JPH05185272A - Automatic soldering apparatus - Google Patents

Abstract

PURPOSE:To reduce the consumption of inert gas by sucking the inert gas at the upstream side in conveying direction of the substrate to inject this inert gas to the downstream side and further, sucking the inert gas at the downstream side to inject the inert gas to the upstream side. CONSTITUTION:In an automatic soldering apparatus 1, the substrate comes in from a conveying-in station 11 and comes out from a conveying-out station 13. Inner part in the apparatus 1 is filled up with the inert gas. A first inert gas circulating device 2 sucks the inert gas from the upstream side E in the conveying direction of the substrate and injects to the downstream side F. A second circulating device 3 sucks the gas from the downstream side G and injects to the upstream side H. The gas intending flow-out from the apparatus 1 can be returned back into the apparatus 1 and the consumption of the inert gas can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic soldering apparatus, and in particular, it is possible to almost completely prevent expensive inert gas from flowing out of the automatic soldering apparatus, and prevent oxidation of the soldered portion. The present invention relates to an epoch-making automatic soldering device capable of performing highly reliable soldering at a low maintenance cost by using an inert gas extremely efficiently.

[0002]

2. Description of the Related Art Conventionally, in an automatic soldering apparatus, an electronic component is soldered to a substrate by melting the solder by raising the temperature of the substrate and the solder to a high temperature in an atmosphere containing a large amount of oxygen. According to the automatic soldering device, the soldering part and molten solder are oxidized when the solder and electronic parts are exposed to oxygen at high temperature, and it is not possible to secure sufficient soldering performance. It had the drawback of having to do some work.

In particular, as electronic components have been downsized in recent years and the lead wires have been thinned accordingly, even a slight defect such as oxidation of a soldered portion has serious consequences such as deterioration of reliability of electronic products. It was the cause.

In order to solve such a drawback, the automatic soldering apparatus is filled with an inert gas such as nitrogen gas to carry out soldering while oxygen is blocked, and the electronic parts, the substrate and the solder are heated to a high temperature. In addition, an automatic soldering device has been proposed in which soldering is performed so that the soldering portion and molten solder do not oxidize.

Since the inert gas such as nitrogen gas used in this type of automatic soldering device is expensive, it is necessary to minimize the leakage of the inert gas from the automatic soldering device. Various measures have been taken to increase the tightness of the device.

However, a board to be soldered must be carried into the automatic soldering apparatus from the outside of the apparatus, and must be carried out from the apparatus. In the conventional automatic soldering apparatus, the board is carried in. In addition, the leakage of the inert gas from the carry-in port and the carry-out port for carrying out can hardly be prevented, and a large amount of the inert gas leaks to the outside of the device, which is very uneconomical. there were.

That is, the temperature is controlled so that the temperature gradually increases from the preheating chamber to the reflow soldering chamber. For example, in a reflow soldering apparatus, the gas density is thin in the high temperature portion and the temperature is low in the low temperature portion. Since the gas density is high, the inert gas causes a flow from the low temperature portion having high gas density to the high temperature portion having low gas density. In this case, due to the flow of the inert gas due to the temperature difference, the inert gas flows out from the carry-out port and the expensive inert gas is consumed.

Further, in such a case, as the inert gas flows out from the carry-out port, air flows into the automatic soldering apparatus from the carry-in port to reduce the inert gas density in the preheating chamber. However, the effect of preventing oxidation will be reduced.

A fan for circulating hot air for melting the solder is arranged in the preheating chamber, the reflow soldering chamber, etc., and the inert gas in the chamber is circulated to generate a high temperature inert gas. The substrate is sprayed from above and heated to perform preheating and heating for soldering, but the inert gas hitting the substrate is shunted to the front and rear sides in the direction of travel of the substrate, and the inert gas flows out in the above direction. However, in any case, a large amount of inert gas was exhausted in vain by further encouraging or causing a flow in the opposite direction.

