JPH05206308A - Surface mounting component - Google Patents

Abstract

PURPOSE:To provide an electromagnetic shield function while vacuum adsorption can be performed with an automatic mounting machine without sacrificing the surface space of wiring substrates such as multilayer ceramic substrate or printed circuit board. CONSTITUTION:The present invention comprises wiring substrates 2 such as multilayer ceramic substrate or printed circuit board, an electronic component 3 installed on the wiring substrates 2, and a metal cap 5 which covers the electronic component 3 and has a flat shape on at least a part of top face. Engagement parts 2a and 5a for engaging each other are formed on the inner lower part of the metal cap 5 and the side of the wiring substrates 2. By engaging the engagement part 5a of the metal cap 5 with the engagement part 2a of the wiring substrates 2, the metal cap 5 is fixed on the wiring substrates 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component, and more particularly to a surface mount component which can be attracted by an automatic mounting machine and has an electromagnetic shield function.

[0002]

2. Description of the Related Art A surface mount component (composite circuit component) in which electronic component elements such as ICs are arranged on a wiring substrate such as a multilayer ceramic substrate or a printed circuit board is, for example, There are surface mount components as shown in FIGS. 6, 7 and 8.

The surface mount device shown in FIG. 6 has electrodes 5 on its side surface.
1 is a surface mount component in which an IC package 53 is mounted on a multilayer ceramic substrate 52 on which 1 is formed. This surface-mounted component has a flat upper surface (top surface) of the IC package 53 and can be vacuum-sucked in the process of mounting using an automatic mounting machine, so that it is excellent in workability during mounting. Since no electromagnetic shield is applied, the reliability is low and there is a problem that it may not be used depending on the application.

The surface mount device shown in FIG. 7 has an IC mounted on a multilayer ceramic substrate 52 having electrodes 51 formed on the side surfaces.
It is formed by mounting a chip 63 and sealing it with a resin 54 for sealing. Although this surface mount component is easy to manufacture and has excellent economical efficiency, it cannot be vacuum-sucked using an automatic mounting machine because the flatness of the upper surface (top surface) cannot be ensured. Inferior in workability at time,
Further, there is a problem that it has no electromagnetic shielding property and is easily affected by noise.

Further, the surface mount component shown in FIG. 8 has an I on a multilayer ceramic substrate 52 having electrodes 51 formed on the side surfaces.
While mounting the C chip 63, using the frame member 55,
It is a surface mount component in which the IC chip 63 is sealed by filling the resin 54 for sealing inside the frame member 55. In this surface-mounted component, the flatness of the upper surface (top surface) is secured by using the frame member 55 and filling the inside thereof with the resin 54. Therefore, the wiring pattern of the multilayer ceramic substrate inside the frame member 55 is made of resin. Since it will be buried in the space, the space will be sacrificed by that much, and there is a problem that it will prevent high density, and since it does not have an electromagnetic shield function, it is easily affected by noise and its reliability is low. There is a problem.

The present invention has been made to solve the above problems and has a vacuum suction property by an automatic mounting machine without sacrificing the space on the surface of a wiring substrate such as a multilayer ceramic substrate or a printed circuit board, and , It is intended to provide a highly reliable surface mount component having an electromagnetic shield function.

[0007]

In order to achieve the above object, a surface mount component of the present invention comprises a wiring board such as a multilayer ceramic board or a printed board, and an electronic component element arranged on the wiring board. A metal cap that covers the electronic component element and at least a part of a top surface of which is flat, and forms an engaging portion that engages with a lower inner side of the metal cap and a side surface of the wiring board. The metal cap is fixed to the wiring board by engaging the engagement portion of the metal cap with the engagement portion of the wiring board.

