JPH0521415A - Semiconductor processor - Google Patents

Abstract

PURPOSE:To continue the operation of a pump successively and to see that a semiconductor is not exposed to air in the middle of processing by circulating first processing liquid in a second circulation system when the processing by the first processing liquid is finished, and replacing the first processing liquid in a processing bath with the second processing liquid in this condition. CONSTITUTION:When the processing by HF is finished, the supply of HF to a processing bath by a flow control valve 209 is stopped, and all HF circulates to a circulation pump 103, a filter 104, a flow control valve 209, an auxiliary bath supply line 212, and an auxiliary bath 206. Next, HF is all let fall to the auxiliary bath 106 by opening a drain port 106, and then pure water is supplied form a pure water supply port 210 to clean a semiconductor wafer; with which the processing is finished. After that, the semiconductor wafer is pulled up, and pure water 107 is drained through a drain line 204. Furthermore, the processing liquid 107 inside the processing bath 101 is made HF again through the control valve 209 to provide for new processing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor processing apparatus, and more particularly to a semiconductor processing apparatus for processing a semiconductor wafer with a plurality of processing solutions.

[0002]

2. Description of the Related Art FIG. 3 is a schematic diagram of a conventional semiconductor processing apparatus. As shown in FIG. 3, a processing bath 107 contains a processing solution 107 for processing a semiconductor wafer. The processing liquid overflowing from the processing bath 101 is recovered by the recovery unit 102, dust and the like are removed by the circulation pump 103 through the filter 104, and then returned to the processing bath 101 from the processing liquid supply port 105. On the other hand, the processing liquid 107 in the processing tank 101 is discharged from the drain port 106. And
Pure water 113 for washing semiconductor wafers is washed with water 1
It is housed in 10. The washing tank 110 has a pure water supply port 1
Pure water is supplied from 12, and the overflowed pure water 113 is discharged from the drain port 111.

The operation of the above-described structure will be described below.

A semiconductor wafer (not shown) to be treated with a chemical liquid is dipped in the treatment liquid 107 in the treatment tank 101 for a predetermined time and subjected to a predetermined chemical treatment in the semiconductor process. The treatment liquid 107 in the treatment tank 101 circulates from the recovery unit 102 to the treatment tank 101 via the circulation pump 103, the filter 104, and the treatment liquid supply port 105. By this circulation, the treatment liquid is dedusted and always kept in a clean state. The semiconductor wafer that has been processed in the processing tank 101 is pulled out from the processing tank 101 and washed in the washing tank 1.
Moved to 01.

The wafer is washed with pure water 11 in this washing tank 110.
3, the overflow cleaning process is performed.

In order to replace the processing solution 107 in the processing tank 101 with another processing solution, the circulation pump 103 is temporarily stopped and
The treatment liquid 107 is drained and a new treatment liquid is poured into the bath 101. After this, the circulation pump 103 is operated again to circulate the processing liquid.

[0007]

As described above, the conventional semiconductor processing apparatus is constructed such that the semiconductor wafer is moved between the two tanks, the processing tank 101 and the water washing tank 110, to perform the processing and the water washing. It had been. Therefore, the processing tank 10
While transferring the semiconductor wafer from 1 to the washing tank 110,
The wafer may be contaminated with dust in the atmosphere, or the processing solution may drop during the transfer, resulting in uneven processing solution. For example, when the processing liquid is an etching liquid, uneven etching may occur on the wafer surface.

Further, when the processing liquid in the processing tank 101 is changed, the repetition of stopping and restarting the circulation pump 103 changes the pressure applied to the filter 104. Along with this, the result is that the captured dust is supplied to the processing tank 101 again, which causes a significant decrease in the particle capturing function.

The present invention has been made in view of the above,
An object of the invention is to provide a semiconductor processing apparatus in which the pump is continuously operated and the semiconductor wafer is not exposed to the air during the processing.