As a method for preventing the inflow of air from the carry-in port, there has been proposed a device for supplying more inert gas than that flowing out of the carry-out port to increase the internal pressure in the automatic soldering device. However, this apparatus has a drawback that it requires an extremely large amount of inert gas and is not economical.

[0011]

SUMMARY OF THE INVENTION The present invention has been made in order to eliminate the above-mentioned drawbacks of the prior art, and its purpose is to suck an inert gas on the upstream side in the substrate transport direction. From the automatic soldering device by providing an inert gas recirculation device that ejects the inert gas on the downstream side in the substrate conveyance direction or ejects the inert gas on the downstream side in the substrate conveyance direction and ejects it toward the upstream side in the substrate conveyance direction. It is to return the inactive gas that is about to flow out into the automatic soldering apparatus, and thereby to suppress the consumption of the inactive gas to an extremely small amount and to greatly reduce the soldering cost.

Still another object is to provide the above-mentioned inert gas recirculation device and a sensor for detecting the state of the carry-in station and the carry-out station to obtain a signal for controlling the operation of the inert gas recirculation device. Therefore, when the inert gas flows out from the carry-out port, the inert gas recirculation device is activated to return the inert gas on the downstream side in the transport direction to the upstream side, and when the inert gas flows out from the carry-in port, Direction of the inert gas on the upstream side is returned to the downstream side to almost completely prevent the outflow of the inert gas from the automatic soldering device,
It is to reduce the consumption of the inert gas to about 1/5 of the conventional one.

Still another object is to prevent the inflow of air from the carry-in port and to almost completely prevent the oxidation of the soldered portion and the molten solder by the above structure.

Still another object is to inject the inert gas sucked by the inert gas recirculation device from a nozzle as a so-called air curtain to shut off the gas chamber from the outside air and to inject the inert gas from the automatic soldering device and automatically. It is to almost completely prevent the inflow of outside air into the soldering device.

[0015]

SUMMARY OF THE INVENTION In summary, the present invention (Claim 1) relates to an automatic soldering apparatus for heating and soldering a substrate on which electronic components are mounted while being transported in a heating chamber filled with an inert gas, A first inert gas recirculation device that sucks the inert gas on the upstream side of the substrate in the transport direction and ejects the inert gas to the downstream side of the substrate in the transport direction, and suctions the inert gas on the downstream side of the substrate in the transport direction. Then, a second inert gas recirculation device for ejecting the substrate to the upstream side in the transport direction is provided.

Further, the present invention (claim 2) is an automatic soldering device for heating and soldering a substrate on which electronic components are mounted while being transported in a heating chamber filled with an inert gas, in a transporting direction of the substrate. A first inert gas recirculation device that sucks the inert gas on the upstream side and ejects the inert gas to the downstream side in the transport direction of the substrate, and sucks the inert gas on the downstream side in the transport direction of the substrate to suck the inert gas of the substrate. A second inert gas recirculation device that jets out to the upstream side in the transfer direction and a signal that is arranged at the substrate loading station and detects the state of the loading station and controls the operation of the first inert gas recirculation device are transmitted. And a carry-out station for obtaining a signal for detecting the state of the carry-out station provided in the carry-out station for the substrate and controlling the operation of the second inert gas recirculation device. It is characterized in that a Yonsensa.

Further, according to the present invention (claim 3), the substrate on which the electronic parts are mounted is heated while being sequentially transferred to a preheating chamber filled with an inert gas by a transfer device, a reflow soldering chamber and a slow cooling chamber. In the automatic reflow soldering device for soldering by means of a first inert gas recirculation device that sucks the inert gas upstream of the preheating chamber and ejects the inert gas downstream of the slow cooling chamber, A second inert gas recirculation device that sucks the inert gas downstream of the cooling chamber and ejects it upstream of the preheating chamber, and detects the state of the substrate loading station that is arranged at the substrate loading station. The carry-in station sensor for obtaining a signal for controlling the operation of the first inert gas recirculation device, and the second inert gas which is arranged at the carry-out station of the substrate and detects the state of the carry-out station. It is characterized in that a carry-out station sensor for obtaining a signal for controlling the operation of the scan reflux device.

