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JPH05234828A - Manufacture of solid electrolytic capacitor - Google Patents

Manufacture of solid electrolytic capacitor

Info

Publication number
JPH05234828A
JPH05234828A JP4070312A JP7031292A JPH05234828A JP H05234828 A JPH05234828 A JP H05234828A JP 4070312 A JP4070312 A JP 4070312A JP 7031292 A JP7031292 A JP 7031292A JP H05234828 A JPH05234828 A JP H05234828A
Authority
JP
Japan
Prior art keywords
lead wire
anode lead
metal frame
capacitor
melted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4070312A
Other languages
Japanese (ja)
Other versions
JP3084895B2 (en
Inventor
Shinji Sano
真二 佐野
Kosuke Nakamura
浩介 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lincstech Circuit Co Ltd
Original Assignee
Hitachi AIC Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=13427814&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH05234828(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi AIC Inc filed Critical Hitachi AIC Inc
Priority to JP04070312A priority Critical patent/JP3084895B2/en
Publication of JPH05234828A publication Critical patent/JPH05234828A/en
Application granted granted Critical
Publication of JP3084895B2 publication Critical patent/JP3084895B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To enhance the breakdown strength of the title capacitor, to reduce an irregularity in the leakage current of the title capacitor and to enhance the reliability of the title capacitor by a method wherein an anode lead wire is heated and melted without exerting a pressure and, after that, it is solidified and it is connected to a metal frame. CONSTITUTION:An anode lead wire 2 for a capacitor element 1 is arranged in a recessed part 4 formed in a metal frame 3. After it has been arranged, the tip of the anode lead wire 2 is irradiated with a YAG laser at 20 W for one second, and the anode lead wire is melted. When the anode lead wire 2 is melted, it is made spherical due to surface tension. Consequently, the anode lead wire 2 comes into contact with the metal frame 2; it is solidified in this state; it is connected to the metal frame 3. A cathode layer for the capacitor element 2 is connected to the metal frame by using a conductive adhesive. After it has been connected, a transfer molding operation is executed by using an epoxy resin, and an outer package is formed. After the outer package has been formed, an aging operation is performed, terminals are formed, and a chip-shaped capacitor is formed. Since no pressure is exerted on the anode lead wire in this manner, the breakdown strength of the title capacitor can be enhanced.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は固体電解コンデンサの製
造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a solid electrolytic capacitor.

【0002】[0002]

【従来の技術】タンタル固体電解コンデンサ等のコンデ
ンサは、例えば、次の通りに製造する。すなわち、先
ず、タンタル等の陽極リード線を引き出した、タンタル
の微粉末からなる焼結体を形成する。次に、この焼結体
を陽極化成して酸化皮膜を形成し、さらに二酸化マンガ
ン層、陰極層を順次形成してコンデンサ素子とする。そ
して、陽極リード線を金属フレームに抵抗溶接するとと
もに、陰極層を金属フレームに導電性接着剤により接続
する。コンデンサ素子を金属フレームに接続後、トラン
スファーモールドして外装を形成する。
2. Description of the Related Art A capacitor such as a tantalum solid electrolytic capacitor is manufactured, for example, as follows. That is, first, a sintered body made of fine tantalum powder, in which an anode lead wire of tantalum or the like is drawn out, is formed. Next, this sintered body is anodized to form an oxide film, and then a manganese dioxide layer and a cathode layer are sequentially formed to form a capacitor element. Then, the anode lead wire is resistance-welded to the metal frame, and the cathode layer is connected to the metal frame by a conductive adhesive. After the capacitor element is connected to the metal frame, transfer molding is performed to form an exterior.

【0003】[0003]

【発明が解決しようとする課題】しかし、抵抗溶接によ
り陽極リード線を金属フレームに接続するには、陽極リ
ード線と金属フレームとの接点に圧力を加えなければな
らない。そのため、この圧力により、陽極リード線の焼
結体中にある部分にストレスが加わる。そしてこのスト
レスにより、酸化皮膜が劣化したり破損する。その結
果、コンデンサ素子の耐圧が低下したり、漏れ電流のば
らつきが増大したりして信頼性が低下する欠点がある。
However, in order to connect the anode lead wire to the metal frame by resistance welding, pressure must be applied to the contact point between the anode lead wire and the metal frame. Therefore, this pressure applies stress to the portion of the anode lead wire in the sintered body. The stress causes the oxide film to deteriorate or break. As a result, there is a drawback that the withstand voltage of the capacitor element is lowered, and the variation of the leakage current is increased, so that the reliability is lowered.

