JPH05240625A - Picture recognizing device and electronic parts mounting machine using the same - Google Patents
Picture recognizing device and electronic parts mounting machine using the sameInfo
- Publication number
- JPH05240625A JPH05240625A JP4040832A JP4083292A JPH05240625A JP H05240625 A JPH05240625 A JP H05240625A JP 4040832 A JP4040832 A JP 4040832A JP 4083292 A JP4083292 A JP 4083292A JP H05240625 A JPH05240625 A JP H05240625A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- contour
- electronic component
- qfp8
- visual field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Image Analysis (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、認識補正を行う画像認
識装置およびそれを用いた電子部品実装機に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image recognition device for performing recognition correction and an electronic component mounting machine using the same.
【0002】[0002]
【従来の技術】以下従来の画像認識装置を備えた電子部
品実装機について説明する。図3はその電子部品実装機
の概略構成図である。図3に示すように、装着ヘッド1
で吸着された電子部品2の像は認識カメラ3によって画
像信号として取り込まれる。この画像信号は増幅器4を
通して画像処理装置5へ送られ、画像処理される。この
画像信号には補正処理装置6によって補正量が加えら
れ、モータ駆動装置7を介してモータ8を駆動する。2. Description of the Related Art An electronic component mounter equipped with a conventional image recognition apparatus will be described below. FIG. 3 is a schematic configuration diagram of the electronic component mounter. As shown in FIG. 3, the mounting head 1
The recognition camera 3 captures the image of the electronic component 2 adsorbed in (1) as an image signal. This image signal is sent to the image processing device 5 through the amplifier 4 and subjected to image processing. A correction amount is added to the image signal by the correction processing device 6, and the motor 8 is driven via the motor driving device 7.
【0003】図4は従来の電子部品実装機の動作を示す
フローチャートである。なお各ステップ(以下STと略
す)毎にステップ番号を付した。まずST1で画像を取り
込み、ST2で電子部品を認識する。ST3で電子部品の輪郭
が検出できたかどうかを判定し、輪郭が検出できなけれ
ばST4でその電子部品を廃棄する。またST3で電子部品の
輪郭が検出できたと判定されれば、ST5でリード位置を
検出する。ST6でリード本数を検定し、もしリード本数
が異なっていれば、ST7でその電子部品が廃棄される。
またST6で電子部品のリード本数が所定の本数であると
判定されれば、ST8でリード長さを検定する。リード長
さが所定の長さと異なっていれば、ST7でその電子部品
が廃棄される。またST8でリード長さが所定の長さであ
ると判定されれば、ST9でリードピッチを検定する。リ
ードピッチが所定のピッチと異なっていれば、ST7でそ
の電子部品は廃棄される。ST7でリードピッチが所定の
リードピッチであると判定されれば、ST10で所定の軸に
対する傾き補正とX,Y補正を行う。その結果を電子部品
実装機のX,Y,θ駆動手段に送出し、ST11で電子部品を正
しい位置に移動し、実装する。FIG. 4 is a flowchart showing the operation of a conventional electronic component mounter. A step number is assigned to each step (hereinafter abbreviated as ST). First, the image is captured in ST1, and the electronic component is recognized in ST2. In ST3, it is determined whether the contour of the electronic component can be detected. If the contour cannot be detected, the electronic component is discarded in ST4. If it is determined in ST3 that the contour of the electronic component has been detected, the lead position is detected in ST5. The number of leads is verified in ST6, and if the number of leads is different, the electronic component is discarded in ST7.
If it is determined in ST6 that the number of leads of the electronic component is the predetermined number, the lead length is verified in ST8. If the lead length is different from the predetermined length, the electronic component is discarded in ST7. If the lead length is determined to be the predetermined length in ST8, the lead pitch is verified in ST9. If the lead pitch is different from the predetermined pitch, the electronic component is discarded in ST7. If it is determined in ST7 that the lead pitch is the predetermined lead pitch, in ST10, inclination correction and X, Y correction for a predetermined axis are performed. The result is sent to the X, Y, θ drive means of the electronic component mounter, and in ST11, the electronic component is moved to the correct position and mounted.
