JPH05235484A - Semiconductor light source - Google Patents

Abstract

PURPOSE:To assemble a semiconductor light source without generating any defect in bonding wires nor generating any dust or any flaw on a light emitting device chip, and to adjust easily the optical axes of a Fresnel lens and the chip so as to coincide with each other. CONSTITUTION:A holder 5 is made of the material through which an emitted light alpha is not transmitted. In a front plate 11 of the holder 5, which is placed on the light emitting side of the holder 5, a light emitting opening 12 whose inner diameter is larger than the outer diameter of a Fresnel lens 3 is provided. To the inner surface of the front plate 11, a lens board 4 molded integrally with the Fresnel lens 3 is bonded. A stem 6 of a light emitting device unit 2 is engaged with a mounting part 13 of the holder 5. The inner periphery of the rear end part of the holder 5 is so formed that when the stem 6 is inserted into the mounting part 13 a clearance 14 is generated between them. The light emitting device unit 2 is moved in the orthogonal direction to its optical axis within the clearance 14. Thereby, the optical axes of the light emitting device unit 2 and the Fresnel lens 3 are adjusted so as to coincide with each other.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION This invention relates to semiconductor light sources. More specifically, the present invention relates to a semiconductor light source integrally including a semiconductor light emitting chip such as a semiconductor laser or a light emitting diode and a Fresnel lens for collimating, condensing or diverging light emitted from the light emitting chip.

[0002]

2. Description of the Related Art FIG. 17 is a sectional view of a conventional semiconductor light source P. The semiconductor light source P includes a light emitter unit 53 in which a semiconductor laser chip (semiconductor light emitting chip) 52 is mounted on a metal stem 51, and a substantially cylindrical metal cap 54 for covering the semiconductor laser chip 52. , And a lens substrate 56 provided with a Fresnel lens 55.

However, in assembling the semiconductor light source P, after the lens substrate 56 is adhered to the inner surface of the light emitting window 57 opened at the front end surface of the metal cap 54 to close the light emitting window 57, the metal light source P is made of metal. The cap 54 is covered around the semiconductor laser chip 52, the rear end of the metal cap 54 is joined to the stem 51 by brazing, and the metal cap 54 is attached to the light emitting unit 53.

[0004]

In the conventional semiconductor light source P, the metal cap 54 to which the Fresnel lens 55 is attached and the light emitter unit 53 to which the semiconductor laser chip 52 is mounted are joined. If there is an error in the molding position of the Fresnel lens 55 on the lens substrate 56, deviation of the optical axis of the emitted light or blurring of the focus position occurs. For this reason, after the semiconductor light source P is manufactured, a product inspection is performed to remove a product including an error exceeding the allowable range as a defective product. Therefore, in the conventional semiconductor light source,
There was a drawback that the yield rate was low.

In the process of assembling the semiconductor light source P,
Light emitter unit 53 with semiconductor laser chip 52 exposed
Since the metal cap 54 is bonded to the metal cap 54, the metal cap 54 contacts the bonding wire (not shown) connected to the semiconductor laser chip 52 when the semiconductor laser chip 52 is covered with the metal cap 54. Or
There was a risk of breaking the bonding wire.
Furthermore, it is necessary to take measures to prevent the exposed semiconductor laser chip 52 from being dusted or scratched, and it is difficult to store or handle the light emitting unit 53.

Further, a commercially available light emitter unit (semiconductor laser element) having a semiconductor laser chip built-in is provided at a low cost due to the effect of mass production, whereas a light emitter unit with the semiconductor laser chip exposed is a custom-made product. Therefore, the cost is high and the cost of the semiconductor light source is high.

The present invention has been made in view of the above-mentioned drawbacks of the conventional example, and an object thereof is to prevent a defect such as a contact or a disconnection from occurring in a bonding wire during assembly of a semiconductor light source. In addition, it is inexpensive because it is possible to easily align the optical axis of the Fresnel lens and the light emitting point of the semiconductor laser chip (hereinafter referred to as optical axis adjustment) without dusting or scratching the light emitting chip. To provide a simple semiconductor light source.

[0008]

The semiconductor light source of the present invention comprises:
A light emitting unit having a semiconductor light emitting chip incorporated therein; a Fresnel lens for collimating, condensing or diverging light emitted from the light emitting unit; and a holder for mounting the light emitting unit or the Fresnel lens, When the Fresnel lens and the light emitter unit are attached to the holder, by relatively moving the Fresnel lens and the light emitter unit,
It is characterized by having means for enabling the optical axis adjustment between the Fresnel lens and the light emitter unit.

