JPH05218154A - Socket for ic - Google Patents

Abstract

PURPOSE:To provide an IC socket suitable for burn-in test having a wiping mechanism for causing approximately matrixlike contacts to touch a number of contact points of an IC package stably and securely with simple construction. CONSTITUTION:An IC socket 100 is composed of a base clamp 10, a base housing 20, a matrixlike terminal assembly 30, a support housing 40, a holder 50, a spacer 70, and a locking plate 80. An IC package 60 is inserted into the center opening 51 of the holder 50 and held in place. The locking plate 80 is rotated keeping the contact points of the IC package 60 touching the contacts of the terminal assembly 30, and the holder 50 and the IC package 60 are moved mutually in the direction of a diagonal line, and wiping action of approximately uniform specified size is performed between each contact and each contact point.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and more particularly to an IC socket for interconnecting an IC package having a large number of contacts arranged in a matrix on one surface with the contacts.

[0002]

2. Description of the Related Art ICs (integrated circuits) are widely used in recent high-performance electronic devices and electronic application devices. In such an IC, a semiconductor circuit formed by known means on a substrate such as silicon is mounted and connected on a substrate such as ceramic, sealed with an insulating plastic material such as epoxy, and connected to an external circuit. Of multiple lead terminals or contacts. This type of semiconductor integrated circuit device is generically referred to as an IC package here.

An IC is used for mounting such an IC package on an electronic device, an electronic application device, or the like, or for a burn-in test for testing whether or not the IC package operates with desired performance before mounting the IC package. Socket (hereinafter sometimes simply referred to as an IC socket) is used.

In such an IC socket, it is essential that all the contacts of the IC package are in stable and reliable contact with the contacts. Otherwise, the IC package may malfunction or become inoperable, causing fatal defects or problems in the equipment using it.

A conventional example of a burn-in IC socket is disclosed in Japanese Patent Laid-Open No. 2-266276. In this conventional IC socket, a large number of movable contacts are arranged along the inner wall of a rectangular concave portion of an insulating housing, and a substantially rectangular IC package having contacts or contact terminals exposed on the outer periphery is inserted into the concave portion. At the time of insertion, the cover member is driven to be biased so that the contacts are biased to facilitate the connection between the contacts of the IC package and the contacts of the IC socket.

However, as the degree of integration of ICs has recently increased, contacts arranged only on the outer periphery of the IC package become insufficient, and a large number of contacts arranged in a matrix form on one surface of the IC package, generally on the bottom surface. Things are appearing.

[0007]

It is impossible to apply the conventional IC socket as described above to the IC socket for IC package of high density multi-contact as described above. Further, when an IC socket in which contacts corresponding to the contacts of the IC package are arranged in a matrix is used, good electrical contact cannot be obtained due to dust or an oxide layer on the contact surface. This problem is remarkable in the burn-in test IC socket used in a particularly severe environment.

Therefore, an object of the present invention is to provide an IC socket which is stably and reliably electrically contacted with the contacts of an IC package having a large number of contacts arranged in a matrix on one surface and which can be manufactured at a small size and at a low cost. It is to be.

[0009]

According to the IC socket of the present invention, the contacts of the IC package held in the holder are pressed into contact with the contact row of the IC socket, and an external force is applied to the holder to rotate the IC package. Wiping means for moving the contact row and the contact row toward each other in the contact surface direction are provided.

By this movement, the contact and the contact in a contact state are wiped with each other, and stable and reliable electrical contact can be obtained between them. In a preferred embodiment of the present invention, the IC package holder is formed of a stainless steel plate having an opening for receiving the IC package in a substantially square shape. By rotating the lock plate, the IC package is oscillated in a diagonal direction to generate a wiping action between the contact of the IC socket and the contact of the IC package. Further, when the external force is removed, it naturally returns to a predetermined position, and the contacts of the IC package and the contacts of the IC socket are interconnected at the regular position.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the IC socket of the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is an exploded perspective view showing a schematic structure of each constituent element of a preferred embodiment of an IC socket of the present invention. The IC socket 100 according to the preferred embodiment of the present invention includes a base clamp 10, a base housing 20, and a plurality of terminal assemblies 3.
0, support housing 40, holder 50, spacer 70, and locking plate 80. The IC package 60 is arranged and held in the holder 50.

The base clamp 10 is preferably formed by bending a stainless steel plate. A rectangular center opening of a predetermined size corresponding to the size of the IC package 60 to be connected
It has a flat base 12 on which 14 is formed. On the base 12, holding tongues 16 are formed corresponding to the four corners of the opening 14.
Each holding tongue 16 comprises a rising portion that is substantially vertical to the flat base portion 12 and a horizontal portion that extends outward from its tip.

The base housing 20 is an insulating plate-like body in which four corners of a substantially square shape are cut off to form a substantially octagonal shape, and has a substantially square concave portion 21 in the center thereof, and the concave portion 21 has a bottom surface as will be described later. A groove for receiving the terminal assembly 30 and a large number of through holes 22 for pressing the terminals 32 are formed. Also, the recess 21
A pair of openings 23, 24 are formed outside and diagonally of
Positioning pins 25 and 26 are inserted and fixed, respectively. The base housing 20 is mounted on the base clamp 10. That is, the cutouts at the four corners of the base housing 20 are placed in contact with the holding tongues 16 of the base clamp 10.

