JPH0522953B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC module used for IC cards and other articles incorporating an IC.

[Conventional technology]

To give an example of a conventional IC module, in the example of an IC card shown in FIGS. 10 and 11,
External terminal 1, which serves as an input/output terminal for inputting and outputting data to and from an external device such as a terminal, is IC module 4.
It is provided on the back surface (upper side in FIG. 11) of the. Therefore, the IC module 4 is built in on the back side of the external terminal 1, almost directly below it. The position of the external terminal 1 is determined by the standard, and although it is closer to the edge with respect to the long side 2, it is relatively closer to the center with respect to the short side 3, so the IC module 4 is also generally in this position. It will be deployed. 5 is the center core, 6, 7
8 is an overlay film, and 8 is a magnetic tape.

Furthermore, in conventional IC modules for applications other than IC cards, the IC chip is placed directly below the back side of an external terminal that performs input and/or output to the outside.

[Problem that the invention seeks to solve]

Using conventional IC modules like this,
For example, if an IC card is bent or torsionally deformed by being pushed in a pocket while being carried, especially if it is bent along the short side 3, the stiffness will be relatively high near the center. Because of the presence of the IC module 4, the stress at the boundary between the overlay film 6 and the IC module 4 increases, and the adhesive between the two peels off, resulting in a sudden decrease in strength. The problem was that it caused a large stress concentration and was prone to breakage.

Also, when used for other purposes, the IC chip and external terminals are placed on the front and back sides, so the overall thickness of the IC module becomes thicker, making it difficult to place the IC module inside a thin material. It was extremely difficult.

The present invention solves the above-mentioned problems in the conventional devices, and allows the IC chip and the external terminals for input/output with the outside to be freely selected in a relative relationship with each other, allowing optimal deployment for the application. The purpose of this is to provide an IC module that can be used as an IC module.

[Means for solving problems]

In the present invention, on one side of one circuit board,
An external terminal for input and/or output is provided between the external terminal and an IC chip surrounded by a frame board and provided on a lead circuit board at a position separated from the external terminal and on the other side. At the same time, the external terminal and the IC chip are connected by a circuit on the circuit board, and the circuit board, the frame board of the IC chip, and the lead circuit board are made of the same flexible material. .

〔Example〕

An embodiment of the present invention will be described with reference to FIGS. 1 to 9. An external terminal 1 for inputting and/or outputting to the outside is provided on one side of one circuit board 11, and At a position away from terminal 1,
On the other side, IC chips 9 and 1 are provided on the lead circuit board 12 and surrounded by the frame board 13.
At the same time, this external terminal and the IC chips 9 and 10 are connected by a circuit on the circuit board, and the circuit board 11 and the frame board 13 and lead circuit board 12 that house the IC chips 9 and 10 are connected. Constructed of the same flexible material.

In the embodiment shown in FIG. 1, the external terminal 1 and the IC chips 9, 10 can be placed apart from each other, so the positions of the IC chips 9, 10 are not restricted to the position of the external terminal 1 and can be arranged quite freely. As shown in the figure, not only the long side 2 but also the short side 3 can be placed close to the edge.
The stress acting on the IC chips 9 and 10 can be reduced.

Figures 2 and 3 show the structure near IC module 4.
The details are shown in the figure.

The IC module 4 includes a circuit board 11, IC chips 9 and 10, and a lead circuit board 1, which will be described in detail later.
2, a frame substrate 13, and a molded part 14, which are housed in the center core 5 and are integrally formed with the front and back sides sandwiched between overlay films 6 and 7. A printing layer 15 is applied to the back surface of the overlay film 6. The printing layer 15 consists of a printing pattern 16 and a white solid printing layer 17, as shown in FIG.

Details of IC module 4 are shown in Figures 5 and 5A.
6, 7, 8, and 9 will be explained.

As shown in FIG. 7, the circuit board 11 includes a thin board body 18 and die pads 19 and 20 on which IC chips 9 and 10 are mounted. The die pads 19 and 20 are manufactured by plating Cu foil with Au, Ag, etc. The die pads 19 and 20 may not be provided, and only a die bond area may be provided. Predetermined printed circuits 25, 2 are formed on the laminated area 21 on the board body 18 where the lead circuit board 12 overlaps.
6 are printed with front and back sides connected through through holes 27, 28, etc. This printed circuit may be provided in any part of the lamination area 21 for the printed circuit 25 on the side where the lead circuit board 12 is laminated.
Regarding the printed circuit 26 on the back side, the magnetic tape 8 on the surface of the IC card may have minute irregularities due to the thickness of the circuit, which may cause reading errors.
It is preferable to avoid the circuit area 2 and arrange it in the remaining circuit areas 23 and 24.

