JPH05218237A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To prevent deformation of a card by using a pair of metallic molds which are respectively provided with cavity sections which are formed by cutting into the internal surfaces of the molds and have surfaces parallel to each other so that the casing container of the card can be inserted into the cavity sections. CONSTITUTION:Metallic molds 10 are made of aluminum and can be tied to each other with bolts. A cavity 8 for inserting an IC card 1 is formed by cutting into the a-and b-surfaces 10a and 10b of the molds 10. The cavity 8 is formed so that the cavity 8 can nearly meet the outer periphery of the card 1 and, at the same time, has a width matching the thickness of the card 1 and parallel surfaces on both sides. After the card 1 is formed by sticking the casing containers of the card 1 to each other, the card 1 is inserted into the cavity 8 from the opening of the mold 10 and the foamable resin contained in the card 1 is foamed and hardened. Therefore, deformation of the card 1 can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thin semiconductor device such as an IC card, and more particularly to a method for completely embedding functional parts of an IC card in resin.

[0002]

2. Description of the Related Art Conventionally, a thin semiconductor device such as an IC card (hereinafter referred to as an IC card) has a functional component of the IC card 1, for example, an IC package (hereinafter referred to as an IC) 3 as shown in FIGS. It was made by accommodating the circuit board 2 on which is mounted in a plastic case 11. FIG. 6 shows the structure of a so-called non-contact type IC card having no external connection terminal. The circuit board 2 such as a glass epoxy printed circuit board has functional parts such as the IC 3, a battery as a power source, others, a resistor and a capacitor. Parts (not shown) are mounted, electrically connected to the wiring circuit 2a on the circuit board 2, housed in a pair of cases 11a and 11b, and joined to form an IC card. Is becoming

[0003]

Since the conventional IC card is constructed as described above, when a space is created between the case and the functional parts and the circuit board and an external force is applied to the surface of the card, the card is There were problems such as the surface being partially distorted and holes being formed, making the case thicker than necessary. For this reason, the overall thickness of the card becomes thicker, and the environment resistance such as water easily invades from the joint part of the case is deteriorated, and it takes time to assemble, the reliability of the joint part of the case, etc. There were many problems.

The present invention has been made in order to solve the above problems, and efficiently embeds functional parts of an IC card in a card substrate to provide a compact, thin and highly reliable thin semiconductor device. The purpose is to provide a method of obtaining.

[0005]

In a semiconductor device according to the present invention, a circuit board on which functional components are mounted is housed in an outer casing forming the outer shape of a card, and a gap between the outer casing and the circuit board on which the functional components are mounted. Is filled with a foamed resin, and when the functional component is completely embedded in the resin, the outer casing is foamed in a state of being constrained by a mold.

[0006]

Since the circuit board on which the functional component according to the present invention is mounted is embedded in the foaming resin in the exterior material of the card, it is tough against various external stresses and is environmentally resistant. It becomes an excellent IC card. In addition, the foamed resin to be filled in the card can be filled in a simple process, and by using a simple mold in the foaming process to constrain the outer shape and foaming, deformation due to foaming can be prevented and highly functional I
Get a C card.

[0007]

【Example】

Example 1. An embodiment of the present invention will be described below with reference to FIGS. 1, 2, 3, 4 and 5. 1 and 2
In, the outer shape of the IC card 1 is the same as that of the outer container 7,
The outer skin container 7 is composed of an A-side container 7a and a B-side container 7b joined together at the side surface of the IC card 1, and both containers are joined together by protruding portions 7c and 7d protruding from each container. The outer container 7 is made by forming a polyester resin sheet. In the outer container 7,
The circuit board 2 on which the IC 3, the coil 6, and other components 5 are mounted is housed, and the periphery of the functional component in the outer container 7 is filled with the cured foamed resin. As shown in FIG. 1 and FIG. 2, the outer skin container 7 is a dish-shaped A-side container 7a and B, respectively.
It is composed of a surface container 7b, both of which are joined by projecting portions 7c and 7d protruding from the container body corresponding to the edge of the dish, and the inside is filled with foaming resin 9 in a state of enclosing the functional parts of the card. There is.

3A to 3D are sectional views showing the procedure for making the IC card shown in FIGS. FIG. A shows an outer cover container 7 of an IC card, which is composed of an A-side container 7a and a B-side container 7b, each of which is provided with protrusions 7c and 7d. FIG. B shows a circuit board 2 on which functional parts of an IC card to be housed in the outer container 7 are mounted, including an IC 3, a battery 4,
The coil 6 and other components 5 are mounted on the glass epoxy printed circuit board 2 at predetermined positions and electrically connected to the wiring of the circuit board. Then, as shown in FIG. C, the IC card 1 is a state in which the A-side container 7a of the outer skin container 7 is first laid down,
Approximately one-third of the required amount of the foamable resin 9 is put in, the circuit board 2 of FIG. B is installed, and then the remaining foamable resin 9 is poured onto the circuit board 2 to form a B The surface container 7b is covered so that the respective projecting portions 7c and 7d are overlapped with each other, and the entire circumference is joined except a part thereof. After that, the whole is placed upright as shown in FIG. 3D, the foaming resin 9 is foamed, and the inside of the outer container 7 is filled with the foaming resin.