Further, according to the present invention (claim 5), a substrate carrying electronic parts is carried in a gas chamber filled with an inert gas and containing a fluxer, a heating device and a jet solder bath or a dip solder bath. In a flow-type automatic soldering device that heats and solders while conveying by means of a first inert gas that sucks the inert gas on the upstream side of the substrate in the conveying direction and ejects it toward the downstream side of the substrate in the conveying direction. A recirculation device, a second inert gas recirculation device that sucks the inert gas on the downstream side in the transport direction of the substrate and ejects the inert gas to the upstream side in the transport direction of the substrate, and is disposed in the substrate loading station. A carry-in station sensor for detecting the state of the carry-in station and obtaining a signal for controlling the operation of the first inert gas recirculation device, and the carry-out station provided in the carry-out station of the substrate. It detects the state of implementation the second
And a carry-out station sensor for obtaining a signal for controlling the operation of the inert gas recirculation device.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in the drawings. 1 to 5, an automatic soldering device 1 according to the present invention includes a first inert gas recirculation device 2, a second inert gas recirculation device 3, and a carry-in station sensor 4.
And a carry-out station sensor 5.

First, a first embodiment in which the present invention is applied to a reflow type automatic soldering apparatus 1 will be described with reference to FIGS. 1 to 4.

First, the basic structure of the automatic soldering apparatus 1 will be described. The frame 6 of the automatic soldering apparatus 1 includes a partition wall 8
The heating chamber 9 is divided into the preheating chambers PH ₁ and PH ₂ , the reflow soldering chamber RF, and the slow cooling chamber CL, and the structure of each chamber is as described later in detail with reference to FIGS. 3 and 4. It has a substantially similar structure except that the internal temperature is different.

The preheating chambers PH ₁ and PH ₂ , the reflow soldering chamber RF and the slow cooling chamber CL are provided with a well-known endless chain conveyor 10 as an example of a conveying device so as to pass through them. The substrate 12 loaded in the station 11 is transported in the direction of the arrow A to move the substrate 12
H ₁ , PH ₂ , the reflow soldering chamber RF, and the slow cooling chamber CL are sequentially transported to the unloading station 13.

3 and 4, the preheating chambers PH ₁ and PH ₂ , the reflow soldering chamber RF and the slow cooling chamber C, which are filled with an inert gas such as nitrogen gas and are configured independently of each other.
A casing 14 is disposed in the L, and the heating chamber 9
The ascending circulation passage 6U is formed between the outer wall and the outer wall (on the back side of the drawing), and the descending circulation passage 6D is formed in the casing 14.

Chain conveyor 10 in casing 14
Above the electric heater 15 is a large number of holes 16a is sandwiched metal plate 16 drilled, the heating device 18 which is a sandwich structure is disposed, about the preheating chamber PH ₁ 1
The preheating chamber PH ₂ is heated to about 150 ° C, the reflow soldering chamber RF is heated to about 250 ° C, and the slow cooling chamber CL is heated to about 130 ° C. , The substrate 12 loaded on the chain conveyor 10 is preheated in the preheating chambers PH ₁ and PH ₂ while being conveyed in the direction of arrow A, and then rapidly heated to the soldering temperature in the reflow soldering chamber RF to be soldered. Then, it is gradually cooled in the slow cooling chamber CL and carried out from the carry-out station 13.

The blower 19 is for forcibly circulating the heated inert gas such as nitrogen gas filled in the heating chamber 9, and the preheating chambers PH ₁ and PH ₂ , the reflow soldering chamber RF and Between a pulley 22 fixed to a shaft 21 supported by a bearing 20 such as a ball bearing in a centrifugal blower such as a sirocco fan and a pulley of a motor (not shown), which are respectively disposed below the slow cooling chamber CL, a belt ( (Not shown) is wound around and is driven by the motor.

