JPH05198924A - Pattern formation - Google Patents
Pattern formationInfo
- Publication number
- JPH05198924A JPH05198924A JP703792A JP703792A JPH05198924A JP H05198924 A JPH05198924 A JP H05198924A JP 703792 A JP703792 A JP 703792A JP 703792 A JP703792 A JP 703792A JP H05198924 A JPH05198924 A JP H05198924A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- film
- pattern
- solution
- forming method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007261 regionalization Effects 0.000 title description 4
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 238000000034 method Methods 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 22
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000005470 impregnation Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 43
- 239000010409 thin film Substances 0.000 abstract description 6
- 238000007639 printing Methods 0.000 abstract description 4
- 239000000243 solution Substances 0.000 description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、基板、例えば電子機器
等に使用されるセラミックス配線基板上に、所望とする
機能成分、例えば典型的には配線のための導体、その他
絶縁体、誘電体、抵抗体等からなる所定形状の膜パター
ンを形成するパターン形成方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate, for example, a ceramic wiring substrate used for electronic equipment and the like, on a desired functional component, typically a conductor for wiring, other insulators and dielectrics. The present invention relates to a pattern forming method for forming a film pattern of a predetermined shape made of a resistor or the like.
【０００２】[0002]
【従来の技術】従来、アルミナ基板等のセラミックス基
板上に微細なパターンを形成する方法としては、 （ａ）スクリーン印刷法 （ｂ）レジスト形成−露光・現像−薄膜形成−リフトオ
フを行う方法 （ｃ）薄膜形成−レジスト形成−露光・現像−エッチン
グを行う方法 等が用いられていた。2. Description of the Related Art Conventionally, as a method for forming a fine pattern on a ceramic substrate such as an alumina substrate, (a) a screen printing method (b) a resist formation-exposure / development-thin film formation-lift-off method (c) ) A method of performing thin film formation-resist formation-exposure / development-etching and the like have been used.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記（ａ）の
方法においては、スクリーンメッシュから押し出される
ペーストの粘度特性の管理が難しいため、印刷時のペー
スト内への気泡の巻き込みによる断線が生じ易く、ま
た、基板の凹凸による断線，ショート等が発生し、この
ため量産レベルでは線間，線幅が各々１５０〜１００μ
ｍ程度のパターン解像度が限界であった。However, in the above method (a), since it is difficult to control the viscosity characteristics of the paste extruded from the screen mesh, disconnection easily occurs due to the inclusion of bubbles in the paste during printing. In addition, disconnection, short circuit, etc. occur due to unevenness of the substrate. Therefore, at the mass production level, the line spacing and line width are 150 to 100 μm, respectively.
The pattern resolution of about m was the limit.
【０００４】また、上記（ｂ）の方法においては薄膜形
成のための、蒸着装置，スパッタリング装置等が必要と
され、上記（ｃ）の方法ではこれに加えてエッチングの
ための酸処理設備、および廃液処理設備が必要となり、
いずれもコスト高なプロセスとなってしまっていた。本
発明は、上記事情に鑑み、印刷法における微細パターン
化への障害及び薄膜工程のコスト高を解決し、簡便でか
つ１００μｍ以下のパターン形成が可能なパターン形成
方法を提供することを目的とする。Further, the method (b) requires a vapor deposition apparatus, a sputtering apparatus, etc. for forming a thin film, and the method (c) additionally requires an acid treatment facility for etching, and Waste liquid treatment equipment is required,
Both were expensive processes. SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide a pattern forming method which solves the obstacles to fine patterning in the printing method and the high cost of the thin film process, and is simple and capable of forming a pattern of 100 μm or less. .
【０００５】[0005]
【課題を解決するための手段】上記目的を達成する本発
明のパターン形成方法は、基板上に所定の機能成分から
なる所定形状の膜パターンを形成するパターン形成方法
において、（１）基板表面に感光性樹脂の被膜を形成
し、（２）この被膜を所定のパターンに露光して現像す
ることにより上記膜パターンが形成される部分の被膜を
除去し、（３）上記基板を所定機能成分を含有する溶液
に晒し、（４）その後被膜を基板上から除去することを
特徴とするものである。The pattern forming method of the present invention which achieves the above object is a pattern forming method of forming a film pattern of a predetermined shape composed of a predetermined functional component on a substrate. A film of a photosensitive resin is formed, and (2) this film is exposed to a predetermined pattern and developed to remove the film in the portion where the film pattern is formed, and (3) the substrate is provided with a predetermined functional component. It is characterized by exposing to a solution containing (4) and thereafter removing the coating from the substrate.