Although not shown, the joint portions 7c and 7d of the outer container 7 are provided with through holes penetrating the joint surface at the joint portion at the apex when the foamable resin 9 is foamed in the state of FIG. 3d. Therefore, it is possible to discharge the air in the outer skin container at the time of expansion due to the foaming of the foamable resin 9 and also to discharge the excess foamable resin 9. The expandable resin 9 to be injected into the outer container is a 3-liquid type medium temperature curing expandable epoxy resin in an unfoamed state in an amount sufficient to sufficiently fill the outer container 7 after curing. After joining 7, set in the mold 10 (described later), 50 ℃
Then, the inside of the outer container 7 is filled and cured. Then, the mold 10 is turned over when the inside of the outer container 7 is filled,
Excess foamed resin is discharged, and after curing, the IC card is taken out from the mold 10 and the discharged resin is removed to complete the IC card.

FIG. 4 is a perspective view of the mold 10 when foamed, and FIG. 5 is a sectional view showing a state in which the IC card 1 in the foaming process is set in the mold 10. The mold 10 is made of aluminum and is fastened by bolts (not shown). The cavity 8 for housing the IC card 1 is
It is engraved separately on each of the a-side 10a and the b-side 10b. The cavity 8 fits almost the outer circumference of the IC card 1, has a required card thickness in the thickness direction of the IC card 1, and has flat surfaces on which both surfaces are parallel. The IC card 1 in the state of FIG.
It fastened and was inserted in the cavity 8 from the opening part of the metal mold | die 10, and foaming and hardening were completed in 50 degreeC atmosphere.

As described above with reference to the embodiments, according to the present invention, the functional parts of the IC card are housed in the outer casing having the outer shape of the IC card, and the voids between the functional component and the outer casing are filled with the foamed resin. Since the functional parts are completely embedded in the resin, the function of the IC card can be protected from the environment in which the IC card is used. Further, since the outer casing of the IC card is a dish-shaped one side open type, various molding methods can be adopted. Further, various thermoplastic resins can be selected according to the use environment and purpose of use of the IC card, and since the inside of the outer container itself is completely filled and integrated with the foamed resin, it may be thin. Therefore, as for the molding of the outer container, an appropriate molding method such as sheet molding, blow molding or injection molding can be applied according to the size and shape of the card. In addition, although ultrasonic bonding is applied to the outer container in the above-mentioned embodiment, it goes without saying that various bonding methods such as high-frequency bonding and adhesive bonding can be applied. Although a single mold was used in the examples, the point is to prevent deformation of the outer container due to expansion pressure during expansion of the foamed resin that foams in the outer container. If it can be constrained to a plane, precision in the outer peripheral direction is unnecessary. Therefore, the structure is simple and a large number can be obtained.

As shown in the above embodiment, the IC card is manufactured by storing the expandable resin and the functional component in the outer container, filling the inside of the container by expansion of the resin, and easily deforming due to the internal pressure during foam filling. The card is completed only by removing the excess resin discharged from the mold after foaming and curing, and the card is completed, so there is no need for complicated processes and strict alignment as in the past. , Functional parts can be embedded in a simple process.

Further, since the functional parts are covered with a foamed resin around them, the internal stress due to curing shrinkage or thermal shrinkage of the resin, such as when embedded in a sealing resin, is greatly reduced. A strong card can be obtained because the foamed resin absorbs the stress against external force, especially mechanical shock. In addition, by adjusting the foaming density and elastic modulus of the foamed resin, it becomes possible to manufacture cards suitable for a wider range of purposes.

In the above-mentioned embodiment, the outer container made of polyester resin is used, but other resins such as polycarbonate and polypropylene resin are also effective, as a matter of course.
The heat resistance of the functional parts of the C card allows it to be foamed and cured at a high temperature, so a wider range of resins can be selected. Then, it is possible to add a design to the card surface by various methods such as printing depending on the material of the outer container.

[0015]

As described above, according to the present invention, a circuit board, a functional component, etc. are embedded in a foamed resin and an IC is formed.
As it is formed integrally with the outer cover of the card on the card, it is tough and has excellent environmental resistance, effectively protects functional parts from external force, improves reliability, and is easy to fill and embed in the card with foam resin. Since the deformation of the card can be prevented by the mold having the different structure, and the outer container of the card is pressed against the mold from the inside by the internal pressure, the finished I
The surface of the C card is flat even if the outer container is thin. In the manufacture of an IC card, an IC card having a flat surface can be obtained by storing functional parts in an outer container and foaming a foaming resin in a simple mold, by the internal pressure of the foaming resin and restraint by the mold. Therefore, there is an effect that the productivity is improved in the simplification process.

[Brief description of drawings]

FIG. 1 is a plan view showing a semiconductor device manufactured by a method of the present invention.

FIG. 2 is an enlarged cross-sectional view taken along the line AA in FIG.

FIG. 3 is a cross-sectional view showing the procedure of one embodiment of the present invention.

FIG. 4 is a perspective view showing a mold according to an embodiment of the present invention.

FIG. 5 is a sectional view showing an embodiment of the present invention.

FIG. 6 is a view showing a conventional device, in which a is a plan view and b is a cross-sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC card 2 Circuit board 3 IC 4 Battery 5 Parts 6 Coil 7 Outer skin container 7a A side container 7b B side container 7c, 7d Projection part 8 Cavity 9 Foaming resin 10 Mold 10a a side 10b b side

Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location H01L 23/28 Z 8617-4M

Claims (2)

[Claims] 1. An electronic component is contained in an outer casing formed by joining a pair of dish-shaped containers to each other at their peripheral edges, and a gap between the outer casing and the electronic component is filled with a foaming resin. Then, in the step of foaming the foamable resin in the outer container, the method of manufacturing the semiconductor device is characterized in that foaming is carried out in a state of being constrained by a mold. 2. A pair of molds in which a cavity portion of a mold into which the outer container is inserted is engraved separately on both sides, and has a flat surface on which both surfaces are parallel to each other. Of manufacturing a semiconductor device of.