【0004】図5(a)〜(c)は輪郭検出を説明する
ための図である。これらの図において、8は4辺にリー
ドが配置された半導体部品(以下QFPと略す)、9は
QFP8のリード、10はカメラ視野である。図5
(a)はQFP8がカメラ視野10からはずれた状態を
示しており、この場合は図4のST3でQFP8の輪郭が
検出されないと判定されるのでこのQFP8はST4で廃
棄される。図5(b)はQFP8がカメラ視野10の中
に入っており、図4のST3で輪郭が検出されたと判定さ
れるので、図4のST5のリード位置検出に進む。ここで
図5(c)に示すように、リード9の一部が変形してい
ると、図4のST6でリード本数不足となるか、ST8でリー
ド長さ不良となるかまたはST9でリードピッチ不良とな
り、このQFP8は廃棄される。FIGS. 5A to 5C are views for explaining contour detection. In these figures, 8 is a semiconductor component (hereinafter abbreviated as QFP) in which leads are arranged on four sides, 9 is a lead of the QFP 8, and 10 is a camera visual field. Figure 5
(A) shows a state in which the QFP 8 is out of the camera field of view 10. In this case, it is determined in ST3 of FIG. 4 that the contour of the QFP 8 is not detected, so this QFP 8 is discarded in ST4. In FIG. 5B, it is determined that the QFP 8 is within the camera visual field 10 and the contour is detected in ST3 of FIG. 4, so the process proceeds to the lead position detection of ST5 of FIG. Here, as shown in FIG. 5 (c), if part of the lead 9 is deformed, the number of leads becomes insufficient at ST6 of FIG. 4, the lead length becomes defective at ST8, or the lead pitch at ST9. It becomes defective and this QFP 8 is discarded.
【0005】[0005]
【発明が解決しようとする課題】しかしながら上記の従
来の構成では、図4のST3において電子部品の輪郭が検
出できない時には電子部品が良品であるにもかかわらず
廃棄されてしまうという課題を有していた。However, the above-mentioned conventional configuration has a problem that when the contour of the electronic component cannot be detected in ST3 of FIG. 4, the electronic component is discarded although it is a good product. It was
【0006】本発明は上記の従来の課題を解決するもの
で、輪郭が検出できない場合でも電子部品を移動させて
再度認識処理することによって良品の電子部品を認識で
きる画像認識装置およびその結果に基づいて良品の電子
部品を廃棄することなく実装できる電子部品実装機を提
供することを目的とする。The present invention solves the above-mentioned conventional problems. Based on the image recognition apparatus and the result thereof, a good electronic component can be recognized by moving the electronic component and performing recognition processing again even when the contour cannot be detected. It is an object of the present invention to provide an electronic component mounter that can mount good electronic components without discarding them.
【0007】[0007]
【課題を解決するための手段】この目的を達成するため
に本発明の画像認識装置は、輪郭検出できなかった電子
部品についてその電子部品を吸着した装着ヘッドの座標
を変更することによって輪郭検出できる位置まで電子部
品を移動させ、再度認識処理する構成を有している。In order to achieve this object, the image recognition apparatus of the present invention can detect the contour of an electronic component for which the contour could not be detected by changing the coordinates of the mounting head sucking the electronic component. The electronic component is moved to the position and the recognition processing is performed again.
【0008】[0008]
【作用】この構成によって、カメラ視野から輪郭の一部
がはずれていても電子部品の中心位置を決定することが
でき、この中心位置が画面上の中心位置になるように電
子部品を移動させるため、正しく電子部品を認識でき
る。With this configuration, the center position of the electronic component can be determined even if a part of the contour deviates from the field of view of the camera, and the electronic component is moved so that the center position becomes the center position on the screen. , Can recognize electronic components correctly.