As means for adjusting the optical axis, a clearance is formed between the luminous body unit and the luminous body unit mounting portion of the holder, and the luminous body unit is fixed before being fixed to the holder. It is preferable to adjust the optical axes of the Fresnel lens and the light emitting unit by moving the light emitting unit in the clearance of the light emitting unit mounting portion.

As another means for adjusting the optical axis, the holder is divided into a lens holding member for mounting the Fresnel lens and a luminous body holding member for mounting the luminous body unit, and the Fresnel lens is divided. The optical axis adjustment between the Fresnel lens and the light emitter unit may be performed by relatively moving the lens holding member to which is attached and the light emitter holding member to which the light emitter unit is attached.

[0011]

In the semiconductor light source of the present invention, the light emitter unit containing the semiconductor light emitting chip and the Fresnel lens are connected by the holder so that the light emitter unit and the Fresnel lens can be adjusted in optical axis. For example, after adjusting the optical axis of the Fresnel lens and the light emitting unit by the clearance formed between the light emitting unit and the light emitting unit mounting portion of the holder, the adhesive is injected into this clearance to make the light The axis-adjusted luminous body unit can be fixed to the holder as it is. Alternatively, when the lens holding member for attaching the Fresnel lens and the light emitting body holding member for attaching the light emitting unit are joined by an adhesive or the like, after the lens holding member and the light emitting body holding member are moved to adjust the optical axis. It can be joined by an adhesive or the like.

Therefore, even if there is an error in the molding position of the Fresnel lens, the semiconductor light source can be assembled after the optical axes of the Fresnel lens and the semiconductor light emitting chip have been adjusted, and the deviation of the optical axis of the emitted light and the focus position. It is possible to manufacture a semiconductor light source without blurring. Therefore, it is possible to reduce the defective product rate at the time of manufacturing the semiconductor light source.

Further, since the semiconductor light source is assembled by using the light emitter unit having the semiconductor light emitting chip built-in, it may come into contact with the bonding wire connected to the semiconductor light emitting chip in the process of assembling the semiconductor light source as in the conventional example. , There is no risk of breaking the bonding wire. Further, there is no fear that the semiconductor light emitting chip will be dusted or damaged during the process of assembling the semiconductor light source.

Further, since a commercially available light emitter unit (semiconductor laser element, light emitting diode, etc.) having a semiconductor laser chip built therein can be used, the cost of the semiconductor light source can be reduced.

[0015]

1 is a sectional view of a semiconductor light source A according to a first embodiment of the present invention. This semiconductor light source A includes a light emitter unit 2 having a semiconductor light emitting chip 1 built therein, a lens substrate 4 provided with a Fresnel lens 3, and a light emitter unit 2
And a holder 5 for mounting the lens substrate 4
It is composed of point parts.

The light emitter unit 2 is, as shown in FIG.
A heat sink 7 having a semiconductor light emitting chip 1 such as a semiconductor laser chip or an LED (light emitting diode) chip mounted thereon is fixed to the front surface of a stem 6, and semiconductor light emission is performed by a metal cap 10 in which a light emitting window 8 is closed by a window glass 9. The semiconductor light emitting chip 1 is sealed in the metal cap 10 by covering the chip 1 and the heat sink 7 and joining the rear end of the metal cap 10 to the stem 6. As such a light emitting unit 2, a commercially available semiconductor laser element such as a can-seal type semiconductor laser element or an LED can be used. Since such a commercially available light emitter unit 2 is mass-produced at a low cost, the cost can be reduced. Further, as the light emitting unit 2, a commercially available resin-sealed semiconductor laser element, LED or the like may be used.

The Fresnel lens (Fresnel lens pattern) 3 is formed on the surface of a lens substrate 4 made of a material transparent to the emitted light α such as glass or plastic. In order to fabricate the Fresnel lens 3 on the lens substrate 4, for example, an ultraviolet curable resin is injected into a stamper (not shown) having a recessed pattern of a Fresnel lens pattern, and the lens substrate 4 is inserted into the stamper. After overlapping, the UV curable resin is cured by irradiation with UV light, and the Fresnel lens 3 is transferred to the surface of the lens substrate 4 as shown in FIG. 3A, a so-called 2P method (photo-po
lymarization method). Alternatively, FIG.
Like the Fresnel lens 3 shown in (b), the lens substrate 4 and the Fresnel lens 3 may be integrally molded simultaneously by injection molding, for example.