【０００６】ここで上記基板としては、典型的には、ア
ルミナ基板等のセラミックス基板が用いられる。また、
上記基板表面に被膜される感光性樹脂として、感光性フ
ィルムを使用することが好ましい。さらに、上記機能成
分としては、典型的には有機金属が用いられ、この場合
基板上に導体パターンが形成されることになる。Here, as the substrate, a ceramic substrate such as an alumina substrate is typically used. Also,
A photosensitive film is preferably used as the photosensitive resin coated on the surface of the substrate. Furthermore, as the functional component, an organic metal is typically used, and in this case, a conductor pattern is formed on the substrate.
【０００７】また、上記基板を上記溶液に晒す方法とし
ては、例えば上記基板を上記溶液に浸漬させる方法を採
用してもよく、あるいは例えば上記基板に上記溶液を吹
付ける方法を採用してもよい。また、上記被膜が上記溶
液に対し耐含浸性を有するもの、即ち上記被膜が上記溶
液に濡れにくいものであることが好ましい。As the method of exposing the substrate to the solution, for example, a method of immersing the substrate in the solution may be adopted, or, for example, a method of spraying the solution on the substrate may be adopted. . Further, it is preferable that the coating film has impregnation resistance to the solution, that is, the coating film is hard to be wet with the solution.
【０００８】また、上記被膜を基板上から除去する方法
としては、例えば被膜を剥離する方法、基板を加熱する
ことにより被膜を消散せしめる方法等が採用される。As a method for removing the coating film from the substrate, for example, a method of peeling the coating film, a method of dissipating the coating film by heating the substrate, or the like is adopted.
【０００９】[0009]
【作用】本発明の基本プロセスを上記各ステップに沿っ
て以下に説明する。先ず、セラミックス基板等の基板
を、感光性（ポジ型：光に感光した部分が現像液に溶け
る、ネガ型：光に感光しない部分が現像液に溶ける）樹
脂製の被膜で覆う（上記（１））。この樹脂製の被膜は
液状のレジストを塗布し乾燥することにより形成するこ
とも可能であるが、感光性の樹脂を予めシート状に加工
した感光性フィルム（ドライフィルム）を基板に張り付
ける方法が簡便である。フィルムを張り付けた後、パタ
ーン形成される部分を取り除くように設計されたフォト
マスクで露光し、現像する（上記（２））。ドライフィ
ルムとしては、１．０％ＮａＣＯ3 水溶液といった弱ア
ルカリ溶液によって現像可能なものが市販されており、
これを使用することによって廃液の処理も容易となる。The basic process of the present invention will be described below along with the above steps. First, a substrate such as a ceramics substrate is covered with a photosensitive resin film (positive type: a portion exposed to light is soluble in a developing solution, negative type: a portion not exposed to light is soluble in a developing solution) (the above (1 )). This resin film can be formed by applying a liquid resist and drying it. However, a method in which a photosensitive film (dry film) prepared by processing a photosensitive resin into a sheet shape in advance is attached to a substrate is available. It's simple. After applying the film, the film is exposed with a photomask designed to remove the patterned portion and developed ((2) above). As a dry film, a film that can be developed with a weak alkaline solution such as a 1.0% NaCO 3 aqueous solution is commercially available.
By using this, the waste liquid can be easily treated.
【００１０】現像，乾燥後は、機能成分を含んだ溶液に
基板全体を浸漬し、あるいは溶液をスプレーする（上記
（３））。この溶液として例えば有機金属（メタロオー
ガニック）を採用すれば、導体パターンが得られること
になる。浸漬あるいはスプレーというプロセスをとるこ
とにより、従来個別に行なっていた基板両面へのパター
ン形成を一度に行なうことが可能となる。また、機能成
分を含む溶液に対して濡れないような樹脂被膜を使用す
ることによって、基板から被膜を除去した後の基板上の
不要な部分への機能成分の残留を避けることが可能とな
る。浸漬あるいはスプレーした後乾燥させ、樹脂被膜を
除去する（上記（４））。この樹脂被膜の除去は、この
樹脂被膜を、剥離剤を用いて、あるいは物理的な力を加
えることによって剥離することによって除去してもよい
が、基板の温度を例えば６００℃以上にすることによっ
て樹脂被膜を消散せしめてもよい。これにより所望のパ
ターンが得られることになる。After development and drying, the entire substrate is dipped in a solution containing a functional component, or the solution is sprayed ((3) above). If, for example, an organic metal (metalloorganic) is adopted as this solution, a conductor pattern can be obtained. By adopting the process of dipping or spraying, it becomes possible to perform pattern formation on both surfaces of the substrate, which was conventionally performed individually, at once. Further, by using a resin coating that does not wet the solution containing the functional component, it becomes possible to avoid the functional component from remaining on an unnecessary portion on the substrate after removing the coating from the substrate. After dipping or spraying, it is dried to remove the resin film (the above (4)). The resin coating film may be removed by peeling the resin coating film by using a release agent or by applying a physical force, but the substrate temperature is set to, for example, 600 ° C. or higher. The resin coating may be dissipated. As a result, a desired pattern can be obtained.