In the circuit area 29 other than the laminated area 21, printed circuits 30 and 31 connected to the printed circuits 25 and 26 are arranged so as to be connected to each other through a through hole 32, and a portion thereof is extended to form a through hole 33.
It is connected to external terminal 1 by.

The circuit board 11 is a plastic board made of glass epoxy, epoxy, polyimide, PVC, etc., and has a thickness of about 40 to 100 μm, and has appropriate elasticity that does not interfere with bending of the IC card. If the printed circuit is a simple circuit, only the printed circuits 25 and 30 on one side may be used.

The IC chips 9 and 10 are attached onto the die pads 19 and 20 (or the die bond area) by a die bonder or the like via an epoxy adhesive 46 or the like.

The lead circuit board 12 is bonded onto the laminated region 21 of the circuit board 11 via a prepreg layer 37 which is an adhesive and an insulating material.

The lead circuit board 12 is a plastic board made of glass epoxy or the like with a thickness of about 100 to 150 μm.
As shown in FIG. 8, openings 34 and 35 are provided in portions corresponding to the IC chips 9 and 10, and leads 36 for wire bonding are provided around the openings 34 and 35.
On the lead circuit board 12, a printed circuit 38 connected to the lead 36 is printed on the surface of the lead 36 rule.
A printed circuit 39 is printed on the opposite surface to be connected to a lead 36 or a printed circuit 38 through a through hole 40.

Pads 41 and leads 36 of IC chips 9 and 10
Wire bonding is performed by a wire 42 between the two.

The frame substrate 13 is a plastic plate made of glass epoxy or the like with a thickness of about 150 to 200 μm, and is bonded to the lead circuit board 12 via a prepreg layer 43 which is an adhesive and an insulating material. Opening 4 for bonding work as shown in FIG.
4 are provided.

Glass epoxy resin film is made by sandwiching glass fiber between prepreg layers and deforming it by heating, and its thickness can be adjusted depending on the application. Both the frame board 13 and the lead circuit board 12 are made of glass epoxy resin film, which is the same material as the circuit board 11. If the materials are the same, their behavior with respect to heat will be the same, and accidents such as deformation will not occur during molding.

The manufacturing process of the IC module 4 having the above configuration will be explained.

First, the circuit board 11, IC chips 9 and 10, lead circuit board 12, and frame board 13 are completed individually. For example, in the circuit board 11, the external terminal 1, the printed circuits 25, 26, 30, 31,
Through holes 27, 32, 33, die pad 1
9 and 20, lead circuit board 12
In this case, leads 36, printed circuits 38, 39 and through holes 40 are provided (however, openings 34,
35 has not yet been established). Frame board 1
No. 3 has no opening 44 provided yet. Further, the prepreg layers 37, 43 are
Manufactured without .

Next, after a prepreg layer 37 is bonded to the back surface of the lead circuit board 12, openings 34 and 35 are both bored, and after a prepreg layer 43 is bonded to the back surface of the frame substrate 13, an opening 44 is bored.

Next, the lead circuit board 12 is attached to the prepreg layer 3.
7 to the laminated region 21 of the circuit board 11 under heat and pressure. After that, the through holes 28 are processed.

Next, the frame substrate 13 is heat-pressed onto the lead circuit board 12 via the prepreg layer 43.

Instead of the above process, the circuit board 11, the lead circuit board 12, the frame board 13, and the prepreg layer 3
7 and 43 at the same time, and then the through hole 28 may be processed.

Next, the IC chips 9 and 10 are die-bonded to the die-bonding area of the circuit board 11. Further, the IC chips 9 and 10 and the lead circuit board 12 are connected by wire bonding.

Next, a plastic molding material such as epoxy or silicon-modified epoxy is injected into the opening 44 and solidified to form the molded portion 14.

The IC module 4 formed as described above is fitted into the center core 5, and the front and back sides are sandwiched between overlay films 6 and 7 and heat-pressed to complete the IC card as shown in FIGS. 2 and 3.