After the nitrogen gas filled in the heating chamber 9 is sucked and heated by the heating device 18, the substrate is transported in the descending circulation passage 6D in the direction of arrow B and conveyed by the chain conveyor 10 in the direction of arrow A. After the 12 is heated, the blower 19 pressure-feeds it in the direction of arrow C, raises it again in the direction of arrow D through the ascending circulation passage 6U, and circulates it.

The first inert gas recirculation device 2 includes a substrate 12
For sucking the inert gas on the upstream side in the transport direction and ejecting it to the downstream side in the transport direction, a blower 23 such as a centrifugal blower, a nozzle 24 having a slit-shaped outlet 24a, and a blower. And a pipe 25 for guiding the inert gas sucked by 23 to the nozzle 24.

The blower 23 is mounted in a first preliminary chamber 26 arranged between the carry-in station 11 and the preliminary heating chamber PH _1, and the inert gas in the first preliminary chamber 26 is indicated by an arrow E. The second preliminary chamber 2 disposed between the slow cooling chamber CL and the unloading station 13 after being sucked in the direction and pressure-fed to the pipe 25.
The gas is jetted out in the direction of arrow F from the jet outlet 24a.

The second inert gas recirculation device 3 includes the substrate 12
For sucking the inert gas on the downstream side in the transport direction and ejecting the same to the upstream side in the transport direction, a blower 29 such as a centrifugal blower, a nozzle 30 having a slit-shaped jet port 30a, and a blower. And a pipe 31 for guiding the inert gas sucked by 29 to the nozzle 30.
Is the same as that of the first inert gas recirculation device 2 except that the nozzle 30 is installed in the second auxiliary chamber 28 and the nozzle 30 is installed in the first auxiliary chamber 26.

Then, the inert gas in the second preliminary chamber 28 is sucked in the direction of arrow G and pressure-fed to the pipe 31, so that the first preliminary chamber 2
It is configured to eject in the direction of arrow H from the ejection port 30a.

The carry-in station sensor 4 and the carry-out station sensor 5 are for detecting the states in the carry-in station 11 and the carry-out station 13, respectively, and transmitting the detection signals to the control device 32. The thermometer is configured as an electronic thermometer capable of detecting the outflow of nitrogen gas by detecting the temperature of the gas, and is installed in each of the carry-in station 11 and the carry-out station 13.

The control device 32 is a computer including, for example, a central processing unit 33, an external storage device 34, an input / output port 35, and the like, and the input / output port 35 includes the carry-in station sensor 4 and the carry-out station sensor 5.
And the electric signal lines 36 and 38, respectively, and the blower 23 and
29 and the electric signal lines 39 and 40, respectively.

Next, referring to FIG. 5, a second embodiment in which the present invention is applied to a jet type automatic soldering device 41 will be described. An automatic soldering device filled with nitrogen gas and having a gas chamber 47 formed therein. Inside the frame 6 of 41, there are arranged a fluxer 42, a heating device 43, and a known jet solder bath 44 for jetting molten solder in the direction of arrow I. Since the other configurations are the same as those of the reflow-type automatic soldering device 1 of the first embodiment, the same parts are designated by the same reference numerals and the description thereof will be omitted.

The present invention is configured as described above,
The operation will be described below. 1 to 4, first, in the carry-in station 11, when the substrates 12 are loaded on the chain conveyor 10, the substrates 12 are conveyed in the direction of arrow A, and in the preheating chamber PH ₁ where the nitrogen gas is heated to about 190 ° C. The electronic components that are heated rapidly and are relatively small and have a small heat capacity are immediately heated to about 190 ° C, which is the same as the temperature of nitrogen gas, while the relatively large electronic components that have a large heat capacity have a surface area of about 190 ° C. However, the inside is not sufficiently heated and the temperature is lower than this.

Next, it is transferred to the preheating chamber PH ₂ heated to about 150 ° C., the temperature of the electronic parts having a small heat capacity is lowered, and the electronic parts having a large heat capacity is gradually heated to adjust the overall temperature. As a result, the temperature of the substrate 12 and all the electronic components reaches a uniform temperature of about 150 ° C., and preheating is completed.