[0010]

The first device of the present invention comprises:
A first circulation system that circulates a first processing liquid that processes the wafer between a processing tank that stores semiconductor wafers, a pump, and a filtration filter, and the first processing liquid that is supplied to the pump and the pump. A second circulation system that bypasses the treatment tank to circulate between the filtration filter and the circulation of the first treatment liquid in the first circulation system, and the second circulation system. In the state, the first treatment liquid is discharged to the outside, and the second treatment liquid is caused to flow into the treatment tank. ,
The second processing liquid in the processing tank is discharged to the outside, the first processing liquid in the second circulation system is allowed to flow into the processing tank, and the first circulation system is again supplied with the second processing liquid. And a second processing liquid replacement means for circulating the first processing liquid.

In a second apparatus of the present invention, in the first apparatus, the ratio of the amount of the first processing liquid flowing through the first circulation system to the amount of flowing through the second circulation system is arbitrary. And a flow rate comparison and adjustment means that is adjustable.

A third device of the present invention is the above-mentioned first or second device.
In the above apparatus, the first or second second circulation system is configured to include a preliminary tank for accommodating the first processing liquid.

[0013]

The semiconductor wafer is processed in the processing tank while the first processing liquid is circulating in the first circulation system. After the treatment with the first treatment liquid is completed, the first treatment liquid is circulated in the second circulation system and is prevented from flowing into the second circulation system. In this state, the first processing liquid in the processing tank is replaced with the second processing liquid. When the processing of the wafer with the second processing liquid is completed, the second processing liquid is discharged from the processing bath. After this,
The first processing liquid circulated in the second circulatory system is returned to the first processing liquid again.
Inject and circulate in the circulation system.

[0014]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic diagram of a semiconductor processing apparatus according to an embodiment of the present invention. As shown in FIG. 1, a processing bath 1 for processing a semiconductor wafer has a processing solution 1
07 are accommodated. In the processing tank 101, the recovery unit 10
2 drainage port 203 and the drainage port 106 on the bottom of the processing tank 101
Have. Any of the drainage ports 203 and 106 has a reserve tank 2
06 and is connected to the drain line 204. The processing liquid in the preliminary tank 206 reaches the flow rate control valve 209 from the circulation pump 103 through the filtration filter 104. By the action of the flow rate control valve 209, a part of the processing liquid is returned to the processing tank 101 through the processing tank supply line 213, and the rest is circulated to the preliminary tank 206 through the preliminary tank supply line 212. The flow rate control valve 209 allocates the flow rate of the liquid from the filter 104 to the processing tank supply line 213 and the preliminary tank supply line 212 at an arbitrary ratio. Of course, it is also possible to switch the flow to only one of them. And in the normal case, they are circulated in about half. In addition to the treatment tank supply line 213, the treatment tank 101 is also provided with a pure water supply line 210 and a new solution supply line 215, so that pure water for cleaning processing and new solution for another processing can be freely supplied. It is possible to supply.

The operation of the semiconductor wafer having the above-described structure will be described by taking a case where the semiconductor wafer is chemically treated with an aqueous solution of hydrofluoric acid (HF) and then washed with pure water.

In the processing tank 101, HF is used as the processing liquid 107.
Is satisfied. A semiconductor wafer set on a carrier (not shown) is dipped in the liquid 107 for a predetermined time and is subjected to a predetermined chemical treatment. In this case, the processing liquid (HF) overflowing from the processing tank 101 falls from the recovery unit 102 into the auxiliary tank 206 through the drain port 203 and the auxiliary tank supply line 205. The treatment liquid (HF) in the preliminary tank 206 is subjected to a filter treatment such as particle removal from the circulation pump 103 through the filter 104, and a part of the treatment liquid 107 is passed through the treatment tank supply line 213 through the flow rate control valve 209.
Circulate to. Then, the rest of the processing liquid divided by the flow rate control valve 209 is circulated to the preliminary tank 206 through the preliminary tank supply line 212.

When the treatment with the treatment liquid (HF) is completed,
The supply of the processing liquid to the processing bath 101 is stopped by the flow rate control valve 209, and all the processing liquid is circulated from the preliminary bath supply line 212 to the preliminary bath 206. As a result, the processing liquid in the preliminary tank 206 is circulated to the circulation pump 103, the filter 104, the flow rate control valve 209, the preliminary tank supply line 212, and the preliminary tank 206.

