JPH05214216A - Epoxy resin molding material for sealing - Google Patents
Epoxy resin molding material for sealingInfo
- Publication number
- JPH05214216A JPH05214216A JP4018098A JP1809892A JPH05214216A JP H05214216 A JPH05214216 A JP H05214216A JP 4018098 A JP4018098 A JP 4018098A JP 1809892 A JP1809892 A JP 1809892A JP H05214216 A JPH05214216 A JP H05214216A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- sealing
- molding material
- reaction product
- coupling agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電気部品、電子部品、半
導体素子等を封止するための、封止用エポキシ樹脂成形
材料に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing epoxy resin molding material for sealing electrical parts, electronic parts, semiconductor elements and the like.
【０００２】[0002]
【従来の技術】近年、電気、電子機器の高性能化、高信
頼性、生産性向上のため、プラスチックによる封止が行
われているが、吸湿半田処理後にリードフレームダイパ
ット面との剥離が発生し、パッケージクラックにつなが
るという問題があった。2. Description of the Related Art In recent years, plastics have been used to improve the performance of electrical and electronic equipment, as well as to improve their reliability and productivity. There was a problem that it occurred and led to a package crack.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、従来材料ではリードフレームダイパット面との剥
離が発生し、パッケージクラックにつながりやすい。本
発明は従来の技術における上述の問題点に鑑みてなされ
たもので、その目的とするところは吸湿半田処理後の耐
クラック性に優れた封止用エポキシ樹脂成形材料を提供
することにある。As described in the prior art, with the conventional material, peeling from the lead frame die pad surface occurs, which easily leads to package cracks. The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide an epoxy resin molding material for encapsulation which is excellent in crack resistance after moisture absorption soldering.
【０００４】[0004]
【課題を解決するための手段】本発明は、アミノシラン
カップリング剤と、エポキシ基含有オルガノポリシロキ
サンとの反応物を含有したことを特徴とする封止用エポ
キシ樹脂成形材料のため、上記目的を達成することが出
来たもので、以下本発明を詳細に説明する。The present invention provides an epoxy resin molding material for encapsulation, which contains a reaction product of an aminosilane coupling agent and an epoxy group-containing organopolysiloxane. The present invention has been accomplished, and the present invention will be described in detail below.
【０００５】本発明に用いるエポキシ樹脂は、ビスフェ
ノ−ルＡ型エポキシ樹脂、ビスフェノ−ルＦ型エポキシ
樹脂、ノボラック型エポキシ樹脂、可撓性エポキシ樹
脂、ハロゲン化エポキシ樹脂、グリシジルエステル型エ
ポキシ樹脂、高分子型エポキシ樹脂等のようにエポキシ
樹脂全般を用いることができる。アミノシランカップリ
ング剤としては全般を用いることができ、特に限定する
ものではない。エポキシ基含有オルガノポリシロキサン
としては、１分子中にエポキシ基を含有するオルガノポ
リシロキサンであればよく特に限定しない。アミノシラ
ンカップリング剤と、エポキシ基含有オルガノポリシロ
キサンとの反応は、５０〜１６０℃で２０〜１２０分間
加熱することにより反応物を得ることができ、両者の比
率は特に限定しない。無機質充填剤としてはタルク、ク
レー、シリカ、炭酸カルシュウム、水酸化アルミニゥ
ム、ガラス繊維、アスベスト繊維、セラミック繊維等の
無機質充填剤全般を用いることができ特に限定するもの
ではない。架橋剤及び又は硬化剤としては、フェノール
樹脂、メラミン樹脂、アクリル樹脂、イソシアネート、
アミン系硬化剤、酸無水物、ルイス酸錯化合物等が用い
られ、特に限定しない。必要に応じて用いられる硬化促
進剤としては、リン系及び又は３級アミン系硬化促進剤
等を用いることが出来る。かくして上記材料を配合、混
合、混練、粉砕し更に必要に応じて造粒して封止用エポ
キシ樹脂成形材料を得るものである。更に該封止用成形
材料の成形については、圧縮成形、トランスフアー成
形、射出成形等で封止成形するものである。The epoxy resin used in the present invention includes bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, flexible epoxy resin, halogenated epoxy resin, glycidyl ester type epoxy resin, high All epoxy resins such as molecular type epoxy resins can be used. All aminosilane coupling agents can be used and are not particularly limited. The epoxy group-containing organopolysiloxane is not particularly limited as long as it is an organopolysiloxane containing an epoxy group in one molecule. In the reaction between the aminosilane coupling agent and the epoxy group-containing organopolysiloxane, the reaction product can be obtained by heating at 50 to 160 ° C. for 20 to 120 minutes, and the ratio of the two is not particularly limited. As the inorganic filler, any inorganic filler such as talc, clay, silica, calcium carbonate, aluminum hydroxide, glass fiber, asbestos fiber, ceramic fiber can be used and is not particularly limited. As the cross-linking agent and / or the curing agent, phenol resin, melamine resin, acrylic resin, isocyanate,
Amine-based curing agents, acid anhydrides, Lewis acid complex compounds and the like are used and are not particularly limited. As the curing accelerator used if necessary, phosphorus-based and / or tertiary amine-based curing accelerators and the like can be used. Thus, the above materials are blended, mixed, kneaded, pulverized, and further granulated as required to obtain an epoxy resin molding material for sealing. Further, regarding molding of the molding material for sealing, sealing molding is performed by compression molding, transfer molding, injection molding or the like.
