JPH05226882A - Electronic part supply method in electronic part mounting device - Google Patents
Electronic part supply method in electronic part mounting deviceInfo
- Publication number
- JPH05226882A JPH05226882A JP4059732A JP5973292A JPH05226882A JP H05226882 A JPH05226882 A JP H05226882A JP 4059732 A JP4059732 A JP 4059732A JP 5973292 A JP5973292 A JP 5973292A JP H05226882 A JPH05226882 A JP H05226882A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- supply unit
- component supply
- electronic
- electronic part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000013589 supplement Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 description 6
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Controlling Sheets Or Webs (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、複数の電子部品供給ユ
ニットから、装着ヘッドによって、順次電子部品を取り
出してプリント基板に装着する電子部品装着装置におけ
る電子部品の供給方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of supplying electronic components in an electronic component mounting apparatus for sequentially picking up electronic components from a plurality of electronic component supply units by a mounting head and mounting them on a printed circuit board.
【0002】[0002]
【従来の技術】プリント基板に対して所定の順序で電子
部品を自動的に装着していく電子部品装着装置において
は、装着すべき電子部品の種類に対応して複数の電子部
品供給ユニットが設けられている。そして、先端に部品
吸着ノズルを有した部品装着ヘッドが、あらかじめ設定
された部品装着順序にしたがい、所定の電子部品を保有
する電子部品供給ユニットの部品取出し口まで移動し、
そこで電子部品を吸着してプリント基板への装着動作を
行なっていく。2. Description of the Related Art In an electronic component mounting apparatus for automatically mounting electronic components on a printed circuit board in a predetermined order, a plurality of electronic component supply units are provided corresponding to the types of electronic components to be mounted. Has been. Then, the component mounting head having the component suction nozzle at the tip moves to the component unloading port of the electronic component supply unit holding the predetermined electronic component according to the preset component mounting sequence,
Therefore, the electronic parts are sucked and the mounting operation on the printed circuit board is performed.
【0003】ところで、従来の電子部品装着装置では、
同一種類の電子部品に対して電子部品供給ユニットを、
装着する電子部品の使用する数に応じて一台または複数
台用意するとともに、装着すべき電子部品の種類と数に
応じてそれらの電子部品供給ユニットを本体上に設置し
ていた。したがって、それら本体上に設置した一連の電
子部品供給ユニットは、装着する電子部品の種類ごと
に、常に部品供給動作に関与しており、一の電子部品の
種類を保有する一台または複数台の電子部品供給ユニッ
トが部品切れとなった場合には、その都度装着動作を停
止し、部品切れとなった電子部品供給ユニットに新たな
電子部品を補充していた。By the way, in the conventional electronic component mounting apparatus,
An electronic component supply unit for the same type of electronic component,
One or a plurality of electronic components are prepared according to the number of electronic components to be mounted, and those electronic component supply units are installed on the main body according to the type and number of electronic components to be mounted. Therefore, the series of electronic component supply units installed on the main body is always involved in the component supply operation for each type of electronic component to be mounted, and one or a plurality of electronic component supply units having one type of electronic component When the electronic component supply unit runs out of components, the mounting operation is stopped each time, and a new electronic component is replenished to the electronic component supply unit that has run out of components.
【0004】[0004]
【発明が解決しようとする課題】上述したように、従来
は一の電子部品の種類を保有する電子部品供給ユニット
に部品切れが生ずるたびに、電子部品装着装置の動作を
停止して新たな電子部品を補充しなければならなかった
ので、電子部品装着装置の稼動率が低いという問題があ
った。As described above, conventionally, whenever an electronic component supply unit having one type of electronic component runs out of components, the operation of the electronic component mounting apparatus is stopped and a new electronic component is installed. Since the components had to be replenished, there was a problem that the operation rate of the electronic component mounting device was low.
