JPH051969Y2 - - Google Patents
Info
- Publication number
- JPH051969Y2 JPH051969Y2 JP4661286U JP4661286U JPH051969Y2 JP H051969 Y2 JPH051969 Y2 JP H051969Y2 JP 4661286 U JP4661286 U JP 4661286U JP 4661286 U JP4661286 U JP 4661286U JP H051969 Y2 JPH051969 Y2 JP H051969Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductive
- annular conductor
- attached
- semiconducting
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 238000004804 winding Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 230000005684 electric field Effects 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
Landscapes
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は高圧回転電機の巻線に関し、特に巻線
の鉄心溝位置に取付けられるその表面電位を均一
化する半導電部材の取付構造に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a winding of a high-voltage rotating electric machine, and more particularly to a mounting structure for a semiconducting member that is attached to a core groove of a winding to equalize its surface potential.
従来のこの種の構造としては第3図、第4図に
示すものが広く知られている。図において、1は
使用電圧に耐え得る絶縁テープが巻装される環状
導体である巻線としての亀甲形線輪片、2はこの
線輪片1の鉄心溝(図示せず)に位置する直線部
に巻装された表面電位を均一にする第1半導電部
材である半導電シート、3はこの半導電シート2
を固定するために貼着された押えテープで、この
押えテープ3は所定間隔をもつて隙間lを形成す
るように線輪片1に巻装されて半導電シート2が
鉄心溝に直接接触するようになされている。4は
押えテープ3の線輪片1外端部に位置する表面テ
ープである。そして、5は半導電シート2外端部
に形成された隙間から線輪片1外端の表面テープ
4に亘り塗布された第2半導電部材である半導電
樹脂層である。
As conventional structures of this type, those shown in FIGS. 3 and 4 are widely known. In the figure, 1 is a tortoise-shell-shaped wire loop piece as a winding wire, which is a ring-shaped conductor wrapped with an insulating tape capable of withstanding the working voltage, and 2 is a straight line located in the core groove (not shown) of this wire loop piece 1. 3 is a semiconducting sheet 2 which is a first semiconducting member that makes the surface potential uniform, and is wrapped around the semiconductive sheet 2.
This presser tape 3 is wrapped around the wire ring piece 1 so as to form a gap l at a predetermined interval so that the semiconductive sheet 2 comes into direct contact with the core groove. It is done like this. 4 is a surface tape located at the outer end of the wire ring piece 1 of the presser tape 3. A semiconductive resin layer 5 is a second semiconductive member that is applied from a gap formed at the outer end of the semiconductive sheet 2 to the surface tape 4 at the outer end of the wire ring piece 1.
以上の構成を有するものを製作するには、先
ず、導体に絶縁テープを巻き付けた線輪片1に半
導電シート2を巻き付けることになるが、このと
き半導電シート2は鉄心溝に装着する直線部のみ
に巻き付け、これを固定するために、さらにこの
半導電シート2表面に押えテープ3を図示のよう
に所定間隔をもつて隙間lを形成するように巻き
付ける。この押えテープ3は線輪片1の外端部に
おいては表面テープ4として連続させて巻き付け
る。そして特に線輪片1の直線部から屈曲部に至
る部位には半導電樹脂層5を第4図に拡大して示
したように塗布する。これによつて線輪片1端部
における電界を緩和してその部位の部分放電を抑
制するようにしている。 In order to manufacture a device having the above configuration, first, the semiconductive sheet 2 is wrapped around the coil piece 1, which is a conductor wrapped with insulating tape. In order to fix the semiconductive sheet 2, a presser tape 3 is further wound around the surface of the semiconductive sheet 2 at predetermined intervals to form a gap 1 as shown in the figure. This presser tape 3 is continuously wound around the outer end of the wire loop piece 1 as a surface tape 4. Particularly, a semiconductive resin layer 5 is applied to a portion of the wire ring piece 1 extending from the straight portion to the bent portion as shown in an enlarged view in FIG. As a result, the electric field at the end of the wire ring piece 1 is relaxed, thereby suppressing partial discharge at that part.
従来の線輪片1は以上のように構成されている
ため、半導電シート2と半導電樹脂層5とのラツ
プ部分は、押えテープ3の存在によつてこれら両
者の電気的接触面積を十分に確保することができ
ず、この部位の電界を緩和するという本来の役割
を十分に発揮し得ないという問題点を有してい
た。
Since the conventional wire loop piece 1 is constructed as described above, the lap portion between the semiconductive sheet 2 and the semiconductive resin layer 5 has a sufficient electrical contact area between the two due to the presence of the presser tape 3. Therefore, the problem was that the original role of mitigating the electric field in this region could not be fully exerted.