The holder 5 is formed into a substantially cylindrical shape by a material opaque to the emitted light α, and the lens substrate 4 is attached to the light emitting side and the light emitting unit 2 is attached to the opposite side. There is. That is, the light exit port 12 having an inner diameter larger than the outer diameter of the Fresnel lens 3 is opened in the front plate 11 located on the light exit side of the holder 5, and the light emitting unit 2 is located at the rear end. It is entirely open for insertion. Further, on the inner circumference of the rear end portion of the holder 5, a light emitter unit mounting portion 13 for holding the light emitter unit 2 by fitting the stem 6 of the light emitter unit 2 is recessed. The luminous body unit mounting portion 13 positions the stem 6 of the luminous body unit 2 in the front-back direction (optical axis direction), but the inner dimension of the luminous body unit mounting portion 13 in the lateral direction (direction orthogonal to the optical axis direction) is It is slightly larger than the stem 6 of the luminous body unit 2, and when the stem 6 is housed in the luminous body unit mounting portion 13, there is a clearance 14 between the inner peripheral surface of the luminous body unit mounting portion 13 and the outer peripheral surface of the stem 6. This clearance 1
4, the light emitter unit 2 is slightly moved laterally in the holder 5 so that the optical axis with the Fresnel lens 3 can be adjusted. The holder 5 may be an injection molded product made of a synthetic resin material or a press molded product made of a metal plate.

In manufacturing the semiconductor light source A, however, a can-seal type light emitting unit 2 of the same type as a commercially available product, a lens substrate 4 provided with a Fresnel lens 3, and a holder 5 are supplied. Then, the lens substrate 4 is inserted into the holder 5, the edge of the lens substrate 4 is fixed to the inner surface of the front plate 11 with an adhesive or the like, and the Fresnel lens 3 is arranged inside the light emission port 12 of the front plate 11. Next, the light emitter unit 2 is delivered from the rear end into the holder 5, and the stem 6 of the light emitter unit 2 is placed into the light emitter unit mounting portion 13. After that, a current is supplied to the light emitter unit 2 to cause the light emitter unit 2 to emit light, and the light emitted from the light emitter unit 2 and passing through the Fresnel lens 3 is detected by the inspection device, and the light emitter unit 2 is turned on. The light emitter unit 2 and the Fresnel lens 3 are moved in the lateral direction within the clearance 14 and the optical axes of the light emitter unit 2 and the Fresnel lens 3 are adjusted so that the normal emitted light α can be obtained. In this way, when the normal emitted light α is obtained, the thermosetting adhesive 14a or the like is provided in the clearance 14 between the light emitter unit mounting portion 13 and the stem 6 while holding the holder 5 and the light emitter unit 2 in that state. Is injected, and the adhesive 14a is cured to fix the light emitting unit 2,
The semiconductor light source A is completed.

As described above, since the semiconductor light source A is composed of only three parts, the number of parts is reduced, the assembly can be simplified, and the manufacturing cost can be reduced. Also, the light emitter unit 2
Since the semiconductor light emitting chip 1 is used in advance, there is no fear that the bonding wire connected to the semiconductor light emitting chip 1 will break during assembly, and dust or dust may adhere to the semiconductor light emitting chip 1. Also, the reliability and mounting efficiency of the semiconductor light source A can be improved. Therefore, according to the present invention, it is possible to easily and efficiently manufacture the semiconductor light source A having a high optical axis matching accuracy and at a low cost. It should be noted that a groove or a recess for positioning the lens substrate 4 may be provided around the light exit port 12 on the inner surface of the front plate 11 of the holder 5.

4 (a) and 4 (b) are a front view and a sectional view showing a semiconductor light source B according to a second embodiment of the present invention. In this embodiment, the holder 5 is formed of a material that is opaque to the emitted light α, and the front plate 11 of the holder 5 is provided with a light emitting port 12 having the same shape as the Fresnel lens 3,
The Fresnel lens 3 and the light emitting port 12 are opposed to each other. Therefore, the light that has passed through the lens substrate 4 outside the region of the Fresnel lens 3 and is unnecessary for collimating and focusing the emitted light α is
All of the light is cut off at the outer edge portion of the light emission port 12 of the front plate 11 to cut noise light. Therefore, according to this embodiment, the holder 5 also has a function of cutting noise light, and the number of parts of the semiconductor light source B can be reduced.