【0005】また、電子部品供給ユニットの部品切れは
従来から公知のリトライ機能によって検出できるが、部
品切れはユニットの配置に関係なく順不同にいずれかの
電子部品供給ユニットに発生し、その時間的間隔もばら
ばらであるため、部品切れを生ずるたびに作業員は部品
切れの生じた電子部品供給ユニットに電子部品を補充し
なければならない煩わしさがあった。さらに、同時に複
数台の電子部品供給ユニットに部品切れが生じた場合、
一のユニットにだけ部品を補充して再び始動させてしま
うといった補充漏れの生ずるおそれがあった。Further, although the electronic component supply unit can be detected by a retry function known in the related art, the component exhaustion occurs in any one of the electronic component supply units in any order irrespective of the arrangement of the units, and the time interval between them. Since the parts are out of order, each time a worker runs out of parts, the worker must replenish the electronic parts supply unit in which the parts have run out with electronic parts. Furthermore, if multiple electronic parts supply units run out of parts at the same time,
There was a risk of replenishment leakage, such as replenishing parts to one unit and restarting.
【0006】本発明はこのような従来の課題を解決する
ためになされたもので、電子部品装着装置の動作を停止
させることなく部品の補充作業を行なうことができ、し
かもその補充作業が容易でかつ補充漏れのおそれのない
電子部品供給方法の提供を目的とする。The present invention has been made in order to solve such a conventional problem, and can replenish parts without stopping the operation of the electronic component mounting apparatus, and the replenishment work is easy. Moreover, it is an object of the present invention to provide a method for supplying electronic components without the risk of replenishment leakage.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するた
め、複数の電子部品供給ユニットを有し、これらの電子
部品供給ユニットから順次所定の電子部品を取り出して
プリント基板に装着する電子部品装着装置における本発
明の電子部品供給方法は、プリント基板に装着する全種
類の電子部品をそれぞれ保有する複数台の電子部品供給
ユニットにより一単位の電子部品供給ユニット群を形成
するとともに、この一単位の電子部品供給ユニット群を
複数組設け、前記複数組の電子部品供給ユニット群のう
ちから一組の電子部品供給ユニット群を選択するととも
に、この選択した電子部品供給ユニット群のみから順次
電子部品を取り出してプリント基板へ装着し、前記選択
した電子部品供給ユニット群内のいずれの電子部品供給
ユニットにも同一種類の電子部品がなくなったときに、
電子部品を取出す電子部品供給ユニット群を他の電子部
品供給ユニット群に切換え、この切り換えた他の電子部
品供給ユニット群のみから全種類の電子部品を順次取り
出してプリント基板に装着する方法としてあり、必要に
応じ、前記電子部品供給ユニット群を二組設け、プリン
ト基板移送路の両側に一組づつ対向して配置した方法と
してあり、さらに前記電子部品供給ユニット群をそれぞ
れ単一の取付け基板上に載置した方法としてある。In order to achieve the above object, an electronic component mounting apparatus having a plurality of electronic component supply units and sequentially taking out predetermined electronic components from these electronic component supply units and mounting them on a printed circuit board. In the electronic component supply method of the present invention, the electronic component supply unit group is formed by a plurality of electronic component supply units that respectively hold all types of electronic components to be mounted on the printed circuit board, A plurality of component supply unit groups are provided, one electronic component supply unit group is selected from the plurality of electronic component supply unit groups, and electronic components are sequentially taken out only from the selected electronic component supply unit group. It is mounted on a printed circuit board and the same type is used for any electronic component supply unit in the selected electronic component supply unit group. When it is no longer electronic components are,
There is a method for switching the electronic component supply unit group for taking out electronic components to another electronic component supply unit group, and sequentially taking out all kinds of electronic components from only this switched other electronic component supply unit group and mounting them on the printed circuit board, If necessary, two sets of the electronic component supply unit groups are provided, and one set is provided on each side of the printed circuit board transfer path so as to face each other. Further, the electronic component supply unit groups are each mounted on a single mounting substrate. It is as a method of placing.