Here, the heating state of the substrate 12 in the preheating chambers PH ₁ and PH ₂ will be described in detail. Referring also to FIGS. 3 and 4, the blowers in the preheating chambers PH ₁ and PH ₂ will be described. When 19 rotates, the descending circulation passage 6D
Is a negative pressure, the nitrogen gas above the heating chamber 9 is
Flowing in the hole 16a of the metal plate 16 in a direction, heat-exchanges with the metal plate 16 heated by the electric heater 15, and is further lowered to contact the substrate 12 conveyed by the chain conveyor 10 to contact the substrate 12. The substrate 12 and electronic components are heated.

The nitrogen gas contacting the substrate 12 from above is
Referring to FIG. 4, the flow branches off in the direction of arrow J or K,
The flow direction is determined by the positional relationship between the substrate 12 and the blower 19, and the position of the substrate 12 being conveyed is constantly changing, so the flow direction is also the arrow J to K direction, and the arrow K to J direction. In the preheating chamber PH ₁ , for example, the nitrogen gas flows in the direction in which the nitrogen gas flows into the first preliminary chamber 26 or in the direction of the preheating chamber PH ₂ .

The nitrogen gas which has passed through the chain conveyor 10 and further descended is sucked by the blower 19 and flows rightward and leftward (in the direction of arrow C) to ascend in the ascending circulation passage 6U as indicated by the arrow D, so that the heating device 18 is heated. Return to the top.

At this time, the temperature of the nitrogen gas is detected by a temperature sensor (not shown) and transmitted to the control device 32, and the electric power supplied to the electric heater 15 is adjusted in accordance with a command from the control device 32, so that the inside of the heating chamber 9 is adjusted. The nitrogen gas is controlled so as to reach a predetermined temperature.

Next, the substrate 12 is placed in the reflow soldering chamber R.
It is conveyed to F and is heated there by contacting with nitrogen gas heated to about 250 ° C. in the same manner as in the preheating chambers PH ₁ and PH ₂ , so that the cream solder is melted and the electronic component is placed on the substrate 1.
2 is soldered to a predetermined place.

The preheating chambers PH ₁ and PH ₂ and the reflow soldering chamber RF are filled with inert nitrogen gas,
Since the oxygen concentration in the heating chamber 9 is kept extremely low and is about 100 to 1000 ppm, the molten solder and the lead wires of electronic parts are not oxidized, and ideal soldering is performed.

The substrate 12, which is still in a high temperature state after being soldered in the reflow soldering chamber RF, is further heated to about 130 ° C.
After being transported to the slow cooling chamber CL and slowly cooled, it is unloaded to the unloading station 13 and unloaded in the direction of arrow A.

With reference to FIG. 2, in the automatic reflow soldering apparatus 1, the temperature is controlled so that the temperature gradually increases from the preheating chamber PH ₁ to the reflow soldering chamber RF.

On the other hand, regarding the density of nitrogen gas, the gas density becomes low in the high temperature part and becomes high in the low temperature part. Therefore, the general nitrogen gas flow in the reflow automatic soldering apparatus 1 is the gas density. Preheated room P
The flow is from H ₁ toward the reflow soldering chamber RF with a low gas density. That is, due to the temperature difference, nitrogen gas tends to flow out from the carry-out port.

Referring also to FIG. 5, in the jet type automatic soldering device 41 as well, due to the temperature difference, as described above, from the carry-in station 11 to the carry-out station 1.
Since the gradient of about 6 ° is provided toward 3, the nitrogen gas tends to flow out from the carry-out port.

When the high-temperature nitrogen gas heated in the automatic soldering device 1 flows out from the heating chamber 9 to the unloading station 13, the thermometer 5 as an example of the unloading station sensor detects this and sends a detection signal to the controller 32. Send.