The IC module 4 of this embodiment is constructed as described above, and since the shape and dimensions of the circuit board 11 can be arbitrarily selected, the IC chips 9 and 10 are arranged close to the ends of the short sides 3. can do. Therefore, a relatively rigid portion surrounded by the lead circuit board 12 and frame board 13 around the IC chips 9 and 10 is placed near the edge of the IC card where deformation is less, and the deformation is comparatively small. Near the center of the short side 3, which has a large target, only the circuit board 11 and the external terminal 1, which have very low rigidity, are present. Therefore, even if the vicinity of the terminal hole 45 undergoes large bending deformation, the parts will not peel or break due to large differences in rigidity, and large stress will not be generated at the corners of the terminal hole 45, preventing damage. It can be avoided.

Also, change the position of IC chips 9 and 10 to external terminal 1.
Since the positions of the IC chips 9 and 10 can be selected as desired apart from the IC chips 9 and 10, it is difficult for others to search for the positions of the IC chips 9 and 10 from the outside.

As mentioned above, the IC module of this example is
Materials for the circuit board 11 are mainly used, and the material itself for the molded part 14 is not particularly rigid, and the rigidity of each component is approximately the same. However, as shown in FIG. 5A, in the vicinity of the IC chip 10, the circuit board 11, lead circuit board 12, and frame board 13 are stacked, and the mold part 14 is filled with molding material, so the overall layer thickness increases. The state is similar to that shown above, and the rigidity is higher than that on the external terminal 1 side.

In the above embodiment, the circuit boards 11 and 48 are thin.
Although an example of a highly flexible material is shown, it does not necessarily have to be thin and may be thick.

〔Effect of the invention〕

In the present invention, on one side of one circuit board,
An external terminal for input and/or output is provided between the external terminal and an IC chip surrounded by a frame board and provided on a lead circuit board at a position separated from the external terminal and on the other side. At the same time, the external terminal and the IC chip are connected by a circuit on the circuit board, and the circuit board, the frame board of the IC chip, and the lead circuit board are made of the same flexible material. The IC chip and the external terminals that perform external input/output can be selected in a free correlation with each other, and the IC chip and external terminals can be placed in the optimal position for the application. Furthermore, since the circuit board, the frame board that houses the IC chip, and the lead circuit board are made of the same material, it is possible to heat-bond the IC module into the card. When laminated (laminated), the behavior with respect to heat is the same, and the IC due to the heat during formation
This eliminates accidents such as module deformation, greatly increases reliability and significantly improves quality.

[Brief explanation of the drawing]

Figures 1 to 9 relate to embodiments of the present invention; Figure 1 is a plan view of the IC card, Figure 2 is an enlarged view of section A, Figure 3 is a cross-sectional view taken along the - line, and Figure 4 is a plan view of the IC card. 5 is a sectional view of a part of the overlay film, FIG. 5 is a sectional view of the IC module taken along the - line in FIG. 6, FIG. 5A is a detailed view of a part of FIG. 5, and FIG. Fig. 7 is a plan view of the circuit board, Fig. 8 is a plan view of the lead circuit board, Fig. 9 is a plan view of the frame board, Fig. 10 is a plan view of a conventional IC card, and Fig. 11 is a plan view of the conventional IC card. It is a sectional view taken along the line (however, the direction is shifted by 90 degrees). 1...External terminal, 2...Long side, 3...Short side, 4...IC
Module, 5... Center core, 6, 7... Overlay film, 8... Magnetic tape, 9, 10...
IC chip, 11... Circuit board, 12... Lead circuit board, 13... Frame board, 14... Mold part, 15...
Printing layer, 16... Printing pattern, 17... White solid printing layer, 18... Substrate body, 19, 20... Die pad,
21...Lamination area, 22...Magnetic tape area, 23,
24...Circuit area, 25, 26...Printed circuit, 27,
28...Through hole, 29...Circuit area, 30,3
1...Printed circuit, 32, 33...Through hole, 3
4, 35... Opening, 36... Lead, 37... Prepreg layer, 38, 39... Printed circuit, 40... Through hole, 41... Pad, 42... Wire, 43... Prepreg layer, 44... Opening, 45... Terminal hole, 46 ...adhesive material.

Claims (1)

[Claims] 1. An external terminal for inputting and/or outputting to the outside is provided on one side of one circuit board, and an external terminal is provided on one side of the circuit board at a position away from the external terminal and on the other side. An IC chip surrounded by a frame board and provided on a lead circuit board is provided, and the external terminals and the IC chip are connected by a circuit on the circuit board, and the circuit board and the frame board of the IC chip are connected to each other. An IC module characterized in that the lead circuit board and the lead circuit board are made of the same flexible material. 2. The IC according to claim 1, wherein the circuit board is made of a glass epoxy resin material.
Module.