Next, the drainage port 106 of the processing tank 101 is opened to drop all the processing liquid 107 into the preliminary tank 206. Incidentally, when the treatment liquid 107 is not used thereafter, the drainage liquid is drained from the drain line 204. After draining the processing liquid 107 from the processing tank 101, pure water is supplied from the pure water supply port 210 to wash the semiconductor wafer, and the processing is completed.

Thereafter, the semiconductor wafer is pulled up and the treatment liquid (pure water) in the treatment tank 101 is passed through the drain line 204.
Drain 107. Furthermore, the flow control valve 2
The HF, which has been circulated through the preparatory tank 206 through 09, is led to the processing tank supply line 213, so that the processing liquid 107 in the processing tank 101 becomes HF again to prepare for new processing.

As a result of the above-mentioned operation, the problem of vibration applied to the wafer and the hydrophobicity of the wafer surface, which have conventionally been caused by moving the semiconductor wafer between the baths between the chemical treatment and the cleaning treatment. In addition, the problem that the wafer surface becomes active and dust is likely to adhere is solved. Further, since the semiconductor wafer is not moved between the baths, it is possible to keep a clean wafer surface. Further, since it is not necessary to stop or restart the pump due to the exchange of the processing liquid, pressure fluctuations on the filter for removing particles in the processing liquid are eliminated, and the cleanliness of the processing liquid can be improved.

FIG. 2 shows a modification of the processing tank 101 of FIG. That is, FIG. 2 shows a part of the single-wafer processing apparatus. As shown in FIG. 2, the wafer 304 is immersed in the treatment liquid 107 in the treatment tank 101, and the treatment liquid is supplied from the supply port 303 to the wafer 304 and discharged from the drain port 106. The supply system and drainage system are the same as in FIG.

[0023]

As described above, according to the semiconductor processing apparatus of the present invention, since it is possible to switch the processing liquid in the processing tank without stopping the pump, it is possible to maintain the dust removal capability. Moreover, since it is not necessary to move the semiconductor wafer between the chemical treatment and the cleaning treatment, it is possible to prevent dust adhesion and liquid dripping on the semiconductor wafer due to the movement, so that the quality and process reliability can be improved. Further, since the chemical solution treatment and the cleaning treatment can be performed in one treatment tank, the device can be downsized.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a semiconductor processing apparatus according to an embodiment of the present invention.

FIG. 2 is a partial schematic configuration diagram showing another example of the processing tank having the configuration of FIG.

FIG. 3 is a schematic configuration diagram of a conventional semiconductor processing apparatus.

[Explanation of symbols]

101 processing tank 102 Collection Department 103 Circulation pump 104 filters 105 Processing liquid supply port 106 drain 107 treatment liquid 110 wash tank 111 drain 112 Pure water supply port 113 pure water 203 drain 204 drainage line 205 Spare tank supply line 206 Spare tank 209 Flow control valve 210 Pure water supply port 212 Spare tank supply line 213 Processing tank supply line 215 New liquid supply line 303 Supply port 304 wafer

Claims (3)

[Claims] 1. A first circulation system for circulating a first treatment liquid for treating the wafer between a treatment tank for accommodating semiconductor wafers, a pump, and a filtration filter, and the first treatment liquid. A second circulation system that circulates the treatment tank by bypassing the treatment tank between the pump and the filtration filter, and stops the circulation of the first treatment liquid in the first circulation system; Only the circulation in the second circulation system is continued, and in this state, the first treatment liquid in the treatment tank is discharged to the outside,
A first processing liquid replacement means for causing the second processing liquid to flow into the processing tank, the second processing liquid in the processing tank being discharged to the outside, and the second processing liquid in the second circulation system being discharged. A second processing liquid replacement means for causing the first processing liquid to flow into the processing bath and to circulate the first processing liquid again in the first circulation system. apparatus. 2. A flow rate comparison and adjustment means capable of arbitrarily adjusting the ratio of the amount of the first processing liquid flowing through the first circulation system to the amount of the first processing liquid flowing through the second circulation system. Item 1
The described device. 3. The apparatus according to claim 1, wherein the second circulation system is provided with a preliminary tank for accommodating the first processing liquid.