[go: up one dir, main page]

JPH0521501A - Device and method for detecting high frequency in wire bonding device - Google Patents

Device and method for detecting high frequency in wire bonding device

Info

Publication number
JPH0521501A
JPH0521501A JP3194983A JP19498391A JPH0521501A JP H0521501 A JPH0521501 A JP H0521501A JP 3194983 A JP3194983 A JP 3194983A JP 19498391 A JP19498391 A JP 19498391A JP H0521501 A JPH0521501 A JP H0521501A
Authority
JP
Japan
Prior art keywords
discharge
circuit
high frequency
wire
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3194983A
Other languages
Japanese (ja)
Inventor
Masanao Ura
正直 浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP3194983A priority Critical patent/JPH0521501A/en
Publication of JPH0521501A publication Critical patent/JPH0521501A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/78268Discharge electrode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009Pre-treatment of the connector or the bonding area
    • H01L2224/8503Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01072Hafnium [Hf]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve the reliability of a wire bonding device so as to form an optimum ball diameter by detecting the occurrence of a high frequency at the time of abnormal discharge and notifying the abnormal discharge based on the occurrence of the high frequency. CONSTITUTION:A high-frequency detection circuit 13 is constituted so that the circuit 13 can detect the occurrence of abnormal discharge by detecting a high frequency generated from a discharge electrode 10. Therefore, the occurrence of such an accident that a ball is buried in a capillary 9, and so on, can be prevented and, at the same time, a ball having a suitable ball diameter can be formed. In addition, since the occurrence of abnormal discharge can be notified quickly, the reliability of a wire bonding device can be improved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体デバイスの組立
工程において、第1ボンディング点、例えば半導体チッ
プ上の電極と第2ボンディング点、例えばリードフレー
ムに配設された外部リードとをワイヤを用いて接続する
ワイヤボンディング装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a wire at a first bonding point, for example, an electrode on a semiconductor chip and a second bonding point, for example, an external lead arranged on a lead frame, in a process of assembling a semiconductor device. The present invention relates to a wire bonding device for connecting with each other.

【0002】[0002]

【従来技術】従来、金線又は銅,アルミニウムなどのワ
イヤを用いて第1ボンディング点となる半導体チップ上
の電極と第2ボンディング点となるリードとを接続する
装置としては、図2に示す回路を用いてボールを形成す
るワイヤボンディング装置が知られている。
2. Description of the Related Art Conventionally, as a device for connecting an electrode on a semiconductor chip, which is a first bonding point, and a lead, which is a second bonding point, using a gold wire or a wire such as copper or aluminum, the circuit shown in FIG. There is known a wire bonding apparatus for forming a ball by using.

【0003】図2に示すように、高電圧を発生する電源
回路1は、抵抗Rを介して高電圧定電流素子2のE1
子と接続されている。この高電圧定電流素子2は、トラ
ンジスタ(又はFET)で構成されており、E1 端子は
エミッタ(又はソース)、B1 端子はベース(又はゲー
ト)、C1 端子はコレクタ(又はドレイン)である。
As shown in FIG. 2, a power supply circuit 1 for generating a high voltage is connected to an E 1 terminal of a high voltage constant current element 2 via a resistor R. This high voltage constant current element 2 is composed of a transistor (or FET), an E 1 terminal is an emitter (or source), a B 1 terminal is a base (or gate), and a C 1 terminal is a collector (or drain). is there.

【0004】前記B1 端子は、差動増幅器3の出力側と
接続されている。この増幅器3の入力側の一端は、電源
回路1と接続され、他端は基準電圧発生回路4を介して
抵抗Rと接続されている。また、C1 端子は、スイッチ
回路5を介して放電電極10と接続されている。スイッ
チ回路5は、このスイッチ回路5を一定時間オン/オフ
するタイマ6と接続されており、このタイマ6は、トリ
ガ信号Trによって駆動される。また、ワイヤ8はキャ
ピラリ9に挿通され、クランパ7は電源回路1と接続さ
れている。
The B 1 terminal is connected to the output side of the differential amplifier 3. One end of the amplifier 3 on the input side is connected to the power supply circuit 1, and the other end is connected to the resistor R via the reference voltage generation circuit 4. Further, the C 1 terminal is connected to the discharge electrode 10 via the switch circuit 5. The switch circuit 5 is connected to a timer 6 that turns on / off the switch circuit 5 for a certain period of time, and the timer 6 is driven by a trigger signal Tr. The wire 8 is inserted through the capillary 9, and the clamper 7 is connected to the power supply circuit 1.

