
からなる固定基体の表面に直接形成され、固定基体を介
して、前記固定側駆動電極と導通することになる。接続
電極は固定基体の前記表面のうち、任意の場所に設けれ
ばよい。
In order to apply a voltage to the fixed side drive electrode to generate an electrostatic force, a connection electrode for electrically connecting the fixed side drive electrode to an external circuit is required. This connection electrode,
It is provided on the surface of the fixed base opposite to the fixed drive electrode. That is, the connection electrode is provided not on the surface of the fixed base body that is joined to the movable plate or the support frame of the movable plate, but on the opposite surface thereof. The connection electrode is directly formed on the surface of the fixed base made of a conductive substrate, and is electrically connected to the fixed side drive electrode through the fixed base. The connection electrode may be provided at any place on the surface of the fixed substrate.

【0012】接続電極は、固定基体の表面に、固体基体
とは別の材料で電極層を形成する方法のほか、シリコン
などの導電性基板からなる固定基体に、高濃度の不純物
層を形成することによって、固体基体の内部構造自体
に、電極としての機能を持たせることも可能である。
For the connection electrode, in addition to the method of forming an electrode layer on the surface of the fixed substrate using a material different from that of the solid substrate, a high concentration impurity layer is formed on the fixed substrate made of a conductive substrate such as silicon. As a result, the internal structure of the solid substrate itself can have a function as an electrode.

【0013】[0013]

【作用】可動板と一対の固定基体の何れもが、導電性基
板で形成されていれば、可動板と固定基体の熱膨張特性
はほぼ同じになるので、熱膨張率の違いによる歪みは発
生しなくなる。つぎに、固定基体のうち、固定側駆動電
極とは反対側の面に、接続電極を設けておけば、固定基
体が導電性を有するので、この固定基体を介して、接続
電極と固定側駆動電極とを導通させることができる。
If both the movable plate and the pair of fixed bases are made of a conductive substrate, the thermal expansion characteristics of the movable plate and the fixed base are almost the same, so that distortion due to the difference in the coefficient of thermal expansion occurs. Will not do. Next, if a connection electrode is provided on the surface of the fixed base opposite to the fixed-side drive electrode, the fixed base has conductivity, so that the connection electrode and the fixed-side drive are connected via this fixed base. The electrodes can be electrically connected.

【0014】その結果、前記した従来の静電リレーの問
題、すなわち、間に可動板を挟んだ上下の固定基体に、
それぞれ接続電極の設置場所をとるために、上下の固定
基体の寸法を大幅に違えなくてはならない、という問題
が解消される。接続電極は、固定基体のうち、可動板と
の接合面とは反対側の開放された面に設けられることに
なるので、上下の固定基体で大幅な寸法の違いをつける
必要がなくなるのである。また、接続電極と固定側駆動
電極をつなぐ電路構造が、固定基体と可動板および支持
枠との接合構造に全く影響を受けないので、作製が容易
であり、接続の信頼性も格段に向上する。
As a result, the problem of the above-mentioned conventional electrostatic relay, that is, in the upper and lower fixed bases with the movable plate sandwiched therebetween,
This solves the problem that the upper and lower fixed bases must be greatly different in size to occupy the installation place of the connection electrodes. Since the connection electrode is provided on the open surface of the fixed base opposite to the joint surface with the movable plate, it is not necessary to make a large difference in size between the upper and lower fixed bases. Further, since the electric path structure connecting the connection electrode and the fixed side drive electrode is not affected by the joint structure of the fixed base body, the movable plate and the support frame at all, the production is easy and the reliability of the connection is remarkably improved. ..

【0015】特に、下側の固定基体では、例えば、固定
基体の下面に設けられた接続電極を、静電リレーを載せ
るパッケージ実装用の支持台を介して、そのまま外部回
路と接続することも可能になり、接続作業の簡略化と、
接続距離の短縮化、および、接続信頼性の向上を図るこ
とができる。
In particular, in the lower fixed base body, for example, the connection electrodes provided on the lower surface of the fixed base body can be directly connected to the external circuit via the package mounting support on which the electrostatic relay is mounted. And simplification of connection work,
The connection distance can be shortened and the connection reliability can be improved.