FIGS. 5A and 5B are a front view and a sectional view showing a semiconductor light source C according to a third embodiment of the present invention. In this semiconductor light source C, a holder 5 is formed of a material that is opaque to the emitted light α, and a front plate 11 of the holder 5 has a light emitting port 12 having a size smaller than a region where the Fresnel lens 3 is formed. .. If the light exit port 12 smaller than the Fresnel lens 3 is provided in this way, a part of the light transmitted through the Fresnel lens 3 and collimated or condensed is blocked by the outer edge portion of the light exit port 12 of the front plate 11. Therefore, the emitted light α emitted from the semiconductor light source C can be
The beam shape can be shaped into the opening shape of the light exit port 12. Therefore, for example, as shown in FIG. 5A, if the light emitting port 12 is formed in an elliptical shape, the semiconductor light source C can emit a light beam having an elliptical cross section. In addition, the opening shape of the light exit port 12 is circular, triangular,
With a star shape or the like, the cross-sectional shape of the light beam can be shaped into a circle, a triangle, a star shape, or the like. Therefore, according to this embodiment, the holder 5 also has a function of shaping the cross-sectional shape of the emitted light α, and the number of parts of the semiconductor light source C can be reduced.

FIG. 6 is a sectional view showing a semiconductor light source D according to the fourth embodiment of the present invention. In this embodiment, the holder 5 is formed of a material transparent to the emitted light α, such as a transparent acrylic resin or a transparent polycarbonate resin. Since the emitted light α passes through the holder 5, the holder 5 has no light emission port. The Fresnel lens 3 is directly formed on the inner surface of the front plate 11 of the holder 5 (or on the outer surface of the front plate 11) without using a lens substrate. This Fresnel lens 3 may also be molded by the so-called 2P method, or may be simultaneously molded integrally with the holder 5 by injection molding.

Therefore, according to this embodiment, since the lens substrate is not necessary, the number of parts at the time of assembling becomes two, and the holder 5 in which the Fresnel lens 3 is integrally formed is formed.
The light emitter unit 2 is attached to the light emitter unit 2, and the optical axes of the light emitter unit 2 and the Fresnel lens 3 are adjusted by using the clearance 14 of the light emitter unit mounting portion 13. It only needs to be fixed, which simplifies the assembly and further enhances the cost reduction effect.

FIG. 7 is a sectional view showing a semiconductor light source E according to the fifth embodiment of the present invention. In this embodiment, the holder 5 is formed of a material transparent to the emitted light α, the Fresnel lens 3 is integrally formed on the inner surface (or the outer surface) of the front plate 11 of the holder 5, and the front plate is further formed. A region of the outer surface (or inner surface) of 11 facing the Fresnel lens 3 is formed as a flat smooth surface 15, and light is scattered outside the region where the Fresnel lens 3 is provided.

In order to scatter light outside the area where the Fresnel lens 3 is provided, at least the front plate 11 is used.
Area a and / or outside the Fresnel lens 3 on the inner surface of
Alternatively, the area b outside the Fresnel lens 3 on the outside of the front plate 11 may be roughened to form a light scattering surface (diffuse reflection surface) 16. In addition, the inner peripheral surface c of the cylindrical portion 17 of the holder 5 and /
Alternatively, the outer peripheral surface d of the tubular portion 17 may be roughened to form the light scattering surface 16. In order to form these light-scattering surfaces 16, if the corresponding region of the inner surface of the cavity formed in the injection molding die for molding the holder 5 is roughened by roughening the surface of the holder 5, Light scattering surface 16 at the same time when molding
Can be formed.

For example, in FIG. 7, the area a outside the Fresnel lens 3 on the inner surface of the front plate 11 and the inner peripheral surface c of the cylindrical portion 17 are roughened to form a light scattering surface 16. Alternatively,
Only the area a outside the Fresnel lens 3 on the inner surface of the front plate 11 may be roughened to form the light scattering surface 16. Alternatively, a region a on the inner surface of the front plate 11 outside the Fresnel lens 3 and a region b on the outer surface of the front plate 11 outside the Fresnel lens 3
The inner peripheral surface c of the cylindrical portion 17 may be roughened to form the light scattering surface 16.

By forming the light-scattering surface 16 in the peripheral region other than the Fresnel lens 3 and the facing region in this way, unnecessary light that does not contribute to the collimation and focusing of the emitted light α is diffusely reflected and necessary light is emitted. Only the emitted light α can be extracted forward. As a result, the holder 5 can have a function of cutting noise light, and the number of parts of the semiconductor light source E can be reduced.