[0008]

The electromagnetic shielding function is achieved by providing the electronic component element such as the IC chip mounted on the wiring board such as the multilayer ceramic substrate or the printed circuit board with the metal cap having at least a part of the upper surface (top surface) flat. In addition, since at least a part of the upper surface (top surface) of the metal cap is formed to be flat, vacuum suction can be performed by an automatic mounting machine. In addition, the space such as the wiring pattern on the upper surface of the wiring board on which the electronic component element is mounted is not buried in the resin filled to flatten the upper surface unlike the conventional surface mount component. It is possible to improve the degree of integration. Further, the metal cap is easily and reliably fixed to the wiring board by engaging the engaging portion formed on the inner side of the lower portion with the engaging portion formed on the side surface of the wiring board, thereby simplifying the manufacturing process. It becomes possible to change.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view showing the structure of a surface mount component according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the assembled surface mount component.

As shown in FIGS. 1 and 2, the surface mount component of this embodiment has electrodes (side electrodes) on two opposite side surfaces.
An IC chip (electronic component element) 3 is mounted on a multilayer ceramic substrate (wiring substrate) 2 on which 1 is formed, and this is sealed with a resin 4 for sealing, and from above, an upper surface (top surface) Is formed flat and a metal cap 5 having a short side facing the electrode 1 is formed so as to expose the electrode 1 on the side surface of the multilayer ceramic substrate 2.

The two side surfaces of the multilayer ceramic substrate 2 on which the electrodes 1 are not formed are opposed to each other.
Engagement portions 2a that engage with the engagement portions 5a formed inside the lower portions of the opposite side surfaces of the metal cap 5 are formed.
The engaging portion 2a is formed by forming a notch in a predetermined green sheet (the required number is determined by the film thickness) serving as an intermediate layer among a plurality of unsintered green sheets laminated by a method such as punching. It can be formed by superposing this on another green sheet having no notch and firing it integrally. However, the engaging portion 2a
The method of forming is not limited to the above method, and it may be formed by other methods. In the surface mount component of this embodiment, the engaging portion 2a is a concave recess having a rectangular planar shape, and the engaging portion 5a is cut and raised. The metal cap 5 is fixed to the multilayer ceramic substrate 2 by engaging the engaging portion 5a with the engaging portion 2a of the multilayer ceramic substrate 2.

In the surface mount component (composite circuit component) formed as described above, the IC chip (electronic component element) 3 mounted on the multilayer ceramic substrate 2 is sealed with the sealing resin 4. Since the metal cap 5 is fixed on the multilayer ceramic substrate 2 and electromagnetically shielded by the applied metal cap 5, and the upper surface (top surface) of the metal cap 5 is formed flat, vacuum adsorption by an automatic mounting machine is prevented. I have it. Further, the metal cap 5 is easily fixed to the multilayer ceramic substrate 2 by engaging the engaging portion 5a with the engaging portion 2a formed on the side surface of the multilayer ceramic substrate 2, and an IC chip (electronic component element) is obtained. Since a space such as a wiring pattern (not particularly shown in FIG. 1) on the upper surface of the multilayer ceramic substrate 2 on which 3 is mounted is not sacrificed, the degree of integration can be improved. The multilayer ceramic substrate 2 has a plurality of electrodes inside,
Although a capacitor or the like is formed, the engaging portion 2a is formed only on a part of the side surface thereof, and it hardly affects the degree of integration inside the multilayer ceramic substrate 2.

FIG. 3 is an exploded perspective view showing a surface mount component according to another embodiment of the present invention. In the surface mount component of this embodiment, the IC package 13 is used as an electronic component element. Further, in this embodiment, the engaging portions 2a and 5a formed on the multilayer ceramic substrate 2 and the metal cap 5 are hemispherical depressions (2a) and hemispherical protrusions (5a), respectively, so that they are surely secured to each other. Is formed to engage with.

FIG. 4 is an exploded perspective view showing a surface mount component according to still another embodiment of the present invention. In the surface mount component of this embodiment, the IC chip (electronic component element) 3 is sealed with the sealing resin 4, as shown in FIG.
Similar to the embodiment shown in FIG. 2, the engaging portion 2a of the multi-layer ceramic substrate 2 is formed in a chamfered portion of its four corners, and the engaging portion 5a of the metal cap 5 also corresponds thereto. Then, it is formed by bending the lower side of the protruding piece 5b provided at the four corners. In the surface mount component of this embodiment, since the engaging portions 2a are formed at the corners of the multilayer ceramic substrate, electrodes (side electrodes) are formed on all four side faces of the multilayer ceramic substrate.
1 can be formed.

