JPH05190437A - Semiconductor manufacturing apparatus - Google Patents

Abstract

PURPOSE:To eliminate an irregularity when the amount of a chemical liquid (a resist) to be dropped is measured and adjusted, to prevent the coating defect of a wafer and to make a coating operation efficient. CONSTITUTION:A resist is dropped onto a weighing instrument 6, which is equipped with an analog output, through a discharge nozzle 1 from a resist discharge pump 4; a weighed result is compared with a comparison value by using a comparison and judgment circuit 77 the difference from a standard value is calculated by using an operation circuit 8; a signal for the portion of a correction amount is sent to a discharge-amount adjustment motor 5 which adjusts the resist discharge pump 4; and an adjusting operation is performed.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a semiconductor substrate (wafer).
The present invention relates to a semiconductor manufacturing apparatus used in a photoresist coating process for manufacturing a semiconductor.

[0002]

2. Description of the Related Art In the conventional adjustment of the resist dropping amount, a person measures the amount of the resist dropped from the resist discharge nozzle 1 using a measuring cylinder 11 as shown in the configuration diagram of FIG. When it is out of the standard, the resist discharge pump 4 is adjusted. In addition, after making this adjustment, the drop amount is measured again, it is judged whether the value is inside or outside the standard, and if it is not within the standard, the above adjustment is repeated and the repeated work is carried out. .

[0003]

Since the conventional resist dropping amount measurement and adjustment work is performed by a human,
There are problems that a measurement error may occur, which may adversely affect the product, that the adjustment time may vary during adjustment of the resist ejection mechanism, and that it may take a long time.

[0004]

An automatic drop adjusting mechanism in a semiconductor manufacturing apparatus according to the present invention measures an amount of dropped resist and converts the weight of the resist into a voltage, and an analog output measuring device which outputs the weight. It is equipped with a comparison and judgment circuit that compares and judges the signal and the set value (amount), an arithmetic circuit that processes this data and sets the adjustment amount, etc., and a motor drive unit that adjusts the resist discharge amount by the signal. There is.

[0005]

The present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing an embodiment of the present invention. This embodiment has a resist discharge mechanism and a circuit-configured automatic resist dropping amount adjusting mechanism.

According to a program sequence input in advance, the amount of the resist that is in charge of any number of ejections is dropped on the analog output measuring device 6, and the amount of each dropping is input to the comparison / determination circuit 7. The comparison / determination circuit 7 determines how much the signal from the measuring instrument 6 differs from the set value (quantity).
And the processing is performed by the arithmetic circuit 8. If the dropping amount is within the standard, the resist discharge nozzle 1 is connected to the wafer chuck 2
Although it is moved to the upper part to start product processing, if it is out of the standard, the comparison judgment circuit 7 judges how much the drop amount is, the calculation circuit 8 calculates the correction amount, and sends a signal to the discharge amount adjustment motor 5. , The resist discharge pump 4 is operated, and this sequence is repeated until it is within the standard.

[0007]

As described above, since the present invention has a mechanism for automatically measuring the dropping amount and automatically feeding back the measurement data, it is possible to eliminate the error of the dropping amount by the person and the variation of the adjusting amount. In addition, it has the effects of preventing defective coating on the wafer and improving work efficiency.

[Brief description of drawings]

FIG. 1 is a block diagram of an embodiment of the present invention.

FIG. 2 is a configuration diagram showing a resist discharge mechanism of a conventional manufacturing apparatus.

[Explanation of symbols]

 1 Resist Discharge Nozzle 2 Wafer Chuck 3 Suck Back 4 Resist Discharge Pump 5 Discharge Amount Adjusting Motor 6 Meter with Analog Output 7 Comparison Judgment Circuit 8 Arithmetic Circuit 9 D / A Converter 10 Driver 11 Measuring Cylinder

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location // B05C 5/00 Z 9045-4D

Claims (1)

[Claims] 1. In a semiconductor manufacturing apparatus for coating photoresist on a wafer, a measuring instrument for automatically measuring the amount of resist dropped from a nozzle, a comparison judgment circuit for feeding back the measured value and comparing it with a standard value, and a standard. A semiconductor manufacturing apparatus comprising: an arithmetic circuit that sets a correction amount when the value deviates from the value; and a dropping amount automatic adjustment mechanism that automatically controls and corrects the resist ejection mechanism based on the signal.