【0016】[0016]

【実施例】ついで、この発明の実施例を図面を参照しな
がら以下に説明する。図1は、この発明にかかる静電リ
レーの断面構造を表し、図2は、平面構造を表してい
る。静電リレーは、可動板6および可動板6を支持する
支持枠60が、上下の固定基体7、8で挟まれて、接合
一体化されている。可動板6および支持枠60と固定基
体7、8は、シリコン単結晶板で形成されている。具体
的には、3枚のシリコンウェハに、可動板6および支持
枠60と、上下の固定基体7、8をそれぞれ複数個作製
したのち、これらのシリコンウェハを重ねて接合し、そ
の後、個々の静電リレー部分毎に分断して、多数の静電
リレーを同時に製造するのが、生産性が高く好ましい方
法となる。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a sectional structure of an electrostatic relay according to the present invention, and FIG. 2 shows a planar structure. In the electrostatic relay, the movable plate 6 and the support frame 60 that supports the movable plate 6 are sandwiched between the upper and lower fixed bases 7 and 8 to be integrally joined. The movable plate 6, the support frame 60, and the fixed bases 7 and 8 are formed of a silicon single crystal plate. Specifically, after a plurality of movable plates 6 and support frames 60 and a plurality of upper and lower fixed bases 7 and 8 are formed on three silicon wafers, these silicon wafers are stacked and bonded, and then each It is a high productivity and a preferable method to divide | segment into each electrostatic relay part and to manufacture many electrostatic relays simultaneously.

【0017】図2に示すように、支持枠60には概略コ
字形の溝61が貫通形成され、このコ字形溝61の内側
が矩形の可動板6となる。可動板6は、周囲の支持枠6
0よりも厚みが薄くなっており、可動板6の一辺が支持
枠60に屈曲自在に支持されている。可動板6の両面に
は、シリコン酸化膜等からなる絶縁層61、61が形成
されている。可動板6の先端側両面には、絶縁層61、
61の上に、導電金属層などからなる可動接点62、6
2が設けられている。
As shown in FIG. 2, a substantially U-shaped groove 61 is formed through the support frame 60, and the inside of the U-shaped groove 61 serves as a rectangular movable plate 6. The movable plate 6 is a support frame 6 around the movable plate 6.
The thickness is smaller than 0, and one side of the movable plate 6 is flexibly supported by the support frame 60. Insulating layers 61, 61 made of a silicon oxide film or the like are formed on both surfaces of the movable plate 6. The insulating layer 61,
On top of 61, movable contacts 62, 6 made of a conductive metal layer or the like.
Two are provided.

【0018】下側の固定基体8は、上面に絶縁層81が
形成され、その上に固定接点82および固定側駆動電極
80が設けられている。固定側駆動電極80は、導電金
属層などからなり、絶縁層81の一部に形成された貫通
部分を通じて、固定基体8に接合されている。固定側駆
動電極80の表面には、エレクトレット86が形成され
ている。固定基体8の下面は、全体が接続電極84とな
っており、パッケージ実装用の支持台9の上に接合され
て、任意の個所で外部回路と接続されるようになってい
る。
An insulating layer 81 is formed on the upper surface of the lower fixed substrate 8, and a fixed contact 82 and a fixed side drive electrode 80 are provided on the insulating layer 81. The fixed-side drive electrode 80 is made of a conductive metal layer or the like, and is joined to the fixed base 8 through a penetrating portion formed in a part of the insulating layer 81. An electret 86 is formed on the surface of the fixed-side drive electrode 80. The entire lower surface of the fixed substrate 8 serves as a connection electrode 84, which is joined on the package mounting support 9 and connected to an external circuit at an arbitrary position.

【0019】上側の固定基体7は、下面に、固定基体8
と同様の、絶縁層81、固定接点72、固定側駆動電極
70およびエレクトレット76が設けられている。但
し、このエレクトレット76と前記固定基体8のエレク
トレット86とは、互いに逆の極性を備えたものを用い
ている。固定基体7の上面には、図2に示すように、片
側の隅に接続電極74が形成されている。
The upper fixed base 7 has a fixed base 8 on the lower surface.
An insulating layer 81, a fixed contact 72, a fixed side drive electrode 70, and an electret 76 are provided in the same manner as in. However, the electret 76 and the electret 86 of the fixed base body 8 have polarities opposite to each other. As shown in FIG. 2, on the upper surface of the fixed base 7, connection electrodes 74 are formed at one corner.