The control device 32 issues an operation start command to the blower 29 in response to the detection signal, rotates the blower 29, sucks the nitrogen gas in the second auxiliary chamber 28 in the direction of arrow G, and guides it to the pipe 31. It is pumped, and the jet port 30a
Is jetted in the direction of arrow H as an air curtain.

By this action, the nitrogen gas which is about to flow from the slow cooling chamber CL to the carry-out station 13 is sucked by the blower 29 and therefore does not flow to the carry-out station 13.

Further, when the nitrogen gas flows out to the carry-out station 13, the pressure in the automatic soldering apparatus 1 drops and the outside air tries to flow into the carry-in station 11.
The nitrogen gas of the carry-out station 13 is pressure-fed to the carry-in station 11 by the blower 29, and is ejected as an air curtain to increase the pressure in the carry-in station 11 and prevent the inflow of air.

The procedure of this control will be described with reference to FIG. 6. In step S ₁ , whether or not the temperature of the carry-out station 13 is equal to or higher than a predetermined temperature is checked by the thermometer 5 which is an example of the carry-out station sensor.

When the thermometer 5 detects a temperature equal to or higher than a predetermined temperature, it is judged that the nitrogen gas heated to a high temperature in the heating chamber 9 is flowing out of the carry-out station 13, and the controller 32 operates. rotate the blower 29 at step S ₂ by sucking the nitrogen gas in the second preliminary chamber 28 the pipe 31
And is ejected as an air curtain from the ejection port 30a into the first preliminary chamber 26.

When the thermometer 5 does not detect a temperature equal to or higher than the predetermined temperature, it is judged that the nitrogen gas does not flow out, and the process proceeds to the point A through the route R ₁ without performing the operation of step S ₂ . Further, the output of the blower 29 can be changed depending on the degree of temperature, and when the temperature is gradually lowered, the output of the blower 29 can be gradually reduced and the output can be controlled to be stopped.

Next, at step S ₃ , it is checked by the thermometer 4 as an example of the carry-in station sensor whether the temperature of the carry-in station 11 is equal to or higher than a predetermined temperature.

When the thermometer 4 detects a temperature higher than a predetermined temperature, it is judged that the nitrogen gas heated to a high temperature in the heating chamber 9 is flowing out from the carry-in station 11, and the controller 32 is operated.
In step S ₄ , the blower 23 is rotated to suck the nitrogen gas in the first preliminary chamber 26, pressure-feed it to the pipe 25, and blow it into the second preliminary chamber 28 from the jet outlet 24a as an air curtain. Returning to the point B through the route R ₂ , the temperature of the carry-out station 13 is checked again in step S ₁ .

When the thermometer 4 does not detect a temperature higher than the predetermined temperature, it is judged that the nitrogen gas does not flow out from the carry-in station 11, and the route is passed through the route R ₃ without performing the operation of step S _4. Return to B and step S again
_{At 1} , the temperature of the carry-out station 13 is checked. Further, similarly to the above, the output of the blower 23 can be changed depending on the degree of the temperature, and when the temperature is gradually lowered, the output of the blower 23 can be gradually reduced and the output can be controlled to stop.

As described above, the nitrogen gas in the automatic soldering device 1 is circulated and repeatedly used while being enclosed in the automatic soldering device 1 without flowing out from either the carry-in station 11 or the carry-out station 13. Therefore, as a result of the test, the amount of nitrogen gas used can be reduced by about 80% as compared with the conventional automatic soldering device, that is, 1/5 of the conventional one.
It turned out that it can be suppressed to.

In the above embodiment, the carry-in station sensor and the carry-out station sensor are described as thermometers, but the carry-in station sensor and the carry-out station sensor are not limited to the thermometer, and an anemometer and an oxygen concentration meter are not limited thereto. Alternatively, a nitrogen concentration meter or the like may be used.