【0008】[0008]
【作用】上述した本発明の電子部品供給方法によれば、
部品供給動作に関与していた電子部品供給ユニット群の
うちのいずれかの電子部品供給ユニットに部品切れが生
じた場合、対向して用意してある電子部品供給ユニット
群に切り替えて部品供給動作を続行し、部品切れの生じ
た電子部品供給ユニット群は、その群を構成する全ての
電子部品供給ユニットにつき一斉に電子部品を補充し、
あるいは、その電子部品供給ユニット群を取付け基板ご
と外部に取り出して、外部の充分広いスペースで電子部
品を補充する。According to the above-described electronic component supplying method of the present invention,
If one of the electronic component supply units that was involved in the component supply operation runs out of components, the electronic component supply unit group that is prepared to face it is switched to the component supply operation. Continuing, the electronic component supply unit group in which the parts have run out, replenishes electronic components at once for all the electronic component supply units that make up the group,
Alternatively, the electronic component supply unit group is taken out together with the mounting substrate and the electronic component is replenished in a sufficiently large space outside.
【0009】[0009]
【実施例】以下、本発明の一実施例について図面を参照
して説明する。まず、図2にもとづいて本発明の電子部
品供給方法が実施される電子部品装着装置の実施例の概
要を説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. First, an outline of an embodiment of an electronic component mounting apparatus in which the electronic component supply method of the present invention is implemented will be described based on FIG.
【0010】同図に示す電子部品装着装置は、プリント
基板Pの移送路10上に設けた搬送コンベア11と、電
子部品を供給する電子部品供給ユニット群20,30
と、電子部品供給ユニット群20又は30から電子部品
を取り出してプリント基板P上に装着する装着ヘッド4
0とを備えている。The electronic component mounting apparatus shown in FIG. 1 includes a conveyor 11 provided on a transfer path 10 for a printed circuit board P and electronic component supply unit groups 20 and 30 for supplying electronic components.
And a mounting head 4 for picking up an electronic component from the electronic component supply unit group 20 or 30 and mounting it on the printed circuit board P.
It has 0 and.
【0011】電子部品供給ユニット群20及び30は、
移送路10の前後両側にそれぞれ対向して配置してあ
る。これら各電子部品供給ユニット群20,30は、そ
れぞれプリント基板Pに装着すべき全種類の電子部品を
それぞれ保有する複数台の電子部品供給ユニット21
a,21b,・・(31a,31b,・・)からなって
いる。ここで、特に装着個数の多い電子部品は、二台以
上の電子部品供給ユニットに保有させてある。これら各
電子部品供給ユニット21a,21b,・・(31a,
31b,・・)は、各一枚の取付け基板22(32)上
に並べて設けられている。したがって、各電子部品供給
ユニット群20,30は、取付け基板22(32)ごと
電子部品装着装置の本体1に着脱することができる。The electronic component supply unit groups 20 and 30 are
The transfer path 10 is arranged so as to face each other on both front and rear sides. Each of the electronic component supply unit groups 20 and 30 includes a plurality of electronic component supply units 21 that respectively hold all types of electronic components to be mounted on the printed circuit board P.
a, 21b, ... (31a, 31b, ...). Here, the electronic components, which are particularly mounted in large numbers, are held in two or more electronic component supply units. Each of these electronic component supply units 21a, 21b, ... (31a,
..) are arranged side by side on each one of the mounting substrates 22 (32). Therefore, each of the electronic component supply unit groups 20 and 30 can be attached to and detached from the main body 1 of the electronic component mounting device together with the mounting substrate 22 (32).
【0012】このような構成の電子部品装着装置は、搬
送コンベア11によって所定位置にプリント基板Pを配
置した後、いずれか一方の電子部品供給ユニット群20
又は30から装着ヘッド40が電子部品を吸着し、プリ
ント基板Pの所定位置に装着する。In the electronic component mounting apparatus having such a configuration, after the printed circuit board P is arranged at a predetermined position by the conveyor 11, the electronic component supply unit group 20 of either one of them is arranged.
Alternatively, the mounting head 40 picks up an electronic component from 30 and mounts it on a predetermined position of the printed circuit board P.