FIGS. 8A and 8B are a front view and a sectional view showing a sixth embodiment of the present invention. In this semiconductor light source F, the holder 5 is formed of a material transparent to the emitted light α, the Fresnel lens 3 is integrally formed on the inner surface of the front plate 11 of the holder 5, and the outer surface of the front plate 11 of the holder 5 is formed. A smooth surface 15 having a predetermined shape smaller in size than the area where the Fresnel lens 3 is formed is formed on the surface. Further, the outer region e of the smooth surface 15 on the outer surface of the front plate 11 of the holder 5 and the outer peripheral surface d of the cylindrical portion 17 are roughened to serve as a light scattering surface 16.
In order to form the smooth surface 15 and the light scattering surface 16, the area corresponding to the smooth surface 15 of the inner surface of the cavity formed in the injection molding die for molding the holder 5 is finished to be smooth and the light scattering is performed. The area corresponding to the surface 16 may be roughened by roughening.

If a smooth surface 15 smaller than the Fresnel lens 3 is formed so as to face the Fresnel lens 3 in this way, a part of the light that is transmitted through the Fresnel lens 3 and collimated or condensed is a light scattering surface. Since it can be scattered by 16, the beam shape of the emitted light α emitted from the semiconductor light source F can be shaped into the shape of the smooth surface 15.
Therefore, for example, as shown in FIG. 8A, if the area of the smooth surface 15 is elliptical, the semiconductor light source F
Can emit a light beam with an elliptical cross section.
If the area of the smooth surface 15 is formed into a circle, a triangle, a star, or the like, the cross-sectional shape of the light beam can be shaped into a circle, a triangle, a star, or the like. Therefore, according to this embodiment, the holder 5 also has a function of shaping the cross-sectional shape of the emitted light α, and the number of parts of the semiconductor light source F can be reduced.

FIG. 9 is a sectional view of a semiconductor light source G according to the seventh embodiment of the present invention. In this embodiment, the holder 5 is divided into a lens holding member 18 for mounting the Fresnel lens 3 and a luminous body holding member 19 for mounting the luminous body unit 2.

The holder 5 is divided into a lens holding member 18 and a light emitter holding member 19 on a plane perpendicular to the axis, and the lens holding member 18 and the light emitter holding member 19 are adapted to emit light α of synthetic resin or metal. On the other hand, it is formed of an opaque material. Therefore, the lens holding member 18 and the light emitter holding member 19 can be displaced from each other in the direction perpendicular to the axis with the rear end surface of the lens holding member 18 and the front end surface of the light emitter holding member 19 being in contact with each other.

The front plate 11 provided on the lens holding member 18 is provided with a light emitting port 12 having an inner diameter larger than the outer diameter of the Fresnel lens 3. A luminous body unit mounting portion 13 for holding the luminous body unit 2 by fitting the stem 6 of the luminous body unit 2 is recessed in the inner periphery of the rear end portion of the luminous body holding member 19. This light emitter unit mounting portion 13 is used for the light emitter unit 2
The stem 6 can be positioned in the front-rear direction (optical axis direction) and the lateral direction (direction perpendicular to the optical axis).

In manufacturing the semiconductor light source G, however, the light emitting unit 2 of the same type as the commercially available product as shown in FIG. 2 and the Fresnel lens 3 as shown in FIG. 3 (a) or 3 (b) are used. Then, the lens substrate 4 provided with and the holder 5 (lens holding member 18, light emitter holding member 19) are supplied. Then, the lens substrate 4 is inserted into the lens holding member 18,
The edge of the lens substrate 4 is fixed to the inner surface of the front plate 11 with an adhesive or the like, and the Fresnel lens 3 is arranged inside the light emission port 12 of the front plate 11. Then, from the rear side, the luminous body unit 2 is inserted into the luminous body unit mounting portion 13 of the luminous body holding member 19.
Then, the stem 6 of the luminous body unit 2 is fitted and fixed to the luminous body unit mounting portion 13. After that, the rear end surface 18a of the lens holding member 18 and the front end surface 19a of the light emitter holding member 19 are joined by an adhesive, a brazing material, or the like.

However, when the lens holding member 18 and the light emitter holding member 19 are joined together without adjustment, the Fresnel lens 3 is formed at a position offset from the center of the lens substrate 4, or the lens substrate 4 is a lens holding member. If the semiconductor light emitting chip 1 is mounted at a position deviated from the center of 18 or the semiconductor light emitting chip 1 is displaced from the center of the light emitting unit 2, the emission direction of the emitted light α is displaced from the optical axis, as shown in FIG. ..