【0009】[0009]
【実施例】以下本発明の一実施例について、図面を参照
しながら説明する。図1は本発明の一実施例における画
像認識装置の動作を示すフローチャートであり、図4に
示す従来例と異なる部分のみを示した。図1に示すよう
に、まずST1で画像を取り込み、ST2で輪郭検出手段によ
り電子部品の輪郭を検出する。次にST3で全体の輪郭が
検出できたかどうかを判定し、全体の輪郭が検出できた
(図5(b)または図5(c)の場合)と判定されれば
図4に示す従来例のST5へ進み、それ後は図4に示すST6
以降のフローに従うことになる。一方ST3で全体の輪郭
が検出できなかった(図5(a)の場合)と判定されれ
ばST4で電子部品の中心位置を推測し、ST5で電子部品が
カメラ視野内に納まるように視野移動手段により電子部
品を移動させ、再びST1に戻って画像取り込みから始め
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a flow chart showing the operation of the image recognition apparatus in one embodiment of the present invention, and only the parts different from the conventional example shown in FIG. 4 are shown. As shown in FIG. 1, first, an image is captured in ST1, and the contour of the electronic component is detected by the contour detecting means in ST2. Next, in ST3, it is determined whether or not the entire contour can be detected. If it is determined that the entire contour can be detected (in the case of FIG. 5B or 5C), the conventional example shown in FIG. Proceed to ST5, then ST6 shown in Figure 4
The following flow will be followed. On the other hand, if it is determined in ST3 that the entire contour could not be detected (in the case of Fig. 5 (a)), ST4 estimates the center position of the electronic component, and ST5 moves the visual field so that the electronic component fits within the camera visual field. The electronic parts are moved by the means, and the process returns to ST1 again and starts from image capturing.
【0010】次に本発明の画像処理装置における電子部
品の中心推測方法について説明する。図2(a)は電子
部品の中心推測方法を説明するための図、図2(b)は
同中心推測方法のフローチャートであり、電子部品がQ
FPの例について示した。まず図2(a)に示すよう
に、カメラ視野10の4辺の内でQFP8の像がカメラ
視野10にかかっている辺AをST1で検出する。次にST2
で辺Aからカメラ視野10に入っている部分を輪郭検出
する。次にST3でQFP8の辺の内カメラ視野10内に
入っている辺の長さと方向(ベクトル記号を省略し、L
1、L2と表示する)を検出する。次にこれらの情報よ
り、ST4でカメラ視野10内に入っているQFP8のコ
ーナー(C)とQFP8の辺(LH、LV)の中心Uc、
Rcとを求める。なおQFP8ではそれぞれのリード9
の先端を結んだ線の交点をコーナー(C)とする。予め
データ作成時にQFP8の外形寸法が与えられているの
で、ST5でそれぞれの辺のベクトル方向(L1、L2)へ
外形寸法の中間点(Uc、Rc)から直線を引き、ST6で
ベクトルの交点Ppを求め、ST7でPpをQFP8の中心
と決定する。Next, a method of estimating the center of an electronic component in the image processing apparatus of the present invention will be described. FIG. 2A is a diagram for explaining a method of estimating the center of an electronic component, and FIG. 2B is a flowchart of the method of estimating the center of the electronic component.
An example of FP is shown. First, as shown in FIG. 2A, the side A where the image of the QFP 8 extends on the camera visual field 10 is detected in ST1 among the four sides of the camera visual field 10. Then ST2
Then, the contour is detected from the side A within the camera visual field 10. Next, in ST3, the length and direction of the side within the camera visual field 10 of the side of QFP8 (vector symbol is omitted, L
1, L 2 and display) for detecting a. Then from these information, corner QFP8 contained in the camera field of view 10 in ST4 (C) and QFP8 sides (L H, L V) center U c of,
Find R c . In QFP8, each lead 9
The intersection of the lines that connect the tips of is defined as the corner (C). Since the external dimensions of QFP8 are given in advance at the time of data creation, in ST5, draw a straight line from the midpoints (U c , R c ) of the external dimensions in the vector direction (L 1 , L 2 ) of each side, and in ST6. The intersection point P p of the vector is obtained, and P p is determined to be the center of QFP8 in ST7.
【0011】このようにして求めたPpとカメラ視野1
0の中心Pcの差を求め、その差分(X,Y,θ)だけ装着
ヘッドを移動させることによりQFP8の全体がカメラ
視野10内に納まることになり、正確に輪郭検出ができ
る。P p and the camera field of view 1 thus obtained
By obtaining the difference between the centers P c of 0 and moving the mounting head by the difference (X, Y, θ), the entire QFP 8 is set within the camera visual field 10, and the contour can be accurately detected.
【0012】なおこのような画像認識装置を電子部品実
装機に装着することにより、良品を不良と判定すること
もなく、正確な位置合わせが可能となる。By mounting such an image recognition device on an electronic component mounter, accurate alignment can be performed without determining that a non-defective product is defective.