【0013】次に、上述した電子部品装着装置における
電子部品供給方法を、図2のフローチャートにもとづい
て説明する。電子部品の供給は、いずれか一方の電子部
品供給ユニット群20又は30のみから行なわれる。い
ま、本体1の後部側にある電子部品供給ユニット群20
から電子部品の供給を行なう旨、図示しない制御装置か
ら指令が出されると(ステップ(以下、単にSと略す)
1)、装着ヘッド40はその選択された電子部品供給ユ
ニット群20から電子部品の吸着動作を行なう。Next, an electronic component supplying method in the above-described electronic component mounting apparatus will be described with reference to the flowchart of FIG. The electronic components are supplied from only one of the electronic component supply unit groups 20 or 30. Now, the electronic component supply unit group 20 on the rear side of the main body 1
When a command is issued from a control device (not shown) to supply electronic components from the controller (step (hereinafter, simply abbreviated as S))
1), the mounting head 40 performs the suction operation of the electronic component from the selected electronic component supply unit group 20.
【0014】すなわち、電子部品供給ユニット群20に
設けられた電子部品供給ユニット21a,21b,・・
の中から装着すべき所定の電子部品を保有する電子部品
供給ユニットを選択し(S2)、装着ヘッド40がその
電子部品装着装置の部品取出し口aの上方まで移動す
る。そして、その部品取出し口aの上方から装着ヘッド
40が下降して電子部品の吸着動作を行なう(S3)。That is, the electronic component supply units 21a, 21b, ... Provided in the electronic component supply unit group 20.
The electronic component supply unit holding the predetermined electronic component to be mounted is selected from among the above (S2), and the mounting head 40 is moved to above the component ejection port a of the electronic component mounting device. Then, the mounting head 40 descends from above the component take-out port a to perform the suction operation of the electronic component (S3).
【0015】続いて、装着ヘッド40に電子部品が吸着
保持されているか否かを検出し(S4)、吸着保持され
ている場合にはその電子部品をプリント基板Pに装着す
る(S5)。一方、装着ヘッド40に電子部品が吸着保
持されていなかった場合には、再度同じ電子部品供給ユ
ニットに対して電子部品の吸着動作を行なう。この繰返
し動作(S6)を一定回数行ない(これをリトライ機能
という)、それでもなお、装着ヘッド40に電子部品が
吸着されない場合には、その電子部品供給ユニットは
「部品切れ」と判定し、制御装置にその旨を記憶させる
(S7)。Subsequently, it is detected whether or not the electronic component is suction-held by the mounting head 40 (S4), and if the electronic component is suction-held, the electronic component is mounted on the printed circuit board P (S5). On the other hand, when the electronic component is not sucked and held by the mounting head 40, the electronic component suction operation is performed again for the same electronic component supply unit. If the electronic component is not adsorbed by the mounting head 40 after performing the repeating operation (S6) a certain number of times (this is called a retry function), the electronic component supply unit determines that the component is out, and the control device To that effect is stored (S7).
【0016】次いで、同じ電子部品供給ユニット群20
の中に、「部品切れ」と判定された電子部品供給ユニッ
トと同一種類の電子部品を保有する電子部品供給ユニッ
トがあるか否かを検索する(S8)。これをオルタネー
ト機能といい、あらかじめ制御装置に電子部品供給ユニ
ット群20内の電子部品供給ユニット21a,21b,
・・についての「電子部品供給ユニットの型式」、「保
有する電子部品の形式,寸法」等の情報を記憶してお
き、その情報を検索して行なう。Next, the same electronic component supply unit group 20
It is searched whether or not there is an electronic component supply unit having an electronic component of the same type as the electronic component supply unit determined to be "out of components" (S8). This is called an alternate function, and the control device is previously provided to the electronic component supply units 21a, 21b in the electronic component supply unit group 20,
Information such as "model of electronic component supply unit" and "type and size of electronic component possessed" is stored and retrieved.
【0017】検索の結果、同一種類の電子部品を保有す
る電子部品供給ユニットが存在した場合には、さらにそ
のユニットが「部品切れ」となっていないかを検査し
(S9)、「部品切れ」でない場合には、その電子部品
供給ユニットを選択して(S10)、装着ヘッド40に
よって電子部品の吸着動作を行なわせる(S3)。As a result of the search, if there is an electronic component supply unit holding the same type of electronic component, it is further inspected whether the unit is "part out" (S9), and "part out". If not, the electronic component supply unit is selected (S10), and the mounting head 40 performs the electronic component suction operation (S3).