この考案は叙上の問題点を解決するためになさ
れたもので、半導電シート2と半導電樹脂層5と
の電気的接触を完全にして電界緩和を十分にして
部分放電を有効に抑制することを目的とする。 This idea was made in order to solve the above-mentioned problems, and it makes complete electrical contact between the semiconducting sheet 2 and the semiconducting resin layer 5, sufficiently relaxing the electric field, and effectively suppressing partial discharge. The purpose is to
この考案は、高圧回転電機のの鉄心溝に装着さ
れる絶縁被覆した環状導体と、該環状導体の上記
溝部位置に対して取付けられた第1半導電部材
と、該第1半導電部材を上記環状導体に固定すべ
く該第1半導電部材の両外端部を除く領域に所定
間隔をもつて貼着された第1貼着帯と、上記第1
半導電部材の両外端部を上記環状導体に接着固定
する接着部材と、上記第1半導電部材が取付けら
れた領域を除く上記環状導体の領域に所定間隔を
もつて貼着された第2貼着部材と、上記第1半導
電部材の外端部から上記環状導体外端に亘り被覆
された第2半導電部材とを備えたものである。
This invention includes an annular conductor covered with an insulating coating that is installed in a core groove of a high-voltage rotating electrical machine, a first semiconducting member that is attached to the groove position of the annular conductor, and a first semiconducting member that is attached to the groove of the annular conductor. a first adhesive band attached at a predetermined interval to an area other than both outer ends of the first semiconductive member to be fixed to the annular conductor;
an adhesive member that adhesively fixes both outer ends of the semiconductive member to the annular conductor; and a second adhesive member that is attached at a predetermined interval to an area of the annular conductor excluding the area where the first semiconductive member is attached. The device includes an adhesive member, and a second semiconductive member that covers the outer end of the first semiconductive member and the outer end of the annular conductor.
この考案によれば、第1半導電部材と第2半導
電部材との電気的接触を完全にすることができ、
環状導体外端における電界緩和が十分となりこの
部位における部分放電を有効に抑制することがで
きる。
According to this invention, electrical contact between the first semiconducting member and the second semiconducting member can be made complete;
The electric field is sufficiently relaxed at the outer end of the annular conductor, and partial discharge at this location can be effectively suppressed.
以下第1図及び第2図に示す実施例に基づいて
従来と同一又は相当部分には同一符号を付してこ
の考案の特徴を中心に説明する。同図によれば、
半導電シート2を固定する第1貼着帯である押え
テープ3が線輪片1の直接部の両外端部を残した
状態に巻き付けられ、線輪片1外端の屈曲部は、
この半導電シート2端部から少し離隔した位置か
ら押えテープ3と同テープが第2貼着帯である表
面テープ4として巻き付けられている。ところ
が、半導電シート2端部は押えテープ3によつて
固定されていないことからこの固定が充分でな
く、そのため、接着部材である両面粘着テープ6
を用いて半導電シート2を線輪片1の絶縁テープ
に直接接着して固定する。このようにして半導電
シート2を十分露呈させて固定した上で、その端
部に従来のように半導電樹脂層5が塗布されてい
る。かかる構成にすることによつて半導電シート
2と半導電樹脂層5との電気的接触を十分に確保
することができることから線輪片1端部における
電界を従来よりもさらに有効に緩和することがで
き、したがつてこの部位における部分放電をさら
に効果的に抑制することができる。
Hereinafter, based on the embodiment shown in FIGS. 1 and 2, the features of this invention will be mainly explained, with the same or corresponding parts as those of the conventional device being designated by the same reference numerals. According to the same figure,
The holding tape 3, which is the first adhesive band for fixing the semiconductive sheet 2, is wrapped around the wire ring piece 1 with both outer ends of the direct part left intact, and the bent part of the outer end of the wire ring piece 1 is
A presser tape 3 and the same tape are wrapped as a surface tape 4, which is a second adhesive band, from a position a little apart from the end of the semiconductive sheet 2. However, since the ends of the semiconductive sheet 2 are not fixed by the presser tape 3, this fixation is not sufficient, and therefore the double-sided adhesive tape 6, which is the adhesive member, is not fixed.
The semiconducting sheet 2 is directly adhered and fixed to the insulating tape of the wire ring piece 1 using a . After the semiconductive sheet 2 is sufficiently exposed and fixed in this manner, a semiconductive resin layer 5 is applied to the end portion thereof as in the conventional manner. With this configuration, it is possible to ensure sufficient electrical contact between the semiconductive sheet 2 and the semiconductive resin layer 5, so that the electric field at the end of the wire ring piece 1 can be relaxed more effectively than before. Therefore, partial discharge in this region can be suppressed more effectively.
なお、上記実施例では半導電シート2端部の固
定に両面貼着テープ6を用いたものについて説明
したが、この部位の半導電シート2を線輪片1に
固定できるものであれば他の接着手段を使用して
もよいことは言うまでもない。 In the above embodiment, the double-sided adhesive tape 6 was used to fix the ends of the semiconductive sheet 2, but other methods may be used as long as this part of the semiconductive sheet 2 can be fixed to the coil piece 1. It goes without saying that adhesive means may also be used.