【0004】本発明の目的は、以上の欠点を改良し、耐
圧を向上し、漏れ電流のばらつきを減少し、信頼性の高
い固体電解コンデンサの製造方法を提供するものであ
る。
An object of the present invention is to provide a method for manufacturing a solid electrolytic capacitor which has improved reliability, improved breakdown voltage, reduced leakage current variation, and high reliability.

【0005】[0005]

【課題を解決するための手段】本発明は、上記の目的を
達成するために、陽極リード線を引き出したコンデンサ
素子を金属フレームに接続し、外装を形成する固体電解
コンデンサの製造方法において、陽極リード線を圧力を
加えずに加熱溶融した後、凝固して金属フレームに接続
することを特徴とする固体電解コンデンサの製造方法を
提供するものである。
In order to achieve the above object, the present invention provides a method for manufacturing a solid electrolytic capacitor, in which a capacitor element from which an anode lead wire is drawn is connected to a metal frame to form an outer package, and an anode is provided. It is intended to provide a method for producing a solid electrolytic capacitor, characterized in that a lead wire is heated and melted without applying pressure and then solidified and connected to a metal frame.

【0006】陽極リード線を圧力を加えずに加熱溶融す
るにはレーザーやアーク放電法等を用いる。
To heat and melt the anode lead wire without applying pressure, a laser or arc discharge method is used.

【0007】[0007]

【作用】コンデンサ素子の陽極リード線を、レーザー等
を用いて圧力を加えずに加熱溶融し、凝固して金属フレ
ームに接続しているため、接続時に陽極リード線にスト
レスが掛からず、酸化皮膜を劣化したり破損することが
全くなるなる。
[Function] The anode lead wire of the capacitor element is heated and melted without applying pressure using a laser or the like and solidified to be connected to the metal frame, so that no stress is applied to the anode lead wire at the time of connection, and an oxide film is formed. Will not be deteriorated or damaged at all.

【0008】[0008]

【実施例】以下、本発明を実施例に基づいて説明する。 実施例1:先ず、タンタルワイヤーからなる陽極リード
線を引き出して、タンタルの微粉末からなる焼結体を形
成する。次に、この焼結体を陽極化成して酸化皮膜を形
成する。酸化皮膜を形成後、硝酸マンガン溶液を含浸
し、熱分解して二酸化マンガン層を形成する。その後、
コロイド状のカーボンを付着してカーボン層を形成して
陰極を引き出すとともに、その表面に銀ペーストを塗布
して陰極層を形成する。陰極層を形成後、図1(イ)に
示す通り、コンデンサ素子1の陽極リード線2を、金属
フレーム3に形成した凹部4に配置する。配置後、陽極
リード線2の先端に、YAGレーザーを20Wで1秒間
照射してこれを溶融する。陽極リード線2は溶融する
と、表面張力により球状になる。従って、図1(ロ)に
示す通り、陽極リード線2は、金属フレーム3に接触
し、その状態で凝固し、金属フレーム3に接続される。
また、コンデンサ素子1の陰極層は導電性接着剤により
金属フレームに接続する。接続後、エポキシ樹脂により
トランスファーモールドして外装を形成する。外装を形
成後、エージングし、端子を形成してチップ型コンデン
サにする。
EXAMPLES The present invention will be described below based on examples. Example 1: First, an anode lead wire made of tantalum wire is pulled out to form a sintered body made of fine tantalum powder. Next, this sintered body is anodized to form an oxide film. After forming the oxide film, it is impregnated with a manganese nitrate solution and thermally decomposed to form a manganese dioxide layer. afterwards,
Colloidal carbon is adhered to form a carbon layer and the cathode is pulled out, and silver paste is applied to the surface to form a cathode layer. After forming the cathode layer, as shown in FIG. 1A, the anode lead wire 2 of the capacitor element 1 is arranged in the recess 4 formed in the metal frame 3. After the arrangement, the tip of the anode lead wire 2 is irradiated with a YAG laser at 20 W for 1 second to melt it. When the anode lead wire 2 is melted, it becomes spherical due to surface tension. Therefore, as shown in FIG. 1B, the anode lead wire 2 contacts the metal frame 3, is solidified in that state, and is connected to the metal frame 3.
The cathode layer of the capacitor element 1 is connected to the metal frame with a conductive adhesive. After connection, transfer molding is performed with an epoxy resin to form an exterior. After forming the outer package, it is aged to form terminals to form a chip-type capacitor.