Therefore, before the lens holding member 18 and the luminous body holding member 19 are joined and fixed, the lens holding member 18 and the luminous body holding member 19 are respectively driven as shown in FIG. 20 and the luminous body holding member fixing device 21 hold the luminous body unit 2 and supply a current to the luminous body unit 2 to cause the luminous body unit 2 to emit light. Then,
The luminous body holding member 1 is fixed by the luminous body holding member fixing device 21.
The lens holding member driving device 20 moves the lens holding member 18 in the lateral direction while keeping 9 stationary, and the inspection device 22 detects the emitted light α emitted from the light emitting unit 2 and passing through the Fresnel lens 3, and the optical axis Parallel output light α
So that the light emitting unit 2 and the Fresnel lens 3 can be obtained.
And adjust the optical axes. In this way, when the normal emitted light α is obtained, the lens holding member 18 and the light emitter holding member 19 are bonded and integrated with an adhesive or a brazing material while keeping the lens holding member 18 in that state, and the semiconductor light source G is completed. The lens holding member 18 may be fixed, and the light emitter holding member 19 may be moved in the lateral direction to adjust the optical axis.

Since the semiconductor light source G is composed of only four parts, the number of parts is small,
Assembly is simple and manufacturing cost can be reduced. Also,
Since the light emitting unit 2 has the semiconductor light emitting chip 1 built-in in advance, there is no risk of breaking the bonding wire connected to the semiconductor light emitting chip 1 during assembly, and the semiconductor light emitting chip 1 is free from dust and dust. It is possible to improve the reliability and the mounting efficiency of the semiconductor light source G without the risk of being attached. Therefore, according to the present invention, it is possible to easily and efficiently manufacture the semiconductor light source G having a high optical axis matching accuracy and at a low cost.

12 (a) and 12 (b) are a front view and a sectional view showing a semiconductor light source H according to an eighth embodiment of the present invention.
In this embodiment, the lens holding member 18 and the light emitter holding member 19 are formed of a material that is opaque to the emitted light α, and the front plate 11 of the lens holding member 18 has a light exit port 12 of the same shape as the Fresnel lens 3. And the Fresnel lens 3 and the light emission port 12 are opposed to each other. Therefore,
Transmitted through the lens substrate 4 outside the Fresnel lens 3 region,
Light unnecessary for collimating or focusing the emitted light α is generated by the front plate 11
All are blocked at the outer edge portion of the light emission port 12 and noise light is cut. Therefore, according to this embodiment, the lens holding member 18 also has a function of cutting noise light, and the number of parts of the semiconductor light source H can be reduced.

13A and 13B are a front view and a sectional view showing a semiconductor light source I according to a ninth embodiment of the present invention.
In this semiconductor light source I, the lens holding member 18 and the light emitter holding member 19 are formed of a material that is opaque to the emitted light α, and the front plate 11 of the lens holding member 18 has a size smaller than the formation area of the Fresnel lens 3. Light output port 1
2 is opened. If the light exit port 12 smaller than the Fresnel lens 3 is provided in this way, a part of the light transmitted through the Fresnel lens 3 and collimated or condensed is blocked by the outer edge portion of the light exit port 12 of the front plate 11. Therefore, the beam shape of the emitted light α emitted from the semiconductor light source I can be shaped into the opening shape of the light emitting port 12.
Therefore, for example, as shown in FIG.
If the light emitting port 12 has an elliptical shape, the semiconductor light source I can emit a light beam having an elliptical cross section. Further, if the opening shape of the light emitting port 12 is circular, triangular, star-shaped, etc., the cross-sectional shape of the light beam can be shaped into a circle, a triangle, a star, etc., respectively. Therefore, according to this embodiment, the lens holding member 18 also has a function of shaping the cross-sectional shape of the emitted light α, and the number of parts of the semiconductor light source I can be reduced.

FIG. 14 is a sectional view showing a semiconductor light source J according to the tenth embodiment of the present invention. In this embodiment, the lens holding member 18 is formed of a material transparent to the emitted light α, such as a transparent acrylic resin or a transparent polycarbonate resin. Since the emitted light α passes through the lens holding member 18, the light emitting port is not necessary. The Fresnel lens 3 is directly formed on the inner surface of the front plate 11 of the lens holding member 18 (or on the outer surface of the front plate 11) without using the lens substrate 4.