【0005】上記構成よりなる装置を用いてボールの形
成を行うには、外部からのトリガ信号Trによってタイ
マ6によりスイッチ回路5が駆動されてスイッチがオン
になる。このスイッチ回路5の5a側の端子には、最大
約1200V程度の電圧がかかっている。したがって、
このスイッチのオンによって放電電極10に高電圧が印
加されてワイヤ8の先端との間で放電が開始される。そ
して、電源回路1からの高圧電源により抵抗Rの両端に
誘起される電圧は、基準電圧発生回路4及び差動増幅器
3に入力される。そして、基準電圧発生回路4で形成さ
れる基準電圧との差電圧が差動増幅器3より出力されて
1 端子がバイアスされて高電圧定電流素子2は定電流
制御を行う。そして、放電電極10とワイヤ8間の放電
エネルギーEによりワイヤの先端を溶融してボール状に
形成する。
In order to form a ball using the apparatus having the above structure, the switch circuit 5 is driven by the timer 6 driven by the timer 6 in response to an external trigger signal Tr. A maximum voltage of about 1200 V is applied to the terminal on the 5a side of the switch circuit 5. Therefore,
When this switch is turned on, a high voltage is applied to the discharge electrode 10 to start discharge with the tip of the wire 8. Then, the voltage induced across the resistor R by the high-voltage power supply from the power supply circuit 1 is input to the reference voltage generation circuit 4 and the differential amplifier 3. The differential voltage from the reference voltage generated by the reference voltage generating circuit 4 is output from the differential amplifier 3 and the B 1 terminal is biased, and the high voltage constant current element 2 performs constant current control. Then, the tip of the wire is melted by the discharge energy E between the discharge electrode 10 and the wire 8 to form a ball shape.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、従来の
装置では、以下のような欠点がある。すなわち、
However, the conventional device has the following drawbacks. That is,

【0007】従来の装置では、差動増幅器3により電
圧制御が行われて高電圧定電流素子2により定電流制御
されるが、この差動増幅器3には比較的高利得なアンプ
が用いられているので、位相遅れ等が発生して速やかな
制御がなされず、定電流を安定して維持することができ
ないという欠点がある。その結果、位相遅れが発生して
定電流制御が安定せず放電維持用のスパーク放電電流の
減少により適正電流が得られないため、良好なボール形
成ができないという欠点がある。
In the conventional device, voltage control is performed by the differential amplifier 3 and constant current control is performed by the high-voltage constant current element 2, but an amplifier having a relatively high gain is used for this differential amplifier 3. Therefore, there is a drawback in that a constant current cannot be stably maintained because a phase delay occurs and quick control is not performed. As a result, a phase delay occurs, the constant current control is not stable, and an appropriate current cannot be obtained due to a decrease in the spark discharge current for sustaining the discharge.

【0008】また、従来の装置では、放電電極10が
酸化状態や侵蝕された状態であるような場合には、異常
放電が発生し該放電時に数百KHz〜数MHzの高周波
が発生する。このような高周波が発生せずに正常な放電
がなされている時は、図3に示すような正常な電圧波形
が得られるが、高周波が発生して異常放電が行われる
と、波形が乱れて正常な電圧波形が得られない。この異
常放電時には、高周波の影響によりボール径が小さくな
ったり変形することがある。したがって、最適なボール
径を有するボールが得られないという欠点がある。しか
も、この状態で装置を運転し続けると、キャピラリにボ
ールが埋もれてしまい、キャピラリを交換するために装
置の運転を停止させなければならず、作業性が悪くしか
も装置の信頼性が損なわれるという欠点もある。
Further, in the conventional device, when the discharge electrode 10 is in an oxidized state or in an eroded state, an abnormal discharge occurs and a high frequency of several hundred KHz to several MHz is generated during the discharge. A normal voltage waveform as shown in FIG. 3 is obtained when a normal discharge is generated without generating such a high frequency, but when a high frequency is generated and an abnormal discharge is generated, the waveform is disturbed. Normal voltage waveform cannot be obtained. During this abnormal discharge, the ball diameter may be reduced or deformed due to the influence of high frequency. Therefore, there is a drawback that a ball having an optimum ball diameter cannot be obtained. Moreover, if the device is continuously operated in this state, the balls will be buried in the capillaries, and the device operation must be stopped in order to replace the capillaries, resulting in poor workability and impaired device reliability. There are also drawbacks.