【0018】一方、その電子部品供給ユニットも「部品
切れ」の場合には、さらにオルタネート機能を繰返し、
それでもなお同一種類の電子部品を保有しかつ「部品切
れ」でない電子部品供給ユニットが存在しなかったとき
は、本体後部側の電子部品供給ユニット群20からの部
品供給を打ち切り、その電子部品供給ユニット群20は
「部品切れ」である旨の信号を制御装置に記憶させ、か
つ信号灯等の表示手段でその旨を表示する。制御装置
は、電子部品供給ユニット群20において、ある種類の
電子部品が「部品切れ」との信号を受けると、部品の供
給対象ユニットとして電子部品供給ユニット群30を選
択し(S11,S12)、S2〜S10の工程を実行
し、電子部品装着装置をの動作を停止することなく電子
部品の供給動作を行なっていく。On the other hand, when the electronic component supply unit is also "parts out", the alternate function is further repeated,
If there is still no electronic component supply unit that holds the same type of electronic component and is not "parts out", then the component supply from the electronic component supply unit group 20 on the rear side of the main body is terminated, and the electronic component supply unit is terminated. The group 20 causes the control device to store a signal indicating that it is "out of parts", and displays it on a display means such as a signal light. When the electronic device supply unit group 20 receives a signal that a certain type of electronic part is “out of parts”, the control device selects the electronic part supply unit group 30 as a unit to which the parts are supplied (S11, S12), The steps S2 to S10 are executed, and the electronic component supply operation is performed without stopping the operation of the electronic component mounting apparatus.
【0019】ただし、電子部品供給ユニット群30が、
電子部品供給ユニット群20を選択する以前すでに選択
されていた場合には、その電子部品供給ユニット群30
も「部品切れ」となっているので、電子部品装着装置の
動作を停止してアラーム等でその旨を作業員に知らせる
(S13)。もっとも、一方側の電子部品供給ユニット
群に対して部品供給動作が行なわれている間に、「部品
切れ」となった電子部品供給ユニット群に対し、電子部
品の補充を行なっておけば、電子部品装着装置を停止す
ることなく、継続して電子部品の供給動作を行なうこと
ができる。However, the electronic component supply unit group 30 is
If the electronic component supply unit group 20 is already selected before it is selected, the electronic component supply unit group 30 is selected.
Is also "parts out", the operation of the electronic component mounting device is stopped and the operator is notified of that by an alarm or the like (S13). However, if electronic parts are replenished to the electronic parts supply unit group that is "out of parts" while the parts supply operation is being performed to the electronic parts supply unit group on one side, The electronic component supply operation can be continuously performed without stopping the component mounting apparatus.
【0020】「部品切れ」の電子部品供給ユニット群に
対する電子部品の補充作業は、取付け基板22(32)
を本体1から取り外し機外にて行なうことができる。し
たがって、補充作業は充分広い場所で、装着ヘッドやこ
れを駆動するロボット等がない状態で行なわれるので、
補充作業に際してに危険はともなわない。また、電子部
品の補充は、「部品切れ」の電子部品供給ユニットだけ
でなく、電子部品供給ユニット群の全てのユニットに対
して一括して行なえばよいので、いちいち「部品切れ」
のユニットを捜す必要もなく、補充作業が容易となりし
かも補充漏れの心配もなくなる。なお、あらかじめ、電
子部品を補充した別の電子部品供給ユニット群を用意し
ておき、本体1に装着してある電子部品供給ユニット群
が「部品切れ」となった場合にはそのユニット群ごと交
換することもできる。このようにすると、電子部品の補
充作業がより一層容易となる。The replenishment work of the electronic parts to the "parts out" electronic parts supply unit group is performed by the mounting substrate 22 (32).
Can be removed from the main body 1 and performed outside the machine. Therefore, the refilling work is performed in a sufficiently wide area without the mounting head or the robot for driving the mounting head.
There is no danger during replenishment work. In addition, electronic parts can be replenished not only for the electronic parts supply unit that is "out of parts" but also for all the units in the electronic parts supply unit group at once.