FIG. 5 is a perspective view showing a surface mount component according to still another embodiment of the present invention. The surface mount component of this embodiment basically has the same configuration as that of the embodiment shown in FIGS. 1 and 2, but all surfaces except the lower surface of the multilayer ceramic substrate 2 are covered with the metal cap 5. It is formed so as to cover it, and is provided with a further excellent electromagnetic shield function.

In each of the above embodiments, the case where the multilayer ceramic substrate is used as the wiring substrate has been described, but in the surface mount component of the present invention, not only the multilayer ceramic substrate but also a printed circuit board or the like may be used as the wiring substrate. It is possible.

In the above embodiment, the case where the upper surface of the metal cap is formed to be entirely flat has been described.
The upper surface of the metal cap does not necessarily have to be flat as a whole, and at least a part of the upper surface may be flat so that vacuum suction can be performed by an automatic mounting machine.

In the surface mount component of the present invention,
The shapes of the wiring board and the engaging portion of the metal cap are not particularly limited, and can be formed in various shapes other than the shapes shown in the above embodiments.

Furthermore, in the above embodiment, the case where the electronic component element is a circuit element such as an IC chip or an IC package has been described, but the electronic component element is an IC chip or an IC.
The present invention can be applied to the case of a component other than a circuit element such as a package.

[0020]

As described above, the surface-mounted component of the present invention is an electronic component mounted on a wiring board, in which an engaging portion that engages with each other is formed inside the lower portion of the metal cap and the side surface of the wiring board. Since the metal cap is fixed to the wiring board by covering the element with the metal cap and engaging the engagement portion with the engagement portion on the side surface of the wiring board, it is possible to fix the metal cap to the wiring board. The electronic component element such as an IC chip mounted on the wiring board is electromagnetically shielded by the applied metal cap to improve reliability, and at least a part of the upper surface (top surface) of the metal cap is formed flat. Since it is possible to perform vacuum suction by the automatic mounting machine, workability in the mounting process is improved.

Further, the space such as the wiring pattern on the upper surface of the wiring board on which the electronic component element is mounted is not sacrificed, and the degree of integration can be improved. Further, the metal cap is easily and reliably fixed to the wiring board by engaging the engaging portion formed on the inner side of the lower portion with the engaging portion formed on the side surface of the wiring board, thereby simplifying the manufacturing process. Can be converted.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a structure of a surface mount component according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a surface mount component according to an embodiment of the present invention.

FIG. 3 is an exploded perspective view showing a surface mount component according to another embodiment of the present invention.

FIG. 4 is an exploded perspective view showing a surface mount component according to another embodiment of the present invention.

FIG. 5 is a perspective view showing a surface mount component according to another embodiment of the present invention.

FIG. 6 is a perspective view showing a conventional surface mount component.

FIG. 7 is a perspective view showing another conventional surface mount component.

FIG. 8 is a perspective view showing another conventional surface mount component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electrode 2 Multilayer ceramic substrate (wiring substrate) 2a Engagement part of a multilayer ceramic substrate 3 Electronic component element (IC chip) 5 Metal cap 5a Engagement part of metal cap 13 Electronic component element (IC package)

Claims (1)

[Claims] 1. A wiring board such as a multilayer ceramic board or a printed board, an electronic component element disposed on the wiring board, and a metal cap which covers the electronic component element and at least a part of an upper surface of which is flat. By providing an engaging portion that engages with each other inside the lower portion of the metal cap and the side surface of the wiring board, the engaging portion of the metal cap is engaged with the engaging portion of the wiring board. The surface mount component, wherein the metal cap is fixed to the wiring board.