【0009】そこで、本発明は上記従来技術の欠点に鑑
みてなされたもので、異常放電時に高周波が発生したこ
とを検出し、該検出出力により高周波が発生し異常放電
が行われていることを告知するようにして装置の信頼性
を向上させて最適なボール径を形成することができるワ
イヤボンディング装置における高周波検出装置及びその
方法を提供することを目的とする。
Therefore, the present invention has been made in view of the above-mentioned drawbacks of the prior art. It is detected that a high frequency is generated at the time of abnormal discharge, and a high frequency is generated by the detection output to perform the abnormal discharge. It is an object of the present invention to provide a high-frequency detection device in a wire bonding device and a method therefor capable of improving the reliability of the device and forming an optimum ball diameter as described above.

【0010】[0010]

【課題を解決するための手段】本発明は、キャピラリ先
端から突出したワイヤの先端と放電電極との間に高電圧
を印加することにより放電を起こさせ、その放電エネル
ギーによりワイヤの先端部を溶融してボールを形成する
ワイヤボンディング装置において、電源回路と、該電源
回路と接続された電流制御回路と、該電流制御回路を介
して接続された放電電極と、前記電源回路と接続された
クランパと、前記電流制御回路及び放電電極間と前記ク
ランパとの間で接続された高周波検出回路とを備え、前
記高周波検出回路は、異常放電時に放電電極から発生す
る高周波を検出できるように構成したものである。ま
た、本発明は、電源回路と、該電源回路と接続された電
流制御回路と、該電流制御回路を介して接続された放電
電極と、前記電源回路と接続されたクランパと、前記電
流制御回路及び放電電極間と前記クランパとの間で接続
された高周波検出回路とを備え、前記高周波検出回路に
より異常放電時に放電電極から発生する高周波が検出さ
れた場合には告知手段により告知させるようにしたもの
である。更に、本発明に係る高周波検出方法は、キャピ
ラリ先端から突出したワイヤの先端と放電電極との間に
高電圧を印加することにより放電を起こさせ、その放電
エネルギーによりワイヤの先端部を溶融してボールを形
成するワイヤボンディング装置であって、異常放電時に
放電電極から発生する高周波を検出できるようにしたも
のである。
According to the present invention, a high voltage is applied between the tip of a wire protruding from the tip of a capillary and a discharge electrode to cause discharge, and the discharge energy melts the tip of the wire. In a wire bonding device for forming balls, a power supply circuit, a current control circuit connected to the power supply circuit, a discharge electrode connected via the current control circuit, and a clamper connected to the power supply circuit. A current control circuit and a high frequency detection circuit connected between the discharge electrodes and between the clamper, the high frequency detection circuit being configured to detect a high frequency generated from the discharge electrode during abnormal discharge. is there. The present invention also provides a power supply circuit, a current control circuit connected to the power supply circuit, discharge electrodes connected via the current control circuit, a clamper connected to the power supply circuit, and the current control circuit. And a high-frequency detection circuit connected between the discharge electrodes and between the clamper, and when the high-frequency detection circuit detects a high-frequency generated from the discharge electrodes during abnormal discharge, the notification means is used for notification. It is a thing. Furthermore, the high-frequency detection method according to the present invention causes a discharge by applying a high voltage between the tip of the wire protruding from the tip of the capillary and the discharge electrode, and the discharge energy melts the tip of the wire. A wire bonding device for forming a ball, which can detect a high frequency generated from a discharge electrode during abnormal discharge.

【0011】[0011]

【実施例】次に、本発明に係るワイヤボンディング装置
における高周波検出装置の実施例を説明する。
EXAMPLE An example of the high frequency detecting device in the wire bonding apparatus according to the present invention will be described below.