There is no need to search for a unit, and refilling work becomes easy, and there is no fear of refilling leakage. It should be noted that another electronic component supply unit group supplemented with electronic components is prepared in advance, and when the electronic component supply unit group mounted on the main body 1 becomes "parts out", the entire unit group is replaced. You can also do it. This makes it easier to replenish electronic components.
【0021】なお、本発明は上述した一実施例に限定さ
れるものではなく、発明の要旨を変更しない範囲で種々
の変形実施が可能である。例えば、電子部品供給ユニッ
ト群は二組に限定されることなく、必要に応じた数の組
だけ用意して電子部品装着装置の本体上に設置すればよ
く、その設置箇所もプリント基板移送路両側の対向する
位置でなくともよい。また、取付け基板を介在すること
なく、直接本体上に電子部品供給ユニットを取り付けて
もよい。The present invention is not limited to the above-described embodiment, and various modifications can be made without changing the gist of the invention. For example, the electronic component supply unit group is not limited to two sets, and as many sets as necessary may be prepared and installed on the main body of the electronic component mounting apparatus, and the installation locations are also on both sides of the printed circuit board transfer path. The positions do not have to face each other. Further, the electronic component supply unit may be directly mounted on the main body without interposing the mounting substrate.
【0022】[0022]
【発明の効果】以上説明したように、本発明の電子部品
供給方法によれば、複数台の電子部品供給ユニットから
なる電子部品供給ユニット群を一単位として管理するこ
とにしたので、いずれかの電子部品供給ユニットに「部
品切れ」が生じた場合には、そのユニットの属する電子
部品供給ユニット群全体につき電子部品の補充を行なえ
ばよく、補充作業が容易でしかも補充漏れの心配がなく
なるという効果を有する。また、一の電子部品供給ユニ
ット群に「部品切れ」が生じた場合、別の電子部品供給
ユニット群から電子部品を供給するようにしたので、電
子部品装着装置を停止させることなく稼動率の向上を図
ることができる。As described above, according to the electronic component supply method of the present invention, the electronic component supply unit group consisting of a plurality of electronic component supply units is managed as one unit. When an "out of parts" occurs in an electronic component supply unit, it is sufficient to replenish electronic components for the entire electronic component supply unit group to which the unit belongs, and the effect of easy replenishment work and elimination of replenishment leakage Have. In addition, when a "parts out" occurs in one electronic component supply unit group, electronic components are supplied from another electronic component supply unit group, so the operating rate is improved without stopping the electronic component mounting device. Can be planned.
【図1】本発明の実施例に係る電子部品供給方法を説明
するためのフローチャートである。FIG. 1 is a flowchart illustrating an electronic component supply method according to an exemplary embodiment of the present invention.
【図2】同方法を実施するための電子部品装着装置の一
例を示す概略斜視図である。FIG. 2 is a schematic perspective view showing an example of an electronic component mounting apparatus for carrying out the method.
10…移送路 11…搬送コンベア 20,30…電子部品供給ユニット群 21a,21b,・・,31a,31b…電子部品供給
ユニット 22,23…取付け基板 40…装着ヘッド10 ... Transfer path 11 ... Conveyor 20, 30 ... Electronic component supply unit group 21a, 21b, ..., 31a, 31b ... Electronic component supply unit 22, 23 ... Mounting board 40 ... Mounting head
Claims (3)
れらの電子部品供給ユニットから順次所定の電子部品を
取り出してプリント基板に装着する電子部品装着装置に
おいて、 プリント基板に装着する全種類の電子部品をそれぞれ保
有する複数台の電子部品供給ユニットにより一単位の電
子部品供給ユニット群を形成するとともに、この一単位
の電子部品供給ユニット群を複数組設け、 前記複数組の電子部品供給ユニット群のうちから一組の
電子部品供給ユニット群を選択するとともに、この選択
した電子部品供給ユニット群のみから順次電子部品を取
り出してプリント基板へ装着し、 前記選択した電子部品供給ユニット群内のいずれの電子
部品供給ユニットにも同一種類の電子部品がなくなった
ときに、電子部品を取出す電子部品供給ユニット群を他
の電子部品供給ユニット群に切換え、この切り換えた他
の電子部品供給ユニット群のみから全種類の電子部品を
順次取り出してプリント基板に装着する、 ことを特徴とした電子部品装着装置における電子部品供
給方法。1. An electronic component mounting apparatus having a plurality of electronic component supply units, wherein predetermined electronic components are sequentially picked up from these electronic component supply units and mounted on a printed circuit board, and all kinds of electronic components mounted on the printed circuit board. An electronic component supply unit group of one unit is formed by a plurality of electronic component supply units each holding a component, and a plurality of electronic component supply unit groups of this one unit are provided, and the electronic component supply unit group of the plurality of sets A set of electronic component supply unit groups is selected from among them, and electronic components are sequentially taken out from only the selected electronic component supply unit group and mounted on a printed circuit board, and any one of the electronic component supply unit groups selected is selected. When there are no more electronic components of the same type in the component supply unit, an electronic component supply unit that takes out electronic components The electronic component mounting apparatus is characterized in that the electronic component supply unit group is switched to another electronic component supply unit group, and all kinds of electronic components are sequentially taken out from only the switched other electronic component supply unit group and mounted on the printed circuit board. Electronic parts supply method.