【0020】固定基体8の上に配置された可動板6の支
持枠60には、図2に示すように、固定基体8の固定接
点82の一部が露出するように、切り欠き67が形成さ
れている。固定基体8と可動板6の支持枠60は、固定
接点82と、金属などからなる接合層89を介して一体
接合されている。上側の固定基体7と支持枠60とは、
固定接点72と、可動板6用の接続電極64を介して一
体接合されている。固定基体7には、固定接点72の一
部が露出するように切り欠き77が形成されており、こ
の切り欠き77の部分で、支持枠60の上に延長された
固定接点72が露出し、外部回路と接続可能になってい
る。また、固定基体7には、可動板6の接続電極64に
対応する位置にも、切り欠き78が形成されており、接
続電極64の一部が露出している。
As shown in FIG. 2, a notch 67 is formed in the support frame 60 of the movable plate 6 arranged on the fixed base 8 so that a part of the fixed contact 82 of the fixed base 8 is exposed. Has been done. The fixed base 8 and the support frame 60 of the movable plate 6 are integrally joined to the fixed contact 82 via a joining layer 89 made of metal or the like. The upper fixed base 7 and the support frame 60 are
It is integrally joined to the fixed contact 72 via the connection electrode 64 for the movable plate 6. A notch 77 is formed in the fixed base 7 so that a part of the fixed contact 72 is exposed. The fixed contact 72 extended above the support frame 60 is exposed at the notch 77. It can be connected to an external circuit. Further, the fixed base 7 is also formed with a notch 78 at a position corresponding to the connection electrode 64 of the movable plate 6, and a part of the connection electrode 64 is exposed.

【0021】上記のような構造の静電リレーにおいて、
接続電極74および84と接続電極64の間に電圧を印
加すると、図1に点線矢印で示すように、接続電極74
と固定基体7を介して導通している固定側駆動電極7
0、および、接続電極84と固定基体8を介して導通し
ている固定側駆動電極80と、可動側駆動電極である可
動板6の間に電圧が印加される。互いに対向する固定側
駆動電極70、80と可動板6の間に作用する静電力
で、可動板6の先端側が、上方または下方に作動する。
その結果、可動板6の上下何れかの可動接点62、62
が、固定接点71、71または81、81に接触して短
絡させる。すなわち、固定接点71、71または81、
81に接続された外部負荷の一方をオン状態にする。接
続電極74、84と接続電極64の間に印加する入力電
圧の極性を反転させれば、可動板6が逆方向に作動し
て、外部負荷のオンオフ状態を逆転できる。
In the electrostatic relay having the above structure,
When a voltage is applied between the connection electrodes 74 and 84 and the connection electrode 64, as shown by the dotted arrow in FIG.
And the fixed side drive electrode 7 that is electrically connected to the fixed base 7 through the fixed base 7.
A voltage is applied between 0 and the fixed side drive electrode 80 which is electrically connected to the connection electrode 84 via the fixed base body 8 and the movable plate 6 which is the movable side drive electrode. The tip end side of the movable plate 6 is operated upward or downward by the electrostatic force acting between the fixed side drive electrodes 70 and 80 and the movable plate 6 which face each other.
As a result, one of the movable contacts 62, 62 above or below the movable plate 6
Contacts the fixed contacts 71, 71 or 81, 81 to cause a short circuit. That is, the fixed contacts 71, 71 or 81,
One of the external loads connected to 81 is turned on. If the polarity of the input voltage applied between the connection electrodes 74 and 84 and the connection electrode 64 is reversed, the movable plate 6 operates in the opposite direction, and the on / off state of the external load can be reversed.

【0022】上記実施例では、下側の固定基体8、可動
板6の支持枠60、および、上側の固定基体7の平面寸
法は同じであり、下方の電極を露出させる必要のある個
所のみに、小さな切り欠き67、77、78を形成して
いる。したがって、静電リレーの基本的な動作や特性に
影響のある実質的な面積は、上下の固定基体7、8およ
び可動板6の何れも同じであり、可動板6が上方と下方
に作動するときで特性がアンバランスになることはな
い。
In the above-mentioned embodiment, the lower fixed base 8, the support frame 60 of the movable plate 6 and the upper fixed base 7 have the same plane dimensions, and the lower electrodes are exposed only at the portions where they need to be exposed. , Small cutouts 67, 77, 78 are formed. Therefore, the substantial area that affects the basic operation and characteristics of the electrostatic relay is the same for both the upper and lower fixed bases 7 and 8 and the movable plate 6, and the movable plate 6 operates upward and downward. The characteristics do not sometimes become unbalanced.