【0012】図1は、本発明に係るワイヤボンディング
装置の回路の構成を示す図である。なお、図2に示す従
来装置の構成と同じ機能及び構成よりなるものは同じ符
合を用いて説明する。
FIG. 1 is a diagram showing a circuit configuration of a wire bonding apparatus according to the present invention. It should be noted that components having the same functions and configurations as those of the configuration of the conventional apparatus shown in FIG.

【0013】図1において、高電圧を発生する電源回路
1は、電流制御回路12と接続されている。この電流制
御回路12は、定電流回路12aと高電圧定電流開閉素
子12bとで構成されている。定電流回路12aは、定
電流を生成して後段の高電圧定電流開閉素子12bに供
給するものである。また、高電圧定電流開閉素子12b
は、従来の高電圧定電流素子2とほぼ同様の素子が使用
されているが、従来の高電圧定電流素子2は定電流制御
を行い、最大約1200V程度の電圧は、後段のスイッ
チ回路5に加わっているのに対して、本実施例では高電
圧定電流開閉素子12bに当該電圧がかけられている。
この高電圧定電流開閉素子12bは、トランジスタ(又
はFET)で構成されており、E2 端子はエミッタ(又
はソース)、B2 端子はベース(又はゲート)、C2
子はコレクタ(又はドレイン)である。前記B2 端子
は、電源回路1と電流制御回路12との間に接続された
駆動電源回路11を介してスイッチ回路5と接続されて
おり、これらによってループが形成されている。そし
て、このスイッチ回路5には、このスイッチ回路5を一
定時間オン/オフするタイマ6と接続されており、この
タイマ6は、トリガ信号Trによって駆動される構成と
なっている。
In FIG. 1, a power supply circuit 1 that generates a high voltage is connected to a current control circuit 12. The current control circuit 12 is composed of a constant current circuit 12a and a high voltage constant current switching element 12b. The constant current circuit 12a generates a constant current and supplies it to the high voltage constant current switching element 12b in the subsequent stage. Also, the high voltage constant current switching element 12b
A device similar to the conventional high-voltage constant current device 2 is used, but the conventional high-voltage constant current device 2 performs constant current control, and a maximum voltage of about 1200 V is applied to the switch circuit 5 in the subsequent stage. In contrast to this, in the present embodiment, the voltage is applied to the high voltage constant current switching element 12b.
The high voltage constant current switching element 12b is composed of a transistor (or FET), an E 2 terminal is an emitter (or source), a B 2 terminal is a base (or gate), and a C 2 terminal is a collector (or drain). Is. The B 2 terminal is connected to the switch circuit 5 via the drive power supply circuit 11 connected between the power supply circuit 1 and the current control circuit 12, and a loop is formed by these. The switch circuit 5 is connected to a timer 6 that turns on / off the switch circuit 5 for a certain period of time, and the timer 6 is driven by a trigger signal Tr.

【0014】また、高電圧定電流開閉素子12bのC2
端子は、放電電極10と接続されており、またこのC2
端子及び放電電極10間とクランパ7との間には、高周
波検出回路13が接続されている。この高周波検出回路
13は、ダイオード等よりなる検波回路で構成されてい
る。この高周波検出回路13は、数百KHz〜数MHz
の広帯域の周波数を検出することができる。この高周波
検出回路13で放電電極10から放電時(放電時とは、
放電が開始された時及び放電が行われている間も含
む。)に高周波が発生していることが検出された場合に
は、その検出信号に基づいて図示せぬ制御回路内で異常
放電が発生しているものと判定して表示機又は警報器等
による告知手段(図示せず)により告知させることがで
きる。この告知に基づいて自動又は外部の操作手段を操
作して装置の運転を停止させる。また、キャピラリ9に
はワイヤ8が挿通されている。
Further, C 2 of the high voltage constant current switching element 12b is
The terminal is connected to the discharge electrode 10, and this C 2
A high frequency detection circuit 13 is connected between the terminals and the discharge electrode 10 and between the clamper 7. The high frequency detection circuit 13 is composed of a detection circuit including a diode and the like. This high frequency detection circuit 13 has a frequency of several hundred KHz to several MHz.
It is possible to detect a wide range of frequencies. At the time of discharging from the discharge electrode 10 by this high frequency detection circuit 13 (when discharging,
It also includes the time when the discharge is started and the time when the discharge is being performed. ) Is detected, it is determined that abnormal discharge has occurred in the control circuit (not shown) based on the detection signal, and a notification is given by a display or alarm device. It can be announced by means (not shown). Based on this notification, the operation of the apparatus is stopped by operating the automatic or external operation means. A wire 8 is inserted through the capillary 9.