以上この考案によれば、高圧回転電機の鉄心溝
に装着される絶縁被覆した環状導体と、該環状導
体の上記溝部位置に対して取付けられた第1半導
電部材と、該第1半導電部材を上記環状導体に固
定すべく該第1半導電部材の両外端部を除く領域
に所定間隔をもつて貼着された第1貼着帯と、上
記第1半導電部材の両外端部を上記環状導体に接
着固定する接着部材と、上記第1半導電部材が取
付けられた領域を除く上記環状導体の領域に所定
間隔をもつて貼着された第2貼着部材と、上記第
1半導電部材の外端部から上記環状導体外端に亘
り被覆された第2半導電部材とを備えているの
で、第1半導電部材と第2半導電部材との電気的
接触を良好になし得、したがつてこの部分におけ
る電界の緩和を向上して部分放電をより有効に防
止することができる。
As described above, according to this invention, an annular conductor coated with an insulating coating is installed in a core groove of a high-voltage rotating electric machine, a first semiconducting member is attached to the groove position of the annular conductor, and the first semiconducting member is provided. a first adhesive band affixed at a predetermined interval to an area other than both outer ends of the first semiconducting member to fix it to the annular conductor; and both outer ends of the first semiconducting member. a second adhesive member that is attached at a predetermined interval to an area of the annular conductor excluding the area where the first semiconducting member is attached; Since the second semiconductive member is coated from the outer end of the semiconductive member to the outer end of the annular conductor, good electrical contact is made between the first semiconductive member and the second semiconductive member. Therefore, the relaxation of the electric field in this portion can be improved and partial discharge can be more effectively prevented.
第1図はこの考案に係る線輪片の構造を示す全
体斜視図、第2図はその要部拡大図、第3図は従
来の線輪片を示す第1図相当図、第4図はその第
2図相当図である。
図において、1は線輪片(導体)、2は半導電
シート(第1半導電部材)、3は押えテープ(第
1貼着帯)、4は表面テープ(第2貼着帯)、5は
半導電樹脂層(第2半導電部材)、6は両面粘着
テープ(接着部材)である。なお、各図中、同一
符号は同一又は相当部分を示す。
Figure 1 is an overall perspective view showing the structure of the wire ring according to this invention, Figure 2 is an enlarged view of its main parts, Figure 3 is a view equivalent to Figure 1 showing a conventional wire ring, and Figure 4 is an enlarged view of the main part. This is a diagram corresponding to Figure 2. In the figure, 1 is a wire loop piece (conductor), 2 is a semiconductive sheet (first semiconductive member), 3 is a presser tape (first adhesive band), 4 is a surface tape (second adhesive band), 5 6 is a semiconductive resin layer (second semiconductive member), and 6 is a double-sided adhesive tape (adhesive member). In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (1)
した環状導体と、該環状導体の上記溝部位置に
対して取付けられた第1半導電部材と、該第1
半導電部材を上記環状導体に固定すべく該第1
半導電部材の両外端部を除く領域に所定間隔を
もつて貼着された第1貼着帯と、上記第1半導
電部材の両外端部を上記環状導体に接着固定す
る接着部材と、上記第1半導電部材が取付けら
れた領域を除く上記環状導体の領域に所定間隔
をもつて貼着された第2貼着部材と、上記第1
半導電部材の外端部から上記環状導体外端に亘
り被覆された第2半導電部材とを備えたことを
特徴とする高圧回転電機の巻線。 (2) 上記接着部材を両面テープとしたことを特徴
とする実用新案登録請求の範囲第1項記載の高
圧回転電機の巻線。[Claims for Utility Model Registration] (1) An insulated annular conductor installed in a core groove of a high-voltage rotating electric machine, a first semiconducting member attached to the groove position of the annular conductor, and a first semiconductor member attached to the groove position of the annular conductor; 1
the first to fix the semiconducting member to the annular conductor;
a first adhesive band attached at a predetermined interval to an area other than both outer ends of the semiconductive member; and an adhesive member for adhesively fixing both outer ends of the first semiconductive member to the annular conductor. , a second adhesive member attached at a predetermined interval to an area of the annular conductor excluding the area where the first semiconductive member is attached;
A winding wire for a high-voltage rotating electrical machine, comprising: a second semiconductive member covering the outer end of the annular conductor from the outer end of the semiconductive member. (2) The winding wire for a high-voltage rotating electric machine according to claim 1, wherein the adhesive member is a double-sided tape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4661286U JPH051969Y2 (en) | 1986-03-26 | 1986-03-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4661286U JPH051969Y2 (en) | 1986-03-26 | 1986-03-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62159141U JPS62159141U (en) | 1987-10-09 |
JPH051969Y2 true JPH051969Y2 (en) | 1993-01-19 |
Family
ID=30866435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4661286U Expired - Lifetime JPH051969Y2 (en) | 1986-03-26 | 1986-03-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH051969Y2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6368400B1 (en) | 2000-07-17 | 2002-04-09 | Honeywell International | Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography |
US8053159B2 (en) | 2003-11-18 | 2011-11-08 | Honeywell International Inc. | Antireflective coatings for via fill and photolithography applications and methods of preparation thereof |
-
1986
- 1986-03-26 JP JP4661286U patent/JPH051969Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS62159141U (en) | 1987-10-09 |
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