【0023】[0023]

【発明の効果】以上に述べた、この発明にかかる静電リ
レーは、従来、絶縁基板が用いられていた固定基体の材
料として導電性基板を採用したことにより、同じ導電性
基板からなる可動板との熱膨張率の違いがなくなり、熱
膨張率の違いによる歪みの発生が解消された。
As described above, in the electrostatic relay according to the present invention, since the conductive substrate is used as the material of the fixed base which has conventionally been the insulating substrate, the movable plate made of the same conductive substrate is used. There is no difference in the coefficient of thermal expansion between and, and the occurrence of strain due to the difference in the coefficient of thermal expansion is eliminated.

【0024】しかも、固定側駆動電極を外部回路と接続
するのに必要な接続電極を、可動板との対向面とは反対
側の面に形成して、導電性基板からなる固定基体を介し
て固定側駆動電極と導通させることができるので、接続
電極の形成が容易で、その電気的特性も良好になる。ま
た、固定基体の接続電極を可動板との対向面に形成しな
くてよければ、下側の固定基体から可動板の支持枠およ
び上側の固定基体へと、順番に寸法を小さくして、固定
基体と可動板の対向面上に接続電極を露出させる場所を
確保する必要がなくなり、各固定基体および可動板の支
持枠の寸法形状を略同一に設定することができる。その
結果、上下の固定基体の面積の違いによる動作のアンバ
ランスを無くして、静電リレーの動作特性を改善すると
ともに、静電リレー全体の小型化を図ることができる。
In addition, the connection electrode necessary for connecting the fixed side drive electrode to the external circuit is formed on the surface opposite to the surface facing the movable plate, and the fixed base body made of a conductive substrate is interposed therebetween. Since it can be electrically connected to the fixed-side drive electrode, the connection electrode can be easily formed and its electrical characteristics can be improved. If the connection electrode of the fixed base does not have to be formed on the surface facing the movable plate, the size is reduced in order from the lower fixed base to the support frame of the movable plate and the upper fixed base, and fixed. It is not necessary to secure a place for exposing the connection electrode on the facing surface of the base and the movable plate, and the size and shape of the support frame of each fixed base and the movable plate can be set to be substantially the same. As a result, it is possible to eliminate the imbalance of the operation due to the difference in the areas of the upper and lower fixed bases, improve the operating characteristics of the electrostatic relay, and reduce the size of the electrostatic relay as a whole.

【図面の簡単な説明】[Brief description of drawings]

【図1】 この発明の実施例となる静電リレーの断面図FIG. 1 is a sectional view of an electrostatic relay according to an embodiment of the present invention.

【図2】 同上の平面図FIG. 2 is a plan view of the above.

【図3】 従来例の分解斜視図FIG. 3 is an exploded perspective view of a conventional example.

【図4】 別の従来例の断面図FIG. 4 is a sectional view of another conventional example.

【符号の説明】[Explanation of symbols]

6 可動板 60 支持枠 62 可動接点 64 接続電極(可動側) 7、8 固定基体 70、80 固定側駆動電極 72、82 固定接点 74、84 接続電極(固定側) 6 movable plate 60 support frame 62 movable contact 64 connection electrode (movable side) 7, 8 fixed base 70, 80 fixed side drive electrode 72, 82 fixed contact 74, 84 connection electrode (fixed side)

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成4年5月2日[Submission date] May 2, 1992

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0012[Correction target item name] 0012

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0012】接続電極は、固定基体の表面に、固基体
とは別の材料で電極層を形成する方法のほか、シリコン
などの導電性基板からなる固定基体に、高濃度の不純物
層を形成することによって、固基体の内部構造自体
に、電極としての機能を持たせることも可能である。
[0012] The connection electrode, the surface of the fixed base, the other method is the fixed base to form an electrode layer of a different material, the fixing substrate made of a conductive substrate such as silicon, forming a high concentration impurity layer by, the internal structure itself of the fixed substrate, it is possible to provide a function as an electrode.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 相澤 浩一 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 粟井 崇善 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 石田 拓郎 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 柿手 啓治 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 来住 秀樹 大阪府門真市大字門真1048番地松下電工株 式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Koichi Aizawa Koichi Aizawa 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Inventor, Takayoshi Awai, 1048, Kadoma, Kadoma City, Osaka (72) Inventor Takuro Ishida 1048 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Keiji Kakite 1048 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Inventor Hideki 1048 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 固定接点および固定側駆動電極を有する
一対の固定基体が、両面に可動接点および可動側駆動電
極を有する可動板を両側から挟み、可動側駆動電極とそ
の外側の固定側駆動電極がそれぞれ対面するように配置
された静電リレーにおいて、一対の固定基体および可動
板が導電性基板からなり、固定側駆動電極と外部回路と
の電気的接続を行う接続電極が、固定基体の固定側駆動
電極とは反対側の面に設けられ、導電性基板からなる固
定基体を介して、接続電極と固定側駆動電極が導通され
ていることを特徴とする静電リレー。
1. A pair of fixed bases having a fixed contact and a fixed side drive electrode sandwich a movable plate having a movable contact and a movable side drive electrode on both sides from both sides, and a movable side drive electrode and a fixed side drive electrode on the outside thereof. In the electrostatic relay arranged so as to face each other, the pair of fixed base and the movable plate are made of a conductive substrate, and the connection electrode for electrically connecting the fixed side drive electrode and the external circuit is fixed to the fixed base. An electrostatic relay characterized in that a connection electrode and a fixed-side drive electrode are electrically connected to each other via a fixed base body made of a conductive substrate provided on a surface opposite to a side-drive electrode.
JP3810492A 1992-02-25 1992-02-25 Electrostatic relay Pending JPH05242788A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3810492A JPH05242788A (en) 1992-02-25 1992-02-25 Electrostatic relay