【0015】上記構成よりなる装置を用いてボールの形
成を行うには、外部からのトリガ信号Trによってタイ
マ6が駆動されてスイッチ回路5が駆動される。一方、
電流制御回路12の定電流回路12aの後段の高電圧定
電流開閉素子12bには、前記スイッチ回路5のスイッ
チが閉じてオンされ、高電圧定電流開閉素子12bのB
2 端子がバイアスされて該素子12bが駆動されてE2
とC2 端子間に最大約1200V程度の電圧が印加され
る。そして、放電電極10とワイヤ8の先端との間で放
電を起こさしめ、その放電エネルギーEによりワイヤ8
の先端を溶融してボール状に形成する。この時のE2
2 間に流れる電流はほぼ一定の電流が流れている。そ
して、本実施例によれば、放電電極10とワイヤ8間で
の電極間距離の変化やスパーク放電電極の酸化等により
スパーク放電が不安定になった場合であっても、高電圧
定電流開閉素子12bのスイッチングが速やかになされ
るので、応答速度が早く位相遅れ等のない高速スイッチ
ングが可能となると共に装置がシンプルになる。
In order to form a ball using the apparatus having the above structure, the timer 6 is driven by the external trigger signal Tr and the switch circuit 5 is driven. on the other hand,
In the high voltage constant current switching element 12b in the subsequent stage of the constant current circuit 12a of the current control circuit 12, the switch of the switch circuit 5 is closed and turned on, and the B of the high voltage constant current switching element 12b is turned on.
The two terminals are biased and the element 12b is driven to generate E 2
A maximum voltage of about 1200 V is applied between the C 2 and C 2 terminals. Then, a discharge is caused between the discharge electrode 10 and the tip of the wire 8, and the discharge energy E causes the wire 8 to move.
The tip of is melted to form a ball. The current flowing between E 2 and C 2 at this time is a substantially constant current. Further, according to the present embodiment, even when the spark discharge becomes unstable due to a change in the electrode distance between the discharge electrode 10 and the wire 8 or oxidation of the spark discharge electrode, high voltage constant current switching is performed. Since the element 12b is switched quickly, the response speed is fast and high-speed switching without phase delay is possible and the device is simple.

【0016】一方、本実施例では前記C2 端子及び放電
電極10間とクランパ7との間に高周波検出回路13が
設けられているので、放電電極10の酸化状態や浸蝕状
態に起因して放電時に図3に示すような高周波が発生し
て異常放電が発生している場合には、この高周波を検出
して図示せぬ表示機や警報等の告知手段により高周波が
発生したことを告知させる。この告知手段からの情報に
基づいて自動的に又は図示せぬ操作手段を操作して装置
の運転を停止させることによって高周波の発生によりボ
ール径が小さくなったり変形したボールが形成されてキ
ャピラリ9内にボールが埋没する等の事故を未然に防ぐ
ことができる。そして、放電電極10を点検して清掃,
交換等をすることによって安定したスパーク放電を行い
装置の連続運転が可能となる。
On the other hand, in this embodiment, since the high frequency detecting circuit 13 is provided between the C 2 terminal and the discharge electrode 10 and between the clamper 7, the discharge is caused by the oxidation state or the erosion state of the discharge electrode 10. At times, when a high frequency as shown in FIG. 3 is generated and abnormal discharge is generated, this high frequency is detected and a notification means such as a display or an alarm (not shown) notifies that the high frequency is generated. Based on the information from the notification means, the operation of the device is stopped automatically or by operating the operation means (not shown) to form a ball having a reduced ball diameter or a deformed ball due to the generation of a high frequency, and the inside of the capillary 9 is formed. It is possible to prevent accidents such as the ball being buried in the ground. Then, the discharge electrode 10 is inspected and cleaned,
By replacing the battery, stable spark discharge can be performed and continuous operation of the device becomes possible.