【0013】[0013]
【発明の効果】以上のように本発明は、その電子部品の
画面上に残された部分の輪郭を検出する輪郭検出手段
と、その輪郭検出手段からの出力により中心位置を推測
する中心推測手段と、その結果に基づいて電子部品を視
野内に移動させる視野移動手段とを備えた構成により、
電子部品を吸着する際に多少の位置ずれが発生したり、
当初の教示(認識装置に情報を入力する作業)の精度が
それほど正確でなかったとしても、電子部品の全体の輪
郭を検出できる画像認識装置を実現できるものであり、
またこのような画像認識装置を電子部品実装機に用いる
ことにより従来のように良品を不良品と判定して廃棄す
ることがなくなる。As described above, according to the present invention, the contour detecting means for detecting the contour of the portion of the electronic component left on the screen, and the center estimating means for estimating the center position by the output from the contour detecting means. And a configuration including a visual field moving means for moving the electronic component into the visual field based on the result,
There may be some misalignment when picking up electronic parts,
Even if the accuracy of the initial teaching (the operation of inputting information to the recognition device) is not very accurate, it is possible to realize an image recognition device that can detect the outline of the entire electronic component.
Further, by using such an image recognition device in an electronic component mounting machine, it is not necessary to judge a non-defective product as a defective product and discard it as in the conventional case.
【図1】本発明の一実施例における画像認識装置の動作
を示すフローチャートFIG. 1 is a flowchart showing the operation of an image recognition apparatus according to an embodiment of the present invention.
【図2】(a)は電子部品の中心推測方法を説明するた
めの図(b)は同中心推測方法のフローチャートFIG. 2A is a diagram for explaining a center estimation method of an electronic component, and FIG. 2B is a flowchart of the center estimation method.
【図3】従来の画像認識装置を備えた電子部品実装機の
概略構成図FIG. 3 is a schematic configuration diagram of an electronic component mounter including a conventional image recognition device.
【図4】従来の電子部品実装機の動作を示すフローチャ
ートFIG. 4 is a flowchart showing the operation of a conventional electronic component mounter.
【図5】輪郭検出を説明するための図FIG. 5 is a diagram for explaining contour detection.
ST3 輪郭検出 ST4 部品中心推測 ST5 視野移動 ST3 Contour detection ST4 Part center guess ST5 Field of view
Claims (2)
み出している場合、その電子部品の画面上に残された部
分の輪郭を検出する輪郭検出手段と、前記輪郭検出手段
からの出力を処理し電子部品の中心位置を推測する中心
推測手段と、前記中心推測手段からの指示により電子部
品を視野内に移動させる視野移動手段とを有する画像認
識装置。1. When a part of an electronic component to be recognized protrudes from the screen, a contour detecting unit for detecting a contour of a portion of the electronic component left on the screen, and an output from the contour detecting unit are output. An image recognition apparatus having a center estimating means for processing and estimating the center position of an electronic component, and a visual field moving means for moving the electronic component into the visual field in accordance with an instruction from the central estimating means.
子部品実装機。2. An electronic component mounter equipped with the image recognition device according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4040832A JPH05240625A (en) | 1992-02-27 | 1992-02-27 | Picture recognizing device and electronic parts mounting machine using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4040832A JPH05240625A (en) | 1992-02-27 | 1992-02-27 | Picture recognizing device and electronic parts mounting machine using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05240625A true JPH05240625A (en) | 1993-09-17 |
Family
ID=12591619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4040832A Pending JPH05240625A (en) | 1992-02-27 | 1992-02-27 | Picture recognizing device and electronic parts mounting machine using the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05240625A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07271818A (en) * | 1994-03-31 | 1995-10-20 | Toshiba Corp | Hyper-medium system |
JP2012088162A (en) * | 2010-10-19 | 2012-05-10 | Mitsutoyo Corp | Image measuring device and drive controlling method |
JP2017053671A (en) * | 2015-09-08 | 2017-03-16 | キヤノン株式会社 | Shape measurement method |
-
1992
- 1992-02-27 JP JP4040832A patent/JPH05240625A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07271818A (en) * | 1994-03-31 | 1995-10-20 | Toshiba Corp | Hyper-medium system |
JP2012088162A (en) * | 2010-10-19 | 2012-05-10 | Mitsutoyo Corp | Image measuring device and drive controlling method |
JP2017053671A (en) * | 2015-09-08 | 2017-03-16 | キヤノン株式会社 | Shape measurement method |
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