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3810492A JPH05242788A (en) 1992-02-25 1992-02-25 Electrostatic relay

Publications (1)

Publication Number Publication Date
JPH05242788A true JPH05242788A (en) 1993-09-21

Family

ID=12516167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3810492A Pending JPH05242788A (en) 1992-02-25 1992-02-25 Electrostatic relay

Country Status (1)

Country Link
JP (1) JPH05242788A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000038208A1 (en) * 1998-12-22 2000-06-29 Nec Corporation Micromachine switch and its production method
US6828888B2 (en) 2002-02-19 2004-12-07 Fujitsu Component Limited Micro relay of which movable contact remains separated from ground contact in non-operating state
EP1388875A3 (en) * 2002-08-08 2006-04-12 Fujitsu Component Limited Hermetically sealed electrostatic MEMS
JP2012004112A (en) * 2010-06-17 2012-01-05 General Electric Co <Ge> Mems switching array having substrate arranged to conduct switching current

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000038208A1 (en) * 1998-12-22 2000-06-29 Nec Corporation Micromachine switch and its production method
US6828888B2 (en) 2002-02-19 2004-12-07 Fujitsu Component Limited Micro relay of which movable contact remains separated from ground contact in non-operating state
US6970060B2 (en) 2002-02-19 2005-11-29 Fujitsu Component Limited Micro relay of which movable contact remains separated from ground contact in non-operating state
EP1388875A3 (en) * 2002-08-08 2006-04-12 Fujitsu Component Limited Hermetically sealed electrostatic MEMS
US7551048B2 (en) 2002-08-08 2009-06-23 Fujitsu Component Limited Micro-relay and method of fabricating the same
JP2012004112A (en) * 2010-06-17 2012-01-05 General Electric Co <Ge> Mems switching array having substrate arranged to conduct switching current

Similar Documents

Publication Publication Date Title
US3403438A (en) Process for joining transistor chip to printed circuit
JPH06223698A (en) Electrostatic driving relay
JPH06331651A (en) Accelerometer with minute mechanism and preparation thereof
US20020185939A1 (en) Electrode structure of piezoelectric vibrator
JP2008243450A (en) Contact mechanism device, and method of manufacturing the same
JPS6046636U (en) multi-pole relay
JP2001176365A (en) Pressure switch
JPH05242788A (en) Electrostatic relay
US20220416759A1 (en) Piezoelectric vibration plate, piezoelectric vibration device, and manufacturing method for piezoelectric vibration device
JPH10162713A (en) Micro relay
JP3393678B2 (en) Electrostatic relay
JP2967563B2 (en) Piezoelectric transformer
JPH0212225A (en) Electrophoretic display element
JPH1082709A (en) Pressure sensor and manufacture thereof
JPH0219700A (en) Piezoelectric fan
JPH04370622A (en) Electrostatic relay
JPH05259805A (en) Piezoelectric resonator
JPS62240934A (en) Liquid crystal display device
JP2532487Y2 (en) Electrostatic relay
JPH0741212Y2 (en) Piezoelectric vibrator
JP2892525B2 (en) Electrostatic relay
JP2010129564A (en) Electronic component package, and piezoelectric vibrator
JPS6310604Y2 (en)
JP2587406Y2 (en) Piezoelectric ceramic actuator
JPH01518A (en) liquid crystal display element