In the terminal assembly 30, in the specific embodiment shown in FIG. 1, a row of terminals 32 is punched or insert-molded on a narrow insulating plate 31, and a plurality of the terminals 32 are arranged in parallel to obtain a required number of terminals 32. .. Of course, a plurality of rows of terminals 32 may be formed on the insulating plate 31 of the terminal assembly 30. Each terminal 32 has a linear upper portion 33 protruding above and below the insulating plate 31.
And a lower portion 34. The lower portion 34 of the terminal 32 is inserted into the through hole 22 on the bottom surface of the base housing 20, penetrates the base housing 20, and is connected to, for example, a circuit board (not shown).

After inserting a predetermined number of terminal assemblies 30 into the recesses 21 of the base housing 20, a flat plate support housing 40 having through holes 42 corresponding to the through holes 22 on the bottom surface of the base housing 20 is placed in the recesses 21. insert. That is, the plurality of terminal assemblies 30 are arranged between the base housing 20 and the support housing 40 in a sandwich shape. At this time,
The upper portion 33 of each terminal 32 of the terminal assembly 30 penetrates the through hole 42 of the support housing 40 and projects from the upper surface. In this state, the tip of the upper portion 33 of the terminal 32 protruding from the upper surface 44 of the support housing 40 is bent horizontally as described later to obtain a contact 35 described later.

Next, the holder 50 is preferably a flat plate member formed by stamping a stainless steel plate. The overall shape is similar to the base housing 20. An opening 51 for receiving the IC package 60 is provided at the center. A pair of cantilever elastic arms 52 is formed at one corner of the opening 51, and a bent relatively narrow connecting arm 53 is formed at the diagonal portion. A pair of arc-shaped holes 54 and 55 spaced from the opening 51 are formed in these diagonal portions. A pair of round holes 56 and 57 are formed in a diagonal portion orthogonal to the arcuate holes 54 and 55. The holder 50 is fixed by inserting the positioning posts 25 and 26 of the base housing 20 into the round holes 56 and 57. The diagonal portion of the IC package 60 is aligned and held between the elastic arm 52 of the opening 51 of the holder 50 and the corner 58 facing the elastic arm 52.

The spacer 70 is placed on the holder 50 in which the IC package 60 is inserted and held in the opening 51. The spacer 70 has a central opening 71 and substantially arcuate holes 72, 73 at diagonal positions. The holes 72 and 73 have substantially the same shape and dimensions as the arcuate holes 54 and 55 of the holder 50.

Finally, the locking plate 80 is a substantially circular cap-shaped member, and has a pair of pins 81, 82 on its bottom surface.
Are formed. The pins 81 and 82 are inserted into the arcuate holes 54-55 and 72-73 of the holder 50 and the spacer 70 which are overlapped with each other. Here, it should be noted that the arcuate holes 54-55 are formed in a special shape different from the circle centered on the center of the opening 51. Therefore, when the locking plate 80 is rotated, its pins 81 and 82 come into contact with the side surfaces of the arcuate holes 54-55.
As a result, an external force is applied to the connecting arm 53 to press the corner 58 toward the corner where the substantially cantilever elastic arm 52 is formed. This allows each contact 35 of the terminal assembly 30 to
And IC package 60 contacts are in contact
It will be appreciated that there is a wiping action between 35 and the contacts. Details of these operations will be described below with reference to FIGS.

FIG. 2 shows an IC package 60 in the holder 50 of FIG.
The top view which shows the state which mounted is shown. 3 is line 3 of FIG.
FIG. 3 is a sectional view taken along line -3, showing the IC socket 100 of the present invention.
The assembled state of each of the constituent elements 10 to 80 of FIG. FIG. 4 is an enlarged view of a part indicated by a circle A in FIG. 3, showing a contact state of the contact of the IC package and the contact of the IC socket.

As can be seen from FIG. 2, the IC package
The 60 is inserted into the central opening 51 of the holder 50. At this time,
The IC package 60 is positioned so that one of the two opposing corners 61, 62 fits between the elastic arms 52 and the other fits in the corner 58 of the connecting arm 53. In other words, the IC package 60 is elastically sandwiched by the holder 50 and is held substantially without backlash. This elasticity is provided by a pair of cantilever elastic arms 52 substantially. As described above, the arcuate holes 54 and 55 have the pins 81 and 82 of the locking plate 80.
Has been inserted. Further, the arcuate holes 54 and 55 are formed into the openings 51 or I.
It is not formed concentrically from the center of the C package 60, but is formed eccentrically. Therefore, when the locking plate 80 is rotated clockwise and counterclockwise, a force is applied to the left and right ends of the holder 50 in the left and right directions, and the IC package 60 is
Move or oscillate in the left-right direction with a preselected small dimension of approximately 0.2 mm. Here, since the upper and lower parts of the center of the holder 50 are fixed by the positioning pins 25 and 26, the entire holder 50 does not move, but the IC package 60 simply moves relative to the contacts 35 and the like of the IC socket 100. Please note that. In addition, the connecting arm 53 is an IC package as shown in the drawing.
The zigzag structure having two components in the direction parallel and perpendicular to the side edge of 60 provides elasticity and enables the side edge of the IC package 60 to be properly clamped as shown.