Therefore, according to this embodiment, since the lens substrate 4 is not necessary, the number of parts at the time of assembly is three. Moreover, the luminous body unit 2 is attached to the opaque luminous body holding member 19, and the rear end surface 18a of the lens holding member 18 integrally formed with the Fresnel lens 3 and the luminous body holding member 19 to which the luminous body unit 2 is attached. After the front end surfaces 19a are joined to each other, the lens holding member 18 and the light emitter holding member 19 are relatively moved in the lateral direction to adjust the optical axis, and then the lens holding member 18 is fixed with an adhesive or a brazing material.
The semiconductor light source J can be manufactured only by fixing the light emitting body holding member 19. Therefore, the assembly of the semiconductor light source can be simplified and the cost can be reduced.

FIG. 15 is a sectional view showing a semiconductor light source K according to the eleventh embodiment of the present invention. In this embodiment, the lens holding member 18 is formed of a material transparent to the emitted light α, and the Fresnel lens 3 is integrally formed on the inner surface (or outer surface) of the front plate 11 of the lens holding member 18,
Further, an area of the outer surface (or inner surface) of the front plate 11 facing the Fresnel lens 3 is formed as a flat smooth surface 15, and light is scattered outside the area where the Fresnel lens 3 is provided. There is.

In order to scatter light outside the area where the Fresnel lens 3 is provided, at least the area a outside the Fresnel lens 3 on the inner surface of the front plate 11 and the semiconductor light source E shown in FIG. And / or roughening the area b outside the Fresnel lens 3 on the outside of the front plate 11,
The light scattering surface 16 may be used. In addition, the lens holding member 1
No. 8, the inner peripheral surface f of the tubular portion 23 and / or the outer peripheral surface g of the tubular portion 23.
The light scattering surface 16 may be roughened. In order to form these light-scattering surfaces 16, if the corresponding regions of the inner surface of the cavity formed in the injection molding die for molding the lens holding member 18 are roughened by roughening the lens, The light scattering surface 16 can be formed at the same time when the holding member 18 is molded.

By forming the light-scattering surface 16 in the peripheral region other than the Fresnel lens 3 and the facing region in this way, unnecessary light that does not contribute to the collimation and focusing of the emitted light α is diffusely reflected and necessary light is emitted. Only the emitted light α can be extracted forward. As a result, the holder 5 can have a function of cutting noise light, and the number of parts of the semiconductor light source K can be reduced.

16 (a) and 16 (b) are a front view and a sectional view showing a twelfth embodiment of the present invention. This semiconductor light source L
In this case, the lens holding member 18 is formed of a material transparent to the emitted light α, the Fresnel lens 3 is integrally formed on the inner surface of the front plate 11 of the lens holding member 18, and the front plate 11 of the lens holding member 18 is formed. A smooth surface 15 having a predetermined shape smaller in size than the Fresnel lens 3 forming region is formed on the outer surface of the. In addition, the front plate 11 of the lens holding member 18
The outer region e of the smooth surface 15 and the outer peripheral surface g of the cylindrical portion 23 are roughened to serve as the light scattering surface 16. To form the smooth surface 15 and the light scattering surface 16, the lens holding member 1
The region corresponding to the smooth surface 15 of the inner surface of the cavity formed in the injection molding die for molding 8 may be finished smooth, and the region corresponding to the light scattering surface 16 may be roughened by roughening. ..

If the smooth surface 15 smaller than the Fresnel lens 3 is formed so as to face the Fresnel lens 3 in this way, a part of the light which is transmitted through the Fresnel lens 3 and collimated or condensed is a light scattering surface. Since it can be scattered by 16, the beam shape of the emitted light α emitted from the semiconductor light source L can be shaped into the shape of the smooth surface 15.
Therefore, for example, as shown in FIG.
If the smooth surface 15 has an elliptical shape, the semiconductor light source L can emit a light beam having an elliptical cross section. If the area of the smooth surface 15 is formed into a circle, a triangle, a star, or the like, the cross-sectional shape of the light beam can be shaped into a circle, a triangle, a star, or the like. Therefore, according to this embodiment, the holder 5 also has a function of shaping the cross-sectional shape of the emitted light α, and the number of parts of the semiconductor light source L can be reduced.

[0047]

According to the present invention, since the light emitter unit and the Fresnel lens can be attached to the holder in the state where the optical axes are adjusted, a semiconductor light source without deviation of the optical axis of the emitted light or blurring of the focal position is manufactured. It is possible to improve the non-defective rate at the time of manufacturing the semiconductor light source.