【００１１】本発明においては、パターン形成が不要な
部分に樹脂被膜を形成する手法として、例えばドライフ
ィルムを用いたフォトリソグラフィー法を使用すること
によって、ドライフィルム等の感光性樹脂の持つ解像度
で微細パターンを形成することが可能となる。具体的に
は１００μｍ以下の微細パターンの形成も可能となる。
また、パターン膜の形成も、溶液中に浸漬あるいは溶液
をスプレーすることにより行われるために、両面同時の
パターン形成が可能となり、また従来必要であった位置
合わせの必要もない。更に、乾燥後に樹脂被膜を剥離あ
るいは焼成することによって容易に完成品が得られる。In the present invention, a photolithography method using a dry film, for example, is used as a method for forming a resin film on a portion where pattern formation is unnecessary, so that a fine resin can be obtained at the resolution of a photosensitive resin such as a dry film. It becomes possible to form a pattern. Specifically, it becomes possible to form a fine pattern of 100 μm or less.
Further, since the pattern film is also formed by immersing it in a solution or spraying the solution, it is possible to form a pattern on both surfaces simultaneously, and there is no need for alignment, which was necessary in the past. Furthermore, the finished product can be easily obtained by peeling or baking the resin coating after drying.
【００１２】[0012]
【実施例】以下図面を参照して、本発明の実施例につい
て説明する。図１〜図６は、本発明の一実施例に係るパ
ターン形成方法の各工程を模式的に表わした図である。
厚み０．６３５ｍｍ、外形寸法７６．２×７６．２ｍｍ
のアルミナ基板１を６０℃に予熱し、これにドライフィ
ルム２（日本合成化学工業（株）製ＡＬＰＨＯ３３１Ｙ
５）を基板両面に張り付けた。張り付け時のローラ３の
温度を１００℃とし、ローラ３の加圧を４ｋｇ／ｃｍ2
とし、ラミネート速度を３０ｍｍ／ｓｅｃとした（図
１）。Embodiments of the present invention will be described below with reference to the drawings. 1 to 6 are diagrams schematically showing each step of a pattern forming method according to an embodiment of the present invention.
Thickness 0.635 mm, external dimensions 76.2 x 76.2 mm
Alumina substrate 1 of 1 is preheated to 60 ° C., and dry film 2 (ALPHO331Y manufactured by Nippon Synthetic Chemical Industry Co., Ltd.)
5) was attached to both sides of the substrate. The temperature of the roller 3 at the time of pasting is set to 100 ° C., and the pressure of the roller 3 is set to 4 kg / cm 2
And the laminating speed was 30 mm / sec (FIG. 1).
【００１３】常温で２０分間放置した後に、波長４０５
ｎｍにおいて１０ｍＷ／ｃｍ2 の光量をもつ紫外線ラン
プを有する両面同時露光装置を用いて、紫外光４で基板
裏面を全面露光、基板表面を最小線幅／線間ピッチ６０
μｍの微細パターンを持つフォトマスク５を基板に密着
させて露光した。露光時間は１２秒間とした（図２）。After leaving at room temperature for 20 minutes, the wavelength 405
Using a double-sided simultaneous exposure device having an ultraviolet lamp having a light amount of 10 mW / cm 2 in nm, the entire surface of the back surface of the substrate is exposed to ultraviolet light 4, and the minimum surface width / interline pitch of 60
A photomask 5 having a fine pattern of μm was brought into close contact with the substrate and exposed. The exposure time was 12 seconds (Fig. 2).
【００１４】室温で２０分間放置した後に６０℃に加温
した１．０％ＮａＣＯ3 溶液を基板表面から３０ｃｍ離
れた位置より基板両面に各々３０秒間スプレーした。ス
プレー圧は１．０ｋｇ／ｃｍ2 とした（図３）。流水に
て水洗した後に４０℃の温風中に５分間放置して乾燥し
た。以上の工程によって基板表面に線間／線幅６０／６
０μｍの樹脂被膜２ａが、また基板裏面にはその全面に
樹脂被膜２ｂが形成された（図４）。After standing at room temperature for 20 minutes, 1.0% NaCO 3 solution heated to 60 ° C. was sprayed on both sides of the substrate for 30 seconds from a position 30 cm away from the surface of the substrate. The spray pressure was 1.0 kg / cm 2 (Fig. 3). After washing with running water, it was dried by leaving it in warm air at 40 ° C. for 5 minutes. Through the above steps, the line spacing / line width is 60/6 on the substrate surface.