【0009】実施例2:実施例1において、陽極リード
線を次の通りの金属フレームに接続する以外は、同一の
条件で接続する。すなわち、図2(イ)に示す通り、金
属フレーム5に屈曲部6を形成する。そしてこの屈曲部
6に設けた凹部7にコンデンサ素子8の陽極リード線9
を配置する。次に、実施例1と同一条件でYAGレーザ
ーを照射し、図2(ロ)に示す通り、陽極リード線9を
金属フレーム5に接続する。
Example 2 In Example 1, connection was made under the same conditions except that the anode lead wire was connected to a metal frame as follows. That is, as shown in FIG. 2A, the bent portion 6 is formed on the metal frame 5. Then, the anode lead wire 9 of the capacitor element 8 is formed in the concave portion 7 provided in the bent portion 6.
To place. Next, a YAG laser is irradiated under the same conditions as in Example 1, and the anode lead wire 9 is connected to the metal frame 5 as shown in FIG.

【0010】従来例:実施例1において、陽極リード線
を金属フレームに次の通り抵抗溶接法を用いて接続する
以外は、同一の条件で製造する。すなわち、図3(イ)
に示す通り、陽極リード線11を金属フレーム12の平
面上に載せる。そして3kg/8mm2 の圧力を加えて、抵
抗溶接し、図3(ロ)に示す通り、陽極リード線11を
接続する。
Conventional Example: Manufacturing is performed under the same conditions as in Example 1, except that the anode lead wire is connected to the metal frame by the resistance welding method as follows. That is, FIG.
The anode lead wire 11 is placed on the flat surface of the metal frame 12, as shown in FIG. Then, resistance welding is performed by applying a pressure of 3 kg / 8 mm 2 , and the anode lead wire 11 is connected as shown in FIG.

【0011】次に、耐圧不良を比較するために、定格1
6V、2.2μFの実施例1、実施例2及び従来例の構
造のタンタル固体電解コンデンサに、電圧20Vを印加
した。そして短絡したものを不良として、その個数を測
定した。なお、試料数は各々1000ケとする。測定の
結果、実施例1及び実施例2は0ケであったのに対し、
従来例は2ケ不良となった。
Next, in order to compare the breakdown voltage defects, a rating of 1
A voltage of 20 V was applied to the tantalum solid electrolytic capacitors having the structures of Example 1 and Example 2 of 6 V and 2.2 μF and the conventional example. And what short-circuited was made into a defect, and the number was measured. The number of samples is 1000 each. As a result of the measurement, in Example 1 and Example 2, the number was 0.
The conventional example had two defects.

【0012】また、上記と同一定格のタンタル固体電解
コンデンサにつき、漏れ電流を測定し、図4に示した。
その結果、実施例1と実施例2はほぼ同程度のばらつき
を示した。しかし、従来例は最大値が1桁大きくなり、
ばらつきが非常に大きかった。
The leakage current of the tantalum solid electrolytic capacitor having the same rating as above was measured and shown in FIG.
As a result, Example 1 and Example 2 showed almost the same variation. However, in the conventional example, the maximum value is increased by one digit,
The variation was very large.

【0013】[0013]

【発明の効果】以上の通り、本発明の製造方法によれ
ば、陽極リード線をレーザーやアーク放電等により圧力
を加えないで加熱溶融し、凝固して金属フレームに接続
しているため、耐圧を向上できるとともに漏れ電流のば
らつきを減少でき、信頼性の高い固体電解コンデンサが
得られる。
As described above, according to the manufacturing method of the present invention, the anode lead wire is heated and melted without applying pressure by laser or arc discharge and solidified to be connected to the metal frame. And the leakage current variation can be reduced, and a highly reliable solid electrolytic capacitor can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例のコンデンサ素子を金属フレー
ムに接続する前後の斜視図を示す。
FIG. 1 shows perspective views before and after connecting a capacitor element of an embodiment of the present invention to a metal frame.

【図2】本発明の他の実施例のコンデンサ素子を金属フ
レームに接続する前後の斜視図を示す。
FIG. 2 shows perspective views before and after connecting a capacitor element of another embodiment of the present invention to a metal frame.