[0058]

INDUSTRIAL APPLICABILITY As described above, the present invention sucks the inert gas on the upstream side in the carrying direction of the substrate and jets it to the downstream side in the carrying direction of the substrate, or sucks the inert gas on the downstream side in the carrying direction of the substrate. Since it is equipped with an inert gas recirculation device that ejects on the upstream side in the substrate transport direction, the inert gas that is about to flow out of the automatic soldering device can be returned to the inside of the automatic soldering device. There is an effect that the gas consumption can be suppressed to an extremely small amount and the soldering cost can be significantly reduced.

Further, since the above-described inert gas recirculation device is provided, and the sensor for detecting the state of the carry-in station and the carry-out station to obtain a signal for controlling the operation of the inert gas recirculation device, the inert gas recirculation device is provided. When the inert gas flows out from the carry-out port, the inert gas recirculation device is operated to return the inert gas downstream in the carrying direction to the upstream side, and when the inert gas flows out from the carry-in port, the inert gas upstream in the carrying direction is discharged. There is an effect that the active gas can be returned to the downstream side to almost completely prevent the outflow of the inert gas from the automatic soldering device, and the consumption amount of the inert gas can be reduced to about 1/5 of the conventional amount.

Furthermore, since the above structure can prevent the inflow of air from the carry-in port, there is an effect that the oxidation of the soldering portion and the molten solder can be almost completely prevented.

Further, since the inert gas sucked by the inert gas recirculation device is ejected from the nozzle as a so-called air curtain, the gas chamber is shut off from the outside air and the inert gas flows out from the automatic soldering device and is automatically soldered. This has the effect of almost completely preventing the inflow of outside air into the attachment device.

[Brief description of drawings]

1 to 4 relate to a first embodiment of the present invention, and FIG. 1 is a perspective view of an entire main part of an automatic soldering apparatus including a computer circuit.

FIG. 2 is a longitudinal sectional view including a computer circuit of a reflow type automatic soldering device equipped with an inert gas recirculation device.

FIG. 3 is a vertical cross-sectional view showing a flow of an inert gas in a reflow type automatic soldering device when a substrate is not present.

FIG. 4 is a vertical cross-sectional view showing the flow of an inert gas in the reflow soldering device when a substrate is present.

FIG. 5 is a vertical cross-sectional view including a computer circuit of a jet-type automatic soldering device equipped with an inert gas recirculation device.

FIG. 6 is a flowchart illustrating a routine of an inert gas recirculation device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Automatic soldering apparatus 2 1st inert gas recirculation apparatus 3 2nd inert gas recirculation apparatus 4 Thermometer which is an example of a carry-in station sensor 5 Thermometer which is an example of a carry-out station sensor 9 Heating chamber 10 Conveying apparatus 11 Carry-in station 12 substrate 13 carry-out station 24 nozzle 30 nozzle 41 jet-type automatic soldering device as an example of automatic soldering device 42 fluxer 43 heating device 44 jet-type soldering tank 47 gas chamber PH ₁ preheating chamber PH ₂ preheating chamber RF reflow soldering Room CL slow cooling room

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[Procedure amendment]

[Submission date] December 11, 1991

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Correction target item name] All drawings

[Correction method] Change

[Correction content]

[Figure 1]

[Fig. 2]

[Figure 3]

[Figure 4]

[Figure 5]

[Figure 6]

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display area // B23K 101: 42

Claims (10)