A resin coating 2a of 0 μm was formed, and a resin coating 2b was formed on the entire back surface of the substrate (FIG. 4).
【００１５】次に、（株）ノリタケカンパニーリミテッ
ド製のＡｕレジネート液ＧＧＭ−２５に基板全体を浸漬
し、取り出した後６０℃の乾燥器中で２０分間乾燥し、
Ａｕ膜７を形成した（図５）。乾燥後に６００℃１０分
キープ、１５℃／分の昇降温レートで焼成することによ
って、樹脂被膜が消失し、かつ線間／線幅６０／６０μ
ｍ、厚み約２μｍの緻密なＡｕ膜７となった（図６）。Next, the entire substrate was immersed in Au resinate solution GGM-25 manufactured by Noritake Company Limited, taken out, and then dried in a dryer at 60 ° C. for 20 minutes,
An Au film 7 was formed (FIG. 5). By keeping at 600 ° C for 10 minutes and baking at a temperature rising / falling rate of 15 ° C / min after drying, the resin film disappears, and the line spacing / line width is 60 / 60μ.
As a result, a dense Au film 7 having a thickness of m and a thickness of about 2 μm was obtained (FIG. 6).
【００１６】なお、上記実施例では基板片面にのみパタ
ーン形成を行なう場合を述べたが、基板裏面へのフォト
リソグラフィー工程を行なうことによって両面同時のパ
ターン形成も可能であることはいうまでもない。In the above-mentioned embodiment, the case where the pattern is formed only on one surface of the substrate is described, but it goes without saying that the pattern can be formed on both surfaces simultaneously by performing the photolithography process on the back surface of the substrate.
【００１７】[0017]
【発明の効果】以上、本発明により、印刷による微細パ
ターン化への障害および薄膜工程のコスト高を解決し、
簡便で１００μｍ以下のパターン形成が量産レベルで可
能となった。As described above, according to the present invention, the obstacle to the fine patterning by printing and the high cost of the thin film process are solved,
A simple pattern formation of 100 μm or less is possible at the mass production level.
【図１】アルミナ基板にドライフィルムを張り付ける工
程を示す模式図である。FIG. 1 is a schematic diagram showing a process of attaching a dry film to an alumina substrate.
【図２】露光工程を示す模式図である。FIG. 2 is a schematic diagram showing an exposure process.
【図３】現象液を基板表面にスプレーする工程を示す模
式図である。FIG. 3 is a schematic diagram showing a step of spraying a phenomenon liquid on the surface of a substrate.
【図４】所定パターンの樹脂被膜が形成された基板を示
す断面図である。FIG. 4 is a cross-sectional view showing a substrate on which a resin film having a predetermined pattern is formed.
【図５】所定パターンの樹脂被膜で覆われていない部分
にＡｕの膜が形成された基板を示す断面図である。FIG. 5 is a cross-sectional view showing a substrate having an Au film formed on a portion which is not covered with a resin film having a predetermined pattern.
【図６】樹脂被膜が消失した後の基板を示す断面図であ
る。FIG. 6 is a cross-sectional view showing the substrate after the resin coating has disappeared.
１ アルミナ基板 ２ ドライフィルム（感光性樹脂） ２ａ，２ｂ 樹脂被膜 ５ フォトマスク ６ Ｎａ2 ＣＯ3 溶液（現像液） ７ Ａｕ膜1 Alumina substrate 2 Dry film (photosensitive resin) 2a, 2b Resin coating 5 Photomask 6 Na 2 CO 3 solution (developing solution) 7 Au film
───────────────────────────────────────────────────── フロントページの続き (72)発明者 北村 弘司 埼玉県秩父郡横瀬町大字横瀬2270番地 三 菱マテリアル株式会社セラミックス研究所 内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Koji Kitamura 2270 Yokose, Yokose-cho, Chichibu-gun, Saitama Sanryo Materials Co., Ltd. Ceramics Laboratory
Claims (7)
状の膜パターンを形成するパターン形成方法において、 基板表面に感光性樹脂の被膜を形成し、 前記被膜を所定のパターンに露光して現像することによ
り前記膜パターンが形成される部分の前記被膜を除去
し、 前記基板を所定の機能成分を含有する溶液に晒し、 その後前記被膜を前記基板上から除去することを特徴と
するパターン形成方法。1. A pattern forming method for forming a film pattern of a predetermined shape comprising a predetermined functional component on a substrate, wherein a film of a photosensitive resin is formed on the surface of the substrate, and the film is exposed to a predetermined pattern and developed. By removing the coating film in the portion where the film pattern is formed, exposing the substrate to a solution containing a predetermined functional component, and then removing the coating film from the substrate. .