【図3】従来例のコンデンサ素子を金属フレームに接続
する前後の斜視図を示す。
FIG. 3 shows perspective views before and after connecting a conventional capacitor element to a metal frame.

【図4】漏れ電流のグラフを示す。FIG. 4 shows a graph of leakage current.

【符号の説明】[Explanation of symbols]

1,8…コンデンサ素子、 2,9…陽極リード線、
3,5…金属フレーム。
1, 8 ... Capacitor element, 2, 9 ... Anode lead wire,
3, 5 ... Metal frame.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 陽極リード線を引き出したコンデンサ素
子を金属フレームに接続し、外装を形成する固体電解コ
ンデンサの製造方法において、陽極リード線を圧力を加
えずに加熱溶融した後、凝固して金属フレームに接続す
ることを特徴とする固体電解コンデンサの製造方法。
1. A method for manufacturing a solid electrolytic capacitor in which a capacitor element from which an anode lead wire is drawn out is connected to a metal frame to form an exterior, the anode lead wire is heated and melted without applying pressure, and then solidified to be a metal. A method for manufacturing a solid electrolytic capacitor, which comprises connecting to a frame.
JP04070312A 1992-02-20 1992-02-20 Method for manufacturing solid electrolytic capacitor Expired - Lifetime JP3084895B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04070312A JP3084895B2 (en) 1992-02-20 1992-02-20 Method for manufacturing solid electrolytic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04070312A JP3084895B2 (en) 1992-02-20 1992-02-20 Method for manufacturing solid electrolytic capacitor

Publications (2)

Publication Number Publication Date
JPH05234828A true JPH05234828A (en) 1993-09-10
JP3084895B2 JP3084895B2 (en) 2000-09-04

Family

ID=13427814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04070312A Expired - Lifetime JP3084895B2 (en) 1992-02-20 1992-02-20 Method for manufacturing solid electrolytic capacitor

Country Status (1)

Country Link
JP (1) JP3084895B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1209706A2 (en) * 2000-11-22 2002-05-29 Nec Corporation Method for fabricating chip type solid electrolytic capacitor and apparatus for performing the same method
US7271995B2 (en) 2002-10-07 2007-09-18 Avx Corporation Electrolytic capacitor with improved volumetric efficiency
JP2011204791A (en) * 2010-03-24 2011-10-13 Nec Tokin Corp Solid electrolytic capacitor
US8075640B2 (en) 2009-01-22 2011-12-13 Avx Corporation Diced electrolytic capacitor assembly and method of production yielding improved volumetric efficiency
US8139344B2 (en) 2009-09-10 2012-03-20 Avx Corporation Electrolytic capacitor assembly and method with recessed leadframe channel
US8199462B2 (en) 2008-09-08 2012-06-12 Avx Corporation Solid electrolytic capacitor for embedding into a circuit board
CN108010753A (en) * 2017-12-29 2018-05-08 无锡赛晶电力电容器有限公司 A kind of capacitor outgoing line connection structure and preparation method thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1209706A2 (en) * 2000-11-22 2002-05-29 Nec Corporation Method for fabricating chip type solid electrolytic capacitor and apparatus for performing the same method
EP1209706A3 (en) * 2000-11-22 2006-04-26 Nec Tokin Corporation Method for fabricating chip type solid electrolytic capacitor and apparatus for performing the same method
US7271995B2 (en) 2002-10-07 2007-09-18 Avx Corporation Electrolytic capacitor with improved volumetric efficiency
US7656647B2 (en) 2002-10-07 2010-02-02 Avx Corporation Electrolytic capacitor with improved volumetric efficiency
US8199462B2 (en) 2008-09-08 2012-06-12 Avx Corporation Solid electrolytic capacitor for embedding into a circuit board
US8075640B2 (en) 2009-01-22 2011-12-13 Avx Corporation Diced electrolytic capacitor assembly and method of production yielding improved volumetric efficiency
US8139344B2 (en) 2009-09-10 2012-03-20 Avx Corporation Electrolytic capacitor assembly and method with recessed leadframe channel
JP2011204791A (en) * 2010-03-24 2011-10-13 Nec Tokin Corp Solid electrolytic capacitor
CN108010753A (en) * 2017-12-29 2018-05-08 无锡赛晶电力电容器有限公司 A kind of capacitor outgoing line connection structure and preparation method thereof

Also Published As

Publication number Publication date
JP3084895B2 (en) 2000-09-04

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