Further, since the semiconductor light source is assembled by using the light emitting body unit having the semiconductor light emitting chip built-in, it may come into contact with the bonding wire connected to the semiconductor light emitting chip in the process of assembling the semiconductor light source as in the conventional example. , There is no risk of breaking the bonding wire. Further, since the semiconductor light emitting chip is not likely to be dusted or scratched in the process of assembling the semiconductor light source, storage and handling of the light emitter unit are facilitated. Therefore, mounting of the light emitter unit on the holder is facilitated, and mounting efficiency and product reliability are improved.

Therefore, according to the semiconductor light source of the present invention, at the time of assembling the semiconductor light source, the bonding wire of the semiconductor light emitting chip is not brought into contact with or broken, and the light emitting chip is dusted or scratched. In addition, the optical axes of the Fresnel lens and the light emitting chip can be easily adjusted.

Further, since a commercially available light emitter unit (semiconductor laser element, light emitting diode, etc.) having a semiconductor laser chip built therein can be used, the cost of the semiconductor light source can be reduced.

[Brief description of drawings]

FIG. 1 is a sectional view showing a semiconductor light source according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a luminous body unit used in the above-mentioned embodiment.

FIG. 3A is a sectional view showing a Fresnel lens formed on a surface of a lens substrate, and FIG. 3B is a sectional view showing a Fresnel lens integrally formed with the lens substrate.

4A and 4B are a front view and a sectional view showing a semiconductor light source according to a second embodiment of the present invention.

5A and 5B are a front view and a sectional view showing a semiconductor light source according to a third embodiment of the present invention.

FIG. 6 is a sectional view showing a semiconductor light source according to a fourth embodiment of the present invention.

FIG. 7 is a sectional view showing a semiconductor light source according to a fifth embodiment of the present invention.

8A and 8B are a front view and a sectional view showing a semiconductor light source according to a sixth embodiment of the present invention.

FIG. 9 is a sectional view showing a semiconductor light source according to a seventh embodiment of the present invention.

FIG. 10 is a cross-sectional view showing a state before adjusting an optical axis in the above-mentioned embodiment.

FIG. 11 is a cross-sectional view showing an optical axis adjusting method in the above-mentioned embodiment.

12A and 12B are a front view and a sectional view showing a semiconductor light source according to an eighth embodiment of the present invention.

13 (a) and 13 (b) are a front view and a sectional view showing a semiconductor light source according to a ninth embodiment of the present invention.

FIG. 14 is a sectional view showing a semiconductor light source according to a tenth embodiment of the present invention.

FIG. 15 is a sectional view showing a semiconductor light source according to an eleventh embodiment of the present invention.

16 (a) and 16 (b) are a front view and a sectional view showing a semiconductor light source according to a twelfth embodiment of the present invention.

FIG. 17 is a sectional view showing a conventional semiconductor light source.

[Explanation of symbols]

 1 Semiconductor Light Emitting Chip 2 Light Emitting Unit 3 Fresnel Lens 4 Lens Substrate 5 Holder 13 Light Emitting Unit Mounting Part 14 Clearance 18 Lens Holding Member 19 Light Emitting Element Holding Member

Claims (3)

[Claims] 1. A light emitter unit having a semiconductor light emitting chip built therein, a Fresnel lens for collimating, condensing or diverging light emitted from the light emitter unit, and a light emitter unit and a Fresnel lens for mounting the light emitter unit. A holder is provided, and when the Fresnel lens or the luminous body unit is attached to the holder, the Fresnel lens and the luminous body unit are relatively moved to adjust the optical axis of the Fresnel lens and the luminous body unit. Semiconductor light source having optical axis adjusting means for enabling. 2. A clearance is formed between the luminous body unit and a luminous body unit mounting portion of the holder, and the luminous body unit is fixed to the clearance of the luminous body unit mounting portion before the luminous body unit is fixed to the holder. The semiconductor light source according to claim 1, wherein the optical axis of the Fresnel lens and the light emitting unit is adjusted by moving the light source unit inside. 3. The holder is divided into a lens holding member for mounting the Fresnel lens and a light emitter holding member for mounting the light emitter unit, and the lens holding member having the Fresnel lens attached and the light emitter unit are fixed. 2. The semiconductor light source according to claim 1, wherein the optical axis adjustment of the Fresnel lens and the light emitting unit is performed by moving the light emitting member holding member relative to each other.