Next, referring to FIG. 3, an IC socket 100 according to a preferred embodiment of the present invention will be described. As shown in the drawing, in the IC socket 100 according to the preferred embodiment of the present invention, the base housing 20 has a protruding portion 27 on the bottom surface which is fitted and protrudes into the opening 14 of the base clamp 10. This base housing
A support housing 40 is inserted and held in the recess 21 of the groove 20, and a groove and a terminal in which a narrow insulating plate 31 holding a row of a large number of terminals 32 is inserted in the bottom surface of the recess 21 and each terminal.
A through hole 22 is formed through which the lower part 34 of the terminal 32 penetrates and projects to the bottom surface. The upper portion 33 of the terminal 32 projects from the upper surface 44 of the support housing 40 and is bent substantially parallel to the upper surface 44 to form a contact portion or contact 35. This is apparent from the partially enlarged view shown in FIG.

A holder 50 is mounted on a support housing 40 having contacts 35 arranged on the upper surface 44.
An IC package 60 is inserted and held in the center opening 51 of the holder 50. A large number of substantially hemispherical contacts 63 are formed so as to project from the bottom surface of the IC package 60. The contact 63 of the IC package 60 is brought into contact with the corresponding contact 35. Next, a cap-shaped locking plate 80 is arranged on the holder 50, into which the IC package 70 is inserted and held, via the spacer 70. The locking plate 80 engages with the holding leg of the base clamp 10 or the tip of the tongue piece 16 to keep the IC sockets 100 assembled to each other. When the locking plate 80 is clamped and held by the base clamp 10, the pair of pins 81 and 82 formed on the bottom surface of the locking plate 80 are held by the holder 50.
Are inserted into the arc-shaped holes 54 and 55 and the arc-shaped grooves 72 and 73 of the spacer 70. Here, the tips of the pins 81, 82 have heads 81a, 82a substantially equal to the width of the arcuate holes 54, 55, respectively.

Pin 8 of locking plate 80 as described above
1, 82 substantially contact the side surfaces of the arcuate holes 54, 55 of the holder 50. Therefore, when the locking plate 80 is rotated, for example, since the arcuate holes 54 and 55 are not completely concentric,
A force is applied to the holder 50 in the left-right (lateral) direction in FIG. As a result, the IC package 60 has the arc-shaped holes 5 in the diagonal direction.
It moves, for example, 0.2 mm depending on the eccentric dimension of 4, 55. This movement causes a wiping action of 0.2 mm between the contact 63 and the contact 35 of the IC package 60 in FIG. It should be noted that this wiping action occurs substantially uniformly with respect to all the contacts 35 and the contacts 63 arranged in a matrix.

The IC socket of the present invention has been described above in detail according to the preferred embodiments. However, it is needless to say that the present invention should not be limited to such a specific embodiment, and various modifications and changes can be made according to need or application. For example,
It is needless to say that the contacts 35 are not necessarily required to be arranged and formed completely in a matrix and may have a square shape having a plurality of rows of contacts in the periphery.
Further, each terminal may have an arbitrary shape and structure having a substantially flat contact portion on the upper surface. Furthermore, as long as mutual movement occurs between the contacts of the IC package and a wiping action occurs, another means for pressing or extending the holder diagonally instead of rotating the locking plate as in the above-described embodiment. Alternatively, it goes without saying that a configuration can be adopted.

[0026]

According to the IC socket of the present invention, it is possible to cause a substantially uniform wiping action between a large number of contacts of the IC package and the socket contact, and to make stable and reliable contact. Further, since the wiping size can be accurately controlled by the size and shape of the arcuate hole, it can be adapted to the size of the contact and the contact, and can be applied to an extremely high density IC socket. Furthermore, since the attachment and detachment of the IC package is a relatively simple operation including the contact wiping operation, the workability is excellent.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing components of a preferred embodiment of an IC socket according to the present invention.

FIG. 2 is a plan view of an IC package placed on the holder of FIG.

3 is a cross-sectional view in the diagonal direction (line 3-3 of FIG. 2) in the assembled state of the IC socket of FIG.

FIG. 4 is an enlarged view of a part surrounded by a dotted line A in FIG.

[Explanation of symbols]

 100 IC socket 60 IC package 63 contacts 35 contacts 50, 80 Wiping means

Claims (1)

[Claims] 1. An IC socket for pressing and interconnecting an IC package having a plurality of contacts formed on one surface facing a plurality of contacts arranged in a plane, wherein the contacts have the contacts of the IC package. An IC socket, comprising: wiping means for moving the contact and the IC package to face each other in a contact surface direction in a state of being in contact with each other.