て、 前記電子部品供給ユニット群を二組設け、プリント基板
移送路の両側に一組づつ対向して配置しておくことを特
徴とした電子部品装着装置における電子部品供給方法。2. The electronic component supply method according to claim 1, wherein two sets of the electronic component supply unit groups are provided, and one set is arranged so as to face each other on both sides of the printed circuit board transfer path. Electronic component supply method in component mounting apparatus.
て、前記電子部品供給ユニット群がそれぞれ単一の取付
け基板上に載置されていることを特徴とした電子部品装
着装置における電子部品供給方法。3. The electronic component supply method according to claim 2, wherein the electronic component supply unit groups are mounted on a single mounting board, respectively. ..
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP05973292A JP3176691B2 (en) | 1992-02-14 | 1992-02-14 | Electronic component supply method in electronic component mounting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP05973292A JP3176691B2 (en) | 1992-02-14 | 1992-02-14 | Electronic component supply method in electronic component mounting apparatus |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP02707799A Division JP3361763B2 (en) | 1999-02-04 | 1999-02-04 | Electronic component supply method in electronic component mounting apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05226882A true JPH05226882A (en) | 1993-09-03 |
JP3176691B2 JP3176691B2 (en) | 2001-06-18 |
Family
ID=13121674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP05973292A Expired - Fee Related JP3176691B2 (en) | 1992-02-14 | 1992-02-14 | Electronic component supply method in electronic component mounting apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3176691B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997010694A1 (en) * | 1995-09-13 | 1997-03-20 | Matsushita Electric Industrial Co., Ltd. | Parts mounting method |
JPH10150294A (en) * | 1996-11-18 | 1998-06-02 | Yamaha Motor Co Ltd | Mounting method and device |
JP2003051699A (en) * | 2001-08-06 | 2003-02-21 | Matsushita Electric Ind Co Ltd | Device and method for detecting part mounting error in electronic part mounter |
JP2009147028A (en) * | 2007-12-12 | 2009-07-02 | Panasonic Corp | Component mounting method |
-
1992
- 1992-02-14 JP JP05973292A patent/JP3176691B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997010694A1 (en) * | 1995-09-13 | 1997-03-20 | Matsushita Electric Industrial Co., Ltd. | Parts mounting method |
US6189207B1 (en) | 1995-09-13 | 2001-02-20 | Matsushita Electric Industrial Co., Ltd. | Method of mounting parts |
JPH10150294A (en) * | 1996-11-18 | 1998-06-02 | Yamaha Motor Co Ltd | Mounting method and device |
JP2003051699A (en) * | 2001-08-06 | 2003-02-21 | Matsushita Electric Ind Co Ltd | Device and method for detecting part mounting error in electronic part mounter |
JP2009147028A (en) * | 2007-12-12 | 2009-07-02 | Panasonic Corp | Component mounting method |
Also Published As
Publication number | Publication date |
---|---|
JP3176691B2 (en) | 2001-06-18 |
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