[Claims] 1. An automatic soldering device that heats and solders a substrate on which electronic components are mounted while being transported in a heating chamber filled with an inert gas, and sucks the inert gas on the upstream side in the transport direction of the substrate. And a second inert gas recirculation device that jets the substrate downstream in the transport direction, and a second inert gas recirculation device that sucks the inert gas downstream in the substrate transport direction and jets the inert gas upstream in the substrate transport direction. And an inert gas recirculation device of 1. 2. An automatic soldering device that heats and solders a substrate on which electronic components are mounted while being transported in a heating chamber filled with an inert gas, and sucks the inert gas on the upstream side in the transport direction of the substrate. And a second inert gas recirculation device that jets the substrate downstream in the transport direction, and a second inert gas recirculation device that sucks the inert gas downstream in the substrate transport direction and jets the inert gas upstream in the substrate transport direction. An inert gas recirculation device, a carry-in station sensor disposed at the substrate carry-in station for detecting the state of the carry-in station and obtaining a signal for controlling the operation of the first inert gas recirculation device, And a carry-out station sensor for detecting the state of the carry-out station and obtaining a signal for controlling the operation of the second inert gas recirculation device. Characteristic automatic soldering device. 3. Reflow automatic soldering in which a substrate on which an electronic component is mounted is heated and soldered while being sequentially transported to a preheating chamber, a reflow soldering chamber and a slow cooling chamber filled with an inert gas by a transport device. In the apparatus, a first inert gas recirculation device that sucks the inert gas upstream of the preheating chamber and ejects the inert gas downstream of the slow cooling chamber, and the inert gas downstream of the slow cooling chamber. A second inert gas recirculation device that sucks gas and ejects the gas upstream from the preheating chamber, and the first inert gas recirculation device that is disposed at the substrate loading station and detects the state of the loading station. And a carry-in station sensor for obtaining a signal for controlling the operation of the substrate, and the operation of the second inert gas recirculation device is controlled by detecting the state of the carry-out station provided at the carry-out station of the substrate. An automatic reflow soldering device comprising a carry-out station sensor for obtaining a signal. 4. The first and second inert gas recirculation devices are arranged so as to block the flow of the inert gas between the preheating chamber and the carry-in station and between the slow cooling chamber and the carry-out station. The automatic reflow soldering device according to claim 3, further comprising a nozzle that ejects the inert gas in a direction perpendicular to a transport direction of the device. 5. Soldering by heating a substrate on which an electronic component is mounted in a gas chamber filled with an inert gas and containing a fluxer, a heating device and a jet solder bath or a dip solder bath while being transported by a transport device. In the flow type automatic soldering device, a first inert gas recirculation device for sucking the inert gas on the upstream side in the carrying direction of the substrate and ejecting the inert gas to the downstream side in the carrying direction of the substrate, and the carrying direction of the substrate. A second inert gas recirculation device that sucks the inert gas on the downstream side and ejects the inert gas to the upstream side in the transport direction of the substrate; and An input station sensor for obtaining a signal for controlling the operation of the inert gas recirculation device of 1.
A flow-out type sensor, which is provided in the substrate unloading station and includes a unloading station sensor for detecting a state of the unloading station and obtaining a signal for controlling the operation of the second inert gas recirculation device. Automatic soldering device. 6. The first and second inert gas recirculation devices are arranged in a transfer direction of the transfer device so as to block the flow of the inert gas between the gas chamber and the periphery of the flow type automatic soldering device. The flow-type automatic soldering device according to claim 5, further comprising a nozzle that ejects the inert gas in a direction perpendicular to the above. 7. The carry-in station sensor and the carry-out station sensor are for detecting the outflow of the inert gas from the automatic soldering device and controlling the first or second inert gas recirculation device. An automatic soldering device according to any one of claims 2, 3, 4 and 5, characterized in that it is an anemometer which sends out a signal. 8. The carry-in station sensor and the carry-out station sensor detect the temperature in the carry-in station or the carry-out station and send a signal for controlling the first or second inert gas recirculation device. 6. The automatic soldering device according to claim 2, wherein the automatic soldering device is a thermometer. 9. The carry-in station sensor and the carry-out station sensor output signals for detecting the oxygen concentration in the carry-in station or the carry-out station and controlling the first or second inert gas recirculation device. 3. An oxygen concentration meter for sending out,
The automatic soldering device according to any one of 3, 4, and 5. 10. The carry-in station sensor and the carry-out station sensor detect the nitrogen concentration in the carry-in station or the carry-out station to detect the first concentration.
Or a nitrogen concentration meter that sends a signal for controlling the second inert gas recirculation device.
The automatic soldering device according to any one of 3, 4, and 5.