【0017】なお、本実施例では、上記告知手段による
告知は、高周波検出回路13で検出される周波数がセル
フティーチ時等で予め図示せぬ制御回路内に設定された
値以上の場合にのみ告知するようにしてもよい。その
他、この告知させるタイミング及び条件等は、装置の状
態等によって適宜設定することができる。
In the present embodiment, the notification by the notification means is made only when the frequency detected by the high frequency detection circuit 13 is equal to or higher than the value preset in the control circuit (not shown) at the time of self-teaching or the like. You may do it. In addition, the timing and conditions for this notification can be appropriately set depending on the state of the device.

【0018】[0018]

【発明の効果】以上のとおり、本発明によれば、高周波
発生により異常放電が発生した場合にこの高周波を検出
して異常放電であることが確認できるので、キャピラリ
内にボールが埋没する等の事故を未然に防ぐことができ
ると共に良好なボール径を有するボールを形成すること
ができる。また、本発明によれば、高周波が発生して異
常放電が行われる危険性があることを速やかに告知さ
せ、しかもその告知情報に基づいて装置の運転を停止さ
せるようにしたので、装置の信頼性が向上する効果があ
る。
As described above, according to the present invention, when an abnormal discharge occurs due to the generation of a high frequency, it is possible to detect this high frequency and confirm that the discharge is abnormal. Therefore, it is possible to prevent the ball from being buried in the capillary. Accidents can be prevented and a ball having a good ball diameter can be formed. Further, according to the present invention, it is possible to promptly notify that there is a risk of high frequency generation and abnormal discharge, and to stop the operation of the device based on the notification information. There is an effect that the property is improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1は、本発明に係るワイヤボンダー用ボール
形成装置の回路の構成を示す図である。
FIG. 1 is a diagram showing a circuit configuration of a ball bonder forming apparatus for a wire bonder according to the present invention.

【図2】図2は、従来のワイヤボンダー用ボール形成装
置の回路の構成を示す図である。
FIG. 2 is a diagram showing a circuit configuration of a conventional wire bonder ball forming apparatus.

【図3】図3は、正常波形と高周波が発生して異常放電
がなされていることを示す電圧波形図である。
FIG. 3 is a voltage waveform diagram showing that a normal waveform and a high frequency are generated to cause an abnormal discharge.

【符合の説明】[Explanation of sign]

1 電源回路 5 スイッチ回路 12 電流制御回路 12a 定電流回路 12b 高電圧定電流開閉素子 13 高周波検出回路 1 power supply circuit 5 switch circuits 12 Current control circuit 12a constant current circuit 12b High voltage constant current switching element 13 High frequency detection circuit