ことを特徴とする請求項１記載のパターン形成方法。2. The pattern forming method according to claim 1, wherein the substrate is a ceramic substrate.
して、感光性フィルムを使用することを特徴とする請求
項１記載のパターン形成方法。3. The pattern forming method according to claim 1, wherein a photosensitive film is used as the photosensitive resin coated on the surface of the substrate.
特徴とする請求項１記載のパターン形成方法。4. The pattern forming method according to claim 1, wherein the functional component is an organic metal.
基板を前記溶液に浸漬させ、あるいは前記基板に前記溶
液を吹付けるものであることを特徴とする請求項１記載
のパターン形成方法。5. The pattern forming method according to claim 1, wherein the method of exposing the substrate to the solution is to immerse the substrate in the solution or spray the solution onto the substrate.
有するものであることを特徴とする請求項１記載のパタ
ーン形成方法。6. The pattern forming method according to claim 1, wherein the coating film has impregnation resistance to the solution.
が、前記被膜を剥離し、あるいは前記基板を加熱するこ
とにより前記被膜を消散せしめるものであることを特徴
とするパターン形成方法。7. The pattern forming method, wherein the method of removing the coating film from the substrate is a method of exfoliating the coating film or heating the substrate to dissipate the coating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP703792A JPH05198924A (en) | 1992-01-20 | 1992-01-20 | Pattern formation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP703792A JPH05198924A (en) | 1992-01-20 | 1992-01-20 | Pattern formation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05198924A true JPH05198924A (en) | 1993-08-06 |
Family
ID=11654847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP703792A Pending JPH05198924A (en) | 1992-01-20 | 1992-01-20 | Pattern formation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05198924A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003124213A (en) * | 2001-10-09 | 2003-04-25 | Seiko Epson Corp | Pattern forming method, semiconductor device, electric circuit, display module, color filter, and light emitting element |
| JP2006222295A (en) * | 2005-02-10 | 2006-08-24 | Brother Ind Ltd | Manufacturing method of ultra fine wiring board |
-
1992
- 1992-01-20 JP JP703792A patent/JPH05198924A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003124213A (en) * | 2001-10-09 | 2003-04-25 | Seiko Epson Corp | Pattern forming method, semiconductor device, electric circuit, display module, color filter, and light emitting element |
| JP2006222295A (en) * | 2005-02-10 | 2006-08-24 | Brother Ind Ltd | Manufacturing method of ultra fine wiring board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4291118A (en) | Relief imaging liquids | |
| JPH0157516B2 (en) | ||
| US4119480A (en) | Method of manufacturing thick-film circuit devices | |
| US4376815A (en) | Method of applying photoresist by screening in the formation of printed circuits | |
| US20070072129A1 (en) | Method for forming flexible printed circuit boards | |
| KR20140139484A (en) | Method of processing a photosensitive structure | |
| US6653055B1 (en) | Method for producing etched circuits | |
| KR100601461B1 (en) | Solder resist pattern formation method of printed circuit board | |
| JPS62232989A (en) | Formation of circuit pattern on board | |
| JPH05198924A (en) | Pattern formation | |
| US20010012692A1 (en) | Thick-film etch-back process for use in manufacturing fine-line hybrid circuits | |
| US5376404A (en) | Method of coating ridged plates, particularly printed circuit boards | |
| JP2000156556A (en) | Method for forming resist layer on substrate having through hole part and production of printed wiring board | |
| JPH04365394A (en) | Manufacture of printed wiring board | |
| JPH05198941A (en) | Film formation | |
| JPS62280751A (en) | Developing method for printed wiring board | |
| GB2127324A (en) | Manufacture of printed circuit boards | |
| JP2710512B2 (en) | Manufacturing method of printed wiring board | |
| SU728109A1 (en) | Method of manufacturing protective reliefs | |
| JPS61139089A (en) | Manufacture of printed wiring board | |
| JP2730508B2 (en) | Manufacturing method of printed wiring board | |
| US5578186A (en) | Method for forming an acrylic resist on a substrate and a fabrication process of an electronic apparatus | |
| JPH02287354A (en) | Conductor pattern forming method | |
| JP2684854B2 (en) | Development method | |
| JP3755193B2 (en) | Method and apparatus for manufacturing printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19990921 |