【０００６】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.
【０００７】[0007]
【実施例及び比較例】表１の配合表に従って材料を配
合、混合、混練、粉砕して封止用エポキシ樹脂成形材料
を得たが、エポキシ樹脂としては、エポキシ当量４７５
のビスフェノ−ルＡ型エポキシ樹脂を用い、反応物とし
てはアミノシランカップリング剤２重量部（以下単に部
と記す）に対し、エポキシ基含有オルガノポリシロキサ
ン１０部を添加し、８０℃で９０分間加熱反応させた反
応物を用い、フェノ−ル樹脂としてはノボラック型フエ
ノール樹脂を用いた。次に該封止用成形材料をトランス
ファー成形機を用いて金型温度１７５℃、成形圧力５０
Ｋｇ／ｃｍ2 、硬化時間３分間で素子を封止成形した。EXAMPLES AND COMPARATIVE EXAMPLES Materials were compounded, mixed, kneaded and pulverized according to the composition table of Table 1 to obtain epoxy resin molding materials for sealing.
10 parts of epoxy group-containing organopolysiloxane was added to 2 parts by weight of an aminosilane coupling agent (hereinafter simply referred to as “part”) as a reaction product, and the mixture was heated at 80 ° C. for 90 minutes. The reaction product was used, and a novolak type phenol resin was used as the phenol resin. Next, the molding material for sealing is molded using a transfer molding machine at a mold temperature of 175 ° C. and a molding pressure of 50.
The element was sealed and molded at Kg / cm 2 and a curing time of 3 minutes.
【０００８】[0008]
【表１】
（部） 実施例及び比較例の性能は、表２のようである。[Table 1]
(Part) The performances of Examples and Comparative Examples are shown in Table 2.
【０００９】吸湿半田処理時の耐クラック性は、ＰＣＴ
試験のアルミニューム線の腐食状態でみた。The crack resistance during moisture absorption soldering treatment is PCT
It was observed in the corrosion state of the aluminum wire in the test.
【００１０】[0010]
【表２】 [Table 2]
【００１１】[0011]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する封止用エポキシ
樹脂成形材料においては、吸湿半田処理時の耐クラック
性が向上する効果を有し、本発明の優れていることを確
認した。The present invention is constructed as described above.
It was confirmed that the epoxy resin molding material for encapsulation having the structure described in the claims has the effect of improving the crack resistance during the moisture absorption soldering process, and that the present invention is excellent.
Claims (1)
シ基含有オルガノポリシロキサンとの反応物を含有した
ことを特徴とする封止用エポキシ樹脂成形材料。1. An epoxy resin molding material for encapsulation, which contains a reaction product of an aminosilane coupling agent and an epoxy group-containing organopolysiloxane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4018098A JPH05214216A (en) | 1992-02-04 | 1992-02-04 | Epoxy resin molding material for sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4018098A JPH05214216A (en) | 1992-02-04 | 1992-02-04 | Epoxy resin molding material for sealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05214216A true JPH05214216A (en) | 1993-08-24 |
Family
ID=11962157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4018098A Pending JPH05214216A (en) | 1992-02-04 | 1992-02-04 | Epoxy resin molding material for sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05214216A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009061362A2 (en) * | 2007-11-02 | 2009-05-14 | Momentive Performance Materials Inc. | Textiles treated with copolymers of epoxy compounds and amind silanes |
| WO2009061371A3 (en) * | 2007-11-02 | 2009-07-30 | Momentive Performance Mat Inc | Copolymers of epoxy compounds and amino silanes |
| WO2012061699A3 (en) * | 2010-11-05 | 2012-08-16 | Momentive Performance Materials Inc. | Durable non-fluorine water repellent agent and process for preparing same |
-
1992
- 1992-02-04 JP JP4018098A patent/JPH05214216A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009061362A2 (en) * | 2007-11-02 | 2009-05-14 | Momentive Performance Materials Inc. | Textiles treated with copolymers of epoxy compounds and amind silanes |
| WO2009061371A3 (en) * | 2007-11-02 | 2009-07-30 | Momentive Performance Mat Inc | Copolymers of epoxy compounds and amino silanes |
| WO2009061362A3 (en) * | 2007-11-02 | 2009-08-06 | Momentive Performance Mat Inc | Textiles treated with copolymers of epoxy compounds and amind silanes |
| US8530601B2 (en) | 2007-11-02 | 2013-09-10 | Momentive Performance Materials Inc. | Copolymers of epoxy compounds and amino silanes |
| EP2617893A3 (en) * | 2007-11-02 | 2013-12-18 | Momentive Performance Materials Inc. | Textiles treated with copolymers of epoxy compounds and amino silanes |
| EP2617892A3 (en) * | 2007-11-02 | 2013-12-18 | Momentive Performance Materials Inc. | Textiles treated with copolymers of epoxy compounds and amino silanes |
| EP2617891A3 (en) * | 2007-11-02 | 2013-12-25 | Momentive Performance Materials Inc. | Textiles treated with copolymers of epoxy compounds and amino silanes |
| WO2012061699A3 (en) * | 2010-11-05 | 2012-08-16 | Momentive Performance Materials Inc. | Durable non-fluorine water repellent agent and process for preparing same |
| US8329255B2 (en) | 2010-11-05 | 2012-12-11 | Momentive Performance Materials Inc. | Durable non-fluorine water repellent agent and process for preparing same |
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