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 キャピラリ先端から突出したワイヤの先
端と放電電極との間に高電圧を印加することにより放電
を起こさせ、その放電エネルギーによりワイヤの先端部
を溶融してボールを形成するワイヤボンディング装置に
おいて、 電源回路と、該電源回路と接続された電流制御回路と、
該電流制御回路を介して接続された放電電極と、前記電
源回路と接続されたクランパと、前記電流制御回路及び
放電電極間と前記クランパとの間で接続された高周波検
出回路とを備え、前記高周波検出回路は、異常放電時に
放電電極から発生する高周波を検出できるようにしたこ
とを特徴とするワイヤボンディング装置における高周波
検出装置。
1. A wire bonding for forming a ball by applying a high voltage between a tip of a wire protruding from a tip of a capillary and a discharge electrode to cause a discharge, and the discharge energy melts the tip of the wire to form a ball. In the device, a power supply circuit, a current control circuit connected to the power supply circuit,
A discharge electrode connected via the current control circuit, a clamper connected to the power supply circuit, and a high frequency detection circuit connected between the current control circuit and the discharge electrode and the clamper, A high-frequency detection device in a wire bonding device, wherein the high-frequency detection circuit is capable of detecting a high frequency generated from a discharge electrode during abnormal discharge.
【請求項2】 キャピラリ先端から突出したワイヤの先
端と放電電極との間に高電圧を印加することにより放電
を起こさせ、その放電エネルギーによりワイヤの先端部
を溶融してボールを形成するワイヤボンディング装置に
おいて、 電源回路と、該電源回路と接続された電流制御回路と、
該電流制御回路を介して接続された放電電極と、前記電
源回路と接続されたクランパと、前記電流制御回路及び
放電電極間と前記クランパとの間で接続された高周波検
出回路とを備え、前記高周波検出回路により異常放電時
に放電電極から発生する高周波が検出された場合には告
知手段により告知させるようにしたことを特徴とするワ
イヤボンディング装置における高周波検出装置。
2. A wire bonding for forming a ball by applying a high voltage between a tip of a wire protruding from a tip of a capillary and a discharge electrode to cause a discharge and melting the tip of the wire by the discharge energy. In the device, a power supply circuit, a current control circuit connected to the power supply circuit,
A discharge electrode connected via the current control circuit, a clamper connected to the power supply circuit, and a high frequency detection circuit connected between the current control circuit and the discharge electrode and the clamper, A high-frequency detection device in a wire bonding device, wherein when a high-frequency generated from the discharge electrode is detected by the high-frequency detection circuit during abnormal discharge, the notification means notifies the high-frequency detection device.
【請求項3】 キャピラリ先端から突出したワイヤの先
端と放電電極との間に高電圧を印加することにより放電
を起こさせ、その放電エネルギーによりワイヤの先端部
を溶融してボールを形成するワイヤボンディング装置で
あって、異常放電時に放電電極から発生する高周波を検
出できるようにしたことを特徴とするワイヤボンディン
グ装置における高周波検出方法。
3. A wire bonding for forming a ball by applying a high voltage between a tip of a wire protruding from a tip of a capillary and a discharge electrode to cause a discharge and melting the tip of the wire by the discharge energy. A high frequency detecting method in a wire bonding apparatus, which is capable of detecting a high frequency generated from a discharge electrode during abnormal discharge.
JP3194983A 1991-07-10 1991-07-10 Device and method for detecting high frequency in wire bonding device Pending JPH0521501A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3194983A JPH0521501A (en) 1991-07-10 1991-07-10 Device and method for detecting high frequency in wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3194983A JPH0521501A (en) 1991-07-10 1991-07-10 Device and method for detecting high frequency in wire bonding device

Publications (1)

Publication Number Publication Date
JPH0521501A true JPH0521501A (en) 1993-01-29

Family

ID=16333591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3194983A Pending JPH0521501A (en) 1991-07-10 1991-07-10 Device and method for detecting high frequency in wire bonding device

Country Status (1)

Country Link
JP (1) JPH0521501A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549576A (en) * 1977-06-24 1979-01-24 Shinkawa Seisakusho Kk Method of detecting formed pole at wire bonding unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549576A (en) * 1977-06-24 1979-01-24 Shinkawa Seisakusho Kk Method of detecting formed pole at wire bonding unit

Similar Documents

Publication Publication Date Title
JP2617351B2 (en) Wire connection failure detection method
JP4118964B2 (en) Arc extinguishing circuit and arc extinguishing method
JPH0521501A (en) Device and method for detecting high frequency in wire bonding device
JPH07245187A (en) Strobe device
US20040000537A1 (en) Micro-welder
JP2611891B2 (en) Wire bonding apparatus and method
JP2676437B2 (en) Ball forming device for wire bonder
JPS6215017A (en) Wire-cut electric discharge machine
JP2904618B2 (en) Ball forming device for wire bonder
JP2764664B2 (en) Ball forming apparatus and method for wire bonder
JP2611899B2 (en) Ball forming apparatus and method for wire bonder
JP2568140B2 (en) Wire bonding apparatus and method
JP2676438B2 (en) Wire bonding apparatus and method
JP2956761B2 (en) Capillary contact state detection device
JPH0158868B2 (en)
JP2757237B2 (en) Ball forming device for wire bonder
JP2630887B2 (en) Wire bonding equipment
JP2611894B2 (en) Wire bonding equipment
JPH11191564A (en) Bump bonding method and equipment
JPH08236587A (en) Defective bonding detecting method and device in wire bonding device
JPH0473326B2 (en)
JP2630886B2 (en) Wire bonding equipment
JPH0324293Y2 (en)
KR820001255B1 (en) Lightning prevention device of arc welding machine
JPS63119540A (en) Ball forming apparatus for wire bonding